JPH08115612A - Electroconductive paste - Google Patents
Electroconductive pasteInfo
- Publication number
- JPH08115612A JPH08115612A JP27612894A JP27612894A JPH08115612A JP H08115612 A JPH08115612 A JP H08115612A JP 27612894 A JP27612894 A JP 27612894A JP 27612894 A JP27612894 A JP 27612894A JP H08115612 A JPH08115612 A JP H08115612A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- metal powder
- conductive
- shape
- electroconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導電ペーストに関し、
詳しくは、電子部品の外部電極（端子電極）などを形成
するのに適した導電ペーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste,
Specifically, it relates to a conductive paste suitable for forming external electrodes (terminal electrodes) of electronic components.
【０００２】[0002]
【従来の技術】例えば、積層セラミックコンデンサなど
の電子部品の外部電極は、一般に、金属粉末を導電成分
とする導電ペーストを塗布、焼付けすることにより形成
されている。2. Description of the Related Art For example, an external electrode of an electronic component such as a monolithic ceramic capacitor is generally formed by applying and baking a conductive paste containing a metal powder as a conductive component.
【０００３】そして、金属粉末としては、通常、略球形
状や扁平形状を有するＡｇ粉末などが用いられている。As the metal powder, Ag powder having a substantially spherical shape or a flat shape is usually used.
【０００４】[0004]
【発明が解決しようとする課題】しかし、略球形状の金
属粉末（Ａｇ粉末など）のみを導電成分とする導電ペー
ストを用いて外部電極を形成した場合には、図１に示す
ように、電子部品素子１の両端面などに形成された外部
電極２の表面に凹み３が生じるという問題点がある。However, when the external electrodes are formed by using a conductive paste containing only substantially spherical metal powder (Ag powder or the like) as a conductive component, as shown in FIG. There is a problem that the recess 3 is formed on the surface of the external electrode 2 formed on both end surfaces of the component element 1.
【０００５】また、扁平形状の金属粉末（Ａｇ粉末な
ど）のみを導電成分とする導電ペーストを用いて外部電
極を形成した場合には、図２に示すように、電子部品素
子１の両端面などに形成された外部電極２の表面に角
（つの）状突起４が生じるという問題点がある。Further, when the external electrodes are formed by using a conductive paste containing only flat metal powder (Ag powder or the like) as a conductive component, as shown in FIG. There is a problem in that the corner-shaped protrusions 4 are formed on the surface of the external electrode 2 formed on the substrate.
【０００６】そして、このような外部電極２の表面に発
生した凹み３や角状突起４は、製品の外観を損うばかり
でなく、実装時に所定の姿勢で実装することを困難にす
る原因ともなる。そのため、凹みや角状突起のない外部
電極を形成することが可能な導電ペーストが望まれてい
る。The recesses 3 and the angular protrusions 4 formed on the surface of the external electrode 2 not only impair the appearance of the product, but also make it difficult to mount the product in a predetermined posture during mounting. Become. Therefore, a conductive paste capable of forming an external electrode without depressions or angular protrusions is desired.
【０００７】本発明は、上記問題点を解決するものであ
り、電子部品の外部電極を形成するのに用いた場合に、
凹みや角状突起などのない所望の形状を有する外部電極
を形成することが可能な、形状性に優れた導電ペースト
を提供することを目的とする。The present invention solves the above-mentioned problems, and when used for forming external electrodes of electronic parts,
It is an object of the present invention to provide a conductive paste having excellent formability, which enables formation of an external electrode having a desired shape without depressions or angular protrusions.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の導電ペーストは、導電成分として、(ａ)略
球形状で、粒径が約１〜６μmの金属粉末５０〜７０重
量％、(ｂ)扁平形状を有し、粒径が約２〜５μmの金属
粉末２０〜５０重量％、(ｃ)微粉状で、粒径が約０．１
〜１μmの金属粉末５〜２０重量％を含む導電粉末を用
いたことを特徴としている。In order to achieve the above object, the conductive paste of the present invention comprises, as a conductive component, (a) a metal powder having a substantially spherical shape and a particle size of about 1 to 6 μm. %, (B) 20 to 50% by weight of a metal powder having a flat shape and a particle size of about 2 to 5 μm, (c) a fine powder having a particle size of about 0.1
It is characterized in that a conductive powder containing 5 to 20% by weight of a metal powder of ˜1 μm is used.
【０００９】また、前記金属粉末がＡｇ粉末、Ａｇ−Ｐ
ｄ混合粉末、及びＡｇ−Ｐｄ合金粉末からなる群より選
ばれる一種であることを特徴としている。The metal powder is Ag powder or Ag-P.
It is a kind selected from the group consisting of d mixed powder and Ag-Pd alloy powder.
【００１０】[0010]
【作用】本発明の導電ペーストにおいては、略球形状の
金属粉末と、扁平形状を有する金属粉末と、微粉状の金
属粉末とが互にからみあうことにより、塗布、乾燥時に
おける形状性が向上して、表面の平坦性や平滑性が確保
されるとともに、凹みや角状突起を発生させることなく
焼付けを行うことが可能になる。In the conductive paste of the present invention, the substantially spherical metal powder, the flat metal powder, and the fine powder metal powder are intertwined with each other to improve the shape during coating and drying. As a result, the flatness and smoothness of the surface are ensured, and it becomes possible to carry out baking without generating dents or angular protrusions.
【００１１】したがって、本発明の導電ペーストを用い
ることにより、積層セラミックコンデンサなどの電子部
品に、凹みや角状突起などのない良好な外部電極を形成
することができる。Therefore, by using the conductive paste of the present invention, it is possible to form a good external electrode on an electronic component such as a monolithic ceramic capacitor without any dents or angular protrusions.
【００１２】また、前記金属粉末として、Ａｇ粉末、Ａ
ｇ−Ｐｄ混合粉末、及びＡｇ−Ｐｄ合金粉末からなる群
より選ばれる一種を用いることにより、凹みや角状突起
などがなく、電気的特性にも優れた外部電極を確実に形
成することが可能な導電ペーストを得ることが可能にな
る。As the metal powder, Ag powder, A
By using one selected from the group consisting of g-Pd mixed powder and Ag-Pd alloy powder, it is possible to reliably form an external electrode that has no dents or angular protrusions and has excellent electrical characteristics. It is possible to obtain a different conductive paste.
【００１３】なお、本発明の導電ペーストにおいては、
さらにその他の金属粉末、金属混合粉末、合金粉末など
を導電成分として用いることも可能である。In the conductive paste of the present invention,
Furthermore, it is also possible to use other metal powder, metal mixed powder, alloy powder, etc. as the conductive component.
【００１４】[0014]
【実施例】以下、本発明の実施例を比較例とともに示し
てその特徴とするところをさらに詳しく説明する。EXAMPLES Examples of the present invention will now be shown together with comparative examples to characterize them in more detail.
【００１５】下記のＡｇ粉末(ａ)，(ｂ)，(ｃ)を、表
１に示すような割合で配合した導電粉末（混合Ａｇ粉
末）：７５重量％、(ａ)略球形状で、粒径が約１〜６μ
mのＡｇ粉末、(ｂ)扁平形状を有し、粒径が約２〜５μm
のＡｇ粉末、(ｃ)微粉状で、粒径が約０．１〜１μmの
Ａｇ粉末、 ホウケイ酸亜鉛系フリット：５重量％、 セルロース系樹脂及びブチルカルビトール系溶剤：残
部、 を配合することにより導電ペースト（試料）を調製し
た。Conductive powder (mixed Ag powder) containing the following Ag powders (a), (b) and (c) in the proportions shown in Table 1: 75% by weight, (a) having a substantially spherical shape, Particle size is about 1-6μ
m of Ag powder, (b) having a flat shape and a particle size of about 2-5 μm
Ag powder of (c) fine powder with a particle size of about 0.1 to 1 μm, zinc borosilicate frit: 5% by weight, cellulosic resin and butyl carbitol solvent: balance, A conductive paste (sample) was prepared by.
【００１６】[0016]
【表１】 [Table 1]
【００１７】そして、この導電ペーストを電子部品素子
（この実施例では積層セラミックコンデンサ素子）に塗
布した後、乾燥、焼付けを行い、凹みや角状突起などの
発生状態を調べてその形状性を評価した。その結果を表
１に併せて示す。Then, after applying the conductive paste to an electronic component element (multilayer ceramic capacitor element in this embodiment), it is dried and baked, and the state of occurrence of dents and angular protrusions is examined to evaluate its shape. did. The results are shown in Table 1.
【００１８】なお、表１において、試料No.に*印を付し
たものは、発明の範囲外のものである。In Table 1, the sample numbers marked with * are outside the scope of the invention.
【００１９】また、表１において、形状性の良否の判定
は、凹み及び角状突起のいずれかが発生したものを×と
し、凹み及び角状突起のいずれの発生も認められないも
のを○として評価したものである。Further, in Table 1, the quality of the shape was judged to be X when any of the dents and the angular protrusions was generated, and as ◯ when neither of the dents and the angular protrusions was recognized. It is an evaluation.
【００２０】表１より、上記(ａ)，(ｂ)，(ｃ)の各Ａｇ
粉末を、本発明の範囲内の割合で配合してなる導電粉末
（混合Ａｇ粉末）を用いた導電ペースト（試料No.３，
４，５，７，８，９）により形成した外部電極には、凹
みや角状突起の発生は認められなかった。From Table 1, each Ag of the above (a), (b) and (c)
Conductive paste (Sample No. 3, using conductive powder (mixed Ag powder) prepared by mixing powders in a ratio within the range of the present invention.
No dents or angular protrusions were found on the external electrodes formed by 4, 5, 7, 8, 9).
【００２１】しかし、略球形状のＡｇ粉末（(ａ)のＡｇ
粉末）のみを用いた場合（試料No.１）及び、略球形状
のＡｇ粉末（(ａ)のＡｇ粉末）８０重量％、扁平形状の
Ａｇ粉末（(ｂ)のＡｇ粉末）１０重量％、及び微粉状の
Ａｇ粉末（(ｃ)のＡｇ粉末）１０重量％を配合した導電
粉末（混合Ａｇ粉末）を用いた場合（試料No.２）に
は、凹みの発生が認められた。However, a substantially spherical Ag powder (Ag of (a))
Powder (sample No. 1) only, 80% by weight of substantially spherical Ag powder (Ag powder of (a)), 10% by weight of flat Ag powder (Ag powder of (b)), Also, when conductive powder (mixed Ag powder) containing 10% by weight of finely divided Ag powder (Ag powder of (c)) was used (Sample No. 2), the occurrence of dents was observed.
【００２２】また、略球形状のＡｇ粉末（(ａ)のＡｇ粉
末）３０重量％、扁平形状のＡｇ粉末（(ｂ)のＡｇ粉
末）６０重量％、及び微粉状のＡｇ粉末（(ｃ)のＡｇ粉
末）１０重量％を配合した導電粉末（混合Ａｇ粉末）を
用いた場合（試料No.１１）及び、扁平形状のＡｇ粉末
（(ｂ)のＡｇ粉末）のみを用いた場合（試料No.１０）
には、角状突起の発生が認められた。Further, substantially spherical Ag powder (Ag powder of (a)) 30% by weight, flat Ag powder (Ag powder of (b)) 60% by weight, and finely divided Ag powder ((c)). 10% by weight of conductive powder (mixed Ag powder) (Sample No. 11) and flat Ag powder (Ag powder of (b)) alone (Sample No. 11). .10)
The formation of horn-shaped protrusions was observed.
【００２３】さらに、略球形状のＡｇ粉末（(ａ)のＡｇ
粉末）６０重量％、扁平形状のＡｇ粉末（(ｂ)のＡｇ粉
末）１０重量％、及び微粉状のＡｇ粉末（(ｃ)のＡｇ粉
末）３０重量％を配合した導電粉末（混合Ａｇ粉末）を
用いた場合（試料No.６）には、凹みや角状突起の発生
は認められなかったが、導電ペーストを焼成する際の収
縮率が大きくなり、外部電極が電子部品素子（この実施
例では積層セラミックコンデンサ素子）から浮き上がっ
てしまうという現象が認められた。Furthermore, a substantially spherical Ag powder (Ag of (a))
Powder) 60 wt%, flat-shaped Ag powder (Ag powder of (b)) 10 wt%, and fine powder Ag powder (Ag powder of (c)) 30 wt% conductive powder (mixed Ag powder) In the case of using (Sample No. 6), the occurrence of dents and angular protrusions was not observed, but the shrinkage rate when firing the conductive paste was large, and the external electrode was an electronic component element (this example). Then, the phenomenon of being lifted from the monolithic ceramic capacitor element) was confirmed.
【００２４】なお、上記実施例では、導電成分として、
Ａｇ粉末を用いた場合について説明したが、Ａｇ−Ｐｄ
混合粉末やＡｇ−Ｐｄ合金粉末を用い、その略球形状、
扁平形状、及び微粉状の各粉末を所定の割合で配合した
ものを導電成分とした場合にも上記実施例と同様の効果
を得ることができる。導電成分としては、さらにその他
の金属粉末、金属混合粉末、合金粉末などを用いること
も可能である。In the above embodiment, as the conductive component,
Although the case where Ag powder is used has been described, Ag-Pd
Using mixed powder or Ag-Pd alloy powder, its substantially spherical shape,
Even when a mixture of flat and fine powders at a predetermined ratio is used as the conductive component, the same effect as that of the above embodiment can be obtained. As the conductive component, other metal powder, metal mixed powder, alloy powder or the like can be used.
【００２５】また、上記実施例では、積層セラミックコ
ンデンサの外部電極を形成する場合を例にとって説明し
たが、本発明の導電ペーストは積層セラミックコンデン
サに限らず、圧電共振部品や正特性サーミスタなどの種
々の電子部品の外部電極を形成する場合に好適に用いる
ことができる。In the above embodiments, the case where the external electrodes of the monolithic ceramic capacitor are formed has been described as an example. However, the conductive paste of the present invention is not limited to the monolithic ceramic capacitor, but various types of piezoelectric resonance components, positive temperature coefficient thermistors, and the like. It can be preferably used when forming the external electrodes of the electronic component.
【００２６】本発明は、さらにその他の点においても上
記実施例に限定されるものではなく、略球形状、扁平形
状及び微粉状の各金属粉末の配合比、ガラスフリット、
バインダー、溶剤などの添加物の種類や添加量などに関
し、発明の要旨の範囲内において種々の応用、変形を加
えることが可能である。The present invention is not limited to the above-mentioned embodiments in other points as well, and the compounding ratio of the substantially spherical, flat and fine powder metal powders, glass frit,
Various kinds of applications and modifications can be made within the scope of the invention with respect to the types and amounts of additives such as binders and solvents.
【００２７】[0027]
【発明の効果】上述のように、本発明の導電ペースト
は、導電成分として、(ａ)略球形状で、粒径が約１〜６
μmの金属粉末５０〜７０重量％、(ｂ)扁平形状を有
し、粒径が約２〜５μmの金属粉末２０〜５０重量％、
(ｃ)微粉状で、粒径が約０．１〜１μmの金属粉末５〜
２０重量％を含む導電粉末を用いているので、従来の導
電ペーストを用いた場合には発生した、塗布、乾燥時や
焼付け時における、表面の凹みや角状突起の発生を抑
制、防止することができるようになる。As described above, the conductive paste of the present invention has, as a conductive component, (a) a substantially spherical shape and a particle size of about 1-6.
50 to 70% by weight of metal powder having a particle size of 2 to 5 μm, having a flat shape and a particle size of about 2 to 5 μm,
(c) Finely powdered metal powder having a particle size of about 0.1 to 1 μm 5
Since a conductive powder containing 20% by weight is used, it is possible to suppress or prevent the generation of surface dents or angular protrusions during coating, drying or baking, which occurs when a conventional conductive paste is used. Will be able to.
【００２８】したがって、本発明の導電ペーストを用い
ることにより、積層セラミックコンデンサなどの電子部
品に、凹みや角状突起などのない良好な外部電極を形成
することができる。Therefore, by using the conductive paste of the present invention, it is possible to form a good external electrode on an electronic component such as a monolithic ceramic capacitor without any dents or angular protrusions.
【００２９】また、前記金属粉末として、Ａｇ粉末、Ａ
ｇ−Ｐｄ混合粉末、及びＡｇ−Ｐｄ合金粉末からなる群
より選ばれる一種を用いることにより、凹みや角状突起
などがなく、電気的特性にも優れた外部電極を確実に形
成することが可能な導電ペーストを得ることが可能にな
る。As the metal powder, Ag powder, A
By using one selected from the group consisting of g-Pd mixed powder and Ag-Pd alloy powder, it is possible to reliably form an external electrode that has no dents or angular protrusions and has excellent electrical characteristics. It is possible to obtain a different conductive paste.
【図１】電子部品に形成された外部電極の表面に凹みが
発生した状態を示す断面図である。FIG. 1 is a cross-sectional view showing a state in which a recess is formed on a surface of an external electrode formed on an electronic component.
【図２】電子部品に形成された外部電極の表面に角状突
起が発生した状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state where angular protrusions are generated on the surface of an external electrode formed on an electronic component.
Claims (2)
７０重量％、 (ｂ)扁平形状を有し、粒径が約２〜５μmの金属粉末２
０〜５０重量％、 (ｃ)微粉状で、粒径が約０．１〜１μmの金属粉末５〜
２０重量％ を含む導電粉末を用いたことを特徴とする導電ペース
ト。1. As a conductive component, (a) a metal powder 50 having a substantially spherical shape and a particle size of about 1 to 6 μm.
70% by weight, (b) Metal powder 2 having a flat shape and a particle size of about 2 to 5 μm
0 to 50% by weight, (c) a finely powdered metal powder having a particle size of about 0.1 to 1 μm 5
A conductive paste comprising a conductive powder containing 20% by weight.
合粉末、及びＡｇ−Ｐｄ合金粉末からなる群より選ばれ
る一種であることを特徴とする請求項１記載の導電ペー
スト。2. The conductive paste according to claim 1, wherein the metal powder is one selected from the group consisting of Ag powder, Ag-Pd mixed powder, and Ag-Pd alloy powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27612894A JPH08115612A (en) | 1994-10-13 | 1994-10-13 | Electroconductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27612894A JPH08115612A (en) | 1994-10-13 | 1994-10-13 | Electroconductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08115612A true JPH08115612A (en) | 1996-05-07 |
Family
ID=17565184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27612894A Pending JPH08115612A (en) | 1994-10-13 | 1994-10-13 | Electroconductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08115612A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000060613A1 (en) * | 1999-03-30 | 2000-10-12 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| EP1178493A1 (en) * | 1999-12-24 | 2002-02-06 | Ngk Insulators, Ltd. | Ceramic capacitor electrode-forming paste |
| JP2004362950A (en) * | 2003-06-05 | 2004-12-24 | Noritake Co Ltd | Conductive paste mainly composed of silver powder, and its manufacturing method |
| JP2006128608A (en) * | 2004-09-29 | 2006-05-18 | Kyocera Corp | Electronic part, method for manufacturing the same, chip resistor using the same, ferrite core and inductor |
| JP2009239094A (en) * | 2008-03-27 | 2009-10-15 | Tdk Corp | Surface-mounted type electronic component array and method of manufacturing same |
-
1994
- 1994-10-13 JP JP27612894A patent/JPH08115612A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000060613A1 (en) * | 1999-03-30 | 2000-10-12 | Matsushita Electric Industrial Co., Ltd. | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| EP1178493A1 (en) * | 1999-12-24 | 2002-02-06 | Ngk Insulators, Ltd. | Ceramic capacitor electrode-forming paste |
| EP1178493A4 (en) * | 1999-12-24 | 2005-06-15 | Ngk Insulators Ltd | Ceramic capacitor electrode-forming paste |
| JP2004362950A (en) * | 2003-06-05 | 2004-12-24 | Noritake Co Ltd | Conductive paste mainly composed of silver powder, and its manufacturing method |
| JP2006128608A (en) * | 2004-09-29 | 2006-05-18 | Kyocera Corp | Electronic part, method for manufacturing the same, chip resistor using the same, ferrite core and inductor |
| JP2009239094A (en) * | 2008-03-27 | 2009-10-15 | Tdk Corp | Surface-mounted type electronic component array and method of manufacturing same |
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