JPH0897527A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH0897527A JPH0897527A JP23517394A JP23517394A JPH0897527A JP H0897527 A JPH0897527 A JP H0897527A JP 23517394 A JP23517394 A JP 23517394A JP 23517394 A JP23517394 A JP 23517394A JP H0897527 A JPH0897527 A JP H0897527A
- Authority
- JP
- Japan
- Prior art keywords
- silver powder
- conductive paste
- flake
- ceramic capacitor
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 13
- 238000005245 sintering Methods 0.000 abstract description 11
- 230000035939 shock Effects 0.000 abstract description 8
- 230000008602 contraction Effects 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は導電性ペーストに係り、
特に、焼成時の焼結収縮が少ない端子電極を形成するこ
とができ、これにより耐熱衝撃性に優れた積層セラミッ
クコンデンサを作製することができる導電性ペーストに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste,
In particular, the present invention relates to a conductive paste capable of forming a terminal electrode with less sintering shrinkage during firing, thereby producing a laminated ceramic capacitor having excellent thermal shock resistance.
【０００２】[0002]
【従来の技術】積層セラミックコンデンサの端子電極
は、従来、有機ビヒクルと、導電性金属粉としての銀粉
及び素体セラミックスとの接合を図るためのガラスフリ
ットを固形分として含む導電性ペーストを用いて形成さ
れている。具体的には、この導電性ペーストをディップ
法により素体セラミックスに塗布し、乾燥後焼成を行っ
て端子電極が形成されている。一般には、この端子電極
には、耐はんだ喰われ性の向上のために、更にめっき被
膜が形成される。このめっき被膜としては、耐熱性が良
好なニッケル被膜がバリア層として形成され、更にその
上にはんだ濡れ性向上のためにはんだめっき被膜が形成
されている。2. Description of the Related Art Conventionally, a terminal electrode of a monolithic ceramic capacitor uses a conductive paste containing a glass frit as a solid content for bonding an organic vehicle to silver powder as a conductive metal powder and a base ceramic. Has been formed. Specifically, this conductive paste is applied to the elemental ceramics by a dipping method, dried and baked to form the terminal electrodes. Generally, a plating film is further formed on the terminal electrode in order to improve resistance to solder erosion. As this plating film, a nickel film having good heat resistance is formed as a barrier layer, and a solder plating film is further formed thereon for improving solder wettability.
【０００３】なお、従来の導電性ペーストにおいて、銀
粉としては、球状の銀粉が用いられている。In the conventional conductive paste, spherical silver powder is used as the silver powder.
【０００４】[0004]
【発明が解決しようとする課題】従来の導電性ペースト
で形成された端子電極では焼成時の焼結収縮が大きいこ
とから、素体セラミックスに負荷される熱応力（ストレ
ス）が大きく、このことが積層セラミックコンデンサの
耐熱衝撃性劣化の要因となっていた。Since the terminal electrode formed of the conventional conductive paste has a large sinter shrinkage during firing, the thermal stress (stress) applied to the elemental ceramics is large. It was a factor of deterioration of thermal shock resistance of the monolithic ceramic capacitor.
【０００５】本発明は上記従来の問題点を解決し、焼成
時の端子電極の焼結収縮が少なく、耐熱衝撃性に優れた
積層セラミックコンデンサを作製することができる導電
性ペーストを提供することを目的とする。The present invention solves the above-mentioned conventional problems and provides a conductive paste capable of producing a monolithic ceramic capacitor excellent in thermal shock resistance with less sintering shrinkage of a terminal electrode during firing. To aim.
【０００６】[0006]
【課題を解決するための手段】請求項１の導電性ペース
トは、銀粉と有機ビヒクルとを含む導電性ペーストにお
いて、該銀粉の４０重量％以上がフレーク状銀粉である
ことを特徴とする。The conductive paste according to claim 1 is characterized in that, in the conductive paste containing silver powder and an organic vehicle, 40% by weight or more of the silver powder is flaky silver powder.
【０００７】請求項２の導電性ペーストは、請求項１に
おいて、銀粉のうちの４０〜８５重量％がフレーク状銀
粉であり、残部が球状銀粉であることを特徴とする。A conductive paste according to a second aspect of the present invention is characterized in that, in the first aspect, 40 to 85% by weight of the silver powder is flaky silver powder, and the balance is spherical silver powder.
【０００８】請求項３の導電性ペーストは、請求項１又
は２において、積層セラミックコンデンサの端子電極形
成用導電性ペーストであることを特徴とする。A third aspect of the present invention is the conductive paste according to the first or second aspect, which is a conductive paste for forming a terminal electrode of a laminated ceramic capacitor.
【０００９】以下に本発明を詳細に説明する。The present invention will be described in detail below.
【００１０】本発明の導電性ペーストにおいては、銀粉
の少なくとも一部をフレーク状銀粉とする。In the conductive paste of the present invention, at least a part of the silver powder is flake silver powder.
【００１１】本発明で用いるフレーク状銀としては、取
り扱い性及び電極の焼結収縮低減効果の面から、粒径
（偏平面方向の長さ）５〜１０μｍで厚さ１〜３μｍの
ものが好ましい。The flake silver used in the present invention preferably has a grain size of 5 to 10 μm and a thickness of 1 to 3 μm from the viewpoint of handleability and the effect of reducing the sintering shrinkage of the electrode. .
【００１２】本発明において、用いる銀粉中のフレーク
状銀粉の割合が４０重量％未満であると、本発明による
焼結収縮低減効果が十分に得られない。しかしながら、
フレーク状銀粉はその割合が多過ぎると得られる導電性
ペーストの流動性が低下し、取り扱い性、塗布作業性が
悪化するため、銀粉としては、フレーク状銀粉４０〜８
５重量％と、残部球状銀粉との混合粉を用いるのが好ま
しい。なお球状銀粉としては平均粒径１〜３μｍのもの
を用いるのが好ましい。In the present invention, if the ratio of the flake silver powder in the silver powder used is less than 40% by weight, the effect of reducing the sintering shrinkage according to the present invention cannot be sufficiently obtained. However,
If the flake-shaped silver powder is too large in proportion, the fluidity of the conductive paste to be obtained is lowered, and the handling property and the coating workability are deteriorated. Therefore, the flake-shaped silver powder 40 to 8 is used as the silver powder.
It is preferable to use a mixed powder of 5% by weight and the balance spherical silver powder. The spherical silver powder preferably has an average particle size of 1 to 3 μm.
【００１３】本発明の導電性ペーストは、このようなフ
レーク状銀粉を含む銀粉、好ましくはフレーク状銀粉と
球状銀粉との混合銀粉を用い、例えば下記配合にて、好
ましくは粘度２００〜６００ポアズの導電性ペーストと
することにより容易に調製することができる。The conductive paste of the present invention uses silver powder containing such flake-shaped silver powder, preferably mixed silver powder of flake-shaped silver powder and spherical silver powder, for example, in the following formulation, preferably with a viscosity of 200 to 600 poise. It can be easily prepared by using a conductive paste.
【００１４】導電性ペースト配合（重量％） 銀粉：６０〜８０ ガラスフリット：１〜３ 有機ビヒクル：３９〜１７ なお、有機ビヒクルとは、バインダーとしてエチルセル
ロース等と粘度調整剤としてブチルカルビトール等を含
むものである。 Blending of conductive paste (wt%) Silver powder: 60-80 Glass frit: 1-3 Organic vehicle: 39-17 The organic vehicle includes ethyl cellulose as a binder and butyl carbitol as a viscosity modifier. It is a waste.
【００１５】このような本発明の導電性ペーストによれ
ば、常法に従ってディップ法により素体セラミックスに
塗布した後乾燥して焼成することにより、容易に積層セ
ラミックコンデンサに端子電極を形成することができ、
焼結時の端子電極の収縮を減少させて素体セラミックス
へのストレスを低減することにより耐熱衝撃性に優れた
積層セラミックコンデンサを製造することができる。According to such a conductive paste of the present invention, a terminal electrode can be easily formed on a monolithic ceramic capacitor by applying it to a body ceramics by a dipping method according to a conventional method, then drying and firing. You can
A multilayer ceramic capacitor having excellent thermal shock resistance can be manufactured by reducing the contraction of the terminal electrode during sintering and reducing the stress on the elemental ceramics.
【００１６】[0016]
【作用】銀粉の４０重量％以上をフレーク状銀粉とする
ことにより、得られる電極の焼結収縮を大幅に低減する
ことができる。By using 40% by weight or more of the silver powder as flaky silver powder, the sintering shrinkage of the obtained electrode can be significantly reduced.
【００１７】銀粉としてフレーク状銀粉のみを用いる
と、得られる導電性ペーストの流動性が損なわれるが、
銀粉の４０〜８５重量％をフレーク状銀粉とし、残部を
球状銀粉とすることにより、流動性が良好で取り扱い
性、塗布作業性に優れた導電性ペーストとなる。When only flake-shaped silver powder is used as the silver powder, the fluidity of the resulting conductive paste is impaired,
By using 40 to 85% by weight of the silver powder as flake-shaped silver powder and the rest as spherical silver powder, a conductive paste having good fluidity, handleability and coating workability can be obtained.
【００１８】本発明の導電性ペーストは、特に積層セラ
ミックコンデンサの端子電極形成用導電性ペーストとし
て、工業的に極めて有用である。The conductive paste of the present invention is industrially very useful particularly as a conductive paste for forming terminal electrodes of a laminated ceramic capacitor.
【００１９】[0019]
【実施例】以下に実施例及び比較例を挙げて、本発明を
より具体的に説明する。EXAMPLES The present invention will be described more specifically with reference to Examples and Comparative Examples below.
【００２０】実施例１ 下記粒径のフレーク状銀粉と球状銀粉とを表１に示す割
合で混合した混合銀粉を用い、下記配合にて導電性ペー
ストを調製した。なお、ペーストの粘度は２８０±３０
ポアズになるように調整した。Example 1 A conductive paste was prepared with the following composition by using a mixed silver powder in which flaky silver powder having the following particle diameter and spherical silver powder were mixed at the ratio shown in Table 1. The viscosity of the paste is 280 ± 30
Adjusted to be poise.
【００２１】フレーク状銀粉 平均粒径：５μｍ 平均厚さ：２μｍ球状銀粉 平均粒径：２μｍ導電性ペースト配合（重量％） 混合銀：７４ 有機ビヒクル：２３ ガラスフリット：３ 得られた導電性ペーストを、各々、４．５ｍｍ×３．２
ｍｍ、厚さ１．６ｍｍのチタン酸バリウムを主成分とす
る誘電体を用いた積層セラミックコンデンサ素体にディ
ップ法により塗布し、２０℃／分の速さで昇温乾燥し、
更に６８０〜７２０℃で１０分間焼成することにより端
子電極を形成した。その後、更に、電解めっき法により
バリア層としてニッケル層と、はんだ濡れ性向上のため
にはんだめっき層を形成してコンデンサを作製した。 Flake-shaped silver powder average particle diameter: 5 μm Average thickness: 2 μm Spherical silver powder average particle diameter: 2 μm Mixed with a conductive paste (wt%) Mixed silver: 74 Organic vehicle: 23 Glass frit: 3 The obtained conductive paste was used. , 4.5 mm x 3.2, respectively
mm, thickness 1.6 mm, applied to a monolithic ceramic capacitor body using a dielectric material containing barium titanate as a main component by a dip method, and dried by heating at a rate of 20 ° C./min.
Furthermore, the terminal electrode was formed by baking at 680-720 degreeC for 10 minutes. Thereafter, a nickel layer as a barrier layer and a solder plating layer for improving solder wettability were further formed by electrolytic plating to prepare a capacitor.
【００２２】作製したコンデンサについて、次の方法に
より熱衝撃試験を行った。即ち、作製したコンデンサ１
００個を、ロジン系フラックスに浸漬後、３５０±５℃
に温度調節したはんだ槽へピンセットで一個づつ３秒間
浸漬した後、引き上げ、外観を観察して、１００個中の
クラックの発生数を調べ、結果を表１に示した。A thermal shock test was performed on the manufactured capacitor by the following method. That is, the manufactured capacitor 1
After soaking 00 pieces in rosin flux, 350 ± 5 ℃
Each piece was dipped into the solder bath whose temperature was adjusted to 3 by using tweezers for 3 seconds, then pulled up, the appearance was observed, and the number of cracks in 100 pieces was checked. The results are shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】表１より、本発明の導電性ペーストによれ
ば、耐熱衝撃性に優れたコンデンサを得ることができる
ことが明らかである。From Table 1, it is clear that the conductive paste of the present invention can provide a capacitor having excellent thermal shock resistance.
【００２５】[0025]
【発明の効果】以上詳述した通り、本発明の導電性ペー
ストによれば、形成する電極の焼成時の焼結収縮を少な
くすることができる。このため、端子電極の焼結収縮が
少ないことから、耐熱衝撃性に優れた積層セラミックコ
ンデンサを作製することが可能とされる。As described above in detail, according to the conductive paste of the present invention, it is possible to reduce the sintering shrinkage of the formed electrode during firing. Therefore, the sintering shrinkage of the terminal electrode is small, so that it is possible to manufacture a monolithic ceramic capacitor having excellent thermal shock resistance.
【００２６】請求項２の導電性ペーストによれば、流動
性が良好で、取り扱い性、塗布作業性にも優れた導電性
ペーストが提供される。According to the conductive paste of the second aspect, a conductive paste having good fluidity and excellent handleability and coating workability is provided.
【００２７】このような本発明の導電性ペーストは、積
層セラミックコンデンサの端子電極形成用導電性ペース
トとして工業的に極めて有用である。Such a conductive paste of the present invention is industrially very useful as a conductive paste for forming a terminal electrode of a laminated ceramic capacitor.
Claims (3)
ストにおいて、該銀粉の４０重量％以上がフレーク状銀
粉であることを特徴とする導電性ペースト。1. A conductive paste containing silver powder and an organic vehicle, wherein 40% by weight or more of the silver powder is flaky silver powder.
８５重量％がフレーク状銀粉であり、残部が球状銀粉で
あることを特徴とする導電性ペースト。2. The silver powder according to claim 1, wherein
85% by weight is flake-shaped silver powder, and the rest is spherical silver powder, a conductive paste.
クコンデンサの端子電極形成用導電性ペーストであるこ
とを特徴とする導電性ペースト。3. The conductive paste according to claim 1, which is a conductive paste for forming a terminal electrode of a laminated ceramic capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23517394A JPH0897527A (en) | 1994-09-29 | 1994-09-29 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23517394A JPH0897527A (en) | 1994-09-29 | 1994-09-29 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0897527A true JPH0897527A (en) | 1996-04-12 |
Family
ID=16982153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23517394A Withdrawn JPH0897527A (en) | 1994-09-29 | 1994-09-29 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0897527A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004362950A (en) * | 2003-06-05 | 2004-12-24 | Noritake Co Ltd | Conductive paste mainly composed of silver powder, and its manufacturing method |
| JP2005268204A (en) * | 2004-02-19 | 2005-09-29 | Murata Mfg Co Ltd | Conductive paste and ceramic electronic component |
| CN102842353A (en) * | 2012-08-14 | 2012-12-26 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| CN103440899A (en) * | 2013-08-15 | 2013-12-11 | 广东风华高新科技股份有限公司 | Silver electrode paste |
| JP2014182891A (en) * | 2013-03-18 | 2014-09-29 | Fdk Corp | Conductive paste, laminated chip inductor, and ceramic electronic component |
| JP2015111576A (en) * | 2014-12-24 | 2015-06-18 | ナミックス株式会社 | Conductive paste for external electrode, and multilayered ceramic electronic part with external electrode formed by conductive paste |
| JP2016076444A (en) * | 2014-10-08 | 2016-05-12 | 化研テック株式会社 | Conductive paste and electromagnetic wave shielding member |
-
1994
- 1994-09-29 JP JP23517394A patent/JPH0897527A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004362950A (en) * | 2003-06-05 | 2004-12-24 | Noritake Co Ltd | Conductive paste mainly composed of silver powder, and its manufacturing method |
| JP2005268204A (en) * | 2004-02-19 | 2005-09-29 | Murata Mfg Co Ltd | Conductive paste and ceramic electronic component |
| CN102842353A (en) * | 2012-08-14 | 2012-12-26 | 廖晓峰 | Electrocondution slurry for chip component termination electrode |
| JP2014182891A (en) * | 2013-03-18 | 2014-09-29 | Fdk Corp | Conductive paste, laminated chip inductor, and ceramic electronic component |
| CN103440899A (en) * | 2013-08-15 | 2013-12-11 | 广东风华高新科技股份有限公司 | Silver electrode paste |
| JP2016076444A (en) * | 2014-10-08 | 2016-05-12 | 化研テック株式会社 | Conductive paste and electromagnetic wave shielding member |
| JP2015111576A (en) * | 2014-12-24 | 2015-06-18 | ナミックス株式会社 | Conductive paste for external electrode, and multilayered ceramic electronic part with external electrode formed by conductive paste |
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