JPH0810189Y2 - ワイヤボンディング装置のヒートブロック構造 - Google Patents

ワイヤボンディング装置のヒートブロック構造

Info

Publication number
JPH0810189Y2
JPH0810189Y2 JP1990069905U JP6990590U JPH0810189Y2 JP H0810189 Y2 JPH0810189 Y2 JP H0810189Y2 JP 1990069905 U JP1990069905 U JP 1990069905U JP 6990590 U JP6990590 U JP 6990590U JP H0810189 Y2 JPH0810189 Y2 JP H0810189Y2
Authority
JP
Japan
Prior art keywords
heat block
communication
wire bonding
atmosphere gas
outlets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990069905U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0430732U (enrdf_load_stackoverflow
Inventor
芳春 中富
Original Assignee
トーソク株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トーソク株式会社 filed Critical トーソク株式会社
Priority to JP1990069905U priority Critical patent/JPH0810189Y2/ja
Publication of JPH0430732U publication Critical patent/JPH0430732U/ja
Application granted granted Critical
Publication of JPH0810189Y2 publication Critical patent/JPH0810189Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990069905U 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造 Expired - Fee Related JPH0810189Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990069905U JPH0810189Y2 (ja) 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990069905U JPH0810189Y2 (ja) 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造

Publications (2)

Publication Number Publication Date
JPH0430732U JPH0430732U (enrdf_load_stackoverflow) 1992-03-12
JPH0810189Y2 true JPH0810189Y2 (ja) 1996-03-27

Family

ID=31605614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990069905U Expired - Fee Related JPH0810189Y2 (ja) 1990-06-30 1990-06-30 ワイヤボンディング装置のヒートブロック構造

Country Status (1)

Country Link
JP (1) JPH0810189Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2576973Y2 (ja) * 1991-11-21 1998-07-23 ソニー株式会社 ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0430732U (enrdf_load_stackoverflow) 1992-03-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees