DE102018203715A1 - Method for producing a printed circuit board using a mold for conductor elements - Google Patents

Abstract

The present invention relates to a method for producing a printed circuit board with at least one conductor element extending between connecting points in the printed circuit board. In order to increase the productivity of the known method for producing a printed circuit board having at least one conductor element extending between terminals in the printed circuit board, the method according to claim 1 comprises the following steps: Step A: providing a mold (3) with at least one receptacle (3c ) for a conductor element (2) .- step B: arranging a conductor element (2) in the receptacle (3c) of the mold (3) .- step C: connecting the conductor element arranged in the receptacle (3c) of the mold (3) ( 2) with an electrically conductive surface element (5) at positions of the intended connection points. Step D: Embedding the conductor element (2) in insulating material (4) connected to the electrically conductive surface element (5). Step E: Working out the connection points from the electrically conductive surface element (5).

Description

The present invention relates to a method for producing a printed circuit board with at least one conductor element extending between connecting points in the printed circuit board.

Such a method is known from EP 1 842 402 A2 known.

In the known method, a lead wire is welded to a copper foil and then pressed with insulating material.

In view of today's manufacturing precision requirements, the positions and orientations of the conductor elements and terminals must be accurately measured. In particular, in a mass production of corresponding circuit boards, the manufacturing process is delayed by repeated surveying operations, whereby the productivity of the method decreases.

Based on these considerations, the present invention has the object to increase the productivity of the known method.

The object is achieved by the method according to claim 1.

• - Schritt A: Bereitstellen einer Form mit wenigstens einer Aufnahme für ein Leiterelement.
• - Schritt B: Anordnen eines Leiterelements in der Aufnahme der Form.
• - Schritt C: Verbinden des in der Aufnahme der Form angeordneten Leiterelements mit einem elektrisch leitenden Flächenelement an Positionen der vorgesehenen Anschlussstellen.
• - Schritt D: Einbetten des mit dem elektrisch leitenden Flächenelement verbundenen Leiterelements in Isolierstoff.
• - Schritt E: Herausarbeiten der Anschlussstellen aus dem elektrisch leitenden Flächenelement.

The method disclosed herein for producing a printed circuit board having at least one conductor element extending in the printed circuit board between connection points comprises the following steps:

• Step A: Providing a mold with at least one receptacle for a conductor element.
• Step B: Arrange a conductor element in the receptacle of the mold.
• Step C: connecting the conductor element arranged in the receptacle of the mold to an electrically conductive surface element at positions of the provided connection points.
• Step D: embedding the conductor element connected to the electrically conductive surface element in insulating material.
• - Step E: Working out the connection points of the electrically conductive surface element.

By using the mold, the relative orientation of a plurality of conductor elements can be accurately determined, since the arrangement and orientation of the images to each other in the form is precisely defined. Notwithstanding the conventional method, the individual conductor elements for connection to the electrically conductive surface element need not be measured individually, but are simply positioned in the respective receptacles provided. Then, only the electrically conductive surface element must be fixed relative to the mold, so that the positions of all line elements and connection points to the electrically conductive surface element are precisely defined. Since the connection of the conductor elements to the electrically conductive surface element is produced in a state in which the conductor elements are in the mold, relative movements of the conductor elements with one another are precluded. By eliminating the individual Vermessungsvorgänge for making the connection of the conductor elements with the electrically conductive surface element, the productivity of the method for producing the printed circuit board with at least one extending between terminals conductor element can be significantly increased.

• - Teilschritt A1: Bereitstellen einer Form mit einer vorzugsweise ebenen ersten Seite und wenigstens einer sich zur ersten Seite der Form öffnenden Aufnahme für ein Leiterelement.
• - Teilschritt A2: Anordnen der Form, sodass sich die erste Seite der Form zumindest abschnittsweise oder vollständig in einer horizontalen Ebene erstreckt.

It may be advantageous if step A has at least one of the following substeps:

• - partial step A1 By providing a mold with a preferably planar first side and at least one receptacle for a conductor element which opens to the first side of the mold.
• - partial step A2 : Arranging the shape so that the first side of the shape extends at least partially or completely in a horizontal plane.

The horizontal alignment of the shape in sub-step A1 / A2 facilitates the positioning of the conductor element in the receptacle of the mold and the subsequent processing steps.

• - Teilschritt B1: Bereitstellen eines Leiterelements mit wenigstens zwei Verbindungsmittelabschnitten, die vorzugsweise an derselben Seite und/oder an unterschiedlichen Enden des Leiterelements angeordnet und/oder angebracht sind.
• - Teilschritt B2: Anordnen des Leiterelements in der Aufnahme, so dass das Leiterelement bezüglich der Erstreckungsebene der Form vorzugsweise formschlüssig und/oder spielfrei in der Aufnahme aufgenommen ist, wobei bevorzugt das Leiterelement parallel zur Erstreckungsebene der Form ausgerichtet ist.

• - Teilschritt B3: Anordnen des Leiterelements in der Aufnahme, so dass die mit den Verbindungsmittelabschnitten versehene Seite des Leiterelements bündig mit der ersten Seite der Form abschließt und die Verbindungsmittelabschnitte über die erste Seite der Form hervorstehen.
• - Teilschritt B4: Anordnen von Isolierstoff, vorzugsweise eines Isolierstoff-Flächenelements, das vorzugsweise auf die Positionen und ggf. Formen der Verbindungsmittelabschnitte abgestimmte Öffnungen aufweist, an der ersten Seite der Form, bevorzugt derart, dass eine zweite Seite des Isolierstoff-Flächenelements flächig auf der ersten Seite der Form sowie der ersten Seite des in der Aufnahme der Form aufgenommenen Leiterelements aufliegt, wobei besonders bevorzugt die Verbindungsmittelabschnitte oberseitig bündig mit einer ersten Seite des Isolierstoff-Flächenelements abschließen.

However, it may also be useful if step B has at least one of the following substeps:

• - partial step B1 By providing a conductor element having at least two connecting means sections, which are preferably arranged and / or attached to the same side and / or at different ends of the conductor element.
• - partial step B2 : Arranging the conductor element in the receptacle, so that the conductor element with respect to the plane of extension of the mold is preferably received positively and / or play in the receptacle, wherein preferably the conductor element is aligned parallel to the plane of extension of the mold.

• - partial step B3 By arranging the conductor element in the receptacle such that the side of the conductor element provided with the connecting means sections terminates flush with the first side of the mold and the connecting medium sections protrude beyond the first side of the mold.
• - partial step B4 By arranging insulating material, preferably an insulating surface element, which preferably has openings matched to the positions and optionally forms of the connecting means sections, on the first side of the mold, preferably in such a way that a second side of the insulating surface element is flat on the first side of the mold Form and the first side of the received in the receptacle of the form conductor element rests, wherein particularly preferably complete the connecting means sections on the upper side flush with a first side of the insulating surface element.

partial step B1 facilitates the connection of the conductor element with the electrically conductive surface element. In particular, it proves to be practical if the side of the conductor element to which the connecting means sections are attached, is flat. This can be achieved, for example, in that the conductor element is a rectangular wire, which is cut to length, for example, by a coil of appropriate length. Due to the preceding winding on the spool, the rectangular wire may not extend exactly along a straight line. By applying a tensile force on both ends, the conductor element can be straightened. Other techniques for straightening the conductor element are possible.

The connecting means sections are, for example, platelets made of silver or another suitable connecting material, which can accomplish a permanent electrically conductive connection between the conductor element and the electrically conductive surface element.

After the application of the connecting means sections, the conductor element can be pulled into a suitable length and brought into shape, which preferably fits exactly into a corresponding receptacle in the mold.

partial step B2 favors the fixation of the relative positions and alignment of the conductor elements to each other in the plane of extension of the form, since the conductor elements can not move in their respective recordings.

partial step B3 allows the positioning of the conductor elements also in a direction perpendicular to the plane of extension of the mold.

partial step B4 proves to be helpful to embed the conductor element completely in insulating material. In the conventional method, it proves to be a problem that after joining the conductor element with the electrically conductive surface element insulating material must be pressed into the gap. This gap is difficult to access after establishing the connection between the conductor element and the electrically conductive surface element. In the partial step B4 For example, a prepreg mat having prefabricated openings may be positioned at the positions of the connecting means sections such that it rests flatly on its underside on top of the mold and top of the conduit member while the connecting means sections are flush with the top of the prepreg mat in a plane lie. In this case, each of the openings in the prepreg mat forms a shape which prevents unimpeded spreading of the material of the connecting medium portion received thereon in the subsequent welding operation. An unwanted contact between the conductor element and electrically conductive surface element outside the positions of the intended connection points can thus be additionally prevented. Preferably, a prefabricated insulating surface element is used, so that an individual adaptation of the insulating surface element can be omitted and the productivity of the method can be further increased. For example, the openings may be punched using a mask.

• - Teilschritt C1: Anordnen eines elektrisch leitenden Flächenelements an der ersten Seite der Form, vorzugsweise auf der ersten Seite des Isolierstoff-Flächenelements, bevorzugt derart, dass das elektrisch leitende Flächenelement flächig auf der ersten Seite des Isolierstoff-Flächenelements und/oder flächig auf den Verbindungsmittelabschnitten aufliegt.
• - Teilschritt C2: Anordnen einer ersten Elektrode eines Verbindungswerkzeugs zur Herstellung einer elektrisch leitenden Verbindung zwischen dem Leiterelement und dem elektrisch leitenden Flächenelement auf einer ersten Seite der Form, vorzugsweise derart, dass sich die erste Elektrode in Kontakt mit der ersten Seite des elektrisch leitenden Flächenelements befindet.

• - Teilschritt C3: Anordnen einer zweiten Elektrode des Verbindungswerkzeugs zur Herstellung einer elektrisch leitenden Verbindung zwischen dem Leiterelement und dem elektrisch leitenden Flächenelement auf einer zweiten Seite der Form, vorzugsweise derart, dass sich die zweite Elektrode unter Durchdringung einer Öffnung in der Form in Kontakt mit der zweiten Seite des Leiterelements befindet.
• - Teilschritt C4: Aufbringen eines Kontaktdrucks zwischen der ersten Elektrode und der zweiten Elektrode.
• - Teilschritt C5: Anlegen eines elektrischen Stroms zwischen der ersten Elektrode und der zweiten Elektrode.
• - Teilschritt C6: Erwärmung des Verbindungsmittelabschnitts bis zum Erreichen der erforderlichen Arbeitstemperatur, sodass das Leiterelement und das elektrisch leitende Flächenelement über den Verbindungsmittelabschnitt, vorzugsweise unter Einwirkung einer Kraft zwischen den Elektroden, durch Aufschmelzen und Erstarren des Materials des Verbindungsmittelabschnitts, durch Diffusion oder in fester Phase unlösbar verbunden werden, vorzugsweise durch Verschweißen.
• - Teilschritt C7: Entfernen der ersten Elektrode von der ersten Seite des elektrisch leitenden Flächenelements.
• - Teilschritt C8: Entfernen der zweiten Elektrode von der zweiten Seite des Leiterelements und Entnehmen der zweiten Elektrode aus der Öffnung in der Form.
• - Teilschritt C9: Anbringen wenigstens einer Referenzmarkierung an dem elektrisch leitenden Flächenelement, vorzugsweise durch Fertigen wenigstens einer Öffnung.

However, it can also be useful if step C has at least one of the following substeps:

• - partial step C1 : Arranging an electrically conductive surface element on the first side of the mold, preferably on the first side of the insulating surface element, preferably such that the electrically conductive surface element rests flat on the first side of the insulating surface element and / or surface on the connecting means sections.
• - partial step C2 By arranging a first electrode of a connection tool for producing an electrically conductive connection between the conductor element and the electrically conductive surface element on a first side of the mold, preferably such that the first electrode is in contact with the first side of the electrically conductive surface element.

• - partial step C3 By arranging a second electrode of the connection tool for producing an electrically conductive connection between the conductor element and the electrically conductive surface element on a second side of the mold, preferably in such a way that the second electrode makes contact with the second side of the mold while penetrating an opening in the mold Conductor element is located.
• - partial step C4 By applying a contact pressure between the first electrode and the second electrode.
• - partial step C5 By applying an electric current between the first electrode and the second electrode.
• - partial step C6 In that the conductor element and the electrically conductive surface element are connected via the connecting means section, preferably under the action of a force between the electrodes, by melting and solidification of the material of the connecting medium section, by diffusion or in solid phase , preferably by welding.
• - partial step C7 : Removing the first electrode from the first side of the electrically conductive surface element.
• - partial step C8 By removing the second electrode from the second side of the conductor element and removing the second electrode from the opening in the mold.
• - partial step C9 By attaching at least one reference mark to the electrically conductive surface element, preferably by manufacturing at least one opening.

partial step C1 favors the even and regular layer structure of the printed circuit board. Preferably, a prefabricated blank of an electrically conductive surface element is used, so that an individual cutting of the electrically conductive surface element can be omitted and the productivity of the method can be further increased.

partial step C2 provides an abutment in the form of the first electrode for the subsequently applied by the second electrode contact pressure.

partial step C3 favors the exact positioning of the second electrode in relation to the respective connecting medium section, via which the conductor element is to be connected to the electrically conductive surface element.

partial steps C4 to C8 favor the production of a compound of the conductor element with the electrically conductive surface element by way of resistance welding.

• - Teilschritt D1: Entnehmen des Leiterelements aus der Form.
• - Teilschritt D2: Anordnen von Isolierstoff auf der mit dem Leiterelement verbundenen zweiten Seite des elektrisch leitenden Flächenelements, vorzugsweise auf der zweiten Seite des an der zweiten Seite des elektrisch leitenden Flächenelements angeordneten Isolierstoff-Flächenelements, bevorzugt als Masse oder in Form eines Isolierstoff-Flächenelements, besonders bevorzugt derart, dass der Isolierstoff das Leiterelement mit Ausnahme der Positionen der vorgesehenen Anschlussstellen vollumfänglich umgibt.
• - Teilschritt D3: Aufbringen von Druck und ggf. Wärme auf den Isolierstoff in Richtung des elektrisch leitenden Flächenelements, sodass sich der Isolierstoff der Kontur des Leiterelements anpasst und ggf. mit einem bereits vorhandenem Isolierstoff verbindet.
• - Teilschritt D4: Glätten des Isolierstoffs an der von dem elektrisch leitenden Flächenelement abgewandten Seite zur Ausbildung einer ebenen Unterseite der Leiterplatte.
• - Teilschritt D5: Aushärten des Isolierstoffs.

However, it can also be advantageous if step D has at least one of the following substeps:

• - partial step D1 : Remove the conductor element from the mold.
• - partial step D2 By arranging insulating material on the second side of the electrically conductive surface element connected to the conductor element, preferably on the second side of the insulating surface element arranged on the second side of the electrically conductive surface element, preferably as a mass or in the form of an insulating surface element, particularly preferably in such a way in that the insulating material completely surrounds the conductor element, with the exception of the positions of the intended connection points.
• - partial step D3 : Applying pressure and possibly heat to the insulating material in the direction of the electrically conductive surface element, so that the insulating material adapts to the contour of the conductor element and possibly connects with an already existing insulating material.
• - partial step D4 : Smoothing of the insulating material on the side facing away from the electrically conductive surface element side to form a flat bottom of the circuit board.
• - partial step D5 : Curing of the insulating material.

partial step D1 makes the conductor element accessible for the subsequent application of the insulating material. After establishing the connection between the conductor element and the electrically conductive surface element whose relative position and orientation is fixed, so that the shape is no longer necessary and can be removed.

partial step D2 embeds the guide element almost completely in insulating material. Preferably, a prefabricated insulating surface element is used, so that an individual application of the insulating material can be omitted and the productivity of the method can be further increased. The insulating surface element may have a corresponding receptacle for each conductor element.

partial steps D3 and D4 are preferably carried out in a press under the action of pressure and temperature.

• - Teilschritt E1: Herausarbeiten der Anschlussstellen durch lokale Abtragung umliegender Abschnitte des elektrisch leitenden Flächenelements, vorzugsweise durch Ätzung.
• - Teilschritt E2: Herausarbeiten von wenigstens einer Leitungsbahn durch lokale Abtragung umliegender Abschnitte des elektrisch leitenden Flächenelements, vorzugsweise durch Ätzung.

It may prove helpful if step E has at least one of the following substeps:

• - partial step E1 : Working out of the connection points by local removal of surrounding portions of the electrically conductive surface element, preferably by etching.
• - partial step E2 : Working out of at least one conductor track by local removal of surrounding portions of the electrically conductive surface element, preferably by etching.

partial steps E1 and E2 allow the fabrication of complex circuit patterns on the surface of the circuit board in addition to the conductor elements extending therein between terminals. Preferably, the connection points and / or conductor tracks worked out depending on a previously made reference mark.

Another aspect of the present invention relates to a printed circuit board produced by the method according to one of claims 1 to 6. The above-mentioned advantages apply.

Yet another aspect of the present invention relates to a mold for producing a printed circuit board, preferably a printed circuit board according to claim 7, preferably by the method according to one of claims 1 to 6, comprising at least one receptacle for a conductor element in a first side of the mold and at least one receptacle communicating with the receptacle for insertion of a bonding tool in a second side of the mold. The above benefits apply.

Yet another aspect of the present invention relates to a kit for producing a printed circuit board, preferably a printed circuit board according to claim 7, preferably by the method according to one of claims 1 to 6, comprising a mold according to claim 8, at least one conductor element which can be arranged in the receptacle, and at least an insertable into the opening connection tool. The kit includes matched components and tools for making the circuit board.

terms and definitions

shape

A mold in the sense of this invention is a tool that is used to make the circuit board. The mold has for this purpose at least one receptacle for a conductor element.

• - Die Form besteht aus einem dielektrischen bzw. elektrisch isolierenden Material, beispielsweise einem Verbundwerkstoff bestehend aus Epoxidharz und Glasfasergewebe.
• - Die Form ist als Platte ausgebildet.
• - Die Form erstreckt sich im Wesentlichen in einer Ebene.
• - Die Form umfasst eine Oberseite, die vorzugsweise eben ist.
• - Die Form umfasst eine Unterseite, die vorzugsweise eben ist.
• - Die Oberseite und die Unterseite der Form sind parallel zueinander.
• - Die Form weist eine Dicke von 1 bis 5 mm, vorzugsweise 1,5 bis 3 mm, bevorzugt 2 mm auf.
• - Die Form weist einen polygonalen, vorzugsweise rechteckigen oder quadratischen Umriss auf.
• - Die Aufnahme der Form weist eine Innenkontur auf, die auf die Außenkontur des Leiterelements abgestimmt ist.
• - Die Aufnahme der Form weist eine Außenkontur auf, die auf die Innenkontur des Leiterelements abgestimmt ist.
• - Die Tiefe der Aufnahme ist auf die Höhe/Dicke des Leiterelements abgestimmt.
• - Die Form weist für jedes Leiterelement eine eigene Aufnahme auf.
• - Die Aufnahme erstreckt sich von einer ersten Seite der Form in die Form hinein.
• - Die Aufnahme ist von einer ersten Seite der Form in die Form eingearbeitet, vorzugsweise eingefräst.
• - Die erste Seite der Form bildet die Oberseite der Form.
• - Die Tiefe der Aufnahme liegt im Bereich von 50 bis 1000 µm, vorzugsweise im Bereich von 100 bis 500 µm, bevorzugt im Bereich von 300 bis 400 µm, besonders bevorzugt bei 350 µm.
• - Die Form weist wenigstens eine als Durchgang ausgebildete und mit der Aufnahme kommunizierende Öffnung zur Einbringung eines Werkzeugs von der zweiten Seite der Form auf.
• - Der Durchgang erstreckt sich im Wesentlichen senkrecht zu Erstreckungsebene der Form.
• - Der Durchgang erstreckt sich von der zweiten Seite der Form in die jeweilige Aufnahme.
• - Jeder Aufnahme ist wenigstens eine als Durchgang ausgebildete Öffnung zugeordnet, vorzugsweise jeweils zwei als Durchgang ausgebildete Öffnungen, die bevorzugt an unterschiedlichen Enden der Aufnahme angeordnet sind.

The mold may have at least one of the following features:

• - The mold consists of a dielectric or electrically insulating material, such as a composite material consisting of epoxy resin and glass fiber fabric.
• - The shape is formed as a plate.
• - The form extends essentially in one plane.
• - The mold comprises an upper surface, which is preferably flat.
• - The mold includes a bottom, which is preferably flat.
• - The top and bottom of the mold are parallel to each other.
• - The mold has a thickness of 1 to 5 mm, preferably 1.5 to 3 mm, preferably 2 mm.
• - The shape has a polygonal, preferably rectangular or square outline.
• - The recording of the shape has an inner contour, which is matched to the outer contour of the conductor element.
• - The recording of the shape has an outer contour, which is tuned to the inner contour of the conductor element.
• - The depth of the recording is matched to the height / thickness of the conductor element.
• - The shape has its own recording for each conductor element.
• The receptacle extends from a first side of the mold into the mold.
• - The recording is incorporated from a first side of the mold into the mold, preferably milled.
• - The first side of the form forms the top of the form.
• - The depth of the recording is in the range of 50 to 1000 .mu.m, preferably in the range of 100 to 500 .mu.m, preferably in the range of 300 to 400 .mu.m, more preferably 350 .mu.m.
• - The mold has at least one formed as a passage and communicating with the receptacle opening for introducing a tool from the second side of the mold.
• The passage extends substantially perpendicular to the plane of extent of the mold.
• The passage extends from the second side of the mold into the respective receptacle.
• - Each receptacle is associated with at least one opening formed as a passage, preferably in each case two openings formed as a passage, which are preferably arranged at different ends of the receptacle.

circuit board

A printed circuit board in the sense of this invention is a carrier for electronic components. The circuit board is used e.g. mechanical fastening and electrical connection of electronic components. Almost every electronic device contains one or more printed circuit boards. A circuit board can also be referred to as a printed circuit board, circuit board or printed circuit board and corresponds to what is known in English as Printed Circuit Coard (PCB).

• - Die Leiterplatte umfasst eine Schicht oder mehrere Schichten, vorzugsweise mehrere identische Schichten.
• - Die Leiterplatte ist eine Leiterplatte gemäß EP 1 842 402 A2 .
• - Die Leiterplatte ist eine Leiterplatte gemäß DE 10 2011 102 484 A1 .
• - Die Leiterplatte ist eine Leiterplatte gemäß DE 10 2013 223 143 A1 .
• - Die Leiterplatte erstreckt sich in einer Ebene.
• - Die Leiterplatte weist parallele Oberseiten und Unterseiten auf.
• - An der Oberseite der Leiterplatte befinden sich wenigstens zwei Anschlussstellen.
• - An der Oberseite der Leiterplatte befindet sich wenigstens eine Leitungsbahn.
• - In die Leiterplatte ist wenigstens ein Leiterelement eingebettet, wobei das Leiterelement mit Ausnahme der Anschlussstellen in Isolierstoff eingebettet ist.

The printed circuit board preferably has at least one of the following features:

• - The printed circuit board comprises one or more layers, preferably several identical layers.
• - The circuit board is a circuit board according to EP 1 842 402 A2 ,
• - The circuit board is a circuit board according to DE 10 2011 102 484 A1 ,
• - The circuit board is a circuit board according to DE 10 2013 223 143 A1 ,
• - The circuit board extends in a plane.
• - The PCB has parallel tops and bottoms.
• - At the top of the PCB there are at least two connection points.
• - At the top of the circuit board is at least one line path.
• - In the circuit board at least one conductor element is embedded, wherein the conductor element is embedded with the exception of the connection points in insulating material.

conductor element

A conductor element in the sense of this invention is an object for the transport of electrical energy and / or heat and / or for signal transmission in line-based communications technology and conducted radio-frequency technology. The conductor element can be part of an electrical circuit or power network and thus connect power source and consumer. For transport, electrons flow as a conductor current through the conductor element. For low voltage drop or low transport losses, the conductive material should have a high electrical conductivity, to which some metals are particularly well suited. The cross-sectional area of the conductor is preferably designed for the permissible current density.

• - Das Leiterelement ist ein Leitungsdraht, vorzugsweise ein Runddraht mit einem runden Querschnitt oder ein Rechteckdraht mit einem rechteckigen Querschnitt, wobei der Leitungsdraht vorzugsweise einen über seine Länge konstanten Querschnitt aufweist. Das Leiterelement ist bevorzugt ein Leitungsdraht gemäß EP 1 842 402 A2 .
• - Das Leiterelement ist ein Formteil, vorzugsweise ein Formteil gemäß DE 10 2011 102 484 A1 . Das Formteil kann beispielsweise folgende Merkmale aufweisen:
  • ◯ Das Formteil erstreckt sich im Wesentlichen in einer Ebene.
  • ◯ Das Formteil besteht aus Metall, vorzugsweise aus Kupfer.
  • ◯ Das Formteil umfasst wenigstens abschnittsweise eine konkave Kontur und/oder wenigstens abschnittsweise eine konvexe Kontur.
  • ◯ Das Formteil ist zumindest abschnittsweise, vorzugsweise vollständig, in der Leiterplatte eingebettet.
  • ◯ Die Oberseiten der Leiterplatte und des Formteils sind im Wesentlichen parallel zueinander ausgerichtet.
  • ◯ Das Formteil ist aus einem plattenförmigen Werkstück herausgetrennt, vorzugsweise durch Stanzen, Erodieren oder Scheiden, bevorzugt durch Wasserstrahlschneiden.
  • ◯ Das Formteil weist eine Dicke im Bereich von 10 bis 2000 µm, vorzugsweise im Bereich von 100 bis 1000 µm, bevorzugt im Bereich von 200 bis 500 µm auf.
  • ◯ Eine Länge und/oder Breite des Formteils ist wenigstens fünfmal, vorzugsweise wenigstens zehnmal, bevorzugt wenigstens zwanzigmal, bevorzugt wenigstens fünfzigmal oder bevorzugt wenigstens hundertmal so groß wie die Dicke des Formteils und/oder die Dicke der Leiterplatte.
  • ◯ Das Formteil umfasst einen im Wesentlichen rechteckförmigen Querschnitt.
  • ◯ Die Querschnittsform des Formteils ist über die Breite und/oder über die Länge des Formteils nicht konstant.
  • ◯ Die Dicke des Formteils ist über dessen gesamte Fläche konstant.
  • ◯ Das Formteil umfasst eine Krümmung in einer, zwei, drei oder mehr Krümmungsebenen.
  • ◯ Das Formteil steht zumindest abschnittsweise aus dem Isolierstoff hervor.
  • ◯ Das Formteil ist nicht im Strangpressverfahren herstellbar oder hergestellt.
  • ◯ Das Formteil umfasst wenigstens eine Ausnehmung, die ausgehend von einer Randseite des Formteils in das Formteil eingearbeitet ist. Vorzugsweise ist die Ausnehmung zumindest abschnittsweise mit Isolierstoff befüllt.
  • ◯ Das Formteil umfasst wenigstens eine Öffnung, die sich von der Oberseite, der Unterseite oder einer Randseite des Formteils abschnittsweise in das Formteil erstreckt, wobei die Öffnung vorzugsweise zumindest im Bereich ihrer Mündung einen kreisförmigen, ovalen, polygonalen, vorzugsweise dreieckigen, viereckigen, fünfeckigen, bevorzugt rechteckigen oder quadratischen Umriss umfasst, wobei die Öffnung bevorzugt im Wesentlichen nutförmig ausgebildet ist und sich kontinuierlich oder diskontinuierlich entlang einer geraden oder gekrümmten Linie erstreckt, wobei diese Linie besonders bevorzugt zumindest abschnittsweise parallel zu einer Randseite des Formteils verläuft, wobei die Öffnung besonders bevorzugt zumindest abschnittsweise mit Isolierstoff befüllt ist.
  • ◯ Das Formteil umfasst wenigstens einen Durchbruch, der sich quer, vorzugsweise senkrecht, zur Oberseite, zur Unterseite oder einer Randseite des Formteils durch das Formteil erstreckt, wobei der Durchbruch vorzugsweise einen kreisförmigen, ovalen, polygonalen, vorzugsweise dreieckigen, viereckigen, fünfeckigen, rechteckigen oder quadratischen Umriss umfasst, wobei der Durchbruch bevorzugt im Wesentlichen schlitzförmig ausgebildet ist und sich kontinuierlich oder diskontinuierlich entlang einer geraden oder gekrümmten Linie erstreckt, wobei diese Linie besonders bevorzugt zumindest abschnittsweise parallel zu einer Randseite des Formteils verläuft, wobei der Durchbruch besonders bevorzugt zumindest abschnittsweise mit Isolierstoff befüllt ist.
  • ◯ Das Formteil ist im Wesentlichen L-förmig, T-förmig, H-förmig, S-förmig, O-förmig, E-förmig, F-förmig, X-förmig, Y-förmig, Z-förmig, C-förmig, U-förmig oder Ω-förmig ausgebildet.
  • ◯ Mehrere Formteile sind in derselben Ebene oder in verschiedenen Ebenen, vorzugsweise in zueinander parallelen Ebenen innerhalb der Leiterplatte angeordnet.
• - Das Leiterelement ist ein Widerstand, vorzugsweise ein Präzisionswiderstand, bevorzugt ein Präzisionswiderstand gemäß DE 10 2013 223 143 A1 . Der Präzisionswiderstand kann folgende Merkmale aufweisen:
  • ◯ Der Präzisionswiderstand umfasst einen Widerstandswert im Bereich von 0.1 bis 300 mOhm, vorzugsweise im Bereich von 1 bis 100 mOhm.
  • ◯ Der Präzisionswiderstand umfasst eine Varianz von weniger als +/- 5%, vorzugsweise eine Varianz von weniger als +/- 2%, bevorzugt eine Varianz von +/- 1 % oder weniger.
  • ◯ Der Temperaturkoeffizient des elektrischen Widerstandes des Präzisionswiderstands für den Temperaturbereich zwischen 20 und 60 °C liegt im Bereich von 0.1 ppm/K bis 200 ppm/K, vorzugsweise im Bereich von 0.5 ppm/K bis 100 ppm/K, bevorzugt im Bereich von 1 ppm/K bis 50 ppm/K.
  • ◯ Der Präzisionswiderstand besteht aus Metall, vorzugsweise aus wenigstens einem der Elemente Kupfer (Cu), Mangan (Mn), Nickel (Ni), Chrom (Cr), Aluminium (Al), Silizium (Si) oder Zinn (Sn), bevorzugt aus einer Legierung enthaltend wenigstens eines der Elemente Kupfer (Cu), Mangan (Mn), Nickel (Ni), Chrom (Cr), Aluminium (Al), Silizium (Si) oder Zinn (Sn), beispielsweise aus Manganin, Zeranin oder Isaohm.
• - Das Leiterelement kontaktiert die Anschlussstellen.
• - Das Leiterelement ist mit den Anschlussstellen verschweißt.
• - Das Leiterelement ist zumindest überwiegend, vorzugsweise vollständig, in die Leiterplatte eingebettet.
• - Eine Oberseite und/oder eine Unterseite und/oder wenigstens eine der Randseiten des Leiterelements, vorzugsweise alle Randseiten des Leiterelements, ist/sind zumindest abschnittsweise, vorzugsweise vollständig, mit Isolierstoff bedeckt.
• - Eine Oberseite und/oder eine Unterseite und/oder wenigstens eine der Randseiten des Leiterelements verläuft zumindest abschnittsweise, vorzugsweise vollständig, bündig mit einer Oberseite und/oder einer Unterseite und/oder wenigstens einer der Randseiten einer angrenzenden Schicht aus Isolierstoff.
• - Die Oberseiten und/oder die Unterseiten und/oder wenigstens jeweils eine der Randseiten der Leiterplatte und des Leiterelements sind parallel zueinander ausgerichtet.
• - Das Leiterelement ist im Strangpressverfahren herstellbar oder hergestellt.
• - Das Leiterelement ist als Flachdraht ausgebildet.
• - Das Leiterelement erstreckt sich im Wesentlichen in einer Ebene.
• - Das Leiterelement umfasst einen rechteckförmigen Querschnitt, wobei vorzugsweise die Seite des Querschnitts mit der größeren Ausdehnung zur Oberfläche der Leiterplatte weist.
• - Das Leiterelement weist eine Dicke im Bereich von 10 bis 2000 µm, vorzugsweise im Bereich von 50 bis 1000 µm, bevorzugt im Bereich von 100 bis 500 µm auf.
• - Das Leiterelement umfasst oder besteht aus einem elektrisch leitenden Werkstoff.
• - Das Leiterelement umfasst oder besteht aus Metall, vorzugsweise Kupfer.
• - Das Leiterelement umfasst wenigstens einen Verbindungsmittelabschnitt, vorzugsweise aus einem gegenüber dem Leiterelement verschiedenen Material, bevorzugt Hartlot, besonders bevorzugt Silber. Der Verbindungsmittelabschnitt ist mit dem Leiterelement verbunden, vorzugsweise stoffschlüssig, beispielsweise durch Verschweißen. Der Verbindungsmittelabschnitt ist beispielsweise plättchenförmig ausgebildet.
• - Das Leiterelement umfasst einen Haftvermittler zur Verbesserung der Anbindung an den Isolierstoff.
• - Das Leiterelement umfasst eine aufgeraute Oberfläche zur Verbesserung der Anbindung an den Isolierstoff, vorzugsweise mit folgenden Merkmalen:
  • ◯ Die Oberfläche des Leiterelements wird zumindest teilweise aufgeraut, bevor das Leiterelement mit Isolierstoff in Kontakt gelangt, vorzugsweise vor Schritt B und/oder vor Schritt C.
  • ◯ Das Aufrauen der Oberfläche des Leiterelements erfolgt durch chemisches Ätzen, wobei das chemische Ätzen vorzugsweise durch Eintauchen des Leiterelements in eine das Material des Leiterelements ätzende Flüssigkeit oder durch das Besprühen des Leiterelements mit einer solchen Flüssigkeit erfolgt.
  • ◯ Die Oberfläche des Leiterelements wird durch mechanisches Bearbeiten, zum Beispiel durch Sandstrahlen oder durch das Aufsprühen von Bims- oder Quarzmehl unter hohem Druck, aufgeraut.

The conductor element preferably has at least one of the following features:

• - The conductor element is a conductor wire, preferably a round wire with a round cross section or a rectangular wire with a rectangular cross section, wherein the conductor wire preferably has a constant over its length cross section. The conductor element is preferably a conductor wire according to EP 1 842 402 A2 ,
• - The conductor element is a molding, preferably a molding according to DE 10 2011 102 484 A1 , The molded part may have, for example, the following features:
  • ◯ The molded part extends essentially in one plane.
  • ◯ The molded part is made of metal, preferably copper.
  • ◯ The molding includes at least in sections a concave contour and / or at least partially a convex contour.
  • ◯ The molding is at least partially, preferably completely, embedded in the circuit board.
  • ◯ The tops of the circuit board and the molding are aligned substantially parallel to each other.
  • ◯ The molding is separated out of a plate-shaped workpiece, preferably by punching, eroding or shaving, preferably by water jet cutting.
  • The molding has a thickness in the range from 10 to 2000 .mu.m, preferably in the range from 100 to 1000 .mu.m, preferably in the range from 200 to 500 .mu.m.
  • ◯ A length and / or width of the molding is at least five times, preferably at least ten times, preferably at least twenty times, preferably at least fifty times or preferably at least one hundred times as large as the thickness of the molding and / or the thickness of the printed circuit board.
  • Form The molded part comprises a substantially rectangular cross-section.
  • ◯ The cross-sectional shape of the molding is not constant over the width and / or length of the molding.
  • ◯ The thickness of the molding is constant over its entire surface.
  • ◯ The molded part includes a curvature in one, two, three or more planes of curvature.
  • ◯ The molding is at least partially out of the insulating material.
  • ◯ The molded part can not be produced or manufactured using the extrusion process.
  • ◯ The molding comprises at least one recess which is incorporated, starting from an edge side of the molding in the molding. Preferably, the recess is at least partially filled with insulating material.
  • ◯ The molding comprises at least one opening which extends from the top, the bottom or an edge side of the molding in sections into the molding, the opening preferably at least in the region of its mouth a circular, oval, polygonal, preferably triangular, quadrangular, pentagonal, preferably rectangular or square outline, wherein the opening is preferably substantially groove-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably at least partially parallel to an edge side of Shaped part runs, wherein the opening is particularly preferably at least partially filled with insulating material.
  • The molding comprises at least one aperture extending transversely, preferably perpendicular, to the top, bottom or edge of the molding through the molding, the aperture preferably being circular, oval, polygonal, preferably triangular, quadrangular, pentagonal, rectangular or square outline, wherein the opening is preferably formed substantially slit-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably extends at least partially parallel to an edge side of the molding, the breakthrough particularly preferably at least in sections with insulating material is filled.
  • The molded part is essentially L-shaped, T-shaped, H-shaped, S-shaped, O-shaped, E-shaped, F-shaped, X-shaped, Y-shaped, Z-shaped, C-shaped, U-shaped or Ω-shaped.
  • Form Several moldings are arranged in the same plane or in different planes, preferably in mutually parallel planes within the circuit board.
• The conductor element is a resistor, preferably a precision resistor, preferably a precision resistor according to DE 10 2013 223 143 A1 , The precision resistor can have the following features:
  • Präz The precision resistor comprises a resistance value in the range of 0.1 to 300 mOhm, preferably in the range of 1 to 100 mOhm.
  • Präz The precision resistor comprises a variance of less than +/- 5%, preferably a variance of less than +/- 2%, preferably a variance of +/- 1% or less.
  • Temperatur The temperature coefficient of electrical resistance of the precision resistor for the temperature range between 20 and 60 ° C is in the range of 0.1 ppm / K to 200 ppm / K, preferably in the range of 0.5 ppm / K to 100 ppm / K, preferably in the range of 1 ppm / K to 50 ppm / K.
  • ◯ The precision resistor is made of metal, preferably of at least one of the elements copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (Al), silicon (Si) or tin (Sn), preferably from an alloy containing at least one of the elements copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (Al), silicon (Si) or tin (Sn), for example from manganin, zeranin or Isohm.
• - The conductor element contacts the connection points.
• - The conductor element is welded to the connection points.
• - The conductor element is at least predominantly, preferably completely, embedded in the circuit board.
• - An upper side and / or a lower side and / or at least one of the edge sides of the conductor element, preferably all edge sides of the conductor element is / are at least partially, preferably completely, covered with insulating material.
• - An upper side and / or a lower side and / or at least one of the edge sides of the conductor element extends at least partially, preferably completely, flush with an upper side and / or a lower side and / or at least one of the edge sides of an adjacent layer of insulating material.
• - The tops and / or the undersides and / or at least one of the edge sides of the circuit board and the conductor element are aligned parallel to each other.
• - The conductor element is produced or manufactured by extrusion.
• - The conductor element is designed as a flat wire.
• - The conductor element extends substantially in one plane.
• - The conductor element comprises a rectangular cross section, wherein preferably the side of the cross section with the greater extent to the surface of the circuit board has.
• - The conductor element has a thickness in the range of 10 to 2000 .mu.m, preferably in the range of 50 to 1000 .mu.m, preferably in the range of 100 to 500 microns.
• - The conductor element comprises or consists of an electrically conductive material.
• - The conductor element comprises or consists of metal, preferably copper.
• - The conductor element comprises at least one connecting means section, preferably of a material which is different from the conductor element, preferably brazing material, particularly preferably silver. The connecting means portion is connected to the conductor element, preferably cohesively, for example by welding. The connecting means portion is formed, for example, plate-shaped.
• - The conductor element comprises a bonding agent for improving the connection to the insulating material.
• The conductor element comprises a roughened surface for improving the connection to the insulating material, preferably with the following features:
  • ◯ The surface of the conductor element is at least partially roughened before the conductor element comes into contact with insulating material, preferably before step B and / or before step C.
  • The surface of the conductor element is roughened by chemical etching, wherein the chemical etching preferably takes place by immersing the conductor element in a liquid etching the material of the conductor element or by spraying the conductor element with such a liquid.
  • ◯ The surface of the conductor element is roughened by mechanical treatment, for example by sandblasting or by spraying pumice or quartz powder under high pressure.

insulator

An insulating material in the context of this invention is a non-conductive material, which therefore has only an extremely low and thus negligible electrical conductivity. Insulating materials are used in electrical engineering to limit the flow of electrical current to the live parts. Insulating material is preferably applied in the plastic or flowable state and cured after reaching the intended shape. Insulating material can be applied, for example, as a composition or as a prepreg mat. The prepreg mat comprises a fabric layer which provides internal cohesion and already provides an existing basic structure, wherein the fabric layer is impregnated with flowable or plastic resin and thus allows an adaptation of the mold.

Electrically conductive surface element or film

The electrically conductive surface element in the sense of the invention is a planar element such as e.g. a sheet of electrically conductive material.

• - Das elektrisch leitende Flächenelement umfasst oder besteht aus einem elektrisch leitenden Werkstoff.
• - Das elektrisch leitende Flächenelement umfasst oder besteht aus Metall, vorzugsweise Kupfer.
• - Das elektrisch leitende Flächenelement ist als Folie ausgebildet.
• - Das elektrisch leitende Flächenelement weist eine Dicke im Bereich von 10 bis 1000 µm, vorzugsweise im Bereich von 15 bis 200 µm, bevorzugt im Bereich von 18 bis 105 µm, besonders bevorzugt bei 35 µm auf.

The electrically conductive surface element preferably has at least one of the following features:

• - The electrically conductive surface element comprises or consists of an electrically conductive material.
• - The electrically conductive surface element comprises or consists of metal, preferably copper.
• - The electrically conductive surface element is formed as a film.
• - The electrically conductive surface element has a thickness in the range of 10 to 1000 .mu.m, preferably in the range of 15 to 200 .mu.m, preferably in the range of 18 to 105 .mu.m, particularly preferably 35 .mu.m.

Further preferred developments of the invention result from combinations of the features disclosed herein.

list of figures

• 1 in Ansicht (a) eine perspektivische Darstellung einer Form mit mehreren Aufnahmen zur Anordnung von Leiterelementen und in Ansicht (b) eine schematische Schnittansicht, wobei jeweils eine Aufnahme im Längsschnitt und eine Aufnahme im Querschnitt durch jeweils eine Durchgangsöffnung dargestellt ist.
• 2 eine perspektivische Darstellung eines Leiterelements mit endseitig auf einer Oberseite aufgebrachten Verbindungsmittelabschnitten, wobei das Leiterelement als Leitungsdraht mit rechteckiger Querschnittsfläche ausgebildet ist.
• 3a die in 1b dargestellte schematische Schnittansicht der Form.
• 3b eine Anordnung umfassend die in 1b und 3a dargestellte Form und zwei in 2 dargestellte Leiterelemente in schematischer Schnittansicht, wobei die Leiterelemente in den im Längsschnitt bzw. im Querschnitt dargestellten Aufnahmen der Form derart angeordnet sind, dass die Oberseiten der Leiterelemente bündig mit der Oberseite der Form abschließen und die von den Oberseiten der Leiterelemente vorstehenden Verbindungsmittelabschnitte über die Oberseite der Form hervorstehen.
• 3c die Anordnung gemäß 3b, wobei zusätzlich auf der Oberseite der Form, über welche die Verbindungsmittelabschnitte hervorstehen, ein Isolierstoff-Flächenelement in Gestalt einer Prepreg-Matte angeordnet ist, die mehrere auf die Positionen und Formen der Verbindungsmittelabschnitte abgestimmte Öffnungen aufweist, sodass die Oberseiten der Verbindungsmittelabschnitte bündig mit der Oberseite des Isolierstoff-Flächenelements in einer Ebene angeordnet sind.
• 3d die Anordnung gemäß 3c, wobei zusätzlich auf der Oberseite des Isolierstoff-Flächenelements, die bündig mit den Oberseiten der Verbindungsmittelabschnitte in einer Ebene angeordnet ist, ein elektrisch leitendes Flächenelement aufgebracht ist.
• 3e die Anordnung gemäß 3d, wobei an jedem Verbindungsmittelabschnitt eines zu verbindenden Leiterelements jeweils zwei Kontaktelektroden zur Herstellung einer elektrisch leitenden Verbindung zwischen einem Leiterelement und dem elektrisch leitenden Flächenelement auf unterschiedlichen Seiten der Form angeordnet sind, wobei sich die unterseitige Kontaktelektrode jeweils durch die als Durchgang ausgebildete Öffnung in der Unterseite der Form bis zu dem in der jeweiligen Aufnahme aufgenommenen Leiterelement erstreckt, sodass die jeweilige Kontaktelektrode das zu verbindende Leiterelement unmittelbar kontaktieren kann.
• 4 in Ansicht (a) eine perspektivische Ansicht und in Ansicht (b) eine schematische Schnittansicht einer nach dem erfindungsgemäßen Verfahren hergestellten Leiterplatte.
• 5 ein Flussdiagramm des erfindungsgemäßen Verfahrens zur Herstellung einer Leiterplatte.

Show it:

• 1 in view (a) is a perspective view of a mold with a plurality of receptacles for the arrangement of conductor elements and in view (b) is a schematic sectional view, each showing a receptacle in longitudinal section and a receptacle in cross section through a respective through hole.
• 2 a perspective view of a conductor element with end applied on an upper side connecting means sections, wherein the conductor element is designed as a conductor wire with a rectangular cross-sectional area.
• 3a in the 1b illustrated schematic sectional view of the form.
• 3b an arrangement comprising the in 1b and 3a illustrated form and two in 2 2, wherein the conductor elements are arranged in the receptacles of the form shown in longitudinal section or in cross-section such that the upper sides of the conductor elements are flush with the upper side of the mold and the connecting medium sections projecting from the upper sides of the conductor elements over the upper side of the Protrude shape.
• 3c the arrangement according to 3b in addition, on the upper side of the mold, over which the connecting means sections protrude, an insulating surface element in the form of a prepreg mat is arranged, which has a plurality of openings matched to the positions and shapes of the connecting means sections, so that the upper sides of the connecting means sections are arranged flush with the upper side of the insulating surface element in a plane.
• 3d the arrangement according to 3c , wherein in addition on the upper side of the insulating surface element, which is arranged flush with the upper sides of the connecting means sections in a plane, an electrically conductive surface element is applied.
• 3e the arrangement according to 3d , Wherein each contactor portion of a conductor element to be connected in each case two contact electrodes for producing an electrically conductive connection between a conductor element and the electrically conductive surface element are arranged on different sides of the mold, wherein the lower-side contact electrode in each case through the opening formed as a passage in the underside of Form extends to the recorded in the respective recording conductor element, so that the respective contact electrode can contact the conductor element to be connected directly.
• 4 in view (a) is a perspective view and in view (b) is a schematic sectional view of a printed circuit board produced by the method according to the invention.
• 5 a flowchart of the method according to the invention for the production of a printed circuit board.

Detailed Description of the Preferred Embodiments

The preferred embodiment of the invention will be described below in detail with reference to the accompanying drawings.

A form 3 for producing a printed circuit board 1 is a perspective view in view (a) of 1 shown. The form comprises a total of six shots 3c for a total of six trained as rectangular wires conductor elements 2 , Each of the shots 3c comprises a substantially cuboidal cavity extending to a first side designated as the top 3a the form 3 opens. Starting from a designated as the bottom second page 3b the mold each extend two openings formed as passages 3d in each of the shots 3c into it. The first and second pages 3a . 3b the form 3 are spaced apart and extend in parallel planes. Form 3 can take different shots 3c for differently designed conductor elements 2 respectively. These different shots 3c can be on different sides 3a . 3b the form 3 are located. Form 3 is for example made of an electrically insulating material, for example FR4 (Composite plate consisting of epoxy resin and glass fiber fabric) produced. The pictures 3c are, for example, starting from the first page 3a the form 3 milled. The passages formed as passages 3d are preferably after training the shots 3c manufactured, for example drilled.

In view (b) of the 1 is a form 3 for producing a printed circuit board 1 to describe the method according to the invention schematically and simplified in sectional view. This form 3 has only two shots 3c on, extending along different and perpendicular edges of the mold 3 extend. It can be seen how the pictures are 3c to the first page 3a open the shape and the openings formed as passages 3d starting from the second page 3b the form 3 in the respective recording 3c lead. The openings 3d can get to the second page 3b the form 3 funnel-shaped to an insertion of tools 6b to facilitate.

2 shows a perspective view of a conductor element 2 , as a cuboidal conductor wire 2 is formed with a rectangular cross-sectional area and in each of the shots 3c of in 1 shown shape fits. The two largest surfaces of the cuboidal ladder element 2 make up the top 2a and the bottom 2 B of the conductor element 2 , Rectangular or platelet-shaped connecting medium sections 2c are at opposite ends of the conductor element 2 on its top 2a applied, eg welded. In one in the recording 3c Ingested state, the top extends 2a of the conductor element 2 in a plane with the top 3a the form 3 and terminates flush therewith, wherein the connecting means sections 2c over the top 3a the form 3 protrude. Deviating from the illustration in 2 can the conductor element 2 have a different shape. In particular, the conductor element 2 Also, for example, be a molded part, a round wire or a precision resistor. The recording 3c the form 3 is then usually adjusted accordingly.

The inventive method for producing a printed circuit board 1 with at least one in the circuit board 1 between connection points 1d extending conductor element 2 hereinafter referred to in particular with reference to 3 describes the following steps:

Step A: Providing a mold 3 with at least one receptacle 3c for a conductor element 2.

partial step A1 includes providing the in 1 (b) illustrated form 3 ,

As in 3 (b) shown, the shape becomes 3 arranged so that the top (first side) 3a of the mold 3 extends in a horizontal plane (sub-step A2 ).

Step B: Arranging a conductor element 2 in the receptacle 3 c of the mold 3.

partial step B1 includes the provision of conductor elements 2 , In the present embodiment, each conductor element 2 as cuboidal conductor wire 2 with end and top side applied Verbindungsungsmittelabschnitten 2c trained as in 2 is shown.

As in 3 (b) is shown, each conductor element 2 in the recording 3c arranged such, the conductor element 2 parallel to the plane of extent of the shape 3 is aligned and with respect to the plane of extension of the form 3 almost form-fitting and play-free in the recording 3c is included (sub-step B2 ).

Subsequently, each conductor element 2 so in the appropriate recording 3c used that with the connecting means sections 2c provided page 2a of the conductor element 2 essentially flush with the top (first page) 3a the form 3 completes and only the connecting medium sections 2c over the top (first page) 3a the form 3 stand out (sub-step B3 ).

As in 3 (c) can represent an insulating surface element 4 on the positions and possibly forms of the connecting means sections 2c coordinated openings 4c has, for example in the form of an apertured prepreg mat on the first side 3a the form 3 to be ordered. This makes it possible, each conductor element except the connecting means sections 2c completely surrounded with insulating material and thus completely decouple electrically from the environment. The insulating surface element 4 lies with its underside (second side) 4b preferably flat on the top (first side) 3a of the mold 3 as well as the top side (first page) 2a in the recording 3c the form 3 received conductor element 2 on, wherein the connecting means sections 2c flush with upper side (first side) 4a of the insulating surface element 4 complete (sub-step B4 ).

Step C: connecting the arranged in the receptacle 3c of the mold 3 conductor element 2 with an electrically conductive surface element 5 at positions of the intended connection points 1d ,

First, an electrically conductive surface element 5 eg in the form of a copper foil on the upper side (first side) 3a of the mold 3 arranged so that it is the top (first side) 4a of the insulating surface element 4 and the flush with it ends Verbindungsungsmittelabschnitte 2c completely covered (sub-step C1 ). By pressing the electrically conductive surface element 5 to the top (first page) 4a of the insulating surface element 4 Air pockets can be eliminated.

Subsequently, via the connecting means sections 2c at the positions of the intended connection points 1d electrically conductive connections between the conductor element 2 and the electrically conductive surface element 5 manufactured. This is done for example by welding, in particular by resistance welding, ultrasonic welding, or by brazing or the like.

In a resistance welding method described by way of example, a first electrode is used 6a a resistance welding tool on the top side (first side) 3a the form 3 arranged so that the first electrode 6a in contact with the top (first page) 5a of the electrically conductive surface element 5 located. The position of the first electrode 6a is in the position of an intended connection point 1d or the position of a connecting medium section 2c tuned (sub-step C2 ).

Subsequently, a second electrode 6b the connection tool on the underside (second side) 3b the form 3 arranged such that the second electrode 6b under penetration of an opening 3d in the bottom (second side) 3b the form 3 in contact with the second page 2 B of the conductor element 2 located (substep C3 ).

Following this is between the first electrode 6a and the second electrode 6b applied a contact pressure (sub-step C4 ) and an electric current applied (substep C5 ), which is used to heat the respective connecting medium section 2c leads. In this case, each connecting medium section 2c heated until reaching the required working temperature, so that the conductor element 2 and the electrically conductive surface element 5 over the connecting means section 2c under the action of force and by melting / solidification of the material of the connecting medium section 2c , by diffusion or in solid phase insoluble by welding are connected (sub-step C6 ).

Subsequently, the electrodes 6a . 6b removed (sub-steps C7 and C8 ).

Step D: embedding the conductor element 2 connected to the electrically conductive surface element 5 in insulating material 4, 7.

First, the conductor element 2 out of form 3 taken (sub-step ( D1 ).

Subsequently, insulating material 7 in a malleable state in the form of an insulating surface element 7 such as a prepreg mat on the with the conductor element 2 connected bottom (second side) 5b of the electrically conductive surface element 5 arranged. This is the insulating material 7 preferably with the underside (second side) 4b of the already at the bottom (second side) 5b of the electrically conductive surface element 5 arranged insulating surface element 4 connected. The insulating material 7 but can also be applied as a flowable mass. The insulating material 7 is preferably applied such that it is the conductor element 2 with the exception of the positions of the intended connection points 1c surrounds completely (sub-step D2 ) and the conductor element 2 almost completely embedded.

The optional application of pressure and possibly heat to the insulating material 4 . 7 in the direction of the electrically conductive surface element 5 can cause the insulating material 4 . 7 the conductor element 2 surrounds contour near (substep D3 ). If already an insulating surface element 4 between the conductor element 2 and the electrically conductive surface element 5 is present, the application of pressure and possibly heat to the subsequently applied insulating surface element 7 a connection between the two insulating surface elements 4 . 7 improve.

This happens, for example, in a press. This is the insulating material 4 . 7 at the of the electrically conductive surface element 5 opposite side to form a flat bottom 1b the circuit board 1 smoothed (substep D4 ) and cured (substep D5 ).

Step E: Working out of the connection points 1 c from the electrically conductive surface element 5

Upon completion of step D, the surface of the circuit board is 1 completely with the electrically conductive surface element 5 covered, wherein the conductor element 2 inside the circuit board 1 extends and in insulating material 4 . 7 is embedded.

At the positions of the intended connection points 1d at which the conductor element 2 over the connecting means sections 2c with the electrically conductive surface element 5 is now connected, then the connection points 1c by local removal of surrounding portions of the electrically conductive surface element 5 worked out (sub-step E1 ). This is preferably accomplished by etching.

For example, for signal transmission and conduction paths by local ablation of surrounding portions of the electrically conductive surface element 5 be worked out. This too is preferably accomplished by etching (substep E2 ). A trace 1e stands with at least one connection point 1d preferably in electrically conductive connection.

4 shows one using the in 1 illustrated form 3 manufactured circuit board 1 in a perspective view (view a) and in a schematic sectional view (view b ). The circuit board 1 has a substantially rectangular outline and a cuboid shape. The cuboid conductor element 2 extends between two at the top 1a the circuit board 1 arranged connection points 1d , for example, by etching from a copper foil ( 5 ), with the exception of the positions of the connection points 1d completely in insulating material 1d (4, 7) embedded.

In the schematic sectional view according to 4 (b) is the structural design of the circuit board 1 clearly visible. The top 1a the circuit board 1 is through the first insulating surface element 4 formed in step B (substep B4 ) on the top of the mold 3 was applied. The bottom 1b the circuit board 1 is through the second insulating surface element 7 formed, only after the connection between the conductor element 2 and the electrically conductive surface element 5 over the connecting means sections 2c on the underside of the first insulating surface element 4 was applied to the conductor element almost completely in insulating material 1c embed. The one on the top 1a the circuit board 1 arranged connection points 1d and tracks 1e are made of the material of the electrically conductive surface element ( 5 ) prepared in step C (Partial step C1 ) on the top of the first insulating surface element 4 was arranged.

LIST OF REFERENCE NUMBERS

1

circuit board

1a

Top of the circuit board

1b

Bottom of the circuit board

1c

insulator

1d

junction

1e

pathway

2

conductor element

2a

Top of the conductor element

2 B

Bottom of the conductor element

2c

Connecting means section

3

shape

3a

Top of the form

3b

Bottom of the form

3c

admission

3d

Passage / opening

4

Insulating material (electrically insulating surface element or insulating surface element)

4a

Top of the insulating surface element

4b

Bottom of the insulating surface element

4c

Passage / opening

5

Electrically conductive surface element (conductor surface element or foil)

5a

Top of the electrically conductive surface element

5b

Bottom of the electrically conductive surface element

6a

Electrode (top) of the connection tool

6b

Electrode (bottom) of the connection tool

7

Insulating material (electrically insulating surface element or insulating surface element)

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 1842402 A2 [0002, 0035, 0037]
• DE 102011102484 A1 [0035, 0037]
• DE 102013223143 A1 [0035, 0037]

Claims (9)

Method for producing a printed circuit board (1) having at least one conductor element (2) extending between the connection points (1d) in the printed circuit board (1), comprising the steps: a. Step A: Providing a mold (3) with at least one receptacle (3c) for a conductor element (2). b. Step B: arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: connecting the in the receptacle (3c) of the mold (3) arranged conductor element (2) with an electrically conductive surface element (5) at positions of the provided connection points (1d). d. Step D: embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (4, 7). e. Step E: Working out of the connection points (1c) from the electrically conductive surface element (5). Method according to Claim 1 , characterized in that step A comprises at least one of the following substeps: a. Sub-step A1: providing a mold (3) with a preferably planar first side (3a) and at least one receptacle (3c) for a conductor element (2) which opens to the first side (3a) of the mold (3). b. Sub-step A2: Arranging the mold (3) so that the first side (3a) of the mold (3a) extends at least partially or completely in a horizontal plane. Method according to one of the preceding claims, characterized in that step B comprises at least one of the following substeps: a. Sub-step B1: Provision of a conductor element (2) with at least two connecting means sections (2c), which are preferably arranged and / or attached to the same side (2a) and / or at different ends of the conductor element (2). b. Sub-step B2: Arranging the conductor element (2) in the receptacle (3c), so that the conductor element (2) with respect to the extension plane of the mold (3) is preferably received positively and / or play in the receptacle (4), wherein preferably the conductor element (2) is aligned parallel to the plane of extent of the mold (3). c. Sub-step B3: arranging the conductor element (2) in the receptacle (3c) so that the side (2a) of the conductor element (2) provided with the connecting medium sections (2c) terminates flush with the first side (3a) of the mold (3) and the connecting means sections (2c) protrude beyond the first side (3a) of the mold (3). d. Sub-step B4: arranging insulating material (4), preferably an insulating surface element (4), which preferably has openings (4c) matched to the positions and possibly forms of the connecting medium sections (2c), on the first side (3a) of the mold (4) 3), preferably such that a second side (4b) of the insulating surface element (4) flat on the first side (3a) of the mold (3) and the first side (2a) in the receptacle (3c) of the mold (3c) 3) accommodated conductor element (2) rests, wherein particularly preferably the connecting means sections (2c) on the upper side flush with a first side (4a) of the insulating surface element (4). Method according to one of the preceding claims, characterized in that step C comprises at least one of the following substeps: a. Sub-step C1: arranging an electrically conductive surface element (5) on the first side (3a) of the mold (3), preferably on the first side (4a) of the insulating surface element (4), preferably such that the electrically conductive surface element (5 ) rests flat on the first side (4a) of the insulating surface element (4) and / or flat on the connecting means sections (2c). b. Sub-step C2: arranging a first electrode (6a) of a connection tool for producing an electrically conductive connection between the conductor element (2) and the electrically conductive surface element (5) on a first side (3a) of the mold (3), preferably such that the first electrode (6a) is in contact with the first side (5a) of the electrically conductive surface element (5). c. Sub-step C3: arranging a second electrode (6b) of the connection tool for producing an electrically conductive connection between the conductor element (2) and the electrically conductive surface element (5) on a second side (3b) of the mold (3), preferably such that the second electrode (6b) is in contact with the second side (2b) of the conductor element (2) while penetrating an opening (3d) in the mold (3). d. Sub-step C4: applying a contact pressure between the first electrode (6a) and the second electrode (6b). e. Sub-step C5: applying an electric current between the first electrode (6a) and the second electrode (6b). f. Sub-step C6: heating of the connecting medium section (2c) until the required working temperature has been reached so that the conductor element (2) and the electrically conductive surface element (5) pass over the connecting-medium section (2c), preferably under the action of a force between the electrodes (6a, 6b) , by melting and solidification of the material of the connecting medium portion (2c), by diffusion or in the solid phase are inextricably linked, preferably by welding. G. Partial step C7: removing the first electrode (6a) from the first side (5a) of the electrically conductive surface element (5). H. Sub-step C8: removing the second electrode (6b) from the second side (2b) of the conductor element (2) and removing the second electrode (6b) from the opening (3d) in the mold (3). i. Sub-step C9: attaching at least one reference mark to the electrically conductive surface element (5), preferably by manufacturing at least one opening. Method according to one of the preceding claims, characterized in that step D has at least one of the following substeps: a. Sub-step D1: Remove the conductor element (2) from the mold (3). b. Partial step D2: arranging insulating material (4, 7) on the second side (5b) of the electrically conductive surface element (5) connected to the conductor element (2), preferably on the second side (4b) of the second side (5b) of the electrically conductive surface element (5) arranged, insulating material surface element, preferably as a mass or in the form of an insulating surface element (7), particularly preferably such that the insulating material (4, 7) the conductor element (2) with the exception of the positions of the intended connection points (1c) completely surrounds. c. Sub-step D3: applying pressure and possibly heat to the insulating material (7) in the direction of the electrically conductive surface element (5), so that the insulating material (7) of the contour of the conductor element (2) adapts and possibly with an existing insulating material (7). 4) connects. d. Sub-step D4: smoothing of the insulating material (4, 7) on the side facing away from the electrically conductive surface element (5) side to form a flat bottom (1b) of the printed circuit board (1). e. Sub-step D5: curing of the insulating material (4, 7). Method according to one of the preceding claims, characterized in that step E comprises at least one of the following substeps: a. Sub-step E1: Working out of the connection points (1c) by local removal of surrounding portions of the electrically conductive surface element (5), preferably by etching. b. Sub-step E2: Working out of conductor paths by local removal of surrounding portions of the electrically conductive surface element (5), preferably by etching. Printed circuit board (1) produced by the method according to one of the preceding claims. Mold (3) for producing a printed circuit board (1), preferably a printed circuit board (1) according to Claim 7 , preferably by the method according to one of Claims 1 to 6 comprising at least one receptacle (3c) for a conductor element (2) in a first side (3a) of the mold (3) and at least one opening (3d) communicating with the receptacle (3c) for introducing a connection tool (6b) in a second one Side (3b) of the form (3). Kit for producing a printed circuit board (1), preferably a printed circuit board (1) according to Claim 7 , preferably by the method according to one of Claims 1 to 6 comprising a form Claim 8 , at least one conductor element (2) which can be arranged in the receptacle (3c) and at least one connection tool (6b) which can be introduced into the opening (3d).

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