JPS63283008A - Composite type circuit component part - Google Patents

Abstract

PURPOSE:To specify the displacement of a mounted chip capacitor while specifying and limiting the coating amount of cream solder by forming cutouts at the mounting section of the capacitor at a conductive plate and an intermediate coupling piece respectively. CONSTITUTION:A conductive plated 21 has an inductor connector to be connected with parts of inductors 25, 26 at both wing parts. A chip capacitor 27 is mounted across the center of a conductive plate 21 and one end of an intermediate coupling piece 23. In this case, three cutouts 41L, 41M, 41R are formed at the center of the plates 21. The capacitor 27 is placed between the cutouts 41L and 41R. Thus, the amount of the coating of cream solder is specified and limited and the displacement of the capacitor to be placed is specified.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a composite circuit component having a capacitor, an inductor, etc. used in televisions, VTRs, etc.

(Prior Art) Conventional composite circuit components including capacitors, inductors, etc. are shown in FIGS. 4(a) and 4(b).

The V-composite circuit component 1 shown in FIGS. 12(a) and (b) is constructed by winding wires around drum-shaped cores at both ends of a conductive plate 6, which is a plate-shaped member having a schematically downward rEJT shape. One end of the inductors 5, 5 and one end of a chip capacitor 8 are mounted and connected in the center part, and the other end of the inductor 5,
The other end of the capacitor 5 and the other end of the depth capacitor 8 are each connected to a coupling piece 7L.

The lead wires 3a, 3 are placed on one pane of 7R17M to make a conductive connection, and the other ends of the connecting pieces 7L, 7R, 7M are roughly connected.
b and 3c are mounted and electrically connected by solder. In addition, numeral 15 in the figure is a molding material that includes and covers the connection end of each wire.

In the composite circuit component as described above, each lead wire is inserted into another circuit board by pressing the upper part of the conductive plate 6 in the direction of the arrow by a pusher v2 provided on an automatic insertion FA (not shown). Becomes connected. The bushing 2 is composed of a metal cylindrical case 2a and, for example, a rubber material 2b filled inside the case 2a.

(Problems to be Solved by the Invention) (Details above) In the conventional composite circuit component 1 described above, the conductive plate 6 is mounted across the center of the plate-shaped conductive plate 6 and one end of the coupling piece 7M. The chip capacitor 8 is connected via cream solder applied to the center and one end of the coupling piece 7M.
This will result in a conductive connection.

However, the depth capacitor 8 mounted on the conductive plate 6 and the coupling piece 7M as described above slips when mounted as a result of being electrically connected via the fluid ream solder, and as shown in the figure. There was a problem in that it was displaced as shown by the two-dot chain line 9°10, and the connection was fixed in that displaced state.

However, with the above-mentioned method, not only is it impossible to mount and connect the dip condenser at the desired position, but due to differences in the viscosity of the applied cream solder, the application area expands to areas other than the area where the chip capacitor is mounted. The chip capacitor will be displaced in the cream solder application area.

Therefore, if this state is left unattended, not only will it be impossible to mount the chip capacitor using an automatic insertion machine, but there may also be a situation where the chip capacitor, the conductive plate, and the coupling piece are not connected.

Therefore, an object of the present invention is to provide a composite circuit component that solves these problems.

[Structure of the Invention] (Means for Solving the Problems) The structure of the present invention for solving the above-mentioned problems includes a conductive plate in which an interface connection part to which a part of the inductor is connected is formed on both wing parts, respectively. , Ga11 is placed in the center of this conductive plate in the direction of the direction, and an intermediate connecting piece to which the lead wire is connected to the other end is placed on the right, extending between the temporary central part of the wire and one end of this intermediate connecting piece. In a composite circuit component that includes a chip capacitor to be placed, the conductive plate has a notch formed close to the outside of both ends of the chip capacitor to be placed in the center, and the intermediate coupling piece has a The capacitor is characterized by having a notch formed close to the other end of the chip capacitor to be placed.

(Function) The function of the present invention having the above-mentioned configuration is to form notches in the portions of the conductive plate and the intermediate coupling piece where the chip capacitor is mounted, to regulate and limit the cream solder coating area, and to The displacement of the mounted chip capacitor is regulated.

(Example) An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of the composite circuit component.

In the figure, the composite circuit component 20 has both wing parts 21L, 2
Inductor mounting portions 31L and 3 are provided on the same side of 1R, respectively.
The conductive plate 21 formed with 1R and the inductor mounting portion 3
A predetermined path l! is provided at the end opposite to 1L and 31R. ! l apart,
Inductor mounting portions 32L and 32r are formed respectively, and two first intermediate coupling pieces 22゜2 are formed with a lead wire coupling portion 33 at the (t!! end).
4, one end of which is disposed opposite to the center of the conductive plate 21,
This first intermediate coupling piece 22.2 is provided with an intermediate coupling piece, that is, a second intermediate coupling piece 23, which has a lead wire coupling portion 33 formed on the other end. Upright pieces 3/I to 36 are formed at the opposing ends of I and the second intermediate coupling piece 23, respectively, and the opposing inductor mounting parts 31L, 321- and 31R, 3
The inductor 25, 26 is formed by winding a wire around a drum-shaped core which is placed between 11 and 11, and the central part of the conductive plate 21 and one end of the second intermediate coupling piece 23. The mounted chip capacitor 27 and the first. The lead wires 28 to 30 are connected to the lead wire joint portion 33 of the second intermediate joint piece.

In the figure, numeral 55 denotes a molding material that covers the entirety, including the connecting end portions of the lead wires.

From FIG. 2(a) 1 to the V composite circuit component 20 shown in FIG.
Chip capacitor 27. Explanatory drawings in which the inductors 25 and 26, the molding material 55, and the lead wires 2B to 30 are omitted, FIGS.

(d) is a BB' end view, a c-c' end view, and an EE' sectional view, respectively.

In the same figure (a), both wing parts 21+, 21 of the conductive plate 21
On the same side 37 as R is an inductor mounting portion 31L having a substantially downward "E" shape.

31R is formed.

The inductor mounting portions 31L and 31R are provided with the tram-shaped core (inductor > 25.26, each with a flange portion 25a).
, '26a will be placed on this flange 25a.
, 26a itself is made by bending the central protruding piece 39 of the three protruding pieces 38 to 40 constituting the inductor mounting part in a direction perpendicular to the plane of the paper, and then bending the remaining protruding pieces 38 and 40.
This will be supported by Further, the protruding piece 39 bent at a substantially right angle is brought into contact with the end surface of the drum-shaped core placed thereon, and is later electrically connected by soldering or the like. In this embodiment, the first intermediate coupling piece 22. ．． 2
The inductor mounting portion formed at 4 also has a similar configuration.

The conductive plate 21 has three notches 41L and 41 in the center.
M, 41R are formed. As shown in the figure, the conductive plate 21 is formed symmetrically on the paper with a notch 41M as the center, and a rectangular notch is provided at a position equidistant from the circular notch 41M on the left and right sides of the paper. Portions 41L and 41R are formed, respectively. The chip capacitor 27 is placed between the notches 41L and 41R.

Also, the side edge 3 of the central part where these three notches are formed
On the end opposite to 7, an upright piece 42 is formed to protrude and is bent at a substantially right angle toward the front in the drawing.

As shown in FIG. 4(d), this upright piece 42 protects the end of the depth capacitor 27 placed close to it, and also aims to improve the mechanical strength of the conductive plate itself.

By the way, both wing portions 21L of the conductive plate 21.

Inductor mounting portion 31L formed in 21R.

31R, inductors i[
ii parts 32L and 32R are made to face each other, and the first intermediate joint piece 2 is
2.24 is located.

A clamping piece 43 for clamping a lead wire 28,30 formed into a flat IJ connecting pin is formed approximately at the center of each of the first intermediate connecting pieces 22,24.

This clamping piece 431 is adapted to clamp the connection end of the lead wire inserted between the coupling piece members 22a, 24a and this clamping piece 43 by the elastic force of the clamping piece 43. The clamping piece and the connecting piece member constitute a lead wire connecting part.

Similarly, a second intermediate coupling piece 23 is arranged at a distance from the center of the conductive plate 21.

This second intermediate coupling piece 23 has a chip capacitor mounting portion 44 formed at one end facing the conductive plate 21, and the aforementioned lead wire coupling portion 33 formed at the other end.

The chip capacitor mounting portion 44 has upright pieces 44L and 44R formed to substantially match the width of the chip capacitor 270 (in the direction perpendicular to the long axis), and a rectangular notch 45 in the center. is formed. This notch 45 is located in the chip capacitor 2 as shown in FIG.
7 is placed near one end (lower end in the figure) of the long sleeve.

Upright pieces 34.35L and 35R136 are provided at opposing ends of the first intermediate coupling piece 22, 24 and the second intermediate coupling piece 23 described above, respectively, as shown in approximately J-H directions.

These upright pieces 34.35L and 35R136 are formed near the connection end of each intermediate coupling piece with the lead wire, and the illustrated embodiment is on the front side of the paper, that is, the chip capacitor 2
7 is bent toward the surface on which it is placed (see figure (b)). Incidentally, a plurality of these upright pieces may be formed in the vicinity of the above-mentioned position, or they may be formed so as to be bent on the side opposite to the side on which the chip capacitor is placed.

The functions and effects of the composite circuit component having the above configuration will be explained with reference to FIGS. 5(a) and 5(b).

1, the notch 41L formed in the conductive plate 21 as described above;
41R has the function of preventing the cream solder 57 (hatched area) applied here from spreading in the horizontal direction in the drawing. Therefore, it is possible to prevent the chip capacitor 27 (indicated by the two-dot chain line) placed between the notches 41L and 41R from being displaced in the left-right direction in the drawing.

Furthermore, the notch 41M located between the notches 41L and 41R is formed by air bubbles generated in the cream solder portion between the chip capacitor 27 and the conductive plate 21 to be placed. It has the function of preventing poor conduction with the That is, when the chip capacitor 27 is placed, the air bubbles contained in the applied cream solder 57 are subjected to pressure from the chip capacitor 27, and accordingly escape in the direction of the arrow G shown in FIG. You will be able to make connections.

Similarly, the notch 45 formed in the second intermediate coupling piece 23 has the same function as the notches 41R and 41L, and 1. This has the effect of preventing displacement of the chip capacitor 27 toward the lead wire connection end due to the applied cream solder 58. Therefore, the notches 41L, 41R and the notch 45 restrict displacement of the chip capacitor in two directions, so that it can be reliably placed and fixed in a predetermined position. In addition, when this composite circuit component is mounted on another circuit board after completion, the force applied at the time of mounting is absorbed by the elastic deformation of the connecting members 56L and 56R, which have become thinner due to the formation of the notch 45. This prevents the applied force from reaching the connection portion of the chip capacitor 27, thereby preventing the chip capacitor from peeling off.

The upstanding pieces 44L and 44R serve to increase the contact area between the chip capacitor 27 and the second intermediate coupling piece by soldering in order to ensure conductive connection of the chip capacitor 27 placed between them, and to increase the contact area between the chip capacitor 27 and the second intermediate coupling piece by soldering. It also functions as a positioning member of 27.

Next, we will discuss the third method for manufacturing the above-mentioned composite circuit components.
This will be explained with reference to Figures (a) to (d).

■ The conductive plate 21 shown in FIG. 2 above. First intermediate conclusion 12
One piece 22, 24 and second intermediate connecting piece 23 are shown in FIG.
For example, aluminum alloys as shown in a).

Metal belt (also called lead frame) made of copper etc. 4
9, by performing a press h-th T, etc., they are formed at regular intervals. Specifically, sprocket holes 48 are formed in the metal belt at regular intervals, and the metal belt is intermittently conveyed in the direction of the arrow through these sprocket holes 48.

During transportation, as shown by arrow 46, the conductive plate.

Pressing is applied to the shape including the portion that will become the first intermediate joining piece, the second intermediate joining piece, and the portion that will become the standing piece. Then, at the next predetermined position, as shown by the arrow 47, the upright piece 42. I414L, 44R, 39, 34,
35L, 35R, 36, the holding piece 43, etc. are formed by bending. In this way, according to the present invention, parts of the bonded circuit component can be formed only by press working while the lead frame is being transported.

■ Place the inductor on the inductor placement portion formed as described above. Then apply cream solder,
Solder.

(2) After applying cream solder to the position where the chip capacitor is to be soldered, the chip capacitor 27 is mounted across the second intermediate coupling piece 23 and the conductive plate 21.

At this time, the upright piece 42 formed on the conductive plate 21 functions as a positioning member for the chip capacitor 27.

Further, by bending and forming such an upright piece, it is possible to improve the mechanical strength of the conductive plate itself.

■ Once the inductors 25, 26 and the chip capacitor 27 are mounted and connected as described above, the lead frame 49, the conductive plate, and the first. Cut the part that will become the second intermediate joining piece.

■ Each lead wire joint part 33 is made up of round lead wires 28 to 29 with one end flattened as shown in the same figure (C).
Insert into. At this time, the plurality of round lead wires are
), they are fixed at a predetermined interval M to a transfer belt 20 made of paper, for example, and are intermittently transferred through a sprocket hole 51. Incidentally, the predetermined interval M here is an interval corresponding to each of the lead wire coupling portions 33.

Incidentally, in this embodiment, one end of each lead wire, that is, the joint end with each intermediate joint piece is processed to be flat.

On the other hand, the lead wire connecting portion 33 of each intermediate connecting piece is connected to the clamping piece 4.
3 is formed, the lead wire and each intermediate coupling piece can be easily temporarily fastened by simply inserting the flattened lead wire end between the clamping piece and the intermediate coupling piece member. ing.

■ The composite circuit components assembled as described above are coated with, for example, synthetic resin.

Through the above steps, the composite circuit component is completed.

It should be noted that the present invention is not limited to the illustrated embodiments described above, and various modifications can be made within the scope of the invention.

In the previous example, the inductor is formed by winding a wire around a drum-shaped core, but the inductor is not limited to this, and the inductor mounting part can be formed so that it can hold a round lead wire, for example. An inductor may be formed by inserting a bead core into this lead wire. In addition, although one notch is formed in the conductive plate on the outside of both ends of the chip capacitor in the example shown, two or more notches may be formed, and the shape can also be a rectangular shape. good.

[Effects of the Invention] As described in detail above, according to the present invention, it is possible to provide a composite circuit component in which a chip capacitor can be reliably mounted at a predetermined position and a good conductive connection can be made.

[Brief explanation of drawings]

FIG. 1 is a plan view of a composite circuit component according to an embodiment of the present invention, and FIG. 2(a) is an explanatory diagram showing the composite circuit component shown in FIG. 1 with the inductor, chip capacitor, and lead wire omitted. , FIGS. 2(b) and 2(c) are B-B' end-to-end views shown in FIG. E' sectional view, Figure 3 (a) is an explanatory diagram of the lead frame for composite circuit components shown in Figure 1, Figure 3 (b)
) to (d) are explanatory diagrams of the manufacturing process, and FIG. 4(a). (b) is an explanatory diagram of a conventional composite circuit component, and Fig. 5 (a)
, (b) are respectively explanatory diagrams of the effect of the notch. 21... Conductive plate, 22. 24... First intermediate coupling piece, 23... Intermediate coupling piece (second intermediate coupling piece), 25.
26... Inductor, 27... Chip capacitor, 28.29.30... Lead wire, 31 L, 31R, 32L, 32R... Inductor mounting part, 33... Lead wire coupling part, 34 .35L, 35R, 36... Standing pieces. Agent Patent Attorney Masayoshi Misawa 31L Shiori 9
To the electric! Part Figure 1

Claims (1)

[Claims] It has a conductive plate having an inductor connection part connected to a part of the inductor on both wing parts, and an intermediate coupling piece having one end facing the center of the conductive plate and having a lead wire connected to the other end. In a composite circuit component that includes a chip capacitor placed across the center of the conductive plate and one end of the intermediate coupling piece, the conductive plate has sides of the chip capacitor placed in the center. A composite circuit component characterized by having a notch formed close to the outside of each end, and a notch formed close to the other end of a chip capacitor placed on the intermediate coupling piece. .