JPH0770813B2 - Method of manufacturing printed circuit board - Google Patents

Abstract

The invention relates to a process for scribing and bonding insulated wire conductors (14) in a predetermined pattern on a substrate (10), bonding said conductor substantially simultaneously when it contacts the surface of the adhesive (16) by directing substantially uniform laser beam pulses (30) at said adhesive, and timing the pulses such that the pulse repetition rate is a function of the scribing speed.

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a wire-laid wiring circuit board. More particularly, the invention relates to using laser energy to bond and strip conductors during wire laying.

Prior Art US Patent Nos. 3671914 (Bar), 3674602 (Keo) and Canadian Patent No. 11 issued Jul. 9, 1981.
No. 02924 describes a method and apparatus for laying and wiring a conductor on an insulating substrate on which an adhesive layer is formed in advance. This is done by continuously feeding a fine insulated wire onto the surface of the substrate to deposit it and then cutting these conductors in place. The methods described in these foreign patents are capable of producing conductor wiring having a predetermined interconnection pattern.

The conductor pattern is formed by adhering the insulated wire to the adhesive layer by means of a wire laying element that locally heats the adhesive layer. When the adhesive melts and at least partially surrounds the conductor and then cools, a bond between the conductor and the substrate occurs. The adhesive material thus captures the conductor and forms a mechanical and chemical bond.

European Patent Application No. 11 published on 25 July 1985
No. 0820 describes an apparatus for laying wires in an activated layer of photocurable adhesive. The adhesive is activated using ultrasonic energy and then cured using light energy such as laser energy.

Japanese patent application published on August 23, 1982
57-136931) discloses a method of laying wires in a predetermined pattern on the adhesive coated surface of a substrate. In order to soften the adhesive and press the wire under construction into the adhesive,
A combination of laser energy and ultrasonic energy is used.

However, using a laser beam as an energy source to activate the adhesive used in the wire laying process, the adhesive is applied either on the plate surface on which the wire is to be laid or on the conductor. However, it has many problems and obstacles. Irradiating the adhesive with laser energy as a continuous beam only follows a given conductor pattern if the laser beam travels along the adhesive at a constant velocity or is modulated according to complex control variables. It enables a reliable activation level. The amount of energy received by a particular part of the adhesive increases with the time of exposure of that part to the energy. Obviously, the exposure time is inversely proportional to the speed at which the laser beam travels along a given pattern on the adhesive. Therefore, if the wiring speed of the conductor (hereinafter referred to as the laying speed) changes, the exposure time of the adhesive changes for each different area. In the laying process, the laying element can change the laying speed in at least three situations. That is, when the laying element accelerates from a stopped state to a predetermined rated speed, when forming a bend or fold (in this case the laying element is decelerated before forming the fold and stops to form the bend, and It is required to accelerate to the rated speed after forming the fold), and stop the laying element at both ends of the conductor supply. As a result, if the speed of the laying element is less than the rated speed, the adhesive will receive too much energy and the adhesive or conductor surrounding material will suffer burnout or other damage. If the laser energy level is reduced to prevent over-energy irradiation at low speeds, the amount of energy received by other parts of the adhesive at rated speed will be insufficient for activation in those parts. Will.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to use a precisely controlled laser beam to activate an adhesive for bonding conductors onto a substrate, thereby causing the conductors to remain on the substrate. It is to provide a method and a device for surely laying in a predetermined pattern.

Another object of the present invention is to provide a method of controlling a wire laid circuit board in which activation of the bonding adhesive is controlled in a simple manner.

Yet another object of the present invention is to provide a method and apparatus for effectively joining and debonding laid conductors with one or more laser beams.

Definitions In the following description, a "substrate" is an insulating material on which a conductor pattern is to be formed.

“Conductor” means at least one tangible material having a “conducting portion” capable of conducting energy such as electric energy or light energy in at least a part thereof.
It is an elongated filament. These conductors can be covered by an insulating layer.

"Laying" is the process of placing and securing conductors on a substrate in a predetermined pattern.

"Laser energy" is the amount of energy emitted from a laser energy source and means the product of power and time.

"Adhesive" is a material used to bond a conductor to the surface of a substrate. This adhesive may be a coating that surrounds the conductor, may be placed on the surface of the substrate, or may be supplied individually as a film.

"Activation" means a process of imparting adhesiveness or tackiness to an adhesive and forming a bond between objects.

SUMMARY OF THE INVENTION Laser beams are used in the process of laying a conductor to activate the adhesive in a controllable manner by irradiating the adhesive with a series of discrete laser beam pulses. The laser pulse is a cross section of the laser beam (hereinafter called the focus), the efficiency of the energy source,
It is preset to contain a uniform amount of energy according to various conditions such as adhesive activation requirements. The laser pulse is emitted every time a predetermined portion (incremental portion) of the conductor is laid along the conductor supply. In this way, each unit length, and thus unit area, along the conductor circuit will receive substantially the same amount of energy regardless of the laying speed. Therefore, the method of the present invention provides an accurate and simple means for activating the adhesive and laying conductors to form the wiring pattern. Laser energy can also be used to strip, solder, and cut insulation at the end of conductors.

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a laying head suitable for laser bonding laying conductors where the adhesive is applied to the surface of the substrate. The substrate (10) is a suitable circuit board material,
It is preferably supported on an XY table which can be controlled and moved. The positioning of the table is preferably digitally controlled according to a computer program. The laying head (12) is for distributing the insulated wire (14), and is rotationally driven so as to perform the distribution along the direction of table movement. In a typical procedure the table moves in one direction, during which wires with a given conductor length are laid,
Then, the table is stopped, and the head is rotated to form the folded portion or the bent portion in the conductor wiring.
The table then moves in the new direction indicated by the head position. In such an aspect, the conductor is supplied onto the substrate surface.

The adhesive bath (16) used to bond the insulated wire to the substrate surface in this embodiment is pre-coated on said substrate surface.

The insulated wire is supplied through a wire supply mechanism (20) including a drive roll (21) and a pair of idle rolls (22). The drive roll is preferably controlled so that the wire is fed at a speed that matches the speed of substrate movement by the table. The wire is supplied from the wire supply mechanism to the adhesive coated surface of the substrate through the wire guide (23). The wire is further pushed into the adhesive layer by the grooved guide roller (24). The guide roller (24) has a rotating arm (2) that is urged downward by a spring (28).
It is supported at the free end of 6).

The laser beam (30) is focused by the lens (32),
Further, the light is reflected from the mirror (34) and is incident on the contact point between the insulated wire on the adhesive surface and the adhesive surface or slightly ahead thereof. The laser beam is in the form of constant energy pulses delivered in accordance with the incremental displacement of the table, thus activating the adhesive on the underside of the wire being laid. The roller pushes this wire into the softened and activated adhesive layer. The adhesive then cures rapidly to form a strong bond between the wire and the substrate.

FIG. 2 shows another embodiment in which a micro grooved roller (40) is used in place of the roller (24). In a circuit board in which conductors straddle parallel conductors, it is required to use a small embedding roller to push down the wire being laid until it comes into contact with the board surface between the parallel conductors. Fine wire (eg 0.0025in diameter 42AWG wire)
In the case of, the burial wheel must have a radius of about 0.015 to 0.030 in. As best shown in Figure 2B,
The small grooved roller (40) is a rear bridge machined at the tip of a rod (42) supported by bearings (43) and (44). The rod is urged downward by a bevel gear (46) which is freely rotatably supported and which engages with a bevel gear (48) which itself supports.

FIG. 3 shows another embodiment in which the adhesive is separately supplied and the wire is pushed into the adhesive layer by an ultrasonic needle. The adhesive film (50) passes between the drive roller (52) and the idle roller (53), and the wire (1
4) Move forward at the same time. The adhesive film has a width slightly wider than the wire. Film (50) is roller (5
When supplied from 2) and (53), they pass through the guide (54) and are laid on the substrate under the insulated wire. The laser beam (30) is reflected by the mirror (34) and activates the adhesive just before it comes into contact with the substrate surface.

The ultrasonic needle (60) is biased by ultrasonic vibration, and has a groove at its tip that acts as a wire guide for positioning the wire on the substrate surface. The ultrasonic needle provides a relatively low friction wire guide, which forces the wire into the activated adhesive layer.
The ultrasonic energy preferably provides a substantially frictionless guide and is maintained at a low amplitude level sufficient to implant the wire in place. The ultrasonic needle does not significantly affect the energy supplied to activate the adhesive.
It has been determined that ultrasonic energy can be used at low energy levels without significant cold action or breakage of the insulated wire. The downward force of the ultrasonic needle causes the spring (6
2) Supplied by.

Figures 4A, 4B and 4C show dual beam embodiments for cutting, stripping and soldering wires and activating adhesives. In this embodiment, the adhesive is pre-coated on the insulated wire.

The coated wire (70) has a wire feeding mechanism (72) including a drive roller (74) and a pair of idle rollers (76).
Is supplied via. After that, the wire is guided to the lower side of the grooved ultrasonic needle (80) through the wire guide (78). The ultrasonic needle has a basic shape as shown in FIG. 4A and is energized by the magnetostriction generated by the high frequency energy supplied to the coil (82) surrounding the ultrasonic needle. When biased in this way, the working end of the ultrasonic needle vibrates up and down.

Laser (84) provides control pulsed laser energy via either of two beams (86) and (88). The laser energy is reflected from the mirrors (92), (90) and (94) by the coil (90) at the position of the solid line, passes through the lens (95), is incident on the mirror (96), and is reflected from there to be the substrate (10). It is incident on the underside of the covered coated wire. When the mirror (90) reaches the vertical position (Fig. 4A) indicated by the broken line, the laser energy is reflected from the mirrors (92) (97) (98), passes through the lens (99), and enters the mirror (91). It is reflected from and is incident on the upper part of the insulated wire being laid. As is clear from FIGS. 4B and 4C, the laser energy reflected from the mirror (91) is transferred to the wire clamp (10
Pass through the 0) opening. This wire clamp (100) holds the wire in place during the wire peeling, cutting and soldering steps.

In a typical procedure, the wire end is
2) is pushed down to the lower position of the clamp (100),
In this state, sufficient energy to vaporize the insulator on the conductor is supplied as a pulsed laser beam (88). This sufficient energy is also provided to solder or weld the conductor to the terminal pads (102) on the board surface. The XY table then enables linear conductor travel by moving the substrate in the direction indicated by the laying head. Laser energy from the beam (86) activates the adhesive before it contacts the substrate and the ultrasonic needle (80) pushes the wire down to contact the substrate surface. When the adhesive cools, a bond is formed between the insulated wire and the substrate. If folding or bending points are required in the conductor path, the table movement is stopped, the laying head (12) rotates in a new direction to form the folding or bending of the conductor, and then the table is laid. It moves in the new direction indicated by the head position. At the end of the conductor, laser energy is supplied by the beam (88) to de-insulate the conductor again and to solder or weld it to the terminal pads on the board. After this, the table is moved slightly so that the beam (88) is focused on the conductor, slightly beyond the terminal pad, so that sufficient energy at a reasonable wavelength cuts the conductor. Is supplied to.

FIG. 5 illustrates a suitable control system for providing the laser beam described with respect to FIGS.
The laser preferably comprises a CO ₂ laser (110) powered by a laser power supply (120) via an ON / OFF control switch (122). The laser is a folded-waveguide type equipped with piezoelectric transducers (112) and (114) at the tip, and the cavity size inside the laser tube can be adjusted. A PZT drive circuit or piezoelectric drive circuit (116) controls the piezoelectric transducer to control the laser frequency. Switches (122)
When is turned on, the power supply (120) maintains the current through the gas medium within the cavity of the laser tube. This current basically excites the gas to produce a laser beam.

The CO ₂ laser produces laser energy at a wavelength of 10.6 microns, which is an ideal heat ray for activating the adhesive and stripping the insulation in the conductor, while the conductor is highly reflective for this wavelength. It is virtually unaffected by laser energy.

The computer (130) is located on the XY table (132),
And used to control the orientation of the laying head through the circuit (138). The X position of the table is determined according to the count in the X position counter (134), and the Y position of the table (132) is determined according to the count in the Y position counter (136). A pulse is supplied from the computer (130) to the up input and the down input of each counter to increase or decrease their count, respectively. Each incremental move of the table (132)
30) in response to the pulse from. These pulses are also fed to the four separate inputs of the 5-input OR gate (140).

The output of the OR gate is supplied to the pulse trigger circuit (142), and this circuit (142) controls the ON / OFF control switch (122) via the pulse width control circuit (144). Each pulse from the trigger circuit (142) turns on the laser for a predetermined time period controlled by the pulse width control circuit (144). The pulse width is adjusted by the circuit (146), which adjusts the amount of pulse energy according to ambient conditions.

In the dual-beam embodiment (FIG. 4), the mirror (90) uses a laser energy beam (86) for activating adhesive or a beam (88) for peeling, soldering and cutting.
Orient it to be The mirror position is controlled by a computer (130) via a mirror positioning circuit (148). During the wire laying process, the mirror (90) emits a laser energy pulse as a beam (86) to the underside of the wire at the position indicated by its solid line.

In the case of the peeling, cutting and soldering steps, the circuit (148) positions the mirror (90) at the position indicated by the broken line (FIG. 4). This directs the laser energy as a beam (88) to the upper side of the insulated wire. Since the table is stationary during these operations, successive laser pulses heat the same target area on the conductor, thus delivering a large amount of laser energy to the same surface. The computer output (149) is provided to the OR gate (140) and provides the trigger pulses for these operations. Pulses are provided to counters (134) and (136) periodically, if necessary, to provide slow table movement through the stripping or soldering process. In the case of the cutting operation, the relatively large energy can be favorably absorbed by copper by using the laser energy having the relatively short wavelength. A neodymium-doped yttrium-aluminum-garnet laser with a wavelength of 1.06 micron is preferably used for the cutting process. The laser beam used to activate the adhesive and lay the conductor on the substrate surface must be carefully shaped and controlled within certain spatial and time constraints. That is, careful formation and control of the laser beam allows the adhesive to receive sufficient energy to be activated to bond the conductors. If the laser energy is not properly formed and controlled, the conductor will not be sufficiently joined to the surface of the substrate, resulting in an uncertain bond having voids. On the other hand, if excessive energy is supplied,
The conductor or coating material may be damaged.

The method of the present invention eliminates these problems and achieves reliable activation of the adhesive along the entire length of the conductor.
Therefore, the total amount of energy received per unit area of adhesive should be constant regardless of the velocity of the laser beam incident line traveling along the surface of the adhesive.

As already mentioned, the adhesive is either placed on the surface of the substrate or coated on the conductor itself or supplied individually. The incident laser beam travels with the laying head along the conductor path on the adhesive. A constant energy quantum is emitted in pulses and is received by a predetermined area of the adhesive. At this time, a fixed length of the conductor path is traversed by the laying head and the incident laser beam. When the adhesive is activated, the conductor is placed on the substrate surface. When the adhesive loses the energy it receives from the laser beam, it returns to its non-bonded state, forming a bond between the conductor and the surface of the substrate on which the conductor is laid. The pulsed laser beam is directed toward the adhesive on the wire or the substrate surface, and the trajectory of the incident beam follows the position on the substrate surface where the laying head makes contact with the conductor or immediately before that position. Is.

All of the laser beam pulses have substantially equal amounts of energy. The energy of a pulse is the product of the pulse amplitude or power level of the pulse and the pulse width or pulse duration. Each pulse should have sufficient energy, at least in the area where it is incident, to provide adhesion throughout the time period required to lay the conductor. The pulse energy must be below a level that causes "C-stage" cure of the adhesive or damage to the coated area. The pulse energy is set prior to the start of the laying process.

A pulse of laser energy is emitted as the incremental spacing is advanced along the adhesive. Therefore, the number of pulses emitted per unit time, that is, the pulse repetition rate necessarily changes as the movement interval per unit time. In other words, it changes as a function of laying speed.

According to the method of the invention, the amount of energy received by each unit area of adhesive is kept constant regardless of variations in the laying speed. As a result, a uniform and reliable joint is formed along the entire length of the laid conductor.

The laying element is intended to momentarily maintain the desired conductor position on the laying surface, but at the expense of the ability to control the conductor position as the laying head moves. Therefore, the adhesive should quickly form the bond between the conductor and the substrate surface to maintain the desired position.

If possible, the adhesive after activation should restore the non-adhesive state to form a bond within about 50 to 200 milliseconds to maintain the desired conductor position. One advantage of using a predetermined control energy pulse that is only sufficient to activate the adhesive is that the time it takes for the adhesive to heat, activate, and lose thermal energy (thermal cycle) is relatively short. That's what it means. By matching the amount of energy released to the amount of energy required to activate the adhesive, the duration of thermal cycling is reduced and the required bond is formed relatively quickly than if too much energy is applied.

If possible, the energy level of the laser pulse is
It is preset to the minimum energy required to activate the particular adhesive used in the conductor facility. The adhesive to be used in the laying process to determine this set is baked and the temperature rise required for the adhesive to achieve adhesiveness is identified. Here, the laser beam is pulsed with a specific area of adhesive and with the shortest time possible in that area. The pulse energy level is adjusted to find a level that reliably raises the temperature to a sufficient degree that the adhesive becomes tacky.

The spacing of the incident energy pulses along the laid conductor can be set prior to performing the laying process. This spacing should be small enough to allow continuous bonding along the length of the conductor. The extent of continuous joining is determined by microscopic inspection of the laid conductor. When a gap or ripple appears, the adhesive in that part is no longer activated. The occurrence of such discontinuities is corrected by adjusting the "spot size" of the laser beam and by adjusting the pulse energy level.

The spot size should be as small as possible. However, if the spot size becomes too small, it may cause a slight misalignment of the laser beam off the conductor and the adhesive on it. Preferably the spot size diameter is about 4-5 times the conductor diameter. The spot size should be limited to the extent that it will not damage the equipment surrounding the installation area and cause damage and abnormalities.

The energy distribution at the spot may vary, but it is preferably a one-lobe Gaussian distribution such that most of the energy is concentrated in the center of the spot and therefore the energy density decreases towards the periphery. In order to maintain a stable activation level along the conductor, the spacing between laser pulses should be such that there is overlap between spots. The range of overlap depends on the pulse energy distribution. Obviously, the more diffuse the energy distribution, the greater the overlap. If possible,
The spots should overlap within about 10-90% of their diameter. More preferably, they are about 80 spot diameters.
% Should overlap.

When laying the conductor on the coated surface of the adhesive layer, pulse type CO
_Two lasers are preferably used. The laser pulse amplitude is preferably about 5-10 watts. Pulse width is about 50
~ 2000 microseconds. The pulse interval should be about
It is 0.002-0.010 in. The diameter of the spot is preferably about
It is 0.007 to 0.03 in. Laying speed is about 0 to 1 per second
5 in. However, the laying speed can be increased depending on the upper limit of the laying device. Of course, the preferred range for these parameters will vary depending on the adhesive used.

Any adhesive that can be made tacky and adhesive by a laser beam pulse and that forms a bond between the conductor and the substrate surface can be used to lay the conductor according to the method of this invention. . A thermoplastic or thermosetting resin can be used as the adhesive, and it is desirable that it has both thermoplastic and thermosetting properties.

The power level of the laser beam will fluctuate during use as the signal output of the sealed laser decays throughout its use. Furthermore, in a single installation procedure, momentary fluctuations in the signal are possible.
The method of the present invention provides a preferred means for compensating for small variations in power output.

The power level of the sealed laser beam should be sampled in time. As power output fluctuates, less energy reaches the adhesive. According to the invention, the energy reaching the adhesive can be simply increased by increasing the pulse width or amplitude or by decreasing the pulse spacing (increasing the overlap of the incident pulses onto the adhesive). Is. This equates to an increase in pulse repetition rate.

If an unsealed laser is used, the average power output is measured by splitting a small portion of the beam (about 5-10%) and measuring its power level. When the power level of the split beam changes, the power level of the main part of the beam naturally changes, so the pulse width can be changed to compensate for the power fluctuation.

The conductor laying speed varies from about 0 to 10 in / sec and is usually limited by the operating speed of the wire feeding mechanism.
However, reasonable bonding can be achieved at speeds above 15 in / sec.

Embodiment 1 In this embodiment, a conductor pattern for power connection and ground connection of a printed circuit board is "FR" in the circuit board industry.
It is a copper-coated epoxy-known as a 4 "board-etched on the copper side of a glass laminated substrate. It has a conducting part made of copper wire and an insulated conductor with a total diameter of 1.5 mm as a laying element. A CO ₂ laser (commercially available as Everlace 150 ^™ from Coherent Corporation of the United States) was used to activate the adhesive during the laying process. The reasonable power output of the laser source for Everlace 150 ^TM was about 150 W. The power output per pulse required for the adhesive used was in the range of about 5-10 W. Beam energy distribution The mode was the transverse electromagnetic mode TEM ₀₀ and was selected to be the one lobe Gaussian curve mode.

The following adhesive layer with solid components was layered into an epoxy-glass laminate by applying heat and pressure.

Solid content Acrylonitrile-Bradiene copolymer rubber 26.9% Alkylphenol resole resin 13.4% Diglyceride ether of bisphenol Al Molecular weight approx. ) 17.9% Palladium chloride liquid epoxy resin Reaction product (10% with palladium) 2.6% Fumed silica 4.5% Fluidizer-phenolsilane 0.9% Copper phthalocyanine pigment 2.6% Prior to the layering step, the composition contains 3-6 as a solvent. % Cellosolve acetate, high flush naphtha and methyl ethyl ketone.

The beam output size from the laser was 10 mm in the elementary beam system before the beam passed through the optics of the laser system. The elementary beam passes through the optical system and is focused to approximately 0.5 m.
The pulse width (duration) was selected to be 100 microseconds, incident on the adhesive surface at a given angle to give an elliptical spot with a width of m and a length of about 0.75 mm. The pulse interval (distance) was selected to be 0.1 mm. The laser beam was incident on a point about 0.25 mm in front of the laying needle, which caused the area of the adhesive activated during the laying process to be 0.25 mm away from the laying needle, at which point the conductor abuts. . A uniform bond to the substrate was obtained over the entire length of the conductor at a laying speed of 125 mm / sec.

Example 2 As the elongated tangible wire conductor, for example, 38 awg (United States Wire Gauge) silver-plated with a thickness of about 0.5 μm, that is, a copper wire having a diameter of 0.1 mm is used.
It was coated with a 38 μm thick layer of polyurethane insulation. The conductor was further coated with an adhesive having a dry weight composition as follows. That is, the dry weight composition of the adhesive was 100 g of high molecular weight polyurethane acrylate, 15 g of epoxy acrylate, 9.8 g of polyisocyanate of toluene diisocyanate, 3.5 g of ultraviolet curing agent, and 0.5 g of 4-metaoxyphenol.

The corresponding wet weight composition is as follows: That is, 333.3 g of high molecular weight polyurethane acrylate (32% solution), 15 g of epoxy acrylate, 19.6 g of polyisocyanate (50
% Solution), UV curing agent 3.5 g 4-metaoxyphenol
0.5g, and 7% by weight of toluene.

A model RF165 laser from Larkman Electro-Optics of the United States was used as the laser energy source. The model RF165 is a hermetically sealed CO ₂ laser with a high frequency pump waveguide. Its power output is 20W CW (conti
nuous wave) Gaussian (TEM) beam type with a maximum modulation frequency of 10KHZ.

Laser energy is emitted toward the wire conductor in pulsed beam form, and its pulse width (duration) is about
200 microseconds. The spot is approximately circular and its diameter is about 1 mm (0.04 in). The beam is about 0.2 conductor
Pulse energized when laid in mm (0.008 in). The laying speed is about 5 m / min. The spot size and pulse frequency are adjusted so that each part of the conductor receives about 5 laser pulses. When the activated adhesive coating loses energy, it becomes non-adhesive and forms a bond with the surface within about 200 ms.

When all the conductors of a predetermined pattern are laid on the substrate, the adhesive coating layer is completely cured by exposure to ultraviolet light.

[Brief description of drawings]

FIG. 1 is a sectional view showing a laying head for laser-bonding an insulated wire onto a substrate having an adhesive coating layer, and FIG.
FIG. 3 is a cross-sectional view showing a laying head similar to FIG. 1 designed to use fine wires, and FIG. 3 is another embodiment of the present invention in which adhesive is individually supplied in an isolated manner. Figures 4A, 4B, and 4C show a laying head according to Figure 4, showing different laser beam embodiments in which the adhesive is applied and coated on the wires, at different magnifications, and Figure 5. FIG. 3 is a block diagram showing a control circuit for a laser oscillator.

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Raymond Jay, Kior, New York, USA 11746, Huntington, Whitehall Drive 19 (72) Inventor Jonathan Clark Crawel, USA 02347, Lakeville, Lincoln Street 12

Claims (14)

[Claims] 1. A method for laying a conductor in a predetermined pattern on a substrate surface, the method comprising: (a) preparing a conductor;
(B) laying the conductor on the substrate surface, and (c) using an adhesive that is activated by irradiating laser energy before or at the same time as laying the conductor on the substrate surface. Bonding to the surface of the substrate, the method further comprising generating a laser beam pulse having substantially the same amount of energy, the laser beam pulse being applied to the adhesive between the conductor and the substrate. Substantially irradiating activates the adhesive as the conductor is laid, and timing the pulses such that one pulse is radiated as each length increment of the conductor is laid. A method for manufacturing a printed circuit board, which is characterized by: 2. The method according to claim 1, wherein the pulse energy amount is adjusted before the conductor is laid and is kept constant during the laying. 3. The method according to claim 1, wherein the timing is set so that the laser irradiation area on the adhesive is overlapped by continuous pulses. 4. The method according to claim 3, wherein the irradiation area is overlapped by about 10 to 90% of the beam diameter. 5. The method according to claim 4, wherein the irradiation area is overlapped by about 80% of the beam diameter. 6. A method according to claim 1, wherein the adhesive is applied on the surface of the substrate prior to the conductor laying step. 7. The method according to claim 1, wherein the adhesive is coated on the conductor prior to the conductor laying step. 8. The method according to claim 1, wherein the adhesive is supplied during the step of laying the conductor. 9. A conductor is an insulated conductor, and at least both ends of the insulated conductor are irradiated with a laser beam having sufficient energy and an appropriate wavelength so that the insulating coating can be peeled off. The method according to claim (1). 10. A method according to claim 9 wherein the laser beam having sufficient energy and a suitable wavelength is a second laser beam. 11. A substrate including soldering terminal points, wherein at least one end of the conductor is peeled off and soldered at the terminal points by irradiating a second laser beam. The method described in paragraph (1). 12. A conductor is laid between two terminals on a substrate, in which case the conductor is irradiated with a laser beam having sufficient energy and an appropriate wavelength after reaching the second terminal point. The method according to claim (1), characterized in that the method is used to cut. 13. The method according to claim 9, wherein the second laser beam generates a pulse train of laser energy that is 100% overlap-irradiated at least during a temporary period during the process. The method according to item 10) or (11). 14. A method according to claim 12 wherein the laser beams employed to cut the conductors have different wavelengths and energy levels.