JP2001006436A - Conductive paste and manufacture thereof and laminated ceramic capacitor using the same - Google Patents

Conductive paste and manufacture thereof and laminated ceramic capacitor using the same

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Publication number
JP2001006436A
JP2001006436A JP18045099A JP18045099A JP2001006436A JP 2001006436 A JP2001006436 A JP 2001006436A JP 18045099 A JP18045099 A JP 18045099A JP 18045099 A JP18045099 A JP 18045099A JP 2001006436 A JP2001006436 A JP 2001006436A
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JP
Japan
Prior art keywords
conductive
thick film
powder
film paste
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18045099A
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Japanese (ja)
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JP4161472B2 (en
Inventor
Motohiro Shimizu
基尋 清水
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of JP2001006436A publication Critical patent/JP2001006436A/en
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Abstract

PROBLEM TO BE SOLVED: To provide such a paste which has an excellent dispersion characteristic though it uses conductive powder having an average particle diameter not more than specified and which is less in viscosity change over aging by adding an aniornic polymer dispersant as well as an amine based surface active agent to the conductive thick film paste composed of the conductive powder whose average particle diameter is not more than a specified level and an organic vehicle. SOLUTION: Preferably, alkylene oxide or its polymer and aminic surface active agent such as oxyethilenedodesylamine consisting of alkyl group or hydrogne are contained 0.1-5.0 in 100 wt.% of conductive thick film paste using conductive powder whose average particle diameter is not more than 1 μm. To manufacture the paste, anionic polymer dispersant and conductive powder are mixed to thereby obtain intermediate paste where the dispersant is absorbed by the powder, and then an amine based surface active agent is added thereto.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品の電極形
成に用いられる導電性厚膜ペースト、およびその製造方
法、ならびに導電性厚膜ペーストを用いた積層セラミッ
クコンデンサに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive thick film paste used for forming electrodes of electronic parts, a method for manufacturing the same, and a multilayer ceramic capacitor using the conductive thick film paste.

【0002】[0002]

【従来の技術】従来より、積層セラミックコンデンサの
電極を形成する材料として、導電性厚膜ペーストが用い
られている。このような導電性厚膜ペーストとしては、
Ni、Cu、Ag、Pd等からなる導電性粉末を、有機
バインダーと溶剤を混合してなる有機ビヒクル中に分散
させたものが用いられている。
2. Description of the Related Art Conventionally, a conductive thick film paste has been used as a material for forming electrodes of a multilayer ceramic capacitor. As such a conductive thick film paste,
A material in which a conductive powder made of Ni, Cu, Ag, Pd, or the like is dispersed in an organic vehicle obtained by mixing an organic binder and a solvent is used.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、従来の
導電性厚膜ペーストは、導電性粉末の粒径が1μm以下
の微粒子を用いた場合に、ペースト製造後に粘度が経時
的に上昇し、スクリーン印刷等の方法によりグリーンシ
ート上に印刷する際に膜厚の変動が起こりやすいという
問題点があった。このように、膜厚が不均一な電極乾燥
膜を積層し焼結した場合、体積変化の不均一さに起因す
るデラミネーションやクラックが発生しやすいという問
題点があった。
However, in the case of a conventional conductive thick film paste, when fine particles having a particle diameter of 1 μm or less are used for the conductive thick film paste, the viscosity increases with time after the paste is produced, and screen printing is performed. There is a problem that the film thickness tends to fluctuate when printing on a green sheet by the method described above. As described above, when an electrode dry film having a non-uniform film thickness is laminated and sintered, there is a problem that delamination and cracks are likely to occur due to non-uniform volume change.

【0004】そこで、このような微粒の導電性粉末を効
果的に均一に分散させるために、添加剤として分散剤を
添加する方法がある。すなわち、NiやCu等の導電性
粉末の表面は塩基性を呈しており、例えば、酸−塩基的
な相互作用を考慮して、アニオン性高分子分散剤を添加
する方法がある。しかしながら、分散剤を添加すること
で、導電性粉末の溶剤への濡れは促進され、より短時間
で均一な混合系を形成することができるが、高分子分散
剤は過剰な吸着サイトが単一粒子のみならず、複数の粒
子と3次元的な架橋を形成しやすく、このような架橋が
進行すると粘度上昇やゲル化する問題が新たに発生す
る。
In order to effectively and uniformly disperse such fine conductive powder, there is a method of adding a dispersant as an additive. That is, the surface of a conductive powder such as Ni or Cu exhibits basicity. For example, there is a method of adding an anionic polymer dispersant in consideration of acid-base interaction. However, by adding a dispersant, wetting of the conductive powder with the solvent is promoted, and a uniform mixture can be formed in a shorter time. It is easy to form a three-dimensional cross-link with not only the particles but also a plurality of particles, and when such cross-linking proceeds, a problem such as an increase in viscosity and gelation newly occurs.

【0005】本発明の目的は、上述の問題点を解消すべ
くなされたもので、平均粒径1μm以下の導電性粉末を
用いた導電性厚膜ペーストでありながら分散性に優れ、
かつ経時的な粘度変化の少ない導電性厚膜ペーストおよ
びその製造方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and it is an electroconductive thick film paste using an electroconductive powder having an average particle diameter of 1 μm or less, and has excellent dispersibility.
It is another object of the present invention to provide a conductive thick film paste with less change in viscosity with time and a method for producing the same.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明の導電性厚膜ペーストは、平均粒径1μm以
下の導電性粉末と、有機ビヒクルと、からなる導電性厚
膜ペーストにおいて、アミン系界面活性剤と、アニオン
性高分子分散剤と、を添加することを特徴とする。
Means for Solving the Problems To achieve the above object, a conductive thick film paste of the present invention is a conductive thick film paste comprising a conductive powder having an average particle diameter of 1 μm or less and an organic vehicle. , An amine-based surfactant and an anionic polymer dispersant.

【0007】また、前記アミン系界面活性剤は、アルキ
レンオキサイドまたはその重合体と、アルキル基または
水素と、からなることを特徴とする。
The amine surfactant is characterized by comprising an alkylene oxide or a polymer thereof, an alkyl group or hydrogen.

【0008】また、前記アミン系界面活性剤は、前記導
電性厚膜ペースト100重量部のうち、0.1〜5.0
重量部含有することを特徴とする。
The amine-based surfactant is used in an amount of 0.1 to 5.0 parts by weight based on 100 parts by weight of the conductive thick film paste.
It is characterized by containing by weight.

【0009】また、前記導電性粉末は、Ni粉末、およ
びCu粉末、これらの金属粉末を含む合金粉末から選ば
れる1種または2種以上からなることを特徴とする。
The conductive powder is made of one or more selected from Ni powder, Cu powder, and alloy powders including these metal powders.

【0010】また、本発明の導電性厚膜ペーストの製造
方法は、アニオン性高分子分散剤と導電性粉末を混合し
て、前記導電性粉末に前記アニオン性高分子分散剤を吸
着させた中間ペーストを得る工程と、前記中間ペースト
に前記アミン系界面活性剤を添加する工程と、を備える
ことを特徴とする。
[0010] The method for producing a conductive thick film paste of the present invention is characterized in that an anionic polymer dispersant and a conductive powder are mixed, and the conductive powder is adsorbed with the anionic polymer dispersant. A step of obtaining a paste; and a step of adding the amine-based surfactant to the intermediate paste.

【0011】また、本発明の積層セラミックコンデンサ
は、上述した導電性厚膜ペーストを用いて内部電極を形
成したことを特徴とする。
Further, a multilayer ceramic capacitor according to the present invention is characterized in that internal electrodes are formed using the above-mentioned conductive thick film paste.

【0012】[0012]

【発明の実施の形態】本発明の特徴は、導電性厚膜ペー
スト中における導電性粉末の分散性を高めるために添加
するアニオン性高分子分散剤の過剰な吸着サイト、すな
わち酸サイトを添加剤で中和する点に特徴がある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A feature of the present invention is that an excess of anionic polymer dispersing agent added to enhance the dispersibility of the conductive powder in the conductive thick film paste, that is, an acid site, is used as an additive. It is characterized by neutralizing with.

【0013】このような添加剤としては、塩基性の低分
子化合物または界面活性剤の添加が挙げられ、アルキレ
ンオキサイドまたはその重合体と、アルキル基または水
素とからなるアミン系界面活性剤を用いたところ、効果
的にその粘度上昇を抑制することができた。
Examples of such an additive include addition of a basic low-molecular compound or a surfactant. An amine surfactant comprising an alkylene oxide or a polymer thereof and an alkyl group or hydrogen is used. However, the increase in viscosity could be effectively suppressed.

【0014】アミン系界面活性剤の添加量は、導電性厚
膜ペースト100重量部のうち、0.1〜5.0重量部
含有することが好ましい。すなわち、添加量が0.1重
量部未満であると、添加効果が十分に発揮されず、粘度
上昇を抑制することができない。また、添加量が5.0
重量部を超えると、導電性厚膜ペーストの粘度が著しく
低下し、印刷ペーストとしての適性粘度が得られない。
The amount of the amine surfactant is preferably 0.1 to 5.0 parts by weight based on 100 parts by weight of the conductive thick film paste. That is, if the addition amount is less than 0.1 part by weight, the effect of addition is not sufficiently exhibited, and the increase in viscosity cannot be suppressed. In addition, the amount added is 5.0.
If the amount is more than 10 parts by weight, the viscosity of the conductive thick film paste is remarkably reduced, and an appropriate viscosity as a printing paste cannot be obtained.

【0015】また、導電性粉末は、Ni粉末、およびC
u粉末、これらの金属粉末を含む合金粉末から選ばれる
1種または2種以上からなることが好ましい。これらの
金属粉末または合金粉末は、一般に導電性厚膜ペースト
の導電成分として用いられている。
The conductive powder is Ni powder and C powder.
It is preferable to use one or more selected from u powders and alloy powders containing these metal powders. These metal powders or alloy powders are generally used as a conductive component of a conductive thick film paste.

【0016】また、本発明の導電性厚膜ペーストの製造
方法としては、アニオン性高分子分散剤と導電性粉末を
混合して、前記導電性粉末に前記アニオン性高分子分散
剤を吸着させた中間ペーストを得る工程と、前記中間ペ
ーストに前記アミン系界面活性剤を添加する工程と、を
備えることが好ましい。すなわち、アニオン性高分子分
散剤を導電性粉末に吸着させる必要があるが、アニオン
性高分子分散剤を添加した後にアミン系界面活性剤を添
加すると、アニオン性高分子分散剤はアミン系界面活性
剤と吸着することなく導電性粉末に十分に吸着するた
め、導電性粉末の分散効果が十分に向上する。
Further, in the method for producing the conductive thick film paste of the present invention, an anionic polymer dispersant and a conductive powder are mixed, and the anionic polymer dispersant is adsorbed on the conductive powder. It is preferable to include a step of obtaining an intermediate paste and a step of adding the amine-based surfactant to the intermediate paste. In other words, it is necessary to adsorb the anionic polymer dispersant to the conductive powder, but if the amine surfactant is added after the addition of the anionic polymer dispersant, the anionic polymer dispersant becomes amine-based surfactant. Since it is sufficiently adsorbed to the conductive powder without being adsorbed by the agent, the effect of dispersing the conductive powder is sufficiently improved.

【0017】また、本発明の導電性厚膜ペーストは、積
層セラミックコンデンサの内部電極として用いられるこ
とが好ましい。近年、積層セラミックコンデンサの軽薄
短小化が進み、内部電極形成に用いられる導電性厚膜ペ
ーストに対しては、より一層の導電性粉末の微粒化が求
められている。このような要求に対し、本発明の導電性
厚膜ペーストは、平均粒径1μm以下の導電性粉末を用
いた導電性厚膜ペーストでありながら分散性に優れ、か
つ経時的な粘度変化の少ないという優位性を備えてい
る。
It is preferable that the conductive thick film paste of the present invention is used as an internal electrode of a multilayer ceramic capacitor. 2. Description of the Related Art In recent years, multilayer ceramic capacitors have become lighter, thinner and smaller, and there is a demand for a finer conductive powder in a conductive thick film paste used for forming internal electrodes. In response to such demands, the conductive thick film paste of the present invention is a conductive thick film paste using a conductive powder having an average particle diameter of 1 μm or less, yet has excellent dispersibility and little change in viscosity over time. It has the advantage.

【0018】[0018]

【実施例】まず、溶剤としてテルピネオール80重量部
と、有機バインダーとしてエチルセルロース樹脂20重
量部を準備し、溶剤に有機バインダーを添加した後、撹
拌機により均一に混合させて有機ビヒクルを得る。
First, 80 parts by weight of terpineol as a solvent and 20 parts by weight of an ethylcellulose resin as an organic binder are prepared. After the organic binder is added to the solvent, the mixture is uniformly mixed with a stirrer to obtain an organic vehicle.

【0019】次に、有機ビヒクル45重量部と、ポリア
クリル酸−ポリアクリル酸エステル系のアニオン性高分
子分散剤5重量部と、平均粒径0.5μmのNi粉末5
0重量部を添加し、3本ロールにて均一に分散させるこ
とにより、第1中間ペーストを得た。
Next, 45 parts by weight of an organic vehicle, 5 parts by weight of a polyacrylic acid-polyacrylate based anionic polymer dispersant, and Ni powder 5 having an average particle diameter of 0.5 μm were prepared.
The first intermediate paste was obtained by adding 0 parts by weight and uniformly dispersing with a three-roll mill.

【0020】次に、表1に示すように、異なる添加量の
オキシエチレンドデシルアミンからなるアミン系界面活
性剤を準備し、乳鉢に移した第1中間ペーストに添加し
混合して、試料1ないし7の導電性厚膜ペーストを得
た。
Next, as shown in Table 1, different addition amounts of amine surfactants composed of oxyethylene dodecylamine were prepared, added to the first intermediate paste transferred to the mortar, mixed, and the samples 1 to 7 was obtained.

【0021】そこで、試料1ないし7の導電性厚膜ペー
ストの初期粘度を計測し、大気中25℃で30日間放置
した後、再び粘度を計測し、粘度変化を求めた。
Therefore, the initial viscosities of the conductive thick film pastes of Samples 1 to 7 were measured, and after standing in air at 25 ° C. for 30 days, the viscosities were measured again to determine the change in viscosity.

【0022】なお、導電性厚膜ペーストの粘度測定は、
株式会社トキメック社製のE型粘度計を用いて、25
℃、2.5rpmで測定を行った。評価に用いた試料1
ないし7の導電性厚膜ぺーストの初期粘度の許容範囲
は、18±3Pa・sとした。粘度変化率は、次式によ
って求めた。 粘度変化率(%)=(30日後の粘度−初期粘度)/初
期粘度×100 総合評価は、本発明の範囲内の試料については○を、範
囲外の試料については×とした。
The viscosity of the conductive thick film paste was measured as follows.
Using an E-type viscometer manufactured by Tokimec Co., Ltd., 25
The measurement was performed at 2.5 ° C. and 2.5 ° C. Sample 1 used for evaluation
The allowable range of the initial viscosity of the conductive thick film paste of Nos. 7 to 7 was 18 ± 3 Pa · s. The viscosity change rate was determined by the following equation. Viscosity change rate (%) = (Viscosity after 30 days−Initial viscosity) / Initial viscosity × 100 In the overall evaluation, ○ was given to samples within the range of the present invention, and × was given to samples outside the range.

【0023】[0023]

【表1】 [Table 1]

【0024】表1から明らかであるように、試料2ない
し6の導電性厚膜ペーストは、初期粘度が15.1ない
し20.0Pa・sであり、初期粘度の許容範囲である
18±3Pa・sの範囲内となった。これに対して、オ
キシエチレンドデシルアミンを添加しなかった試料1な
らびに5.50重量部添加した試料7は、それぞれ2
2.2Pa・s、12.3Pa・sで許容範囲外となっ
た。
As is clear from Table 1, the conductive thick film pastes of Samples 2 to 6 have an initial viscosity of 15.1 to 20.0 Pa · s and an allowable range of the initial viscosity of 18 ± 3 Pa · s. s. On the other hand, Sample 1 to which oxyethylene dodecylamine was not added and Sample 7 to which 5.50 parts by weight were added were 2
It was out of the allowable range at 2.2 Pa · s and 12.3 Pa · s.

【0025】30日後の粘度変化率は、オキシエチレン
ドデシルアミンを0.10重量部、1.50重量部、
3.50重量部、5.00重量部添加した試料3ないし
6は、0.6%ないし1.0%で大変小さく優れた。こ
れに対して、オキシエチレンドデシルアミンを0.05
重量部添加した試料2は、139.0%で大きく劣り、
初期粘度で許容範囲外であった試料1と試料7について
も、それぞれ155.9%、−34.1%で同様に大き
く劣った。
After 30 days, the rate of change in viscosity was as follows: 0.10 parts by weight of oxyethylene dodecylamine, 1.50 parts by weight,
Samples 3 to 6 to which 3.50 parts by weight and 5.00 parts by weight were added were 0.6% to 1.0%, which were very small and excellent. On the other hand, 0.05% of oxyethylene dodecylamine was added.
The weight of Sample 2 was 139.0%, which was significantly inferior.
Samples 1 and 7, which had initial viscosities outside the allowable range, were similarly inferior at 155.9% and -34.1%, respectively.

【0026】[0026]

【発明の効果】以上のように本発明によれば、平均粒径
1μm以下の導電性粉末と、有機ビヒクルと、からなる
導電性厚膜ペーストにおいて、アミン系界面活性剤と、
アニオン性高分子分散剤と、を添加することで、平均粒
径1μm以下の導電性粉末を用いた導電性厚膜ペースト
であっても、分散性に優れ、かつ経時的な粘度変化が少
ないという効果が得られる。
As described above, according to the present invention, in a conductive thick film paste comprising a conductive powder having an average particle diameter of 1 μm or less and an organic vehicle, an amine-based surfactant,
By adding an anionic polymer dispersant, the conductive thick film paste using a conductive powder having an average particle size of 1 μm or less has excellent dispersibility and has little change in viscosity with time. The effect is obtained.

【0027】また、前記アミン系界面活性剤は、アルキ
レンオキサイドまたはその重合体と、アルキル基または
水素と、からなることで、上述した効果がより確実に発
揮される。
The above-mentioned effects are more reliably exhibited when the amine-based surfactant comprises an alkylene oxide or a polymer thereof, and an alkyl group or hydrogen.

【0028】また、前記アミン系界面活性剤は、前記導
電性厚膜ペースト100重量部のうち、0.1〜5.0
重量部含有することで、上述した効果がより確実に発揮
される。
The amine-based surfactant is used in an amount of 0.1 to 5.0 parts by weight based on 100 parts by weight of the conductive thick film paste.
By containing the parts by weight, the above-mentioned effects are more reliably exhibited.

【0029】また、前記導電性粉末は、Ni粉末、およ
びCu粉末、これらの金属粉末を含む合金粉末から選ば
れる1種または2種以上からなることで、電子部品の電
極形成に好適な導電性厚膜ペーストが得られるという効
果が得られる。
Further, the conductive powder is composed of one or more selected from Ni powder, Cu powder, and alloy powder including these metal powders, so that the conductive powder suitable for forming an electrode of an electronic component is formed. The effect that a thick film paste is obtained is obtained.

【0030】また、本発明の導電性厚膜ペーストは、積
層セラミックコンデンサの内部電極に用いられること
で、微粒の導電性粉末を含有する導電性厚膜ペーストの
効果が十分に発揮される。
When the conductive thick film paste of the present invention is used for an internal electrode of a multilayer ceramic capacitor, the effect of the conductive thick film paste containing fine conductive powder is sufficiently exhibited.

【0031】また、アニオン性高分子分散剤と導電性粉
末を混合して、前記導電性粉末に前記アニオン性高分子
分散剤を吸着させた中間ペーストを得る工程と、前記中
間ペーストに前記アミン系界面活性剤を添加する工程
と、を備えることを特徴とすることで、平均粒径1μm
以下の導電性粉末を用いた導電性厚膜ペーストでありな
がら分散性に優れ、かつ経時的な粘度変化の少ない導電
性厚膜ペーストを製造することができる。
A step of mixing an anionic polymer dispersant and a conductive powder to obtain an intermediate paste in which the conductive powder adsorbs the anionic polymer dispersant; Adding a surfactant, the average particle diameter is 1 μm
Although it is a conductive thick film paste using the following conductive powder, it is possible to produce a conductive thick film paste having excellent dispersibility and little change in viscosity over time.

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 平均粒径1μm以下の導電性粉末と、有
機ビヒクルと、からなる導電性厚膜ペーストにおいて、 アミン系界面活性剤と、アニオン性高分子分散剤と、を
添加することを特徴とする導電性厚膜ペースト。
1. A conductive thick film paste comprising a conductive powder having an average particle size of 1 μm or less and an organic vehicle, wherein an amine-based surfactant and an anionic polymer dispersant are added. Conductive thick film paste.
【請求項2】 前記アミン系界面活性剤は、アルキレン
オキサイドまたはその重合体と、アルキル基または水素
と、からなることを特徴とする請求項1に記載の導電性
厚膜ペースト。
2. The conductive thick film paste according to claim 1, wherein the amine surfactant comprises an alkylene oxide or a polymer thereof, and an alkyl group or hydrogen.
【請求項3】 前記アミン系界面活性剤は、前記導電性
厚膜ペースト100重量部のうち、0.1〜5.0重量
部含有することを特徴とする請求項1または2に記載の
導電性厚膜ペースト。
3. The conductive material according to claim 1, wherein the amine-based surfactant is contained in an amount of 0.1 to 5.0 parts by weight based on 100 parts by weight of the conductive thick film paste. Thick film paste.
【請求項4】 前記導電性粉末は、Ni粉末、およびC
u粉末、これらの金属粉末を含む合金粉末から選ばれる
1種または2種以上からなることを特徴とする請求項1
ないし3の何れかに記載の導電性厚膜ペースト。
4. The conductive powder comprises Ni powder and C powder.
2. A powder comprising one or two or more selected from u powder and an alloy powder containing these metal powders.
4. The conductive thick film paste according to any one of items 1 to 3.
【請求項5】 アニオン性高分子分散剤と導電性粉末を
混合して、前記導電性粉末に前記アニオン性高分子分散
剤を吸着させた中間ペーストを得る工程と、 前記中間ペーストに前記アミン系界面活性剤を添加する
工程と、を備えることを特徴とする導電性厚膜ペースト
の製造方法。
5. A step of mixing an anionic polymer dispersant and a conductive powder to obtain an intermediate paste in which the anionic polymer dispersant is adsorbed to the conductive powder; Adding a surfactant. A method for producing a conductive thick film paste, comprising:
【請求項6】 請求項1ないし4の何れかに記載の導電
性厚膜ペーストを用いて内部電極を形成したことを特徴
とする積層セラミックコンデンサ。
6. A multilayer ceramic capacitor, wherein an internal electrode is formed by using the conductive thick film paste according to claim 1.
JP18045099A 1999-06-25 1999-06-25 Conductive thick film paste, method for producing the same, and multilayer ceramic capacitor using the same Expired - Lifetime JP4161472B2 (en)

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