JPH0810188Y2 - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPH0810188Y2
JPH0810188Y2 JP1990054556U JP5455690U JPH0810188Y2 JP H0810188 Y2 JPH0810188 Y2 JP H0810188Y2 JP 1990054556 U JP1990054556 U JP 1990054556U JP 5455690 U JP5455690 U JP 5455690U JP H0810188 Y2 JPH0810188 Y2 JP H0810188Y2
Authority
JP
Japan
Prior art keywords
bonding
temporary bonding
temporary
ball
wafer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990054556U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0415238U (enrdf_load_stackoverflow
Inventor
岩実 浦元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1990054556U priority Critical patent/JPH0810188Y2/ja
Publication of JPH0415238U publication Critical patent/JPH0415238U/ja
Application granted granted Critical
Publication of JPH0810188Y2 publication Critical patent/JPH0810188Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990054556U 1990-05-28 1990-05-28 ボンディング装置 Expired - Fee Related JPH0810188Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0415238U JPH0415238U (enrdf_load_stackoverflow) 1992-02-06
JPH0810188Y2 true JPH0810188Y2 (ja) 1996-03-27

Family

ID=31576723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990054556U Expired - Fee Related JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810188Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0415238U (enrdf_load_stackoverflow) 1992-02-06

Similar Documents

Publication Publication Date Title
EP0297244A2 (en) Single lead automatic clamping and bonding system
JPH0845994A (ja) フリップチップの基板へのボンディング方法
CN107305916A (zh) 一种csp封装led的贴片机及其加工工艺
US20010013532A1 (en) Apparatus for positioning a thin plate
JP2009200203A (ja) ダイボンディング装置及びダイボンディング方法
JPH0810188Y2 (ja) ボンディング装置
JP4780858B2 (ja) 半導体装置の製造方法
JPH0793305B2 (ja) バンプ形成方法およびバンプ形成装置
JP3747054B2 (ja) ボンディング装置及びボンディング方法
CN110750179A (zh) 一种用于绑定柔性面板的固定对位装置
US7264994B2 (en) Method of fabricating a semiconductor device
JP4390365B2 (ja) ボンディング方法及び装置
JPS59186334A (ja) ボンデイング装置
JP2746989B2 (ja) チップの位置決め方法およびその装置、インナリードボンディング装置およびインナリードボンディング方法
KR0155774B1 (ko) 다이 본딩방법 및 그 장치
JPH06310569A (ja) 半導体素子のフェースダウンボンディング法
JPS6224635A (ja) フリツプチツプボンダ−
KR102220338B1 (ko) 칩 본딩 장치 및 방법
JPH03206636A (ja) ボンディング装置
JP3253761B2 (ja) アウタリ−ドボンディング装置および方法
KR100295673B1 (ko) 티씨피용리드본딩장치
JP3211801B2 (ja) エキストラボールの検出方法
JPS59186333A (ja) ボンデイング装置
JP2921164B2 (ja) リードのボンディング装置
JP2712592B2 (ja) ボンディング・ツールとその固定方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees