JPH06325614A - Conductive paste - Google Patents

Conductive paste

Info

Publication number
JPH06325614A
JPH06325614A JP13690093A JP13690093A JPH06325614A JP H06325614 A JPH06325614 A JP H06325614A JP 13690093 A JP13690093 A JP 13690093A JP 13690093 A JP13690093 A JP 13690093A JP H06325614 A JPH06325614 A JP H06325614A
Authority
JP
Japan
Prior art keywords
powder
conductive
conductive powder
conductive paste
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP13690093A
Other languages
Japanese (ja)
Inventor
Masaki Fujiyama
Shuji Mushimoto
Akira Otani
明 大谷
正樹 藤山
修二 虫本
Original Assignee
Murata Mfg Co Ltd
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Mfg Co Ltd, 株式会社村田製作所 filed Critical Murata Mfg Co Ltd
Priority to JP13690093A priority Critical patent/JPH06325614A/en
Publication of JPH06325614A publication Critical patent/JPH06325614A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To apply powder in uniform thickness without deformation during applying and drying processes, and enhance reliability without edge cut or the like during a baking process by using mixture conductive powder where globular and flat conductive powders are mixed. CONSTITUTION:In conductive paste including conductive powder, glass frit. and an organic vehicle, mixture conductive powder incorporating globular conductive powder mixed with flat conductive powder is used. Consequently, the globular conductive powder is suitably mixed with the flat conductive powder, thus enhancing a shape holding property, preventing generation of a recess or the like during a drying process of the applied conductive paste, and restraining contraction of an applying layer during a baking process so as to prevent generation of edge cut. As a result, in the case of formation of an external electrode for ceramic electronic parts, it is possible to form an applying layer having a uniform thickness, and further to form the external electrode having high reliability without any deficiency such as edge cut during a baking process.

Description

【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】この発明は、導電性ペーストに関
し、詳しくは、積層セラミックコンデンサなどのセラミ
ック電子部品の外部電極形成用の導電性ペーストに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste, and more particularly to a conductive paste for forming external electrodes of ceramic electronic parts such as laminated ceramic capacitors.
【0002】[0002]
【従来の技術】積層セラミックコンデンサなどのセラミ
ック電子部品の外部電極(端子電極)を形成するために
用いられる従来の導電性ペーストにおいては、通常、導
電粉末(例えばCu粉末)として、球状の導電粉末が使
用されており、この球状の導電粉末に、ガラスフリット
と有機ビヒクルを混合することにより導電性ペーストが
形成されている。
2. Description of the Related Art In conventional conductive pastes used for forming external electrodes (terminal electrodes) of ceramic electronic parts such as monolithic ceramic capacitors, spherical conductive powders are usually used as conductive powders (eg Cu powders). Is used, and a conductive paste is formed by mixing glass frit and an organic vehicle with this spherical conductive powder.
【0003】[0003]
【発明が解決しようとする課題】しかし、上記従来の導
電性ペーストのように、球状の導電粉末のみを使用した
導電性ペーストを用いてセラミック電子部品(例えば積
層セラミックコンデンサ)の外部電極を形成した場合、
セラミック電子部品(素体)上に導電性ペーストを均一
な厚みに塗布することが困難で、例えば図2に示すよう
に、塗布乾燥工程で、セラミック電子部品(素体)11
に塗布された導電性ペースト(外部電極)12の厚みが
最も大きくなる端面側中央部分などにくぼみ13が形成
されるという問題点がある。
However, like the above-mentioned conventional conductive paste, the external electrode of the ceramic electronic component (for example, a laminated ceramic capacitor) is formed by using a conductive paste using only spherical conductive powder. If
It is difficult to apply the conductive paste on the ceramic electronic component (element) with a uniform thickness. For example, as shown in FIG.
There is a problem that the recess 13 is formed in the central portion of the end face side where the thickness of the conductive paste (external electrode) 12 applied to the outermost part is maximum.
【0004】また、均一な厚みに塗布することが困難
で、エッジ部分の膜厚が薄くなるため、乾燥後の焼付け
工程において、図3に示すように、セラミック電子部品
11に形成された外部電極12にエッジ切れ(外部電極
12がエッジ部分14で断線すること)が発生するとい
う問題点がある。
Further, since it is difficult to apply a uniform thickness and the film thickness at the edge portion becomes thin, the external electrodes formed on the ceramic electronic component 11 in the baking process after drying as shown in FIG. 12 has a problem that an edge breakage (the external electrode 12 is disconnected at the edge portion 14) occurs.
【0005】この発明は、上記問題点を解決するもので
あり、積層セラミックコンデンサなどのセラミック電子
部品の外部電極を形成するのに用いた場合において、塗
布乾燥工程でくぼみなどの変形が生じず、均一な厚みに
塗布することが可能であるとともに、焼付け工程でエッ
ジ切れなどが発生することがなく、信頼性の高い外部電
極を形成することが可能な導電性ペーストを提供するこ
とを目的とする。
The present invention solves the above-mentioned problems, and when it is used to form an external electrode of a ceramic electronic component such as a monolithic ceramic capacitor, deformation such as a dent does not occur in the coating and drying step, It is an object of the present invention to provide a conductive paste that can be applied to a uniform thickness and that can form highly reliable external electrodes without causing edge breakage or the like in the baking process. .
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
に、この発明の導電性ペーストは、積層セラミックコン
デンサなどのセラミック電子部品の外部電極形成用の導
電性ペーストであって、球状の導電粉末と扁平形状の導
電粉末とを混合した混合導電粉末と、ガラスフリット
と、有機ビヒクルとを含有することを特徴とする。
In order to achieve the above object, the conductive paste of the present invention is a conductive paste for forming an external electrode of a ceramic electronic component such as a laminated ceramic capacitor, which is spherical conductive powder. And a flat conductive powder, mixed glass powder, glass frit, and organic vehicle.
【0007】また、前記導電粉末がCu粉末であり、か
つ、扁平形状の導電粉末(Cu粉末)の割合が、導電粉
末(Cu粉末)全体の10〜50重量%の範囲にあるこ
とを特徴とする。
The conductive powder is Cu powder, and the ratio of the flat conductive powder (Cu powder) is in the range of 10 to 50% by weight based on the whole conductive powder (Cu powder). To do.
【0008】なお、この発明の導電性ペーストにおい
て、球状の導電粉末とは、真球状の導電粉末に限らず、
多少変形した球状や扁平でない多面体形状の導電粉末な
どを含む概念である。
In the conductive paste of the present invention, the spherical conductive powder is not limited to the true spherical conductive powder,
It is a concept that includes a slightly deformed spherical or non-flat polyhedral conductive powder.
【0009】[0009]
【作用】導電粉末として、球状の導電粉末と、扁平形状
の導電粉末とを混合した混合導電粉末が用いられている
ため、球状の導電粉末と扁平形状の導電粉末が適度にか
らみ合って保形性が向上し、塗布された導電性ペースト
の乾燥工程におけるくぼみなどの変形の発生が防止され
るとともに、焼付け工程における塗布層の収縮が抑制さ
れ、エッジ切れの発生を防止することが可能になる。
[Function] As the conductive powder, the mixed conductive powder obtained by mixing the spherical conductive powder and the flat conductive powder is used, so that the spherical conductive powder and the flat conductive powder are appropriately entangled with each other to maintain the shape. Property is improved, the occurrence of deformation such as dents in the drying step of the applied conductive paste is prevented, the contraction of the coating layer in the baking step is suppressed, and the occurrence of edge breakage can be prevented. .
【0010】したがって、積層セラミックコンデンサな
どのセラミック電子部品の外部電極を形成する場合に、
厚みが均一な塗布層を形成することができるとともに、
焼付け工程でエッジ切れなどの不具合が生じない信頼性
の高い外部電極を形成することが可能になる。
Therefore, when forming an external electrode of a ceramic electronic component such as a monolithic ceramic capacitor,
While it is possible to form a coating layer with a uniform thickness,
It is possible to form a highly reliable external electrode that does not cause a defect such as edge breakage in the baking process.
【0011】また、焼付け工程における外部電極の収縮
を抑えることが可能になるため、セラミック電子部品素
体(例えば積層セラミックコンデンサ素体)にかかる応
力を低下させてクラックなどの不良の発生を防止するこ
とが可能になる。
Further, since it becomes possible to suppress the contraction of the external electrodes in the baking process, the stress applied to the ceramic electronic component element body (for example, the laminated ceramic capacitor element body) is reduced to prevent the occurrence of defects such as cracks. It will be possible.
【0012】[0012]
【実施例】以下、この発明の実施例を比較例とともに示
してその特徴とするところをさらに詳しく説明する。
EXAMPLES Hereinafter, examples of the present invention will be shown together with comparative examples, and the features thereof will be described in more detail.
【0013】この実施例の導電性ペーストを調製するに
あたっては、次のような材料を用い、それらを下記の配
合割合となるように配合した。 導電粉末 種類 :Cu粉末(球状粉末及び扁平形状粉末) 配合割合 :導電性ペーストに対して70重量% ガラスフリット 種類 :ホウケイ酸亜鉛とホウケイ酸バリウムの
混合フリット 配合割合 :導電性ペーストに対して5重量% 有機ビヒクル 種類(組成):アクリル樹脂をブチルセルソルブで溶解
したもの 配合割合 :導電性ペーストに対して25重量%
In preparing the conductive paste of this example, the following materials were used and they were compounded in the following compounding ratios. Conductive powder type: Cu powder (spherical powder and flat-shaped powder) Mixing ratio: 70 wt% with respect to conductive paste Glass frit type: Mixed frit of zinc borosilicate and barium borosilicate Mixing ratio: 5 with respect to conductive paste Weight% Organic vehicle Type (composition): Acrylic resin dissolved in butyl cellosolve Blending ratio: 25% by weight to conductive paste
【0014】そして、上記の割合で各材料が配合された
導電性ペースト中の、Cu粉末の球状粉末と扁平形状粉
末の配合比を、表1に示すような割合で変化させた。
Then, the compounding ratio of the spherical powder of Cu powder and the flat-shaped powder in the conductive paste in which the respective materials were compounded in the above ratios was changed in the ratios shown in Table 1.
【0015】それから、このようにして調製した試料
(導電性ペースト)を用いてセラミック電子部品(この
実施例では積層セラミックコンデンサ)の外部電極(端
子電極)を形成した。図1は、直方体形状の積層セラミ
ックコンデンサ(素体)1の両端側に、この実施例の導
電性ペーストを用いて外部電極2を形成した積層セラミ
ックコンデンサを示す平面図である。
Then, an external electrode (terminal electrode) of a ceramic electronic component (multilayer ceramic capacitor in this embodiment) was formed using the sample (conductive paste) thus prepared. FIG. 1 is a plan view showing a laminated ceramic capacitor in which external electrodes 2 are formed on both ends of a rectangular parallelepiped laminated ceramic capacitor (element body) 1 using the conductive paste of this embodiment.
【0016】そして、上記のようにして形成した外部電
極2の状態(くぼみやエッジ切れの発生の有無など)を
調べるとともに、積層セラミックコンデンサ1から取得
できる静電容量の大きさを測定した。その結果を表1に
示す。
Then, the state of the external electrode 2 formed as described above (whether or not dents or edge breakage occurred, etc.) was examined, and the magnitude of the capacitance that could be obtained from the monolithic ceramic capacitor 1 was measured. The results are shown in Table 1.
【0017】[0017]
【表1】 [Table 1]
【0018】なお、表1において、試料番号に*印を付
したものはこの発明の範囲外の組成の試料(比較例)で
あり、その他はこの発明の範囲内の組成の試料(実施
例)である。
In Table 1, samples marked with * are samples having compositions outside the scope of the present invention (comparative examples), and others are samples having compositions within the scope of the present invention (examples). Is.
【0019】表1に示すように、扁平形状のCu粉末を
含まない球状のCu粉末のみを使用した導電性ペースト
(試料番号1)を用いて形成した外部電極においては、
乾燥工程におけるくぼみの発生や、焼付け工程における
エッジ切れの発生が認められた。さらに、焼付け工程に
おける収縮が大きいため、接続が切れたりすることによ
る静電容量の低下が認められた。
As shown in Table 1, in the external electrode formed using the conductive paste (Sample No. 1) using only spherical Cu powder containing no flat Cu powder,
Occurrence of dimples in the drying process and edge breakage in the baking process were observed. Furthermore, since the shrinkage in the baking process is large, the capacitance is decreased due to disconnection.
【0020】また、Cu粉末全体に対する扁平形状のC
u粉末の割合が50重量%を越えた導電性ペースト(試
料番号6及び7)を用いて形成した外部電極には、外観
不良(焼付け工程における突起の発生)が認められた。
Further, the flat C-shape of the whole Cu powder is used.
The external electrodes formed by using the conductive paste (Sample Nos. 6 and 7) in which the proportion of the u powder exceeded 50% by weight were found to have a poor appearance (protrusions during the baking process).
【0021】これに対して、Cu粉末全体に対する扁平
形状のCu粉末の割合が10〜50重量%の範囲にある
導電性ペースト(試料番号2〜5)を用いて形成した外
部電極は、乾燥工程においてくぼみなどの変形の発生が
なく、厚みが均一な塗布層を形成することができるとと
もに、焼付け後にも、エッジ切れや突起の発生が認めら
れず、静電容量の低下も認められなかった。
On the other hand, the external electrode formed by using the conductive paste (Sample Nos. 2 to 5) in which the ratio of the flat Cu powder to the entire Cu powder is in the range of 10 to 50% by weight is the drying step. No deformation such as dents was formed, and a coating layer having a uniform thickness could be formed, and even after baking, no edge breakage or protrusion was observed, and no decrease in capacitance was observed.
【0022】したがって、Cu粉末全体に対する扁平形
状のCu粉末の割合は、10〜50重量%の範囲にある
ことが好ましい。
Therefore, the ratio of the flat Cu powder to the entire Cu powder is preferably in the range of 10 to 50% by weight.
【0023】なお、この発明の導電性ペーストを用いて
形成した外部電極はそのままでも使用することが可能で
あるが、半田濡れ性などの特性を向上させるために、例
えば、Niメッキ+Snメッキや、Niメッキ+半田メ
ッキなどの処理を施すことも可能である。
Although the external electrode formed by using the conductive paste of the present invention can be used as it is, in order to improve characteristics such as solder wettability, for example, Ni plating + Sn plating, It is also possible to perform processing such as Ni plating + solder plating.
【0024】また、上記実施例では、導電粉末としてC
u粉末を用いた場合について説明したが、この発明の導
電性ペーストにおいては、導電粉末はCu粉末に限られ
るものではなく、例えばAg粉末などの他の金属粉末、
あるいはAg−Pd粉末のような合金粉末などを導電粉
末として用いることが可能である。
In the above embodiment, the conductive powder is C
Although the case where u powder is used has been described, in the conductive paste of the present invention, the conductive powder is not limited to Cu powder, and other metal powder such as Ag powder,
Alternatively, an alloy powder such as Ag-Pd powder can be used as the conductive powder.
【0025】さらに、上記実施例では、この発明の導電
性ペーストを用いて積層セラミックコンデンサの外部電
極を形成した場合について説明したが、この発明の導電
性ペーストは、積層セラミックコンデンサの外部電極の
みではなく、セラミック半導体や正特性サーミスタ装置
などの種々のセラミック電子部品の外部電極を形成する
場合に使用することが可能である。
Further, in the above embodiment, the case where the external electrode of the laminated ceramic capacitor is formed by using the conductive paste of the present invention has been described. However, the conductive paste of the present invention is formed only by the external electrode of the laminated ceramic capacitor. However, it can be used for forming external electrodes of various ceramic electronic components such as ceramic semiconductors and PTC thermistor devices.
【0026】この発明は、さらにその他の点においても
上記実施例に限定されるものではなく、ガラスフリット
や有機ビヒクルの種類、あるいは、導電粉末、ガラスフ
リット及び有機ビヒクルの配合割合などに関し、発明の
要旨の範囲内において種々の応用、変形を加えることが
可能である。
The present invention is not limited to the above-mentioned embodiments in other points as well, and relates to the kinds of glass frit and organic vehicle, the mixing ratio of conductive powder, glass frit and organic vehicle, and the like. Various applications and modifications can be made within the scope of the gist.
【0027】[0027]
【発明の効果】上述のように、この発明の導電性ペース
トは、導電粉末として、球状の導電粉末と、扁平形状の
導電粉末とを混合した混合導電粉末を用いているため、
積層セラミックコンデンサなどのセラミック電子部品の
外部電極を形成する場合において、塗布乾燥工程でくぼ
みなどの変形が発生せず、均一な厚みに塗布することが
できる。
As described above, the conductive paste of the present invention uses the mixed conductive powder obtained by mixing the spherical conductive powder and the flat conductive powder as the conductive powder.
When forming an external electrode of a ceramic electronic component such as a monolithic ceramic capacitor, deformation such as a dent does not occur in the coating and drying step, and coating can be performed with a uniform thickness.
【0028】そして、均一な厚みに塗布することができ
るため、焼付け工程でエッジ切れなどが発生することを
防止することができるとともに、例えば、積層セラミッ
クコンデンサの外部電極の形成に用いた場合には、所定
の静電容量を安定して取得することが可能な信頼性の高
い外部電極を形成することができる。
Further, since it can be applied to a uniform thickness, it is possible to prevent the occurrence of edge breakage in the baking process and, for example, when it is used for forming an external electrode of a monolithic ceramic capacitor. It is possible to form a highly reliable external electrode capable of stably obtaining a predetermined electrostatic capacity.
【0029】また、扁平形状の導電粉末を配合すること
により、外部電極の収縮率を抑えることが可能になり、
セラミック電子部品(素体)にかかる応力を低下させて
クラックなどの不良の発生を防止することが可能にな
る。
Further, by blending the flat conductive powder, the shrinkage ratio of the external electrode can be suppressed,
It is possible to reduce the stress applied to the ceramic electronic component (element) and prevent the occurrence of defects such as cracks.
【図面の簡単な説明】[Brief description of drawings]
【図1】この発明の導電性ペーストを用いて外部電極を
形成したセラミック電子部品(積層セラミックコンデン
サ)を示す平面図である。
FIG. 1 is a plan view showing a ceramic electronic component (multilayer ceramic capacitor) in which external electrodes are formed using the conductive paste of the present invention.
【図2】従来の導電性ペーストを塗布した後の乾燥工程
で塗布層にくぼみが発生した状態を示す平面図である。
FIG. 2 is a plan view showing a state in which a dent is generated in a coating layer in a drying process after applying a conventional conductive paste.
【図3】従来の導電性ペーストを用いて形成した外部電
極にエッジ切れが発生した状態を示す平面図である。
FIG. 3 is a plan view showing a state in which edge breakage has occurred in an external electrode formed using a conventional conductive paste.
【符号の説明】[Explanation of symbols]
1 セラミック電子部品(積層セラミックコ
ンデンサ) 2 外部電極(導電性ペースト)
1 Ceramic electronic component (multilayer ceramic capacitor) 2 External electrode (conductive paste)

Claims (2)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 積層セラミックコンデンサなどのセラミ
    ック電子部品の外部電極形成用の導電性ペーストであっ
    て、 球状の導電粉末と扁平形状の導電粉末とを混合した混合
    導電粉末と、ガラスフリットと、有機ビヒクルとを含有
    することを特徴とする導電性ペースト。
    1. A conductive paste for forming an external electrode of a ceramic electronic component such as a monolithic ceramic capacitor, which is a mixed conductive powder in which spherical conductive powder and flat conductive powder are mixed, glass frit, and an organic material. A conductive paste containing a vehicle.
  2. 【請求項2】 前記導電粉末がCu粉末であり、かつ、
    扁平形状の導電粉末(Cu粉末)の割合が、導電粉末
    (Cu粉末)全体の10〜50重量%の範囲にあること
    を特徴とする請求項1記載の導電性ペースト。
    2. The conductive powder is Cu powder, and
    The conductive paste according to claim 1, wherein the proportion of the flat conductive powder (Cu powder) is in the range of 10 to 50% by weight based on the whole conductive powder (Cu powder).
JP13690093A 1993-05-14 1993-05-14 Conductive paste Withdrawn JPH06325614A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13690093A JPH06325614A (en) 1993-05-14 1993-05-14 Conductive paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13690093A JPH06325614A (en) 1993-05-14 1993-05-14 Conductive paste

Publications (1)

Publication Number Publication Date
JPH06325614A true JPH06325614A (en) 1994-11-25

Family

ID=15186193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13690093A Withdrawn JPH06325614A (en) 1993-05-14 1993-05-14 Conductive paste

Country Status (1)

Country Link
JP (1) JPH06325614A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134351A (en) * 2000-10-30 2002-05-10 Kyocera Corp Conductive paste and laminated ceramic capacitor using the same
JP2003068560A (en) * 2001-08-23 2003-03-07 Murata Mfg Co Ltd Laminated ceramic capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134351A (en) * 2000-10-30 2002-05-10 Kyocera Corp Conductive paste and laminated ceramic capacitor using the same
JP2003068560A (en) * 2001-08-23 2003-03-07 Murata Mfg Co Ltd Laminated ceramic capacitor

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