JPH0795591B2 - Solid-state imaging device and manufacturing method thereof - Google Patents

Description

The present invention relates to a solid-state imaging device and a manufacturing method thereof.

[Conventional technology]

In recent years, the miniaturization of forming elements has progressed due to improvements in semiconductor process technology, and LSI chips tend to be highly integrated and highly functional. In addition, in such a solid-state image sensor, which is an imaging device, the light receiving area is also highly integrated by increasing the integration of the light receiving element in order to improve the resolution by miniaturizing the light receiving element and reduce the size and weight of video equipment such as a video camera. Is being promoted, and the chip size of the solid-state imaging device tends to be smaller.

The conventional mounting structure of the solid-state image pickup device is mounted using the storage container 21 shown in FIGS. 4 and 5. FIG. 4 shows an external view of a conventional solid-state imaging device, and FIG. 5 shows a cross-sectional structure diagram of the conventional solid-state imaging device. 21 is a container, 22 is an electrode lead, and 23 is a transparent glass plate. The storage container 21 is made of ceramic, and the external shape is the same DIP type as that used for mounting a general LSI chip. Ceramic multi-layered storage container 2
Electrode leads 22 made of Kovar are provided on the outer periphery of 1 by Ag brazing. An internal electrode 27 facing the connection electrode 26 of the solid-state image pickup device 25 is formed around the die-attach part of the storage container 21, and the solid-state image pickup device 25 is made of a conductive resin 28 so that the solid-state image pickup device 25 has a die-attach part of the storage container 21. The connection electrode 26 of the solid-state imaging device 25 and the internal electrode 27 of the storage container 21 are bonded at a predetermined position and are electrically connected by a thin metal wire 29. A transparent glass plate 23 that transmits light to the light receiving region 24 of the solid-state image pickup device 25 is used to seal the storage container 21. Then, a predetermined adhesion region 30 is provided around the storage container 21 for adhering the transparent glass plate 23 to the transparent glass plate.
In the case of 23, resin sealing was used, or a metal seal ring was provided around the transparent glass plate 23 and sealing was performed by electric welding.

[Problems to be Solved by the Invention]

It is needless to say that in order to realize the reduction in size and weight of the video / surveillance camera device, the storage container 21 in which the solid-state imaging device 25 is mounted is preferably small in size due to optical restrictions of the lens mounting portion of the camera. Therefore, it is particularly preferable that the diagonal length of the storage container 21 is as small as possible. However, in the storage container 21 used in the conventional solid-state imaging device 25, the connection electrode 26 of the solid-state imaging device 25 has an internal lead region for connecting the internal electrode 27 of the storage container 21, and the transparent glass plate 23 is a storage container.
An adhesive area 30 for adhesively sealing the light receiving surface of 21 is required on the outer periphery of the light receiving surface of the storage container 21, and the diagonal length of the storage container 21 is 180 to 400% of the diagonal length of the solid-state imaging device 25. In the conventional mounting structure of the solid-state image pickup device 25 using the storage container 21 having a large size, there is a limit in reducing the diagonal length of the storage container 21. For this reason, the lens diameter becomes large, and only the solid-state image sensor 25 is mounted in the storage container 21, and the circuit components for driving the same are separate from the storage container 21. Therefore, the solid-state image sensor 25 is provided in the camera device. Circuit components for driving and areas for mounting them are required, and it is extremely difficult to reduce reliability due to an increase in the number of components and to reduce the size and weight of the camera device.

A first object of the present invention is to provide an extremely small solid-state image pickup device that enables the weight and size of a camera device to be reduced.

The second purpose is to eliminate the circuit components for driving the solid-state image sensor, which were conventionally indispensable in the camera device, and the space required for mounting them, and further, to drastically reduce the number of components. Accordingly, it is an object of the present invention to provide a solid-state imaging device for realizing a highly reliable and low-cost camera device that is extremely lightweight and compact.

[Means for Solving the Problems]

The solid-state imaging device according to claim 1 is a solid-state imaging device having a light-receiving region on one main surface, and an electrode of the solid-state imaging device that is electrically connected to the solid-state imaging device. The film lead bent to the main surface side, the transparent glass plate that is adhered and fixed to the solid-state image sensor facing the light receiving area by the transparent resin, and the film lead is fixed and electrically connected to the film lead. A circuit board, a solid-state image sensor, a film lead, a transparent glass plate, and a housing container having a frame structure in which the circuit board is housed.

The solid-state imaging device according to claim (2) is the solid-state imaging device according to claim (1), in which a tip of a film lead is inserted from one surface of the circuit board into a connection hole provided in the circuit board and the other surface of the circuit board is inserted. The film lead is fixed to the circuit board by soldering to an external electrode whose base end is inserted into the connection hole.

The solid-state imaging device according to claim (3) is the solid-state imaging device according to claim (1) or (2), in which circuit components are mounted on a circuit board.

The solid-state imaging device according to claim (4) is the solid-state imaging device according to claim (1) or (2), in which a surface of the solid-state imaging device that does not face the transparent glass plate is covered with a light-shielding insulating resin. There is.

The method for manufacturing a solid-state imaging device according to claim (5), the step of connecting the electrode of the solid-state imaging element to the film lead of the film carrier, the step of cutting off the solid-state imaging element connected to the film lead from the film carrier, A step of bending the film lead along the side surface of the solid-state image sensor,
After the step of bending the film lead along the side surface of the solid-state imaging device, the step of adhering the solid-state imaging device to the transparent glass plate adhered to one end surface of the frame-structured storage container through the transparent resin, and the film lead Of fixing the other end of the film lead that is not connected to the solid-state image sensor to the circuit board and electrically connecting it, and fixing the other end of the film lead that is not connected to the solid-state image sensor to the circuit board and electrically connecting And the step of enclosing the light-shielding resin in the storage container after the step of performing.

The method for manufacturing a solid-state imaging device according to claim (6) is the method for manufacturing a solid-state imaging device according to claim (5), wherein the other end of the film lead, which is not connected to the solid-state imaging device, is fixed to a circuit board and is electrically connected. The step of electrically connecting is to insert the tip of the film lead from one surface of the circuit board into the connection hole provided in the circuit board, and to solder from the other end of the circuit board to the external electrode whose base end is inserted into the connection hole. It is a process.

The method for manufacturing a solid-state imaging device according to claim (7) is the method for manufacturing a solid-state imaging device according to claim (5) or (6), in which the solid-state imaging device connected to the film lead is cut off from the film carrier. At the same time, the film lead is bent along the side surface of the solid-state image sensor.

[Action]

According to the configuration of claim (1), the film lead is electrically connected to the electrode of the fixed image pickup device having the light receiving region on one main surface, and the film lead is provided along the side surface of the solid state image pickup device. Bend to the other main surface side, and a transparent glass plate is bonded and fixed to the solid-state image sensor facing the light receiving area with a transparent resin, and the film lead is fixed to the circuit board and the circuit board and the film lead are electrically connected. Connection,
The solid-state image sensor, the film lead, the transparent glass plate, and the circuit board are housed inside a frame-structured storage container. The internal lead area and the transparent glass, which have been a serious problem in the conventional sealing of the storage container, An adhesive area for piercing the plate is not required, an extremely small solid-state imaging device can be obtained, and a compact and lightweight camera device can be realized. Moreover, since the film lead is fixed to the circuit board, even if the film lead whose strength is insufficient is bent by an external force, the movement of the circuit board is restricted by the storage container, so that the film lead is inadvertently bent. As a result, the insufficient strength of the film lead can be compensated by the circuit board.

According to the configuration of claim (2), the external electrode has the tip of the film lead inserted from one surface of the circuit board into the connection hole provided in the circuit board, and the base end of which is inserted into the connection hole from the other surface of the circuit board. Since the film lead is fixed to the circuit board by soldering to the circuit board, the circuit connection can be made by using the external electrode which can sufficiently secure the strength. Therefore, the possibility of disconnection can be avoided, and the reliable circuit connection can be obtained.

According to the configuration of claim (3), the circuit board on which the circuit component for driving the solid-state image sensor is mounted together with the solid-state image sensor in the storage container has been indispensable conventionally in the camera device. The circuit components for driving the solid-state imaging device and the space required for mounting them do not require space, and due to the drastic reduction in the number of components, extremely lightweight and compact, highly reliable and low cost. The camera device can be realized with an extremely simple structure.

According to the configuration of claim (4), since the surface of the solid-state imaging device that does not face the transparent glass plate is covered with the light-shielding insulating resin, it is possible to prevent deterioration of the characteristics of the solid-state imaging device due to the external environment.

According to the method of claim (5), the electrode of the solid-state imaging device is connected to the film lead of the film carrier, the solid-state imaging device connected to the film lead is cut off from the film carrier, and the film lead is attached to the side surface of the solid-state imaging device. Then, the solid-state image sensor is bonded to a transparent glass plate adhered to one end surface of the frame-structured storage container through a translucent resin, and the other end of the film lead which is not connected to the solid-state image sensor. Since it is fixed to the circuit board and electrically connected, and then the light-shielding resin is sealed in the storage container, the internal lead area and the transparent glass plate, which had been a big problem in the conventional sealing of the storage container, were sealed. An adhesion area for stopping is not required, and an extremely small solid-state imaging device can be obtained, and a compact and lightweight camera device can be realized.
Moreover, since the film lead is fixed to the circuit board, even if the film lead whose strength is insufficient is bent by an external force, the movement of the circuit board is restricted by the storage container, so that the film lead is inadvertently bent. As a result, the insufficient strength of the film lead can be compensated by the circuit board, and the film lead can be prevented from flowing when the light shielding resin is filled.

According to the method of claim (6), an external electrode in which the tip of the film lead is inserted from one surface of the circuit board into the connection hole provided in the circuit board and the base end is inserted into the connection hole from the other end of the circuit board. Since the film lead is fixed to the circuit board by soldering to the circuit board, the circuit connection can be made by using the external electrode which can sufficiently secure the strength. Therefore, the possibility of disconnection can be avoided, and the reliable circuit connection can be obtained.

According to the method of claim (7), the manufacturing process is performed by bending the film lead along the side surface of the solid-state imaging device at the same time when the solid-state imaging device connected to the film lead is cut off from the film carrier. The number can be reduced, which is a method that makes good use of the film carrier method.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1, 2 and 3.

FIG. 1 is a block diagram of a solid-state imaging device according to an embodiment of the present invention, FIG. 2 is a mounting process diagram of a solid-state imaging device and a film carrier according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 2 is a cross-sectional structure diagram of the solid-state imaging device in FIG.
1 is a solid-state image sensor, 2 is a container, 3 is a film lead, 4 is an opening, 5 is a transparent glass plate, 6 is a light receiving region, 7
Is a transparent insulating resin, 8 is a light insulating resin, 9 is a circuit component, 10 is a connection hole, 11 is a circuit board, and 12 is an external electrode.

The inner diameter of the storage container 2 that stores the solid-state image sensor 1 is equal to the diagonal length L of the solid-state image sensor 1, a transparent glass plate 5 is sealed in the opening 4 of the storage container 2, and the inside of the storage container 2 is sealed. The solid-state imaging device 1 mounted by the film carrier mounting method is mounted. In the solid-state imaging device 1, as shown in FIG. 2 (a), the connection electrode (not shown) of the solid-state imaging device 1 and the film lead 3 of the film carrier 13 are connected by pressure contact (FIG. 2 (b)), Then, at the same time as punching out from the film carrier 13, the film lead 3 is bent along the side surface of the solid-state image sensor 1 in the direction of the other surface of the solid-state image sensor 1 (FIG. 2 (c)). The surface of the solid-state imaging device 1-light-receiving region 6 is adhered to the transparent glass plate 5 provided in the opening 4 of the solid-state imaging device 1-accommodation container 2 in which the film lead 3 is bent with the translucent insulating resin 7. A circuit component 9 for driving the solid-state image sensor 1 is mounted on a circuit board 11 having a diameter of a diagonal length L of the solid-state image sensor 1. The circuit board 11 has a connection hole 10 facing the film lead 3 connected to a connection electrode (not shown) of the solid-state image sensor 1. The tip of the film lead 3 is inserted into the connection hole 10 of the circuit board 11 and connected to the external electrode 12 by soldering. The entire area of the other surface of the solid-state imaging device 1 is prevented from deterioration of characteristics due to the external environment of the solid-state imaging device 1 and the circuit component 9 mounted on the circuit board 11, and the fixed imaging device 1
In order to prevent irregular reflection of light to the light receiving region 6, the light-shielding insulating resin 8 is used for sealing.

With the above structure, the solid-state imaging device can be miniaturized to the utmost limit, and an extremely compact and lightweight camera device can be realized.

Further, a circuit board 11 on which a circuit component 9 for driving the solid-state image sensor 1 is mounted and a storage container 2 together with the solid-state image sensor 1
Due to the mounting structure, the circuit components for driving the solid-state image sensor, which has been indispensable in the past, and the space required for mounting them are required in the camera equipment, and the number of components is drastically reduced. As a result, a highly reliable and low cost camera device can be realized with an extremely simple structure. Also, when enclosing the light-shielding insulating resin 8,
The film lead 3 is not necessary.

Although the shape of the storage device 2 in this embodiment is circular, it is needless to say that the storage container 2 is not limited to a circular shape, and a rectangular storage container may be used like the outer shape of the solid-state imaging device 1. You can get the effect.

〔The invention's effect〕

In the solid-state image pickup device according to claim 1, a film lead is electrically connected to an electrode of a fixed image pickup device having a light receiving region on one main surface, and the film lead is provided along the side surface of the solid-state image pickup device. Bend to the other main surface side, and a transparent glass plate is bonded and fixed to the solid-state image sensor facing the light receiving area with a transparent resin, and the film lead is fixed to the circuit board and the circuit board and the film lead are electrically connected. Connection, and the solid-state image sensor, the film lead, the transparent glass plate, and the circuit board are housed inside a frame-structured storage container, which has been a major problem in the conventional sealing of the storage container.
The internal lead area and the adhesive area for stopping the transparent glass plate are not required, and an extremely small solid-state imaging device can be obtained, and a compact and lightweight camera device can be realized. Moreover, since the film lead is fixed to the circuit board, even if the film lead whose strength is insufficient is bent by an external force, the movement of the circuit board is restricted by the storage container, so that the film lead is inadvertently bent. As a result, the insufficient strength of the film lead can be compensated by the circuit board.

According to the configuration of claim (2), the external electrode has the tip of the film lead inserted from one surface of the circuit board into the connection hole provided in the circuit board, and the base end of which is inserted into the connection hole from the other surface of the circuit board. Since the film lead is fixed to the circuit board by soldering to the circuit board, the circuit connection can be made by using the external electrode which can sufficiently secure the strength. Therefore, the possibility of disconnection can be avoided, and the reliable circuit connection can be obtained.

According to the solid-state imaging device according to claim (3), the structure in which the circuit board on which the circuit component for driving the solid-state imaging device is mounted is mounted together with the solid-state imaging device in the storage container is conventionally indispensable in the camera device. The circuit components for driving the existing solid-state image sensor and the space required for mounting them are not required. Furthermore, due to the drastic reduction in the number of components, it is extremely lightweight, downsized, highly reliable and low in cost. A costly camera device can be realized with an extremely simple structure.

According to the solid-state imaging device of the fourth aspect, since the surface of the solid-state imaging device that does not face the transparent glass plate is covered with the light-shielding insulating resin, deterioration of the characteristics of the solid-state imaging device due to the external environment can be prevented. .

According to the method for manufacturing a solid-state imaging device according to claim (5),
The electrode of the solid-state image sensor is connected to the film lead of the film carrier, the solid-state image sensor connected to the film lead is cut off from the film carrier, the film lead is bent along the side surface of the solid-state image sensor, and then the solid-state image sensor is framed. A transparent glass plate adhered to one end surface of the structure storage container is adhered through a transparent resin, and the other end of the film lead, which is not connected to the solid-state image sensor, is fixed to the circuit board and electrically connected. Since the light-shielding resin is then sealed in the storage container, there has been a big problem in the conventional sealing of the storage container. Since the internal lead area and the adhesive area for sealing the transparent glass plate are not required, an extremely small solid-state imaging device can be obtained, and a compact and lightweight camera device can be realized. Moreover, since the film lead is fixed to the circuit board, even if the film lead whose strength is insufficient is bent by an external force, the movement of the circuit board is restricted by the storage container, so that the film lead is inadvertently bent. As a result, the insufficient strength of the film lead can be compensated by the circuit board, and the film lead can be prevented from flowing when the light shielding resin is filled.

According to the method for manufacturing a solid-state imaging device according to claim 6,
Insert the tip of the film lead from one surface of the circuit board into the connection hole provided on the circuit board, and solder the film lead from the other end of the circuit board to the external electrode whose base end is inserted into the connection hole. Since it can be connected to the circuit by using an external electrode that can secure sufficient strength, the risk of disconnection can be avoided and reliable circuit connection can be obtained.

According to the method for manufacturing a solid-state imaging device according to claim (7),
The number of manufacturing steps can be reduced by simultaneously bending the film lead along the side surface of the solid-state image sensor in the step of cutting off the solid-state image sensor connected to the film lead from the film carrier.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a solid-state image pickup device according to an embodiment of the present invention, FIG. 2 is a mounting process diagram of a solid-state image pickup element and a film carrier according to an embodiment of the present invention, and FIG. 4 is a sectional structural view of the solid-state imaging device in FIG. 4, FIG. 4 is an external view of the conventional solid-state imaging device, and FIG. 5 is a sectional structural view of the conventional solid-state imaging device. 1 ... Solid-state image sensor, 2 ... Storage container, 3 ... Film lead, 4 ... Opening part, 5 ... Transparent glass plate, 6 ... Light receiving area, 7 ... Translucent insulating resin, 8 ... Light-blocking insulating resin, 9 …… Circuit parts, 10 …… Connecting holes, 11 …… Circuit board,
12 …… External electrode, 13 …… Film carrier

Claims (7)

[Claims] 1. A fixed image pickup device having a light receiving area on one main surface, and an electrode of the solid state image pickup device electrically connected to the other main surface side of the solid state image pickup device along a side surface of the solid state image pickup device. And a transparent glass plate that is adhesively fixed to the solid-state image sensor facing the light receiving region by a translucent resin, and is electrically connected to the film lead while fixing the film lead. A solid-state imaging device comprising: a circuit board; and a housing container having a frame structure in which the solid-state imaging device, the film lead, the transparent glass plate, and the circuit board are housed. 2. A tip of a film lead is inserted from one surface of the circuit board into a connection hole provided in the circuit board, and is soldered to an external electrode whose base end is inserted into the connection hole from the other surface of the circuit board. The solid-state image pickup device according to claim 1, wherein the film lead is fixed to the circuit board by doing so. 3. The solid-state image pickup device according to claim 1, wherein circuit components are mounted on a circuit board. 4. The solid-state image pickup device according to claim 1, wherein a surface of the solid-state image pickup element that does not face the transparent glass plate is covered with a light-shielding insulating resin. 5. A step of connecting an electrode of a solid-state image pickup device to a film lead of a film carrier, a step of separating the solid-state image pickup device connected to the film lead from the film carrier, and the film lead of the solid-state image pickup. After the step of bending along the side surface of the element and the step of bending the film lead along the side surface of the solid-state imaging element, the solid-state imaging element is transparently attached to a transparent glass plate adhered to one end surface of the container having the frame structure. A step of adhering via a light-sensitive resin, a step of fixing and electrically connecting the other end of the film lead that is not connected to the solid-state imaging device to a circuit board, and the solid-state imaging device of the film lead. After the process of fixing the other end that is not connected to the circuit board and electrically connecting it, a light blocking resin is enclosed in the storage container. Method of manufacturing a solid-state imaging device including a that step. 6. The step of fixing the other end of the film lead, which is not connected to the solid-state imaging device, to a circuit board and electrically connecting the film lead from one surface of the circuit board to a connection hole provided in the circuit board. 6. The solid-state imaging device according to claim 5, further comprising a step of inserting the tips of the leads and soldering the other surface of the circuit board to an external electrode having a base end inserted in the connection hole. Production method. 7. The film lead is bent along the side surface of the solid-state image pickup device at the same time when the solid-state image pickup device connected to the film lead is cut off from the film carrier. (6) The method for manufacturing a solid-state imaging device according to item (6).