JPH0810189Y2 - ワイヤボンディング装置のヒートブロック構造 - Google Patents

ワイヤボンディング装置のヒートブロック構造

Info

Publication number
JPH0810189Y2
JPH0810189Y2 JP1990069905U JP6990590U JPH0810189Y2 JP H0810189 Y2 JPH0810189 Y2 JP H0810189Y2 JP 1990069905 U JP1990069905 U JP 1990069905U JP 6990590 U JP6990590 U JP 6990590U JP H0810189 Y2 JPH0810189 Y2 JP H0810189Y2
Authority
JP
Japan
Prior art keywords
heat block
communication
wire bonding
atmosphere gas
outlets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990069905U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0430732U (enExample
Inventor
芳春 中富
Original Assignee
トーソク株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トーソク株式会社 filed Critical トーソク株式会社
Priority to JP1990069905U priority Critical patent/JPH0810189Y2/ja
Publication of JPH0430732U publication Critical patent/JPH0430732U/ja
Application granted granted Critical
Publication of JPH0810189Y2 publication Critical patent/JPH0810189Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/0711

Landscapes

  • Wire Bonding (AREA)
JP1990069905U 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造 Expired - Fee Related JPH0810189Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990069905U JPH0810189Y2 (ja) 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990069905U JPH0810189Y2 (ja) 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造

Publications (2)

Publication Number Publication Date
JPH0430732U JPH0430732U (enExample) 1992-03-12
JPH0810189Y2 true JPH0810189Y2 (ja) 1996-03-27

Family

ID=31605614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990069905U Expired - Fee Related JPH0810189Y2 (ja) 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造

Country Status (1)

Country Link
JP (1) JPH0810189Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2576973Y2 (ja) * 1991-11-21 1998-07-23 ソニー株式会社 ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0430732U (enExample) 1992-03-12

Similar Documents

Publication Publication Date Title
JPH0810189Y2 (ja) ワイヤボンディング装置のヒートブロック構造
TW201843036A (zh) 具有冷卻功能的鞋底模具
US7402778B2 (en) Oven for controlled heating of compounds at varying temperatures
JPH0531231U (ja) ワイヤボンダーのヒータブロツク
US4108712A (en) Heat sealing machine with cooling means
US4764235A (en) Process and apparatus for sealing semiconductor packages
CN210254791U (zh) 一种高效加热的焊线机机构及包括该机构的焊线机
US5087590A (en) Method of manufacturing semiconductor devices
JPH0755001Y2 (ja) ボンダの雰囲気カバー
JPH087633Y2 (ja) ワイヤボンディング装置の雰囲気構造
JP3964939B2 (ja) 光学素子成形装置
JPS6051267B2 (ja) 電子部品の成型方法
JP2818870B2 (ja) ワイヤボンディング装置
JPH0619546Y2 (ja) 加熱硬化装置
CN119974444B (zh) 一种用于绝缘层注塑模具的双层水路结构及使用方法
JPS611442A (ja) シエル鋳型の製造方法及び装置
JPS599869Y2 (ja) 真空成形装置
JPS6448022U (enExample)
KR20010073812A (ko) 코어의 냉각 구조 및 그 형성방법
JP2998603B2 (ja) チップのボンディング装置
JPH10146852A (ja) 光学素子成形用素材及び光学素子の成形方法
JPH01133710A (ja) レジンモールド金型
KR0139127Y1 (ko) 반도체패키지 제조용 몰딩프레스의 금형 발열장치
JP2861821B2 (ja) モールドプレス装置
JP2000156385A (ja) 電子部品の樹脂封止成形方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees