JPH079434Y2 - 電気部品の放熱装置 - Google Patents

電気部品の放熱装置

Info

Publication number
JPH079434Y2
JPH079434Y2 JP7390089U JP7390089U JPH079434Y2 JP H079434 Y2 JPH079434 Y2 JP H079434Y2 JP 7390089 U JP7390089 U JP 7390089U JP 7390089 U JP7390089 U JP 7390089U JP H079434 Y2 JPH079434 Y2 JP H079434Y2
Authority
JP
Japan
Prior art keywords
hole
heat dissipation
heat
electric component
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7390089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0312492U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
光男 佐藤
徹 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu General Ltd
Original Assignee
Fujitsu General Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu General Ltd filed Critical Fujitsu General Ltd
Priority to JP7390089U priority Critical patent/JPH079434Y2/ja
Publication of JPH0312492U publication Critical patent/JPH0312492U/ja
Application granted granted Critical
Publication of JPH079434Y2 publication Critical patent/JPH079434Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP7390089U 1989-06-23 1989-06-23 電気部品の放熱装置 Expired - Fee Related JPH079434Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7390089U JPH079434Y2 (ja) 1989-06-23 1989-06-23 電気部品の放熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7390089U JPH079434Y2 (ja) 1989-06-23 1989-06-23 電気部品の放熱装置

Publications (2)

Publication Number Publication Date
JPH0312492U JPH0312492U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-07
JPH079434Y2 true JPH079434Y2 (ja) 1995-03-06

Family

ID=31613115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7390089U Expired - Fee Related JPH079434Y2 (ja) 1989-06-23 1989-06-23 電気部品の放熱装置

Country Status (1)

Country Link
JP (1) JPH079434Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4618926B2 (ja) * 2001-04-05 2011-01-26 株式会社マルテー大塚 自在塗布具

Also Published As

Publication number Publication date
JPH0312492U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-02-07

Similar Documents

Publication Publication Date Title
US11665812B2 (en) Metal member-equipped circuit board, circuit assembly, and electrical junction box
JP6780792B2 (ja) 回路構成体及び電気接続箱
WO2018193828A1 (ja) 金属部材付き基板、回路構成体及び電気接続箱
US6351385B1 (en) Heat sink for integrated circuit packages
US5757619A (en) Cooling apparatus for electronic components
US6922338B2 (en) Memory module with a heat dissipation means
US20050157469A1 (en) Cooling arrangement for a printed circuit board with a heat-dissipating electronic element
JPH079434Y2 (ja) 電気部品の放熱装置
US20190230780A1 (en) Electronic component, electronic component manufacturing method, and mechanical component
JP2925475B2 (ja) 電子装置の放熱構造
JP2564645Y2 (ja) 発熱部品を有する混成集積回路装置
WO2019216238A1 (ja) 回路構成体、及び電気接続箱
JP3684271B2 (ja) パワーモジュール
JPH039335Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3621602B2 (ja) 発熱電子部品の放熱装置
WO2020246224A1 (ja) 回路構成体及び電気接続箱
JPH0631722Y2 (ja) 端子ガイド付き放熱体
JPH10189803A (ja) 放熱板への絶縁基板取付構造
JP2575953Y2 (ja) 半導体部品取付構造
JPH0334914Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS63227098A (ja) 電子部品の放熱実装構造
JP2002043486A (ja) 半導体装置
JPH11251101A (ja) 電子・電気部品の放熱構造
JPH0810230Y2 (ja) 電気部品と放熱体の取付構造
JPH0632692Y2 (ja) 半導体素子用放熱器

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees