JPH0810191Y2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JPH0810191Y2
JPH0810191Y2 JP1990077848U JP7784890U JPH0810191Y2 JP H0810191 Y2 JPH0810191 Y2 JP H0810191Y2 JP 1990077848 U JP1990077848 U JP 1990077848U JP 7784890 U JP7784890 U JP 7784890U JP H0810191 Y2 JPH0810191 Y2 JP H0810191Y2
Authority
JP
Japan
Prior art keywords
lead frame
pressing member
wire bonding
bonding
vertical movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990077848U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459142U (enExample
Inventor
聡蔵 鳥越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1990077848U priority Critical patent/JPH0810191Y2/ja
Publication of JPH0459142U publication Critical patent/JPH0459142U/ja
Application granted granted Critical
Publication of JPH0810191Y2 publication Critical patent/JPH0810191Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990077848U 1990-07-24 1990-07-24 ワイヤボンディング装置 Expired - Fee Related JPH0810191Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990077848U JPH0810191Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990077848U JPH0810191Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH0459142U JPH0459142U (enExample) 1992-05-21
JPH0810191Y2 true JPH0810191Y2 (ja) 1996-03-27

Family

ID=31809537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990077848U Expired - Fee Related JPH0810191Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810191Y2 (enExample)

Also Published As

Publication number Publication date
JPH0459142U (enExample) 1992-05-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees