EP3766310A1

EP3766310A1 - Method for producing a printed circuit board using a mould for conductor elements

Info

Publication number: EP3766310A1
Application number: EP19710657.8A
Authority: EP
Inventors: Markus WÖLFEL
Original assignee: Jumatech GmbH
Current assignee: Jumatech GmbH
Priority date: 2018-03-12
Filing date: 2019-03-11
Publication date: 2021-01-20
Also published as: US11395411B2; KR102413296B1; KR20200128432A; CN111869334B; US20210029831A1; CN111869334A; JP7244531B2; WO2019175090A1; JP2021515990A

Abstract

The present invention relates to a method for producing a printed circuit board having at least one conductor element which extends between connection points in the printed circuit board. In order to increase the productivity of the known method for producing a printed circuit board having at least one conductor element which extends between connection points in the printed circuit board, the method according to claim 1 comprises the following steps: - Step A: providing a mould (3) having at least one receptacle (3c) for a conductor element (2). - Step B: arranging a conductor element (2) in the receptacle (3c) of the mould (3). - Step C: connecting the conductor element (2), which is arranged in the receptacle (3c) of the mould (3), to an electrically conductive sheet-like element (5) at positions of the intended connection points. - Step D: embedding the conductor element (2), which is connected to the electrically conductive sheet-like element (5), in insulating material (4). - Step E: working the connection points out of the electrically conductive sheet-like element (5).

Description

Method for producing a printed circuit board using a mold for

conductor elements

The present invention relates to a method for producing a printed circuit board with at least one conductor element extending between connecting points in the printed circuit board.

Such a method is known from EP 1 842 402 A2.

In the known method, a lead wire is welded to a copper foil and then pressed with insulating material.

In view of today's manufacturing precision requirements, the positions and orientations of the conductor elements and terminals must be accurately measured. In particular, in a mass production of corresponding circuit boards, the manufacturing process is delayed by repeated surveying operations, whereby the productivity of the method decreases.

Based on these considerations, the present invention has the object to increase the productivity of the known method.

The object is achieved by the method according to claim 1.

The method disclosed herein for producing a printed circuit board having at least one conductor element extending in the printed circuit board between connection points comprises the following steps:

Step A: Providing a mold with at least one receptacle for a conductor element.

Step B: Arrange a conductor element in the receptacle of the mold.

Step C: connecting the conductor element arranged in the receptacle of the mold to an electrically conductive surface element at positions of the provided connection points.

Step D: embedding the conductor element connected to the electrically conductive surface element in insulating material.

Step E: Working out the connection points from the electrically conductive surface element.

By using the mold, the relative orientation of a plurality of conductor elements can be accurately determined because of the placement and orientation of the receptacles is precisely defined to each other in the form. Notwithstanding the conventional method, the individual conductor elements for connection to the electrically conductive surface element need not be measured individually, but are simply positioned in the respective receptacles provided. Then, only the electrically conductive surface element must be fixed relative to the mold, so that the positions of all line elements and connection points to the electrically conductive surface element are precisely defined. Since the connection of the conductor elements to the electrically conductive surface element is produced in a state in which the conductor elements are in the mold, relative movements of the conductor elements with one another are precluded. By eliminating the individual Vermessungsvorgänge for making the connection of the conductor elements with the electrically conductive surface element, the productivity of the method for producing the printed circuit board with at least one extending between terminals conductor element can be significantly increased.

It may be advantageous if step A has at least one of the following substeps:

Sub-step A1: Providing a mold with a preferably flat first side and at least one opening for the first side of the mold receptacle for a conductor element.

Sub-step A2: Arranging the shape such that the first side of the shape extends at least partially or completely in a horizontal plane.

The horizontal alignment of the mold in sub-step A1 / A2 facilitates the positioning of the conductor element in the receptacle of the mold and the subsequent processing steps.

However, it may also be useful if step B has at least one of the following substeps:

Sub-step B1: Provision of a conductor element having at least two connecting means sections, which are preferably arranged and / or attached to the same side and / or at different ends of the conductor element.

Sub-step B2: Arranging the conductor element in the receptacle, so that the conductor element with respect to the plane of extension of the mold is preferably received positively and / or play in the recording, wherein preferably the conductor element is aligned parallel to the plane of extension of the mold.

Sub-step B3: arranging the conductor element in the receptacle such that the side of the conductor element provided with the connecting-medium sections is flush with the first one Completes the side of the mold and the connecting means sections protrude beyond the first side of the mold.

Teilschritt B4: arranging insulating material, preferably an insulating surface element, which preferably has on the positions and possibly forms of the connecting means sections matched openings on the first side of the mold, preferably such that a second side of the insulating sheet surface on the first Side of the mold and the first side of the recorded in the receptacle of the form conductor element rests, wherein particularly preferably complete the connecting means sections on the upper side flush with a first side of the insulating surface element.

Sub-step B1 facilitates the connection of the conductor element with the electrically conductive surface element. In particular, it proves to be practical if the side of the conductor element to which the connecting means sections are attached, is flat. This can be achieved, for example, in that the conductor element is a rectangular wire, which is cut to length, for example, by a coil of appropriate length. Due to the preceding winding on the spool, the rectangular wire may not extend exactly along a straight line. By applying a tensile force on both ends, the conductor element can be straightened. Other techniques for straightening the conductor element are possible.

The connecting means sections are, for example, platelets made of silver or another suitable connecting material, which can accomplish a permanent electrically conductive connection between the conductor element and the electrically conductive surface element. Alternatively, the connecting-medium sections can also consist of an electrically non-conductive connecting material, which can effect a permanent, purely mechanical connection between the conductor element and the electrically conductive surface element. For this purpose, the connection material can be welded.

After the orders of the connecting means sections, the conductor element can be pulled into a corresponding length and brought into shape, which preferably fits exactly into a corresponding receptacle in the mold.

Sub-step B2 favors the fixation of the relative positions and alignment of the conductor elements to each other in the plane of extension of the mold, since the conductor elements can not move in their respective recordings. Sub-step B3 allows the positioning of the conductor elements also in a direction perpendicular to the plane of extension of the mold.

Sub-step B4 proves to be helpful in completely embedding the conductor element in insulating material. In the conventional method, it proves to be a problem that after joining the conductor element with the electrically conductive surface element insulating material must be pressed into the gap. This gap is difficult to access after establishing the connection between the conductor element and the electrically conductive surface element. In substep B4, e.g. a prepreg mat with prefabricated openings at the positions of the connecting means are positioned so that it rests with its underside flat on the top of the mold and the top of the conduit member, while the connecting means are flush with the top of the prepreg mat in a plane. In this case, each of the openings in the prepreg mat forms a shape which prevents unimpeded spreading of the material of the connecting medium portion received thereon in the subsequent welding operation. An unwanted contact between the conductor element and electrically conductive surface element outside the positions of the intended connection points can thus be additionally prevented. Preferably, a prefabricated insulating surface element is used, so that an individual adaptation of the insulating surface element can be omitted and the productivity of the method can be further increased. The openings may e.g. be punched using a mask.

However, it can also be useful if step C has at least one of the following substeps:

Sub-step CO: connecting the conductor element arranged in the receptacle of the mold to the electrically conductive surface element via at least one connecting medium section made of an electrically nonconductive, preferably weldable material, preferably by pressure welding.

Sub-step C1: arranging an electrically conductive surface element on the first side of the mold, preferably on the first side of the insulating surface element, preferably such that the electrically conductive surface element rests flat on the first side of the insulating surface element and / or surface on the connecting means sections ,

Sub-step C2: arranging a first electrode of a connection tool for producing an electrically conductive connection between the conductor element and the electrically conductive surface element on a first side of the mold, preferably such that the first electrode is in contact with the first side of the electrically conductive surface element.

Partial step C3: arranging a second electrode of the connection tool for producing an electrically conductive connection between the conductor element and the electrically conductive surface element on a second side of the mold, preferably such that the second electrode is in contact with the second one, penetrating one opening in the mold Side of the conductor element is located.

Sub-step C4: Applying a contact pressure between the first electrode and the second electrode.

Sub-step C5: applying an electric current between the first electrode and the second electrode.

Sub-step C6: heating of the connecting medium section until reaching the required working temperature, so that the conductor element and the electrically conductive surface element insoluble over the connecting means portion, preferably under the action of a force between the electrodes, by melting and solidification of the material of the connecting medium portion, by diffusion or in solid phase be connected, preferably by welding.

Sub-step C7: removing the first electrode from the first side of the electrically conductive surface element.

Partial step C8: removing the second electrode from the second side of the conductor element and removing the second electrode from the opening in the mold.

Sub-step C9: attaching at least one reference mark to the electrically conductive surface element, preferably by manufacturing at least one opening.

By partial step CO, a permanent, purely mechanical connection between the conductor element and the electrically conductive surface element can be accomplished.

Sub-step C1 favors the planar and regular layer structure of the printed circuit board. Preferably, a prefabricated blank of an electrically conductive surface element is used, so that an individual cutting of the electrically conductive surface element can be omitted and the productivity of the method can be further increased. Sub-step C2 creates an abutment in the form of the first electrode for the subsequently applied by the second electrode contact pressure.

Sub-step C3 favors the exact positioning of the second electrode in relation to the respective connecting medium section, via which the conductor element is to be connected to the electrically conductive surface element.

Sub-steps C4 to C8 favor the production of a compound of the conductor element with the electrically conductive surface element by way of resistance welding.

However, it can also be advantageous if step D has at least one of the following substeps:

Sub-step D1: Remove the conductor element from the mold.

Sub-step D2: Arranging insulating material on the connected to the conductor element second side of the electrically conductive surface element, preferably on the second side of the arranged on the second side of the electrically conductive surface element insulating surface element, preferably as a mass or in the form of a Isolierstoff- surface element, especially preferably such that the insulating material completely surrounds the conductor element with the exception of the positions of the intended connection points.

Sub-step D3: Applying pressure and possibly heat to the insulating material in the direction of the electrically conductive surface element, so that the insulating material adapts to the contour of the conductor element and optionally connects with an already existing insulating material.

Sub-step D4: smoothing of the insulating material on the side facing away from the electrically conductive surface element side to form a flat underside of the circuit board.

Sub-step D5: curing of the insulating material.

Sub-step D1 makes the conductor element accessible for the subsequent application of the insulating material. After establishing the connection between the conductor element and the electrically conductive surface element whose relative position and orientation is fixed, so that the shape is no longer necessary and can be removed.

Sub-step D2 embeds the guide element almost completely in insulating material. Preferably, a prefabricated insulating surface element is used, so that an individual orders of the Isolierstoffs can be omitted and the productivity of the process can be further increased. The insulating surface element may have a corresponding receptacle for each conductor element.

Partial steps D3 and D4 are preferably carried out in a press under the action of pressure and temperature.

It may prove helpful if step E has at least one of the following substeps:

Sub-step E0: Attachment of at least one contacting point, which at least electrically connects the conductor element with the electrically conductive surface element.

Sub-step E1: Working out of the connection points by local removal of surrounding portions of the electrically conductive surface element, preferably by etching.

Sub-step E2: Working out of at least one line path by local removal of surrounding portions of the electrically conductive surface element, preferably by etching.

Sub-step E0 enables an additional electrical connection of the conductor elements to the electrically conductive surface element, from which conductor images are produced in sub-steps E1 and E2, and / or external components. Thus, the connection points can be used as a pure mechanical connection.

Sub-steps E1 and E2 allow complex conductor patterns to be formed on the surface of the circuit board in addition to the conductor elements extending therebetween. Preferably, the connection points and / or pathways are worked out in dependence on a previously made reference mark.

Another aspect of the present invention relates to a printed circuit board produced by the method according to one of claims 1 to 6. The above-mentioned advantages apply.

Yet another aspect of the present invention relates to a mold for producing a printed circuit board, preferably a printed circuit board according to claim 7, preferably by the method according to one of claims 1 to 6, comprising at least one receptacle for a conductor element in a first side of the mold and at least one receptacle communicating with the receptacle for insertion of a bonding tool in a second side of the mold. The above benefits apply. Yet another aspect of the present invention relates to a kit for producing a printed circuit board, preferably a printed circuit board according to claim 7, preferably by the method according to one of claims 1 to 6, comprising a mold according to claim 8, at least one conductor element which can be arranged in the receptacle, and at least an insertable into the opening connection tool. The kit includes matched components and tools for making the circuit board.

terms and definitions

shape

A mold in the sense of this invention is a tool that is used to make the circuit board. The mold has for this purpose at least one receptacle for a conductor element.

The mold may have at least one of the following features:

The mold consists of a dielectric or electrically insulating material, for example a composite material consisting of epoxy resin and glass fiber fabric.

The mold is designed as a plate.

The shape extends essentially in one plane.

The mold comprises an upper surface, which is preferably flat.

The mold comprises a bottom which is preferably flat.

The top and bottom of the mold are parallel to each other.

The mold has a thickness of 1 to 5 mm, preferably 1, 5 to 3 mm, preferably 2 mm.

The shape has a polygonal, preferably rectangular or square outline.

The recording of the shape has an inner contour which is matched to the outer contour of the conductor element.

The recording of the shape has an outer contour which is matched to the inner contour of the conductor element. The depth of the recording is matched to the height / thickness of the conductor element.

The mold has a separate receptacle for each conductor element.

The receptacle extends from a first side of the mold into the mold.

The receptacle is incorporated from a first side of the mold into the mold, preferably milled.

The first side of the mold forms the top of the mold.

The depth of the recording is in the range from 50 to 1000 .mu.m, preferably in the range from 100 to 500 .mu.m, preferably in the range from 300 to 400 .mu.m, particularly preferably at 350 .mu.m.

The mold has at least one opening formed as a passage and communicating with the receptacle for introducing a tool from the second side of the mold.

The passage extends substantially perpendicular to the plane of extent of the mold.

The passage extends from the second side of the mold into the respective receptacle.

Each receptacle is associated with at least one opening formed as a passage, preferably in each case two openings formed as a passage, which are preferably arranged at different ends of the receptacle.

circuit board

A printed circuit board in the sense of this invention is a carrier for electronic components. The circuit board is used e.g. mechanical fastening and electrical connection of electronic components. Almost every electronic device contains one or more printed circuit boards. A circuit board can also be referred to as a printed circuit board, circuit board or printed circuit board and corresponds to what is known in English as Printed Circuit Coard (PCB).

The printed circuit board preferably has at least one of the following features:

The printed circuit board comprises one or more layers, preferably several identical layers. The printed circuit board is a printed circuit board according to EP 1 842 402 A2.

The printed circuit board is a printed circuit board according to DE 10 201 1 102 484 A1.

The printed circuit board is a printed circuit board according to DE 10 2013 223 143 A1.

The circuit board extends in a plane.

The circuit board has parallel tops and bottoms.

At the top of the circuit board are at least two connection points.

At the top of the circuit board is at least one line path.

At least one conductor element is embedded in the printed circuit board, with the conductor element, with the exception of the connection points, being embedded in insulating material.

conductor element

A conductor element in the sense of this invention is an object for the transport of electrical energy and / or heat and / or for signal transmission in line-based communications technology and conducted radio-frequency technology. The conductor element can be part of an electrical circuit or power network and thus connect power source and consumer. For transport, electrons flow as a conductor current through the conductor element. For low voltage drop or low transport losses, the conductive material should have a high electrical conductivity, to which some metals are particularly well suited. The cross-sectional area of the conductor is preferably designed for the permissible current density.

The conductor element preferably has at least one of the following features:

The conductor element is a conductor wire, preferably a round wire with a round cross section or a rectangular wire with a rectangular cross section, wherein the conductor wire preferably has a constant over its length cross section. The conductor element is preferably a conductor wire according to EP 1 842 402 A2.

The conductor element is a molded part, preferably a molded part according to DE 10 201 1 102 484 A1. The molded part may, for example, have the following features: o The molded part extends essentially in one plane. o The molding is made of metal, preferably copper. The molded part comprises at least sections a concave contour and / or at least partially a convex contour. The molding is at least partially, preferably completely, embedded in the circuit board. The tops of the circuit board and the molding are aligned substantially parallel to each other. The molded part is cut out of a plate-shaped workpiece, preferably by punching, eroding or shaving, preferably by water jet cutting. The molded part has a thickness in the range from 10 to 2000 .mu.m, preferably in the range from 100 to 1000 .mu.m, preferably in the range from 200 to 500 .mu.m. A length and / or width of the molded part is at least five times, preferably at least ten times, preferably at least twenty times, preferably at least fifty times or preferably at least one hundred times as large as the thickness of the molded part and / or the thickness of the printed circuit board. The molded part comprises a substantially rectangular cross-section. The cross-sectional shape of the molding is not constant over the width and / or the length of the molding. The thickness of the molding is constant over its entire surface. The molding includes a curvature in one, two, three or more planes of curvature. The molding is at least partially out of the insulating material. The molding is not produced or manufactured by extrusion. The molded part comprises at least one recess, which is incorporated starting from an edge side of the molded part in the molded part. Preferably, the recess is at least partially filled with insulating material. The molded part comprises at least one opening which extends from the upper side, the lower side or an edge side of the molded part in sections into the molded part, wherein the opening preferably at least in the region of its mouth a circular, oval, polygonal, preferably triangular, quadrangular, pentagonal, preferably rectangular or square outline, wherein the opening is preferably substantially groove-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably at least in sections runs parallel to an edge side of the molded part, wherein the opening is particularly preferably at least partially filled with insulating material. o The molding comprises at least one opening, which extends transversely, preferably perpendicular, to the top, the bottom or an edge side of the molding through the molding, wherein the opening preferably a circular, oval, polygonal, preferably triangular, square, pentagonal, rectangular or square outline, wherein the opening is preferably formed substantially slit-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably extends at least partially parallel to an edge side of the molding, the breakthrough particularly preferably at least in sections with insulating material is filled. The molded part is essentially L-shaped, T-shaped, H-shaped, S-shaped, O-shaped, E-shaped, F-shaped, X-shaped, Y-shaped, Z-shaped, C-shaped, U-shaped or W-shaped. o Several moldings are arranged in the same plane or in different planes, preferably in mutually parallel planes within the printed circuit board.

The conductor element is a resistor, preferably a precision resistor, preferably a precision resistor according to DE 10 2013 223 143 A1. The precision resistor may have the following characteristics: o The precision resistor comprises a resistance value in the range of 0.1 to 300 mΩ, preferably in the range of 1 to 100 m. The precision resistor comprises a variance of less than +/- 5%, preferably a variance of less than +/- 2%, preferably a variance of +/- 1% or less. o The temperature coefficient of electrical resistance of the precision resistor for the temperature range between 20 and 60 ° C is in the range of 0.1 ppm / K to 200 ppm / K, preferably in the range of 0.5 ppm / K to 100 ppm / K, preferably in the range of 1 ppm / K to 50 ppm / K. o The precision resistor is made of metal, preferably of at least one of the elements copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (AI), silicon (Si) or tin (Sn), preferably from an alloy containing at least one of copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (AI), silicon (Si) or tin (Sn), for example manganin, zeranine or isohm.

The conductor element contacts the connection points.

The conductor element is electrically conductively and / or mechanically connected to at least one of the connection points, preferably all connection points.

The conductor element is welded to the connection points.

The conductor element is at least predominantly, preferably completely, embedded in the printed circuit board.

An upper side and / or a lower side and / or at least one of the edge sides of the conductor element, preferably all edge sides of the conductor element, is / are covered at least in sections, preferably completely, with insulating material.

An upper side and / or a lower side and / or at least one of the edge sides of the conductor element extends at least in sections, preferably completely, flush with an upper side and / or a lower side and / or at least one of the edge sides of an adjacent layer of insulating material.

The tops and / or the bottoms and / or at least one of each

Edge sides of the circuit board and the conductor element are aligned parallel to each other.

The tops and / or the bottoms and / or at least one of each

Edge sides of the conductor element and of the electrically conductive surface element are aligned parallel to one another.

The conductor element can be produced or produced by the extrusion process. The conductor element is designed as a flat wire.

The conductor element extends substantially in one plane.

The conductor element comprises a rectangular cross-section, wherein preferably the side of the cross-section with the greater extent to the surface of the circuit board has.

The conductor element has a thickness in the range from 10 to 2000 .mu.m, preferably in the range from 50 to 1000 .mu.m, preferably in the range from 100 to 500 .mu.m.

The conductor element comprises or consists of an electrically conductive material.

The conductor element comprises or consists of a composite or hybrid material, of which one section is designed to be electrically conductive and the other is designed to be electrically insulating.

The conductor element comprises or consists of metal, preferably copper.

The conductor element comprises at least one connecting means section, preferably of a material which is different from the conductor element, preferably brazing material, particularly preferably silver. The connecting means portion is connected to the conductor element, preferably cohesively, for example by welding. The connecting means portion is formed, for example, plate-shaped.

The conductor element comprises a bonding agent for improving the connection to the insulating material.

The conductor element comprises a roughened surface for improving the connection to the insulating material, preferably with the following features: o The surface of the conductor element is at least partially roughened before the conductor element comes into contact with insulating material, preferably before step B and / or before step C. The roughening of the surface of the conductor element is carried out by chemical etching, wherein the chemical etching is preferably carried out by immersing the conductor element in a liquid etching the material of the conductor element or by spraying the conductor element with such a liquid. o The surface of the conductor element is roughened by mechanical treatment, for example by sandblasting or by spraying pumice or quartz powder under high pressure.

insulator

An insulating material in the context of this invention is a non-conductive material, which therefore has only an extremely low and thus negligible electrical conductivity. Insulating materials are used in electrical engineering to limit the flow of electrical current to the live parts. Insulating material is preferably applied in the plastic or flowable state and cured after reaching the intended shape. Insulating material can be applied, for example, as a composition or as a prepreg mat. The prepreg mat comprises a fabric layer which provides internal cohesion and already provides an existing basic structure, wherein the fabric layer is impregnated with flowable or plastic resin and thus allows an adaptation of the mold.

Electrically conductive surface element or film

The electrically conductive surface element in the sense of the invention is a planar element such as e.g. a sheet of electrically conductive material.

The electrically conductive surface element preferably has at least one of the following features:

The electrically conductive surface element comprises or consists of an electrically conductive material.

The electrically conductive surface element comprises or consists of metal, preferably copper.

The electrically conductive surface element is formed as a film.

The electrically conductive surface element has a thickness in the range from 10 to 1000 μm, preferably in the range from 15 to 200 μm, preferably in the range from 18 to 105 μm, particularly preferably at 35 μm.

Further preferred developments of the invention result from combinations of the features disclosed herein.

Brief description of the figures Show it:

Fig. 1 in view (a) is a perspective view of a mold with a plurality of receptacles for the arrangement of conductor elements and in view (b) is a schematic sectional view, in each case a receptacle in longitudinal section and a receptacle in cross section through a respective through hole is shown.

Fig. 2 is a perspective view of a conductor element with end applied on an upper side connecting means sections, wherein the conductor element is designed as a conductor wire with a rectangular cross-sectional area.

Fig. 3a shows the schematic sectional view of the form shown in Figure 1 b.

3b shows an arrangement comprising the form shown in Figure 1 b and 3a and two conductor elements shown in Figure 2 in a schematic sectional view, wherein the conductor elements are arranged in the longitudinal section or in cross section shots of the mold such that the tops of the conductor elements flush with the top of the mold and projecting from the tops of the conductor elements projecting connecting portions over the top of the mold.

3c shows the arrangement according to FIG. 3b, wherein additionally on the upper side of the mold, over which the connecting means sections protrude, an insulating surface element in the form of a prepreg mat is arranged, which has a plurality of openings matched to the positions and shapes of the connecting means sections the upper sides of the connecting means sections are arranged flush with the upper side of the insulating surface element in a plane.

Fig. 3d, the arrangement of Figure 3c, wherein additionally on the upper side of the insulating surface element, which is arranged flush with the upper sides of the connecting means in a plane, an electrically conductive surface element is applied.

3e, the arrangement according to Figure 3d, wherein at each connecting means portion of a conductor element to be connected in each case two contact electrodes for producing an electrically conductive connection between a conductor element and the electrically conductive surface element are arranged on different sides of the mold, wherein the lower-side contact electrode respectively through the formed as a passage opening in the bottom of the mold extends to the recorded in the respective recording conductor element, so that the respective contact electrode can contact the conductor element to be connected directly. Fig. 4 in view (a) is a perspective view and in view (b) is a schematic sectional view of a printed circuit board produced by the method according to the invention.

5 shows a flow chart of the method according to the invention for producing a printed circuit board.

Fig. 6 in view (a) is a perspective view and in view (b) is a schematic sectional view of a prepared according to the inventive circuit board of another embodiment.

Detailed Description of the Preferred Embodiments

The preferred first embodiment of the invention will be described below in detail with reference to the accompanying drawings 1 to 5.

A mold 3 for producing a printed circuit board 1 is shown in a perspective view in view (a) of FIG. 1. The mold comprises a total of six receptacles 3 c for a total of six conductor elements 2 formed as rectangular wires. Each of the receptacles 3 c comprises a substantially parallelepiped-shaped cavity, which opens toward a first side 3 a of the mold 3 designated as the upper side. Starting from a second side 3b of the mold, referred to as the underside, in each case two openings 3d formed as passages extend into each of the receptacles 3c. The first and second sides 3a, 3b of the mold 3 are spaced apart and extend in parallel planes. The mold 3 can have different receptacles 3 c for differently shaped conductor elements 2. These different receptacles 3 c can be located on different sides 3 a, 3 b of the mold 3. The mold 3 is made, for example, of an electrically insulating material, for example FR4 (composite panel consisting of epoxy resin and glass fiber fabric). The receptacles 3c are milled, for example, starting from the first side 3a of the mold 3. The passages 3d formed as passages are preferably made after the formation of the receptacles 3c, for example drilled.

In view (b) of Figure 1, a mold 3 for producing a printed circuit board 1 for the description of the method according to the invention is shown schematically and simplified in a sectional view. This form 3 has only two receptacles 3 c, which extend along different and mutually perpendicular edges of the mold 3. It can be seen how the receptacles 3c open to the first side 3a of the mold and the passages formed as passages 3d starting from the second side 3b of the mold 3 in the respective Take 3c lead. The openings 3d may extend in a funnel shape towards the second side 3b of the mold 3 to facilitate insertion of tools 6b.

FIG. 2 shows a perspective view of a conductor element 2, which is designed as a parallelepiped conductor wire 2 with a rectangular cross-sectional area and fits into each of the receptacles 3c of the shape shown in FIG. The two largest faces of the parallelepipedic conductor element 2 form the top side 2a and the bottom side 2b of the conductor element 2. Rectangular connection means sections 2c are applied to opposite ends of the conductor element 2 on its top side 2a, e.g. welded. In a state accommodated in the receptacle 3c, the upper side 2a of the conductor element 2 extends in a plane with the upper side 3a of the mold 3 and terminates flush therewith, the connecting medium sections 2c projecting over the upper side 3a of the mold 3. Notwithstanding the illustration in Figure 2, the conductor element 2 may have a different shape. In particular, the conductor element 2 may also be, for example, a molded part, a round wire or a precision resistor. The receptacle 3c of the mold 3 is then to be adapted accordingly in the rule.

The inventive method for producing a printed circuit board 1 with at least one conductor element 2 extending in the printed circuit board 1 between connection points 1 d, which will be described below with particular reference to FIG. 3, comprises the following steps:

Step A: Providing a mold 3 with at least one receptacle 3c for a conductor element 2.

Sub-step A1 includes providing the mold 3 shown in FIG. 1 (b).

As shown in Fig. 3 (b), the mold 3 is arranged so that the top (first side) 3a of the mold 3 extends in a horizontal plane (substep A2).

Step B: Arranging a conductor element 2 in the receptacle 3 c of the mold 3.

Sub-step B1 includes the provision of conductor elements 2. In the present embodiment, each conductor element 2 is formed as a rectangular conductor wire 2 with end and top side applied connecting means sections 2c, as shown in Figure 2.

As shown in FIG. 3 (b), each conductor element 2 is arranged in the receptacle 3c in such a way that the conductor element 2 is aligned parallel to the plane of extent of the mold 3 and is accommodated in the receptacle 3c almost positively with respect to the plane of extent of the mold 3 (sub-step B2). Subsequently, each conductor element 2 is inserted into the corresponding receptacle 3c such that the side 2a of the conductor element 2 provided with the connecting medium sections 2c is substantially flush with the top side (first side) 3a of the mold 3 and only the connecting medium sections 2c are closed over the top side (first Side) 3a of the mold 3 (substep B3).

As shown in FIG. 3 (c), an insulating sheet 4 having openings 4c matched to the positions and possibly shapes of the connecting portions 2c, for example in the form of an apertured prepreg mat, may be formed on the first side 3a of the mold 3 to be ordered. This makes it possible to completely surround each conductor element with the exception of the connecting means 2c with insulating material and thus completely decouple electrically from the environment. The insulating surface element 4 lies with its underside (second side) 4b preferably flat on the upper side (first side) 3a of the mold 3 and the upper side (first side) 2a of the accommodated in the receptacle 3c of the mold 3 conductor element 2, wherein the Connecting means sections 2c upper side flush with a top (first side) 4a of the insulating surface element 4 complete (sub-step B4).

Step C: connecting the conductor element 2 arranged in the receptacle 3c of the mold 3 to an electrically conductive surface element 5 at positions of the provided connection points Id.

First, an electrically conductive sheet 5, e.g. in the form of a copper foil on the upper side (first side) 3a of the mold 3, so that it covers the upper side (first side) 4a of the insulating surface element 4 and the connecting sections 2c flush therewith completely (substep C1). By pressing the electrically conductive surface element 5 to the upper side (first side) 4a of the insulating surface element 4, air pockets can be eliminated.

Subsequently, electrically conductive connections between the conductor element 2 and the electrically conductive surface element 5 are produced via the connecting means sections 2 c at the positions of the provided connection points 1 d. This is done for example by welding, in particular by resistance welding, ultrasonic welding, or by brazing or the like.

In a resistance welding method described by way of example, a first electrode 6 a of a resistance welding tool is disposed on the top side (first side) 3 a of the mold 3 so that the first electrode 6 a is in contact with the top surface (first side) 5 a of the electrically conductive surface element 5. The position of the first electrode 6a is In this case, the position of an intended connection point 1d or the position of a connection means section 2c is coordinated (substep C2).

Subsequently, a second electrode 6b of the bonding tool is disposed on the lower side (second side) 3b of the mold 3 such that the second electrode 6b penetrates an opening 3d in the lower side (second side) 3b of the mold 3 in contact with the second side 2b of the conductor element 2 is (sub-step C3).

Subsequently, a contact pressure is applied between the first electrode 6a and the second electrode 6b (sub-step C4) and an electric current is applied (sub-step C5), which leads to heating of the respective connecting-medium section 2c. In this case, each connecting-medium section 2c is heated until the required working temperature has been reached, so that the conductor element 2 and the electrically conductive surface element 5 are joined by welding via the connecting-medium section 2c by force and by melting / solidifying the material of the connecting-medium section 2c, by diffusion or in solid phase (sub-step C6).

Subsequently, the electrodes 6a, 6b are removed (substeps C7 and C8).

Step D: embedding the connected to the electrically conductive surface element 5 conductor element 2 in insulating 4. 7.

First, the conductor element 2 is removed from the mold 3 (substep (D1).

Subsequently, insulating material 7 in a formable state in the form of an insulating surface element 7 such. a prepreg mat on the underside (second side) 5b of the electrically conductive surface element 5 connected to the conductor element 2. In this case, the insulating material 7 is preferably connected to the lower side (second side) 4b of the insulating material surface element 4 already arranged on the underside (second side) 5b of the electrically conductive surface element 5. The insulating material 7 can also be applied as a flowable mass. The insulating material 7 is preferably applied in such a way that it completely surrounds the conductor element 2, with the exception of the positions of the provided connection points 1c (sub-step D2), and consequently embeds the conductor element 2 almost completely.

The optional application of pressure and possibly heat to the insulating material 4, 7 in the direction of the electrically conductive surface element 5 can cause the insulating material 4, 7, the conductor element 2 surrounds contour near (step D3). If an insulating surface element 4 is already present between the conductor element 2 and the electrically conductive surface element 5, can the application of pressure and possibly heat to the subsequently applied Isolierstoff- surface element 7, a connection between the two insulating surface elements 4, 7 improve.

This happens e.g. in a press. In this case, the insulating material 4, 7 on the side facing away from the electrically conductive surface element 5 side to form a flat bottom 1 b of the circuit board 1 smoothed (sub-step D4) and cured (sub-step D5).

Step E: Working out of the connection points 1d from the electrically conductive surface element 5.

After completion of step D, the surface of the circuit board 1 is completely covered with the electrically conductive surface element 5, wherein the conductor element 2 extends within the circuit board 1 and is embedded in insulating material 4, 7.

At the positions of the provided connection points 1 d, at which the conductor element 2 is connected to the electrically conductive surface element 5 via the connecting means sections 2c, the connection points 1c are then subsequently worked out by locally removing portions of the electrically conductive surface element 5 (substep E1). This is preferably accomplished by etching.

For example, for signal transmission and conductor tracks can be worked out by local removal of surrounding portions of the electrically conductive surface element 5. This too is preferably accomplished by etching (substep E2). A conductor 1e is preferably in electrically conductive connection with at least one connection point 1d.

FIG. 4 shows a printed circuit board 1 produced using the mold 3 shown in FIG. 1 in a perspective view (view a) and in a schematic sectional view (view b). The circuit board 1 has a substantially rectangular outline and a cuboid shape. The cuboid conductor element 2 extends between two arranged on the upper side 1 a of the circuit board 1 connection points 1 d, for example, by etching from a copper foil (5) are worked out, and with the exception of the positions of the connection points 1d completely in insulating material 1d (4, 7) embedded.

In the schematic sectional view of Figure 4 (b), the structural design of the circuit board 1 is clearly visible. The top 1 a of the circuit board 1 is formed by the first insulating surface element 4, which was applied in step B (sub-step B4) on top of the mold 3. The bottom 1 b of the circuit board 1 is formed by the second insulating surface element 7, which only after the connection between the Conductor element 2 and the electrically conductive surface element 5 has been applied via the connecting means sections 2c on the underside of the first insulating surface element 4 in order to embed the conductor element almost completely in insulating material 1c. The connection points 1d and conductor tracks 1e arranged on the upper side 1a of the printed circuit board 1 are made of the material of the electrically conductive surface element (5) which was arranged on the upper side of the first insulating surface element 4 in step C (part step C1).

Another embodiment will be described below in detail with reference to the accompanying Figure 6.

FIG. 6 likewise shows a printed circuit board 1 produced using the mold 3 shown in FIG. 1 in a perspective view (view a) and in a schematic sectional view (view b). The circuit board 1 has substantially the same configuration as the circuit board 1 of the first embodiment. Thus, identical features have the same reference numerals. The printed circuit board 1 of the second embodiment also has a rectangular outline and a cuboid shape. Also in the second embodiment, the cuboid conductor element 2 extends between two arranged on the upper side 1a of the circuit board 1 connection points 1 d.

In contrast to the first exemplary embodiment, in which the connection points 1 d effect a mechanical and electrical connection of the electrically conductive surface element 5 to the conductor element 2, the connection points 1 d in the second exemplary embodiment produce a substantially purely mechanical connection. In particular, during the embedding of the conductor element 2 in insulating material 4, 7 (step D) connected to the electrically conductive surface element 5, the connection points 1 d have the function of structurally bonding the electrically conductive surface element 5 to the conductor element 2. The electrically conductive surface element 5 is a very thin element and therefore can be easily deformed. By the connection of the electrically conductive surface element 5 to the conductor element 2 via the connection points 1d deformation and / or displacement of the electrically conductive surface element 5 during, for example, the pressing for attaching the insulating material 4, 7 (step D) can be reduced, preferably prevented. Thus, a high manufacturing precision can be achieved.

The connection between the electrically conductive surface element 5 and the conductor element 2 (step C) therefore does not necessarily have to be designed in an electrical manner. For example, the connecting-medium section 2c may also be formed from a non-electrically conductive connecting material. The connecting material is preferably weldable to achieve a material connection. In the case of a non-electrically conductive material, the connection can be made for example by pressure welding.

Also in the case of the second embodiment, the connection points 1d are worked out from the electrically conductive surface element 5 after the pressing in step D, that is to say after the action of the mechanical loads (step E). In this case, the connection points 1 d of conductor tracks 1 e are at least electrically insulated from the electrically conductive surface element 5 as shown in FIGS. 6 (a) and (b). Therefore, the connection points 1d in the finished printed circuit board 1 are no longer electrically connected to the conductor tracks 1e as in the first embodiment. It is also conceivable to completely etch away the connection points 1d, since they no longer have any electrical function, but merely serve for the mechanical support during the compression in step D. The electrical connection between the conductor tracks 1 e and the conductor elements 2 and possible external components takes place via introduced in an extra process step contacting points 1f, 1g. These contacting points 1f, 1g can be formed, for example, by plated-through hole, wherein a bore 1f, which generates on its inner circumference with an electrically conductive layer 1g, preferably of metal, preferably of copper, the contact between conductor element 2 and conductor tracks 1e, as in FIG Figs. 6 (a) and 6 (b) are shown. The bore 1f may, for example, be copper-plated along its inner surface up to a conductor track 1e on the one side and a conductor element 2 on the other side so as to ensure an electrical connection between the conductor track 1e and the conductor element 2. The contacting points 1f with 1g can be mounted in a step E0, in which the holes 1f are mounted in a state in which the complete electrically conductive surface element 5 is connected to the intended connection points 1d with conductor elements 2. Thus, the mechanical loads during the attachment of the contacting points 1f 1g can be taken over the intended connection points 1 d and a high manufacturing precision can be achieved. Only then are the connection points 1 d worked out, as described above. Preferably, the contacting points 1f are attached to 1g in the vicinity of the intended connection points 1d.

Furthermore, the conductor element 2 can comprise a hybrid or composite material which is electrically conductive in a section between contacting points 1 g and 1f and is electrically insulating in the section between a contacting point 1f with 1g and an intended connection point 1d. So dark currents can be prevented. For stable mechanical support preferably at least three connection points 1 d are provided on the printed circuit board 1, which preferably span a surface in which the centroid of the electrically conductive surface element 5 is located. This ensures that the electrically conductive surface element 5 is securely held in position.

Through the separation of functions, wherein the intended connection points 1 d ensure a pure mechanical connection during, for example, pressing, and the contacting points 1f with 1g ensure the electrical connection, it can be achieved that the contacting points 1f with 1g are not damaged by possible damage to the connection points 1d be affected.

The first embodiment and the second embodiment can be combined with each other. Thus, individual connection points 1d of a printed circuit board 1 can be etched away completely or electrically insulated and additionally contacting points 1f with 1g for electrical connection between conductor tracks 1e and conductor elements 2 and possibly external components are attached, and other connection points 1d of a printed circuit board 1 can, as in first embodiment, interconnects 1 e and conductor elements 2 electrically connect together.

LIST OF REFERENCE NUMBERS

1 circuit board

1 a top of the circuit board

1 b underside of the printed circuit board

1 c insulating material

1 d connection point

1 e line

1f hole of the contact point

1 g of electrically conductive layer of the contacting

2 conductor element

2a top of the conductor element

2b underside of the conductor element

2c connecting medium section

3 form

3a top of the mold

3b Bottom of the mold

3c recording

3d passage / opening

4 insulating material (electrically insulating surface element or insulating surface element)

4a top of the insulating surface element

4b underside of the insulating surface element

4c passage / opening

5 Electrically conductive surface element (conductor surface element or film)

5a top of the electrically conductive surface element

5b underside of the electrically conductive surface element

6a electrode (top) of the connection tool

6b Electrode (bottom) of the connection tool

7 insulating material (electrically insulating surface element or insulating surface element)

Claims

claims

1. A method for producing a printed circuit board (1) having at least one in the circuit board (1) between connection points (1 d) extending conductor element (2), comprising the steps: a. Step A: Providing a mold (3) with at least one receptacle (3c) for a conductor element (2). b. Step B: arranging a conductor element (2) in the receptacle (3c) of the mold (3). c. Step C: connecting the in the receptacle (3c) of the mold (3) arranged conductor element (2) with an electrically conductive surface element (5) at positions of the provided connection points (1 d). d. Step D: embedding the conductor element (2) connected to the electrically conductive surface element (5) in insulating material (4, 7). e. Step E: Working out of the connection points (1 d) from the electrically conductive surface element (5).

2. The method according to claim 1, characterized in that step A has at least one of the following substeps: a. Sub-step A1: providing a mold (3) with a preferably planar first side (3a) and at least one receptacle (3c) for a conductor element (2) which opens to the first side (3a) of the mold (3). b. Sub-step A2: Arranging the mold (3) so that the first side (3a) of the mold (3a) extends at least partially or completely in a horizontal plane.

3. The method according to any one of the preceding claims, characterized in that step B comprises at least one of the following substeps: a. Sub-step B1: Provision of a conductor element (2) with at least two connecting means sections (2c), which are preferably arranged and / or attached to the same side (2a) and / or at different ends of the conductor element (2). b. Sub-step B2: Arranging the conductor element (2) in the receptacle (3c), so that the conductor element (2) with respect to the extension plane of the mold (3) is preferably received positively and / or play in the receptacle (4), wherein preferably the conductor element (2) is aligned parallel to the plane of extent of the mold (3). c. Sub-step B3: arranging the conductor element (2) in the receptacle (3c) so that the side (2a) of the conductor element (2) provided with the connecting medium sections (2c) terminates flush with the first side (3a) of the mold (3) and the connecting means sections (2c) protrude beyond the first side (3a) of the mold (3). d. Sub-step B4: arranging insulating material (4), preferably an insulating surface element (4), which preferably has openings (4c) which are matched to the positions and possibly forms of the connecting medium sections (2c), on the first side (3a) of the mold (4). 3), preferably such that a second side (4b) of the insulating surface element (4) flat on the first side (3a) of the mold (3) and the first side (2a) in the receptacle (3c) of the mold (3c) 3) accommodated conductor element (2) rests, wherein particularly preferably the connecting means sections (2c) on the upper side flush with a first side (4a) of the insulating surface element (4).

4. The method according to any one of the preceding claims, characterized in that step C has at least one of the following substeps: a. Sub-step CO: connecting the in the receptacle (3c) of the mold (3) arranged conductor element (2) with the electrically conductive surface element (5) via at least one connecting means portion (2 c) of an electrically non-conductive, preferably weldable material, preferably by pressure welding , b. Sub-step C1: arranging an electrically conductive surface element (5) on the first side (3a) of the mold (3), preferably on the first side (4a) of the insulating surface element (4), preferably such that the electrically conductive surface element (5 ) rests flat on the first side (4a) of the insulating surface element (4) and / or flat on the connecting means sections (2c). c. Sub-step C2: arranging a first electrode (6a) of a

Connecting tool for producing an electrically conductive connection between the conductor element (2) and the electrically conductive surface element (5) on a first side (3a) of the mold (3), preferably such that the first electrode (6a) in contact with the first Side (5a) of the electrically conductive surface element (5) is located. d. Sub-step C3: arranging a second electrode (6b) of the

Connecting tool for producing an electrically conductive connection between the conductor element (2) and the electrically conductive surface element (5) on a second side (3b) of the mold (3), preferably such that the second electrode (6b) penetrates an opening ( 3d) in the mold (3) in contact with the second side (2b) of the conductor element (2). e. Sub-step C4: applying a contact pressure between the first electrode (6a) and the second electrode (6b). f. Sub-step C5: applying an electric current between the first electrode (6a) and the second electrode (6b). G. Sub-step C6: heating of the connecting medium section (2c) until the required working temperature has been reached so that the conductor element (2) and the electrically conductive surface element (5) pass over the connecting-medium section (2c), preferably under the action of a force between the electrodes (6a, 6b) , by melting and solidification of the material of the connecting medium portion (2c), by diffusion or in the solid phase are inextricably linked, preferably by welding. H. Partial step C7: removing the first electrode (6a) from the first side (5a) of the electrically conductive surface element (5). i. Sub-step C8: removing the second electrode (6b) from the second side (2b) of the conductor element (2) and removing the second electrode (6b) from the opening (3d) in the mold (3). j. Sub-step C9: attaching at least one reference mark to the electrically conductive surface element (5), preferably by manufacturing at least one opening.

5. The method according to any one of the preceding claims, characterized in that step D comprises at least one of the following substeps: a. Sub-step D1: Remove the conductor element (2) from the mold (3). b. Partial step D2: arranging insulating material (4, 7) on the second side (5b) of the electrically conductive surface element (5) connected to the conductor element (2), preferably on the second side (4b) of the second side (5b) of the electrically conductive surface element (5) arranged, Isolierstoff- surface element, preferably as a mass or in the form of a Isolierstoff- surface element (7), particularly preferably such that the insulating material (4, 7) the conductor element (2) with the exception of the positions of the provided connection points (1 c) completely surrounds. c. Sub-step D3: applying pressure and possibly heat to the insulating material (7) in the direction of the electrically conductive surface element (5), so that the insulating material (7) of the contour of the conductor element (2) adapts and possibly with an existing insulating material (7). 4) connects. d. Sub-step D4: smoothing of the insulating material (4, 7) on the side facing away from the electrically conductive surface element (5) side to form a flat bottom (1 b) of the printed circuit board (1). e. Sub-step D5: curing of the insulating material (4, 7).

6. The method according to any one of the preceding claims, characterized in that step E comprises at least one of the following substeps: a. Sub-step E0: Attachment of at least one contacting point (1f and 1g), which at least electrically connects the conductor element (2) with the electrically conductive surface element (5). b. Sub-step E1: Working out of the connection points (1 d) by local removal of surrounding portions of the electrically conductive surface element (5), preferably by etching. c. Sub-step E2: Working out of conductor paths (1 e) by local removal of surrounding portions of the electrically conductive surface element (5), preferably by etching.

7. Printed circuit board (1) produced by the method according to one of the preceding claims.

8. Form (3) for producing a printed circuit board (1), preferably a printed circuit board (1) according to claim 7, preferably by the method according to one of claims 1 to 6, comprising at least one receptacle (3c) for a conductor element (2) in a first side (3a) of the mold (3) and at least one opening (3d) communicating with the receptacle (3c) for introducing a connecting tool (6b) into a second side (3b) of the mold (3).

9. Kit for producing a printed circuit board (1), preferably a printed circuit board (1) according to claim 7, preferably by the method according to one of claims 1 to 6, comprising a mold according to claim 8, at least one in the receptacle (3c) can be arranged conductor element (2) and at least one connecting tool (6b) insertable into the opening (3d).