JPH079867B2 - Composite type circuit component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a capacitor used in a television, a VTR, and the like,
The present invention relates to a composite type circuit component having an inductor and the like.

(Prior Art) As a conventional composite type circuit component including a capacitor and an inductor, there is one shown in FIGS. 4 (a) and 4 (b).

The composite type circuit component 1 shown in FIGS. 1A and 1B has an inductor 5 formed by winding a winding around a drum-shaped core on both ends of a conductive plate 6 having a substantially downwardly oriented "E" shape. , 5 and one end of the chip capacitor 8 at the center are respectively connected and mounted, while the other ends of the inductors 5 and 5 and the other end of the chip capacitor 8 are coupled pieces 7L, 7R and 7M, respectively.
It is placed on one end of and connected electrically, and the connecting pieces 7L, 7
Lead wires 3a, 3b and 3c are placed on the other ends of R and 7M and are electrically connected by soldering. Reference numeral 15 in the figure denotes a molding material that covers and includes the connection ends of the lead wires.

In the composite type circuit component as described above, the pusher 2 provided in the automatic insertion machine (not shown) presses the upper portion of the conductive plate 6 in the direction of the arrow A to insert each lead wire into another circuit board. Will be connected. The pusher 2 is made up of a metal cylindrical case 2a and a rubber material 2b filled inside the cylindrical case 2a.

(Problems to be solved by the invention) However, in the composite type circuit component having the above configuration, the lead wires 3a to 3c connected to the coupling pieces 7L, 7M, 7R are used.
Are connected and fixed by the solders 9a to 9c and mainly through the end faces of the respective lead wires, the mechanical strength of the connecting portions is low. Therefore, for example, when mounting on another circuit board (not shown), the force applied at the time of mounting is concentrated on the connecting portion between the intermediate coupling piece and the lead wire connected to this. Can result in damage.

Further, when the lead wires and the other circuit board are conductively connected by a bander after being placed on another circuit board, the heat is applied to solder 9a to connect and fix each lead wire to the intermediate coupling piece. There was a problem that 9c was melted, resulting in poor conduction, and in some cases, it could not be shipped as a product.

Therefore, an object of the present invention is to provide a composite type circuit component that solves the above problems.

[Structure of the Invention] (Means for Solving the Problems) The structure of the present invention for achieving the above-mentioned object is a conductive plate in which inductor mounting portions are formed on both blades, and an inductor mounting portion A pair of first intermediate coupling pieces each having an inductor mounting portion formed at opposite ends thereof, and a position where one end is disposed so as to face the central portion of the conductive plate and is sandwiched between the pair of first intermediate coupling pieces. A second intermediate coupling piece disposed in the first intermediate coupling piece and a lead wire coupling portion provided on each of the first intermediate coupling piece and the second intermediate coupling piece, and lead wires coupled to the lead wire coupling portion, respectively. , The inductors mounted on the opposing inductor mounting portions, and the chip capacitors mounted over the central portion of the conductive plate and one end of the second intermediate coupling piece.

(Operation) The operation of the present invention having the above-described structure is to provide a lead wire connecting portion for holding and fixing a connecting end of a lead wire, for example, in the intermediate connecting piece to facilitate the connection of the lead wires and to connect each lead wire. Even when the solder melts due to the heat when conducting electrical connection between the and other circuit boards with solder, the intermediate coupling piece and the lead wire are not separated, and the mechanical strength is improved. There is.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a composite circuit component.

In the figure, the composite circuit component 20 includes a conductive plate 21 in which inductor mounting portions 31L and 31R are formed on both wings 21L and 21R, respectively.
And inductor mounting portions 32L, 32R are formed at the opposite ends of the inductor mounting portions 31L, 31R at a predetermined distance from each other, and a lead wire coupling portion 33 is formed at the other end.
Second intermediary connecting pieces 22, 24 of which one end is arranged to face the central portion of the conductive plate 21 and a lead wire connecting portion 33 is formed at the other end.
Intermediate connecting piece 23 of the first intermediate connecting piece 22, 24
And the second intermediate coupling piece 23, the standing piece at each of the adjacent opposing ends.
34 to 36 are formed, and inductors 25 and 26 formed by winding a winding around drum-shaped cores mounted between the inductor mounting portions 31L and 32L and 31R and 31L that face each other, and the center of the conductive plate 21. And a chip capacitor 27 mounted over one end of the second intermediate coupling piece 23, and lead wires 28 to 30 connected to the lead wire coupling portions 33 of the first and second intermediate coupling pieces. It is configured to have. Reference numeral 55 in the drawing is a molding material that covers the whole including the connecting end portion of the lead wire.

2 (a) is an explanatory view showing the composite circuit component 20 shown in FIG. 1 with the chip capacitors 27, the inductors 25, 26, the molding material 55, and the lead wires 28 to 30 omitted, FIG. 2 (b). ，
(C) and (d) are the BB 'end view and CC', respectively.
It is an end view and EE 'sectional drawing.

In FIG. 3A, inductor mounting portions 31L and 31R each having a substantially downward "E" shape are formed on both sides 21L and 21R of the conductive plate 21 on the same side end 37 side.

The flange portions 25a and 26a of the drum-shaped cores (inductors) 25 and 26 are placed on the inductor placement portions 31L and 31R, respectively. The flange portions 25a and 26a themselves are the inductor placement portions. Of the three projecting pieces 38 to 40, the projecting piece 39 located at the center is bent in the direction perpendicular to the paper surface, and is supported by the remaining projecting pieces 38 and 40. Further, the projecting piece 39 bent at a substantially right angle is brought into contact with the end surface of the drum-shaped core to be placed, and is electrically connected later by solder or the like. In this embodiment, the inductor mounting portions formed on the first intermediate coupling pieces 22 and 24 have the same structure.

At the center of the conductive plate 21, three cutouts 41L, 41M, 41R are formed. As shown in the figure, the conductive plate 21 is formed symmetrically with respect to the plane of the drawing with the notch 41M as the center.
Square notches 41L and 41R are formed at positions equidistant from the circular notches 41M on the left and right sides of the drawing. The chip capacitor 27 is placed between the cutouts 41L and 41R.

In addition, the side end 37 of the central portion where these three notches are formed
On the opposite end side, a standing piece 42 bent at a substantially right angle to the front side of the drawing is formed to project.

As shown in FIG. 3D, the upright piece 42 protects the end portion of the chip capacitor 27 that is placed close to it, and
The mechanical strength of the conductive plate itself is improved.

By the way, the inductor mounting portions 31L and 31R formed on both the wing portions 21L and 21R of the conductive plate 21 face the inductor mounting portions 32L and 32R having the same structure, respectively, and the first intermediate coupling piece 22. , 24 are arranged.

Clamping pieces 43 for holding the round lead wires 28, 30 having flat connecting ends are formed at substantially central portions of the first intermediate coupling pieces 22, 24, respectively. This holding piece 43 is a connecting piece member.
The connecting ends of the lead wires inserted between the holding pieces 22a and 24a and the holding piece 43 are held by the elastic force of the holding pieces 43. The holding piece and the connecting piece member form a lead wire connecting portion.

Similarly, a second intermediate coupling piece 23 is formed at the center of the conductive plate 21.
Are spaced apart from each other and arranged correspondingly.

The second intermediate coupling piece 23 has a chip capacitor mounting portion 44 formed at one end facing the conductive plate 21 and the lead wire coupling portion 33 described above at the other end.

The chip capacitor placing section 44 is a chip capacitor 27.
Upright piece formed to approximately match the width (direction perpendicular to the long axis)
44L and 44R are formed, and a rectangular notch 45 is formed in the center. This cutout portion 45 is provided when the chip capacitor 27 is placed as shown in FIG.
It is formed so as to be located near one end (lower end in the figure) of the long axis.

As described above, the standing pieces 34 are provided at opposite ends of the first and second intermediate connecting pieces 22 and 24 and the second intermediate connecting piece 23, respectively.
35L, 35R, 36 are provided.

The standing pieces 34, 35L, 35R, 36 are formed in the vicinity of the connection ends of the respective intermediate coupling pieces with the lead wires, and the illustrated embodiment is the front side of the drawing, that is, the surface on which the chip capacitor 27 is placed. It is formed by bending it to the side (see (b) of the same figure).

The operation and effect of the composite circuit component having the above configuration will be described with reference to FIGS. 5 (a) and 5 (b).

As shown in FIG. 3A, the first and second intermediate connecting pieces 22, 2
4 and 23 are respectively formed with a holding piece 43 for elastically holding the connecting ends 28a, 29a, 30a of the round lead wires 28, 29, 30 inserted between the intermediate connecting piece members 22a, 24a, 23a. Therefore, the lead wire connection ends 28a, 29a, 30a need only be processed flat. Further, as the lead wire connecting portion 33, it is only necessary to press, for example, a plate-shaped intermediate connecting piece into a substantially downwardly U-shaped shape as shown in FIG. Not only can this be achieved, but the processing steps can be simplified. Further, when the lead wire having the flattened connection end is soldered, the connection area can be increased, so that the mechanical strength of the connection portion can be increased. Further, even if the amount of the applied solder varies, the capillary phenomenon enables reliable soldering. Note that FIG. 5B shows a state in which the lead wire 29 is held by the lead wire coupling piece 33.

By the way, in the completed composite type circuit component, each lead wire is inserted into a lead wire insertion hole (not shown) formed on another circuit board, and is electrically connected by soldering. Even if the solder applied to the lead wire connecting end and the lead wire connecting portion is melted by the heat of the applied solder, the connecting end of the lead wire is formed by the intermediate connecting piece member and the sandwiching piece in the present invention. Since it is held, the lead wire connecting end does not separate from the intermediate coupling piece. Therefore, problems such as poor conduction due to this can be prevented.

Further, a method of forming a bifurcated holding piece at the tip of the lead wire is also conceivable, but this is not practical because it is difficult to process the tip of the lead wire, but according to the present invention, only the plate-shaped body is erected. It has an advantage that it can be easily formed.

Next, regarding the manufacturing method of the composite type circuit component described above,
A description will be given with reference to FIGS.

The conductive plate 21 and the first intermediate coupling pieces 22, 24 shown in FIG.
The second intermediate coupling piece 23 is formed at regular intervals by pressing a metal belt (also referred to as a lead frame) 49 made of, for example, an aluminum alloy or copper as shown in FIG. 3 (a). I am trying to let you. More specifically, sprocket holes 48 are formed in the metal belt at regular intervals, and the metal belt is intermittently conveyed in the direction of arrow D through the sprocket holes 48. As indicated by the arrow 46, the conductive plate, the first intermediate coupling piece, the second intermediate piece
Then, press working is applied to a shape including a portion to be an intermediate coupling piece and a portion to be an upright piece. Then, at the next predetermined position, as shown by the arrow 47, the standing pieces 42, 44L, 44R, 39,
34, 35L, 35R, 36 and the holding pieces 43 are bent and formed.

The inductor is mounted on the inductor mounting portion formed as described above. Then apply cream solder,
Solder.

After applying the cream solder to the position where the chip capacitor is soldered, the second intermediate coupling piece 23 and the conductive plate 21 are connected.
A chip capacitor 27 is mounted over the area. At this time, the standing piece 42 formed on the conductive plate 21 functions as a positioning member for the chip capacitor 27.

As above, inductors 25 and 26, chip capacitor 2
If 7 is mounted and connected, lead frame 49 and conductive plate,
Cut the part that should become the first and second intermediate joining pieces.

The round lead wires 28 to 30, whose one end is flattened as shown in FIG. 3B, are inserted into the lead wire coupling portions 33 described above.

At this time, since the connection ends 28a to 30a of the lead wires are flat, the connection becomes easier. Further, at this time, since each lead wire is temporarily fixed by the lead wire coupling portion, the design in the manufacturing process can be facilitated.

Further, a plurality of round lead wires are fixed to a transfer belt 20 made of, for example, paper at a predetermined interval M and are intermittently transferred by sprocket holes 51, as shown in FIG. The predetermined interval M is an interval corresponding to each of the lead wire coupling portions 33 here.

The composite type circuit component (shown in FIG. 7C) assembled as described above is coated with, for example, a synthetic resin or the like.

The composite circuit component is completed by the above steps.

The present invention is not limited to the illustrated embodiments, and various modifications can be made within the scope of the invention.

[Effects of the Invention] As described in detail above, according to the present invention, the connection of the lead wires is facilitated, and the solder is melted by the heat when the lead wires and the other circuit board are conductively connected by the solder. Even in such a case, it is possible to provide a composite circuit component in which the intermediate coupling piece and the lead wire are not separated from each other and the mechanical strength is improved.

[Brief description of drawings]

FIG. 1 is a plan view of a composite type circuit component according to an embodiment of the present invention, and FIG. 2 (a) is an explanatory view showing the composite type circuit component shown in FIG. 1 with an inductor, a chip capacitor and lead wires omitted. 2 (b) and 2 (c) are BB ′ end views and CC ′ end views shown in FIG. 2 (a), and FIG. 2 (d) is EE shown in FIG. 2 (a). ′ A cross-sectional view, FIG. 3 (a) is an explanatory view of the lead frame for a composite circuit component shown in FIG. 1, FIGS. 4 (b) to (d) are explanatory views of a manufacturing process, and FIG. 4 (a),
(B) is an explanatory view of a conventional composite circuit component, FIG. 5 (a),
(B) is explanatory drawing at the time of connecting a lead wire to a lead wire coupling | bond part, respectively, (a) is a schematic front view, (b) is the EE 'sectional drawing. 21 ... Conductive plate, 22, 24 ... First intermediate coupling piece, 22a, 23a, 24a ...
Coupling piece member, 23 ... Second intermediate coupling piece, 25, 26 ... Inductor, 27 ... Chip capacitor, 28, 29, 30 ... Lead wire, 31L,
31R, 32L, 321R ... Inductor mounting portion, 33 ... Lead wire coupling portion, 43 ... Holding piece.

Claims (3)

[Claims] 1. A conductive plate having inductor mounting portions formed on both wing portions, a pair of first intermediate coupling pieces having an inductor mounting portion formed at one end facing each inductor mounting portion, and one end. And a second intermediate coupling piece disposed opposite to the central portion of the conductive plate and sandwiched between the pair of first intermediate coupling pieces. The second intermediate coupling piece is provided with lead wire coupling portions, respectively, the lead wires coupled to the lead wire coupling portions, the inductors respectively mounted on the opposing inductor mounting portions, the conductive plate central portion and the first conductive plate. 2. A composite type circuit component having a chip capacitor mounted over one end of the intermediate coupling piece 2. 2. The composite circuit component according to claim 1, wherein the lead wire coupling portion elastically holds the lead wire. 3. The composite circuit component according to claim 1, wherein the lead wire is a round lead wire having a flat connection end with the lead wire coupling portion.