JPH079434Y2 - 電気部品の放熱装置 - Google Patents
電気部品の放熱装置Info
- Publication number
- JPH079434Y2 JPH079434Y2 JP7390089U JP7390089U JPH079434Y2 JP H079434 Y2 JPH079434 Y2 JP H079434Y2 JP 7390089 U JP7390089 U JP 7390089U JP 7390089 U JP7390089 U JP 7390089U JP H079434 Y2 JPH079434 Y2 JP H079434Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- heat dissipation
- heat
- electric component
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 36
- 239000011888 foil Substances 0.000 claims description 32
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 239000007769 metal material Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7390089U JPH079434Y2 (ja) | 1989-06-23 | 1989-06-23 | 電気部品の放熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7390089U JPH079434Y2 (ja) | 1989-06-23 | 1989-06-23 | 電気部品の放熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0312492U JPH0312492U (enrdf_load_html_response) | 1991-02-07 |
| JPH079434Y2 true JPH079434Y2 (ja) | 1995-03-06 |
Family
ID=31613115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7390089U Expired - Fee Related JPH079434Y2 (ja) | 1989-06-23 | 1989-06-23 | 電気部品の放熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079434Y2 (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4618926B2 (ja) * | 2001-04-05 | 2011-01-26 | 株式会社マルテー大塚 | 自在塗布具 |
-
1989
- 1989-06-23 JP JP7390089U patent/JPH079434Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312492U (enrdf_load_html_response) | 1991-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |