DE102008044379A1 - Electrical circuit producing method for high-performance application, involves providing wire that extends to separation point provided in separation surface, where electrical contact point in surface is provided at separation point - Google Patents

Abstract

The method involves providing a linearly extending, continuous wire (10), and bending the wire in two spatial dimensions. The bent wire is embedded in an insulating mass. A part of the wire is removed along a separation surface (A). The wire extends to a separation point provided in the separation surface, where an electrical contact point in the separation surface is provided at the separation point. The wire is connected to another wire (14) or a component contact point before embedding. The insulating mass is made of ceramic material or low-temperature ceramic material. An independent claim is also included for a circuit arrangement comprising a wire.

Description

State of the art

The The invention relates to the field of circuit technology and in particular the production of electrical connections between components, to provide a circuit.

electrical Circuits are usually built up substrate-based, wherein a non-conductive substrate carries a conductor layer, whose structure is the electrical connection of components that are mounted on the substrate, defined. For high performance applications usually ceramic substrates are used, the one Wear copper, aluminum or silver layer. One more way the connection is to provide stamped grid, wherein the Punching pattern defining the electrical connections. The stamping pattern is held by an outer frame that follows Assembly of components and pouring of the resulting Circuit is removed.

These Connection technologies have a technology-related pitch, d. H. a minimum offset required by manufacturing tolerances between repetitive structural elements, d. H. a minimum distance between track center to a nearest Head track center. Also when using punched grids is the distance between two opposite edges two tracks through the punch and the material thickness limited. For substrate-based technologies, the structure is in the conductor layer by photolithographic processes and etching provided by the etching technology and the copper thickness there is a high minimum distance between two opposite ones Edges of adjacent tracks results. Especially in power applications have thick conductor layers or stamping plates used be to a sufficient cross-section at the same time lower Provide area occupancy, but this thereby Required minimum thickness of material Minimum structure sizes limited to the bottom. Both during etching and When punching high high layer thicknesses must Minimum distances between the tracks should be provided short circuits at usual manufacturing tolerances to avoid.

The publication DE 3624630 A1 describes a method of manufacturing circuit boards in which the conductor layer of a printed circuit board is replaced by a wire which is applied to the substrate. A laser is used to make electrical contacts by removing an insulating varnish of the wire at certain locations, while at the same time the laser serves to weld the wire to the underlying substrate. The required use of a high-power laser causes high costs, the resulting structure is limited to one level and the contact points are raised relative to the substrate, which makes it difficult to assemble components using conventional production methods. In addition, the method described there is based on the activation of a bonding agent layer by means of a laser, wherein the total deformation of the conductor caused by the laser leads to a high minimum distance between two structures, ie to a high pitch.

The publication DE 4405439 shows a circuit arrangement based on electrical connections by means of stamped sheets, which also results in a high minimum distance between two adjacent tracks. This results in the disadvantages associated with the stamped grid technique.

at All of the above techniques result in a high conductor layer thickness or with a high cross-section of the conductor, a high pitch, which increases together with the conductor track thickness.

It is therefore an object of the method, a circuit arrangement and to provide a method of manufacturing the electrical circuit, the make it possible despite a high conductor cross-section, in particular for high performance applications, a low pitch and thus to achieve a better space utilization.

Disclosure of the invention

The invention makes it possible to separate the relationship between the conductor thickness and the minimum distance between opposite edges of conductors and, in particular, to provide an electrical circuit with a particularly low pitch while at the same time having a large cross-sectional area or thickness of the conductor. The pitch is almost independent of the material thickness of the conductor used. Furthermore, the method according to the invention and the device according to the invention are less time-consuming with respect to substrate-related circuit techniques due to the etching process which is not to be carried out and does not require the use of chemicals, which results in a higher environmental friendliness. In addition, the invention is not limited to a connecting structure running in a plane, but can also realize any expansive structures. In particular, no punching tools or films are necessary, resulting in increased manufacturing flexibility, especially in small series. Since the invention relies on the use of only a single tool that can be flexibly controlled, Ä changes are very easy to implement.

The The invention is based on the concept of an electrical connection structure to produce by means of a curved wire. The necessary tool is a software programmable wire bending machine, of course, too can process high wire thicknesses with high precision, so a small minimum distance between the individual wire sections provided. According to the invention, (at least) one Wire bent, which is at least partially continuous. In another step is the resulting bent wire assembly embedded in an insulating compound. Then the wire becomes alone or together with a part of the insulating compound along a (or several) levels separated along a separation surface, so that the separation results in several wire sections, the equivalent to single, optionally interconnected Tracks are to be considered. At the separation area itself arise separation points, the immediate from the outside are to contact and thus provide an electrical contact point. The electrical contact point is thus through a separation surface provided the wire, wherein the separation surface of the wire may be provided perpendicular to the course of the wire (end face), horizontally to an (end) section of the wire (long elongated contact surface) or generally inclined to Course of the wire or the wire section can run. Of the Wire is bent in at least two room dimensions, so that through the bent wire or through the bent wires gives a shape through which the separation surface runs. When separating along the separation surface Thus, this form is divided into (at least) two parts remaining part in which the wire is used for electrical connection, and a part that is rejected and its distance to the subdivision of the wire or wires into several pieces of wire serves, which are no longer electrically connected by the wire. One piece of wire or several pieces of wire can or can several, through the respective piece of wire having connected contact surfaces.

Especially The method and the device become a connection technique in three dimensions, allowing itself along a Plane that is substantially parallel to the interface, the individual connectors run, and contact points be provided by the wire being perpendicular in the direction is bent to the plane and thus pushes through the separation surface, defines the position of the contact point of the piece of wire. Below the separation surface, the pieces of wire can run along one or in particular along several levels, which are substantially parallel to each other, so several levels of interconnection to realize.

in principle There are two ways to provide the contact points and part off the wire. For one, the curved wire or the bent wires before disconnecting in an insulating compound embedded, the an insulating material surface (or several Isoliermassenoberflächen) provides that at the same time Defines the course of the separation surface. After embedding stand according to this variant, a part or the Parts of the wire or wires out of the insulating, wherein then along the Isoliermassenoberfläche the separation process is carried out. The separation can be performed are guided by means of a separating tool, which along the Isoliermassenoberfläche is or along the coincident Abtrennfläche is guided, for example a separating knife, a milling cutter, a grinding tool and in particular a shearing tool, the one Edge along the separation surface and thus along the Isoliermassenoberfläche is guided.

Possibly may be the separation surface outside the insulation be provided with a small distance to Isoliermassenoberfläche, which corresponds to a maximum of 100%, 50%, 25% or 10% of the wire diameter. Due to the fact that the separation surface only slightly is removed from the Isoliermassenoberfläche is avoided that when separating out of the insulating material sticking out (short) Wire section is bent along the separation direction and so undesirable Generated short circuits. According to one embodiment is the distance between the separation surface and Isoliermassenoberfläche provided such that the protruding from the insulating remain bende wire section one for electrical contact has suitable length and optionally during the separation process is bent in the direction of the tool guide. In this However, case must be guaranteed that the length of the protruding from the insulating wire section less is the distance to the next along the separation direction Contact point to unwanted short circuits too avoid.

According to a second variant, the separation surface is within the insulating, so that not only wire parts are separated during separation, but also insulating material is removed with. The insulating compound may in this case surround the entire bent, not yet severed wire or may provide an insulating compound surface which is remote from the separation surface by a certain distance, but does not embed the entire bent wire. Since in this variant, together with the wire parts to be removed also a part of the insulating materials is removed, the part of the insulating material to be removed can be used during the separation process to attach the wire parts to be removed to ver a bending of the remaining pieces of wire during the separation process to avoid and to allow the parts of the wire to be removed and the insulation to be removed to be removed as a whole and in a coherent manner.

Of the Step of bending is based on providing a linear extending, continuous wire, the example in shape a wire roll can be provided. It can be one or more Wires together in bent form for the production of electric Circuit and serve to its realization. Because the bent wire turns extends through the separation surface and thus the provided by the bent wire form, be it in two or three Room dimensions, the cut-off surface, results through the separation area on the one hand possibilities the contacting of the individual pieces of wire and the other the division into a variety of each other by insulating separate pieces of wire used to connect individual connected to the contact points outer Serves components. On the inventive method for the production of the circuit structure can thus be a step of Montierens of electrical components, the components with their contact points are mounted on contact points, which at the Insulating and provided in particular on the separation surface are.

Preferably the separation surface extends along a plane, wherein However, the separation surface also divided into several sections may be, each extending along a plane, wherein the levels of each section of Abtrennflä chen preferably parallel to each other. This results in a multi-level Structure of the separation surfaces, for example a two-stage or multi-level design, which allows for the adaptation of different component heights can serve external components. In the same way extends the Isoliermassenoberfläche preferably along a single level, but also portions of Isoliermassenoberfläche can lie in respective levels that are parallel to each other are. The Isoliermassenoberfläche or its plane or Layers can be in one level of the cut area or one Section of Abtrennfläche lie, or the Isoliermassenoberfläche Can over the separation surface and outside the remaining after the separation of insulating, wherein the Isoliermassenoberfläche by parts to be separated extends through the wire or the insulating the bent Wire, d. H. the wire to be removed as well as the remaining wire fully embedded. Will also be the part of the wire that separate is surrounded by a part of the insulating compound, so is at the step separating the part of the insulating compound together with the to be removed Part of the wire severed together.

The method may be provided with one or more continuous wires that are the same or different. The wires may differ in material, cross-section, diameter and cross-sectional shape. The wires may, for example, have a circular or a rectangular cross section, for example the cross section of a flat sheet metal strip. In particular, if more than one wire is provided, different wires may differ in temperature dependence of resistivity, resistivity at a particular temperature, and thermal expansion coefficient. For example, various wires can be used, with a wire serving as a connecting wire having a high cross-section and being as low as possible, that is equipped with low resistivity, whereas another wire is used for providing a component in the form of a resistor, wherein the resistance forming wire has a smaller cross-section, has a higher resistivity, or both. Moreover, the further wire preferably has a lower coefficient of thermal expansion and, in particular, a lower temperature dependence of the specific resistance or the absolute resistance. For example, the wire forming the resistor may thus be provided as a short section and may be provided as a shunt resistor, which does not substantially change its resistance value even at high current load and only slightly expands, or substantially fails, despite the resulting high heat loss expands, whereby the mechanical stress remains low. Instead of a shunt resistor, a smaller diameter wire with higher resistivity can be used to provide a fuse. Thus, a wire with specific electrical properties can be used to provide internal components such as shunt resistors or fuses or low-resistance protective resistors, such a wire may have a smaller cross-section than the provided for electrical connection wire. The material of such a wire is Konstantan, Kanthal or Isabellin. Furthermore, in addition to a low temperature dependence of the specific resistance, such a wire can also have a low coefficient of thermal expansion, for example if an Invar alloy is used as the wire material. The material of the wire or wires that make a connection within the circuit according to the invention are preferably also made of a metal or of an alloy, for example of a material with low resistivity, for example of silver, copper, gold or of aluminum or of an alloy of at least two of these materials. Basically, are also Mischun conditions or combinations of several of these materials. The material of the wire or wires can basically be any electrically conductive material. In particular, metals and metal alloys are suitable.

Become at least two wires, for example with different ones Cross section or of different material, for the production the electrical circuit uses or includes the electrical Circuit more than two wires by disconnecting a variety of pieces of wire have been divided, so can these wires are connected together before embedding. In principle, all compounds of substance, shape and or non-positive connections. Preference is given to cohesive Used connections, for example soldering or welding, in particular ultrasonic welding. The connection between the wires or after separating between the remaining Wire pieces can be attached to any section of the piece of wire be provided, for example between the ends of the piece of wire, but preferably at wire ends or at wire end sections. The Connections can be between two parallel Provided sections or end portions of the wire pieces be, or even between faces of two on each other abutting pieces of wire or between an end face of a Wire and the side surface of another wire or its End. Preferably, however, in addition to a wire end of a first Wire a wire end of a second wire directly physically placed adjacent so that the wires overlap at the ends and the second wire continues the course of the first wire. The connection is preferably by a welded connection provided, for example by friction welding, which is generated by ultrasound, with ultrasound during pressing directly adjacent wire ends introduced to a wire outer surface of a wire end and by the intended vibration and by the pressing itself a cohesive connection between the two wire ends at the point where they meet.

Next the connection between two wires or pieces of wire within the insulating compound can also be a connection between a Wire section or a wire end and an electrical or be provided electronic component, as well as the wire embedded in the insulating material. Instead of a connection between a first wire and a second wire as described above For example, the first wire (or second wire) may be connected to a device pad of the embedded internal device. As components In principle, all active and passive electrical systems are suitable or electronic components, but in particular passive components such as capacitors or coils, in particular coils with ferrite core. Preferably, the internal components are in a flat design, wherein the Abtrennfläche not through the components passes.

In addition to a first wire and a second wire or a first wire and a component also other components and other wires can be used, wherein the connection or the contacting is performed by one of the above-mentioned bonding techniques, in particular, ultrasonic welding is suitable. As a particularly preferred embodiment, a shunt resistor is provided within the circuit, in which two different wires are used. A first wire provides the electrical connection between the individual contact points, which may be provided on the outside of the insulating compound (but also inside the insulating compound). The first wire has a low resistivity and a high cross-sectional area, for example a copper wire or a silver wire with a diameter of at least 1 mm, for example 2-5 mm. Furthermore, a second wire made of constantan or a similar material, which has an approximately constant electrical resistivity over wide temperature ranges. Next, the first wire is connected to the second wire, whereupon the second wire is optionally cut off if it does not have a suitably short length, for example less than 10 cm, less than 1 cm or less than 5 mm, depending on the desired resistance value. Prior to or during the bonding of the first wire to the second wire, the first wire is cut to provide a wire end for connection to the second wire. After making the first connection between the first wire and the second wire, another connection is provided between the other end of the second wire and the cut end of the first wire. The course of the wire is then continued with the first wire. First, thus, the first wire is cut, connected to the second wire, resulting in a remaining piece of wire, and a cut first wire. The cut first wire has an end connected to the second end of the second wire. Optionally, the second wire has a smaller cross-section than the first wire to achieve a higher resistance value for a particular length, for example, a gauge of 1 mm or less, for example 0.25-0.1 mm. If necessary, a piece of wire can be made in loops or in a meandering shape to provide a high overall length with low area consumption, for example, if the piece of wire used a Resistance or a flat coil should realize.

In front The bent wire can or can be bent Wires can be arranged on a substrate, and with this (loose) to be connected during the step of embedding to avoid unwanted bending of the wires. Additionally or alternatively, a holder may be provided be. Either the holder or the substrate is embedded with or not, in particular, in the case of co-embedding neither Holder still substrate an electrical connection for provide the wire. According to another embodiment The invention uses spacers which are not electrical Provide contact, and a lower level of the curved wire spaced from an outer surface of the insulating compound hold, which is opposite to the separation surface.

The Embedding by means of insulating can by pouring or by encapsulating the bent wire or the bent wires be provided, for example by injection molding of a plastic or by pouring into curable resin. The insulating compound is initially flowable to these at the to attach bent wire without bending it further, wherein the insulating compound is curable, for example by cooling as with injection molding plastics or by hardening means UV light or by heat as with plastic resins.

Especially suitable as insulating is a ceramic precursor, for example a flowable ceramic particle suspension, the is solidified. As insulation, in which the wire is embedded the ceramic starting materials of DBC, LTTC, DFH or HTCC ceramic substrates. Preference will be given to embedding flowable ceramic precursors used, which are solidified by sintering and during which of sintering only slight volume changes result. In the case of ceramic insulating compound, it can be partially hardened before separation to simplify the separation. Then the insulating compound completely cured, for example by further sintering or calcination. Basically as insulating electrically insulating materials suitable, the can first be deformed, for example by casting or syringes, and which are then solidifiable, for example by curing. The solidifying may include: cooling, Treat with heat or treat with UV radiation.

While essentially metals as the material for the wire and metal alloys, is preferably used as insulating electrically non-conductive material such as plastic or ceramic used, in particular a material which after solidifying the Insulating mass does not conduct electricity.

Brief description of the drawings

embodiments The invention is illustrated in the drawings and in the following Description explained in more detail.

It demonstrate

1a a wire bent according to the invention before the step of severing;

1b a circuit arrangement according to the invention, which results after the step of separating;

2a a circuit detail of the circuit according to the invention with two wires;

2 B a circuit arrangement with a wire and an internal component;

3 shows a wire according to the invention as a plan view of 1a before the step of separating; and

4 shows a wire according to the invention as a plan view of 1b after the step of disconnecting, ie a circuit arrangement according to the invention, such as in 1b is shown.

The 1a shows a precursor of a circuit arrangement according to the invention prior to the step of separating for a more detailed explanation of the invention. The 1a shows a first wire 10 . 12 in a first section 10 and a second section 12 is divided. Between the two sections 10 and 12 connects the two wires a second wire 14 or a section thereof. The section of the wire 14 has a first end parallel to a wire end 10a is disposed of the first portion of the first wire and connected thereto (not shown). In the same way, the second section of the first wire 12 a wire end 12a which is also parallel to an end portion of the second wire 14 arranged opposite to the first end portion of the second wire, and with the end portion 12a of the second section 12 the first wire is connected. The wire section 14 , which is provided by the second wire, serves as a shunt resistor and has a smaller cross-sectional area in order to provide a high resistance even at low length. Optionally, the cross section of the first wire may correspond to the cross section of the second wire. In particular, the illustrated second wire 14 made of constantan, with the sections 10 . 12 of the first wire are provided of a copper wire. In principle, the wires may be coated or uncoated, with coated wires having a conductive layer are equipped. The line A indicates the cut-off surface along which the bent-in wire later poured is separated to remove a part of the wire along the cut-off surface A.

The first wire has many sections 20a , b, c, in which the first wire runs along the separation surface and at the same time the wire extends through the separation surface. The course along the separation surface A in these sections 20a -C is used to increase or extend the resulting there by separation contact points. In the section 20a the first wire extends only partially (with an upper half of the cylinder) through the cut-off surface, so that the feature according to which the bent wire extends through the cut-off surface also encompasses embodiments in which this is not complete but only partial ie with part of the wire cross-section is provided. In section 20a The wire also extends along a plane that is perpendicular to the plane of the drawing, such as plane A. This is accomplished by placing the wire in section 20a inclined, in particular bent perpendicular to the plane of the drawing, for example in meandering or in the form of adjacent or mutually parallel loops. The loops each have ends with a narrow 180 ° course of the wire, the intermediate pieces between the ends are parallel to each other and are preferably adjacent to each other. This results in a contact surface which extends perpendicular to the plane of the drawing in the third space dimension (for example, along plane A), which in turn is perpendicular to the space dimensions, which in the 1a are shown. Due to the section through the plane perpendicular to the plane of the drawing (for example, along plane A), a contact surface results, which comprises a plurality of longitudinal sections through the wire, wherein the longitudinal sections are aligned in a direction perpendicular to the plane of the drawing. The 3a and 3b show the device in a plane corresponding to the plane A. In other places 22a and b, the first wire extends perpendicularly to the separation surface thereby providing a smaller separation area compared to the sections 22a -B is provided, but the electrical interruption of the wire during the separation is ensured. Basically, thus sections of the wire perpendicular to the Abtrennfläche (see 22a . 22b ) as well as parallel to the separation surface (cf. 20a C) or wire sections may extend obliquely to the separation surface therethrough (not shown). During the step of embedding is provided the bent wire 10 . 12 . 14 (ie all curved wires) in insulating material, which either extends between the planes E1 and E2, see arrow 30 , or extending between plane E1 and plane E3, see arrow 32 , Furthermore, the insulating compound may extend between the plane E1 and the separation surface A, wherein the separation surface corresponds to the Isoliermassenoberfläche. As the insulating material surface in particular the levels E2 and E3 are referred to. As mentioned above, there are two variants of the embedding, on the one hand, the variant, which is shown with E1-A, in which the insulating mass only filled the space to the separation surface, so that no insulating material is removed during separation along the separation surface. According to a second variant, the insulating material is filled in a space beyond, ie up to level E2, wherein a part of the later separated wire material is surrounded by insulating, which is also removed, and embedded in the filling up to the level E3 of the entire bent wire is and thus also the entire later to be removed part of the wire remains embedded. The complete embedding of the entire bent wire or all bent wires with insulating compound later allows a simplified hardening, if a hardening process, a sintering process is used.

In 1b a circuit arrangement according to the invention is shown, which was produced by the method according to the invention and already a part of the wire (and possibly also a part of the insulating material to be separated off) was removed above the separation surface. The separation surface A forms the upper side of the circuit arrangement and the opposite surface of the insulating compound E1 forms the underside of the circuit arrangement according to the invention. The circuit arrangement comprises wire pieces 110a - 110d formed from the same wire and further subdivided during the separation step. It should be noted that the section 110b from the section 110c is divided not during the Abtrennschritts but during bending, wherein the first wire to the wire end the course of the wire with the second wire 14 in turn, to the new end of the interrupted first wire 10b was attached. Thus, the bending of the continuous wire may also include the severing of the continuous wire to provide two continuous wire sections of the same wire. According to another approach, wire-cutting steps provided during bending produce multiple wires (but from the same source wire). In this context, a continuous wire section should be referred to as a linearly extending, continuous wire. The wire-separating step may be provided before, during or after bending, but before embedding and separating along the cut-off surface.

In the 1b shown wire sections that run along the separation surface A, see long stretched contact points 120a . 120b and 120c resulting from severing a portion of the wire along the wire path. These elongated contact surfaces 120a C are particularly suitable for higher currents. Other electrical contact points 122a , b are obtained by severing the wire along the separation surface and along the cross section of the wire. The electrical contact points 122a and b are thus contact points which result from the cross section of the wire and which can serve, for example, as measuring points, as taps or also for current connections which conduct small currents, for example for control currents. On the long contact surface 120a is an external component 140 fixed, the underside of which provides a power connection, which extends in a plane and, for example, by soldering to the contact point 120a connected is. In the same way, the circuit of 1b a component 142 that with the elongated contact point 120c connected is. Both components 140 . 142 further comprise a control terminal which conducts only small currents and in the case of the device 140 with the narrower contact point 122a connected via a bonding connection. In the case of the component 142 is the control terminal with the elongated contact point 120b connected, but not to achieve a lower contact resistance, but because the larger area of the electrical contact point 120b allows easy installation with higher manufacturing tolerances.

The 1b (like on the 1a ) are cross-sections through an electrical circuit according to the invention, which can also extend along a plane perpendicular to the plane of the drawing to provide a provided by wire connection structure in three dimensions space. In the 1b (and also in 1a The visible structure shown merely shows a component extending into two spatial dimensions, but in the case of a variant extending in two spatial dimensions (provided by the drawing plane), the only component of a connection arrangement of a circuit arrangement according to the invention extending in two spatial dimensions results.

In the 2a is the one through the wire ends 10a and 12a or through the second wire 14 (see 1a ) shunt resistor shown in plan view. The drawing plane in the 2a is thus perpendicular to the plane of the 1a and 1b , It can be seen that the ends of the first wire or the ends of the portion of the first wire 110a . 110b partly parallel to the respective ends 214a . 214b of the second wire 214 extend. First, the respective ends of the various wires are abutted, and by pressing and applying ultrasonic energy, the ends are welded to the contact surfaces by cold working and static friction. The second wire 214 is along with the contact points that like ends 214a and 214b provide dimensioned as a shunt resistor having a predetermined resistance, which preferably changes only slightly with the temperature. Because of this, the second wire is 214 made from Konstantan. To the influence of (variable in temperature) resistance of the first and second sections 210a To neglect b of the first wire are the sections 210a , b is made with a high cross-section and made of a material that has a high specific conductivity. Furthermore, dimension, in particular the length, and material of the wires and wire sections of the 2a is selected such that the resistance value provided by the first wire is only a fraction of the resistance value of the constantan wire 214 is provided.

The 2 B shows the possibility of fixing an internal component 350 , which is shown schematically and in 2 B a coil with core is. The component 350 has two contact points 352a , b, which are connected to respective ends of two separate sections of a first wire. The ends 310a , b are parallel to the contact surfaces 352a , b of the component 350 arranged and connected directly to this via an electromechanical connection. The connections between the component and the wire sections are made prior to embedding the wire and also all internal components by, for example, cold welding operations such as ultrasonic welding. Alternatively, the connection between component 350 and wire 310a , b be provided via a solder joint. However, if ultrasonic welding is used, internal components as well as various wires or wire sections can be connected to each other with the same tool. The ultrasonic tool used for this purpose can also be used for cutting a wire in order to produce therefrom wire sections that are used individually as a wire for producing circuits according to the invention.

The 3 shows a part of the wire path of the bent wire of the 1a in the plan view. A contact surface 420a , in the 1a With 20a is shown as a plurality of wire loops, along the plane A of 1a run. As a result, the contact surface can be multiplied compared to a non-bent wire. The in 3 shown wire is not cut, ie the separation along the plane A is not yet done. Furthermore, in 3 the insulating material is not shown.

Based on the large number of contiguous loops (which also has a small gap between each other) extends the wire, which is the contact surface 420a forms, to the wire end 410a , At this point, the course of the wire is continued by another wire 414 that is different from the wire of the contact point 420a different. For example, the wire may be on the left of the piece of wire 414 and to the right of the piece of wire 414 be provided as a copper wire with a large cross-section, for example, 2.5 mm, and the wire 414 who is at the end of the wire 410 connects can be provided by a (thinner) Konstantandraht. The wire 414 is by ultrasonic welding to the wire end 410 connected. The wire 414 is continued by the wire end 412a with which the wire, which is also the contact surface 420a forms, continues. At the wire end 412a the wire having the larger cross-section is also welded to the wire 414 connected. Instead of an ultrasound connection, a fusion-welded connection or also a soldered connection or adhesive connection can be provided. However, preferred is an ultrasonic cold weld. The wire end 412a is continued and forms in the place 420c that runs along the cutting plane (corresponds to 1a the cutting plane A), another contact surface 420c , While the contact surface 420a is formed by a plurality of longitudinal cross sections of the wire forms the contact surface 420c a contact surface corresponding to a longitudinal section of a wire section. As already noted, is in 3 the separation step has not been carried out, so that there is a continuous wire path. The spot 420c corresponds to the place 20c of the 1a , where the body 422b the agency 22b in 1a equivalent. While the contact surface at the site 420a through several longitudinal cuts and the contact surface 420c formed by a longitudinal section of the wire, the contact surface 422b formed by a cross section of the wire, ie perpendicular to its longitudinal extent. This results in a lower contact surface content.

The 4 equals to 1b as a plan view of the plane A. The 4 thus corresponds to the in the 1a and 3 illustrated wire trace after the performed step of separating. As in the 3 is in the 4 the insulating material is not shown, but for better illustration, the arranged below the plane A wire sections are shown only in broken lines. In the 4 Thus, only the abutting directly to the exterior contact surfaces are shown as solid lines or as a completely blackened surface. In the 4 The arrangement shown comprises the contact surface 420a comprising a plurality of loops of the wire extending along the plane A (ie along the plane of the drawing) 4 ) lie. The contact surface 522a corresponds to the section along the plane A at the point 22a of the 1a , The contact surface 522a is thus a wire cross section. The contact surface 520b corresponds to the contact area 20b of the 1a and is a section along a length of the wire. The longitudinal piece extends along the plane A, as in 1a is shown. The dashed lines shown are below the area A, ie below the plane in the 4 , Below the in 1a represented level A and above the in 1a Plane E1 shown are a wire end 520a and another wire end 512a , thus forming an interruption of the wire. This interruption is, as already described, by means of a wire 514 bridged, with the wire ends 510a and 512a is electrically connected, for example by means of an ultrasonic welding connection. The wire, which has the thicker cross-section, is starting from the wire end 512a continued and bowed to the plane A, the drawing plane of 4 corresponds, leaving a contact surface 520c is formed. The contact surface 520c corresponds to the contact area 20c of the 1a , Moving to the right again follows a (deliberate) interruption, during which the wire during the separation step above the plane A of the 1a was. The contact surface 522b thus corresponds to a piece of wire that is perpendicular to the plane, ie perpendicular to the plane A of 1a , and exposes the wire cross-section along the plane A by the separation step. In contrast to the contact surface 520c is the contact surface 522b represented only by the wire cross-section, since the piece of wire in question during the Abtrennschritts perpendicular to the plane A, while the contact surface 520c is formed by a wire section which runs along the separation plane A.

Targeted breaks of a continuous wire of the larger cross section, down to the point 514 forming the entire wire is due to wire loops that were above the separation plane A during the step of separation. These were thus removed and formed after separation of the wire contact surfaces, which are formed by longitudinal sections, cross sections or by several parallel de longitudinal sections of the wire. The contact surface 520a may also have additional connections between the parallel wire sections resulting, for example, by plastic deformation during the Abtrennschritts, or optionally connected to each other by means of solder. Instead of solder, other contact elements can be used, in principle also sheets which correspond to the surface of the parallel wire sections or embrace them, and which are mounted on the wire sections, for example by means of a solder or a welded joint, for example by means of an ultrasonic welding connection. An arrangement according to the invention can thus provide contact surfaces as a cross section of a Wire (cf. 522a ), as a longitudinal section of a wire section (see. 520c ), as a longitudinal section of a wire section extending in loops (or as a meander) (cf. 520a ), or as a combination of two of these embodiments, or as a combination of all of these embodiments, individually or in plurality.

QUOTES INCLUDE IN THE DESCRIPTION

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Cited patent literature

• - DE 3624630 A1 [0004]
• - DE 4405439 [0005]

Claims (10)

Method for producing an electrical circuit, comprising the steps of: providing at least one linearly extending, continuous wire ( 10 . 12 . 110a -d); Bending the continuous wire in at least two dimensions of space; Embedding the bent wire in an insulating compound; and separating a part of the wire ( 10 . 12 . 110a -d); along a separation surface (A), through which the bent wire extends, at at least one separation point provided in the separation surface ( 20 . 22 ) around at least one electrical contact point ( 120 . 122 ) in the separation surface (A) at the at least one separation point ( 20 . 22 ) of the wire ( 10 . 12 . 110a -d); provided. The method of claim 1, wherein separating a portion of the wire at at least one of the separation sites ( 20 . 22 ) electrically interrupts the wire and the separation surface (A) or the contact point extends completely along a plane (A) or completely along a plurality of mutually parallel planes. The method of claim 1 or 2, wherein the curved Wire only partially up to a Isoliermassenoberfläche (A) is embedded, through which the wire extends and the separation surface (A) at least in sections or is completely in the Isoliermassenoberfläche, or wherein the part of the wire to be separated partially or completely embedded wherein the severing further comprises severing a portion of the insulating material along the separation plane (A), and a part of the insulating compound and a part of the wire is separated together in the same separation step become. The method of any one of claims 1-3, wherein the providing of wire comprises: providing at least one first wire ( 10 . 12 ) of a first material or having a first cross-section; Providing at least one second wire ( 14 ) of a second material or with a second cross section or of an electrical component ( 350 ) with a component contact point ( 352 ); and the method further comprises: connecting the first wire ( 10 . 12 ) with the second wire ( 14 ) or the component contact point ( 352 ) prior to embedding by (a) placing a wire end ( 210 . 310 ) of the first wire parallel and laterally adjacent to a wire end ( 214 ) of the second wire ( 214 ) or the component contact point ( 352 ); or by arranging the wire end of the first wire with an end face of the first wire adjacent to an end face of the wire end of the second wire or the device pad; and (b) pressing the wire ends or the wire end of the first wire and the device pad together to deliver ultrasonic energy to at least one of the two wire ends or to the device pad or to the device pad and to the wire end of the first wire. Method according to one of the preceding claims, further comprising: attaching the wire ( 10 . 12 ) on a fixture or substrate prior to embedding, wherein the fixture or substrate does not provide electrical connection for the wire. Method according to one of the preceding claims, wherein the embedding is carried out by pouring or overmolding with a mass after or during the embedding is converted into a solid by cooling or by hardening. Circuit arrangement with at least one wire extending in at least two spatial dimensions ( 10 . 12 . 14 ), which is embedded in an insulating compound, and which is divided into separate wire pieces, wherein at least one of the pieces of wire a Abtrennstelle ( 120 . 122 ) in a separation surface (A), insulating compound has a Isoliermassenoberfläche in which at least partially or completely the Abtrennfläche (A), and the Abtrennstelle ( 120 . 122 ) provides at least one electrical contact point in the Abtrennfläche, which is adapted to be electrically contacted from the outside. Circuit arrangement according to claim 7, comprising a plurality Having contact points extending in the same plane (A), in which the Isoliermassenoberfläche lies, or in extend parallel planes and all contact points lie in the Isoliermassenoberfläche. Circuit arrangement according to Claim 7 or 8, with a first piece of wire ( 110a , b) a first material or having a first cross-section, and a second piece of wire ( 14 ), a second material or with a second cross-section or with an electrical component that has a component contact point ( 352 ), wherein the first piece of wire is connected to the second piece of wire or to the component contact point via an electromechanical joint, which physically connects the first piece of wire directly to the second piece of wire or to the component contact point, wherein the joint is provided within the insulating compound and the joint Wire end of the first piece of wire connects to a wire end of the second piece of wire or with a surface of the component contact point, wherein the wire end of the first piece of wire perpendicular or parallel to the Wire end of the second piece of wire or is aligned with the surface of the component contact point. Circuit arrangement according to one of the claims 7-9, with one or more wires, where the pieces of wire of the same wire of the same material and are formed with the same cross section, and wire pieces different wires of different or the same Material or formed with different or the same cross-sections are, and the material includes: an electrically conductive material, a metal, a metal alloy, copper, a copper alloy, Aluminum, an aluminum alloy, silver, a silver alloy or a mixture of at least two of these materials; the insulating material comprising: an electrically insulating material, an electrically insulating, deformable and solidifiable material, ceramic material, a low-temperature ceramic material, a plastic polymer, a plastic polymer blend, an injection-moldable one Plastic, an injection-moldable plastic mixture, a Thermoset material, heat or UV curing resin or a combination thereof.