EP3766310A1 - Procédé de fabrication d'une carte de circuit imprimé à l'aide d'un moule pour éléments conducteurs - Google Patents

Procédé de fabrication d'une carte de circuit imprimé à l'aide d'un moule pour éléments conducteurs

Info

Publication number
EP3766310A1
EP3766310A1 EP19710657.8A EP19710657A EP3766310A1 EP 3766310 A1 EP3766310 A1 EP 3766310A1 EP 19710657 A EP19710657 A EP 19710657A EP 3766310 A1 EP3766310 A1 EP 3766310A1
Authority
EP
European Patent Office
Prior art keywords
mold
electrically conductive
conductor element
sub
surface element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19710657.8A
Other languages
German (de)
English (en)
Inventor
Markus WÖLFEL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jumatech GmbH
Original Assignee
Jumatech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102018203715.9A external-priority patent/DE102018203715A1/de
Application filed by Jumatech GmbH filed Critical Jumatech GmbH
Publication of EP3766310A1 publication Critical patent/EP3766310A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Definitions

  • the present invention relates to a method for producing a printed circuit board with at least one conductor element extending between connecting points in the printed circuit board.
  • a lead wire is welded to a copper foil and then pressed with insulating material.
  • the present invention has the object to increase the productivity of the known method.
  • the object is achieved by the method according to claim 1.
  • the method disclosed herein for producing a printed circuit board having at least one conductor element extending in the printed circuit board between connection points comprises the following steps:
  • Step A Providing a mold with at least one receptacle for a conductor element.
  • Step B Arrange a conductor element in the receptacle of the mold.
  • Step C connecting the conductor element arranged in the receptacle of the mold to an electrically conductive surface element at positions of the provided connection points.
  • Step D embedding the conductor element connected to the electrically conductive surface element in insulating material.
  • Step E Working out the connection points from the electrically conductive surface element.
  • the relative orientation of a plurality of conductor elements can be accurately determined because of the placement and orientation of the receptacles is precisely defined to each other in the form.
  • the individual conductor elements for connection to the electrically conductive surface element need not be measured individually, but are simply positioned in the respective receptacles provided. Then, only the electrically conductive surface element must be fixed relative to the mold, so that the positions of all line elements and connection points to the electrically conductive surface element are precisely defined. Since the connection of the conductor elements to the electrically conductive surface element is produced in a state in which the conductor elements are in the mold, relative movements of the conductor elements with one another are precluded. By eliminating the individual Verniersvor bland for making the connection of the conductor elements with the electrically conductive surface element, the productivity of the method for producing the printed circuit board with at least one extending between terminals conductor element can be significantly increased.
  • Sub-step A1 Providing a mold with a preferably flat first side and at least one opening for the first side of the mold receptacle for a conductor element.
  • Sub-step A2 Arranging the shape such that the first side of the shape extends at least partially or completely in a horizontal plane.
  • the horizontal alignment of the mold in sub-step A1 / A2 facilitates the positioning of the conductor element in the receptacle of the mold and the subsequent processing steps.
  • step B has at least one of the following substeps:
  • Sub-step B1 Provision of a conductor element having at least two connecting means sections, which are preferably arranged and / or attached to the same side and / or at different ends of the conductor element.
  • Sub-step B2 Arranging the conductor element in the receptacle, so that the conductor element with respect to the plane of extension of the mold is preferably received positively and / or play in the recording, wherein preferably the conductor element is aligned parallel to the plane of extension of the mold.
  • Sub-step B3 arranging the conductor element in the receptacle such that the side of the conductor element provided with the connecting-medium sections is flush with the first one Completes the side of the mold and the connecting means sections protrude beyond the first side of the mold.
  • Sub-step B1 facilitates the connection of the conductor element with the electrically conductive surface element.
  • the side of the conductor element to which the connecting means sections are attached is flat. This can be achieved, for example, in that the conductor element is a rectangular wire, which is cut to length, for example, by a coil of appropriate length. Due to the preceding winding on the spool, the rectangular wire may not extend exactly along a straight line. By applying a tensile force on both ends, the conductor element can be straightened. Other techniques for straightening the conductor element are possible.
  • the connecting means sections are, for example, platelets made of silver or another suitable connecting material, which can accomplish a permanent electrically conductive connection between the conductor element and the electrically conductive surface element.
  • the connecting-medium sections can also consist of an electrically non-conductive connecting material, which can effect a permanent, purely mechanical connection between the conductor element and the electrically conductive surface element.
  • the connection material can be welded.
  • the conductor element can be pulled into a corresponding length and brought into shape, which preferably fits exactly into a corresponding receptacle in the mold.
  • Sub-step B2 favors the fixation of the relative positions and alignment of the conductor elements to each other in the plane of extension of the mold, since the conductor elements can not move in their respective recordings.
  • Sub-step B3 allows the positioning of the conductor elements also in a direction perpendicular to the plane of extension of the mold.
  • Sub-step B4 proves to be helpful in completely embedding the conductor element in insulating material.
  • it proves to be a problem that after joining the conductor element with the electrically conductive surface element insulating material must be pressed into the gap. This gap is difficult to access after establishing the connection between the conductor element and the electrically conductive surface element.
  • substep B4 e.g. a prepreg mat with prefabricated openings at the positions of the connecting means are positioned so that it rests with its underside flat on the top of the mold and the top of the conduit member, while the connecting means are flush with the top of the prepreg mat in a plane.
  • each of the openings in the prepreg mat forms a shape which prevents unimpeded spreading of the material of the connecting medium portion received thereon in the subsequent welding operation.
  • An unwanted contact between the conductor element and electrically conductive surface element outside the positions of the intended connection points can thus be additionally prevented.
  • a prefabricated insulating surface element is used, so that an individual adaptation of the insulating surface element can be omitted and the productivity of the method can be further increased.
  • the openings may e.g. be punched using a mask.
  • step C has at least one of the following substeps:
  • Sub-step CO connecting the conductor element arranged in the receptacle of the mold to the electrically conductive surface element via at least one connecting medium section made of an electrically nonconductive, preferably weldable material, preferably by pressure welding.
  • Sub-step C1 arranging an electrically conductive surface element on the first side of the mold, preferably on the first side of the insulating surface element, preferably such that the electrically conductive surface element rests flat on the first side of the insulating surface element and / or surface on the connecting means sections ,
  • Sub-step C2 arranging a first electrode of a connection tool for producing an electrically conductive connection between the conductor element and the electrically conductive surface element on a first side of the mold, preferably such that the first electrode is in contact with the first side of the electrically conductive surface element.
  • Partial step C3 arranging a second electrode of the connection tool for producing an electrically conductive connection between the conductor element and the electrically conductive surface element on a second side of the mold, preferably such that the second electrode is in contact with the second one, penetrating one opening in the mold Side of the conductor element is located.
  • Sub-step C4 Applying a contact pressure between the first electrode and the second electrode.
  • Sub-step C5 applying an electric current between the first electrode and the second electrode.
  • Sub-step C6 heating of the connecting medium section until reaching the required working temperature, so that the conductor element and the electrically conductive surface element insoluble over the connecting means portion, preferably under the action of a force between the electrodes, by melting and solidification of the material of the connecting medium portion, by diffusion or in solid phase be connected, preferably by welding.
  • Sub-step C7 removing the first electrode from the first side of the electrically conductive surface element.
  • Partial step C8 removing the second electrode from the second side of the conductor element and removing the second electrode from the opening in the mold.
  • Sub-step C9 attaching at least one reference mark to the electrically conductive surface element, preferably by manufacturing at least one opening.
  • partial step CO a permanent, purely mechanical connection between the conductor element and the electrically conductive surface element can be accomplished.
  • Sub-step C1 favors the planar and regular layer structure of the printed circuit board.
  • a prefabricated blank of an electrically conductive surface element is used, so that an individual cutting of the electrically conductive surface element can be omitted and the productivity of the method can be further increased.
  • Sub-step C2 creates an abutment in the form of the first electrode for the subsequently applied by the second electrode contact pressure.
  • Sub-step C3 favors the exact positioning of the second electrode in relation to the respective connecting medium section, via which the conductor element is to be connected to the electrically conductive surface element.
  • Sub-steps C4 to C8 favor the production of a compound of the conductor element with the electrically conductive surface element by way of resistance welding.
  • step D has at least one of the following substeps:
  • Sub-step D1 Remove the conductor element from the mold.
  • Sub-step D2 Arranging insulating material on the connected to the conductor element second side of the electrically conductive surface element, preferably on the second side of the arranged on the second side of the electrically conductive surface element insulating surface element, preferably as a mass or in the form of a Isolierstoff- surface element, especially preferably such that the insulating material completely surrounds the conductor element with the exception of the positions of the intended connection points.
  • Sub-step D3 Applying pressure and possibly heat to the insulating material in the direction of the electrically conductive surface element, so that the insulating material adapts to the contour of the conductor element and optionally connects with an already existing insulating material.
  • Sub-step D4 smoothing of the insulating material on the side facing away from the electrically conductive surface element side to form a flat underside of the circuit board.
  • Sub-step D5 curing of the insulating material.
  • Sub-step D1 makes the conductor element accessible for the subsequent application of the insulating material. After establishing the connection between the conductor element and the electrically conductive surface element whose relative position and orientation is fixed, so that the shape is no longer necessary and can be removed.
  • Sub-step D2 embeds the guide element almost completely in insulating material.
  • a prefabricated insulating surface element is used, so that an individual orders of the Isolierstoffs can be omitted and the productivity of the process can be further increased.
  • the insulating surface element may have a corresponding receptacle for each conductor element.
  • Partial steps D3 and D4 are preferably carried out in a press under the action of pressure and temperature.
  • step E has at least one of the following substeps:
  • Sub-step E0 Attachment of at least one contacting point, which at least electrically connects the conductor element with the electrically conductive surface element.
  • Sub-step E1 Working out of the connection points by local removal of surrounding portions of the electrically conductive surface element, preferably by etching.
  • Sub-step E2 Working out of at least one line path by local removal of surrounding portions of the electrically conductive surface element, preferably by etching.
  • Sub-step E0 enables an additional electrical connection of the conductor elements to the electrically conductive surface element, from which conductor images are produced in sub-steps E1 and E2, and / or external components.
  • the connection points can be used as a pure mechanical connection.
  • Sub-steps E1 and E2 allow complex conductor patterns to be formed on the surface of the circuit board in addition to the conductor elements extending therebetween.
  • the connection points and / or pathways are worked out in dependence on a previously made reference mark.
  • Another aspect of the present invention relates to a printed circuit board produced by the method according to one of claims 1 to 6.
  • the above-mentioned advantages apply.
  • Yet another aspect of the present invention relates to a mold for producing a printed circuit board, preferably a printed circuit board according to claim 7, preferably by the method according to one of claims 1 to 6, comprising at least one receptacle for a conductor element in a first side of the mold and at least one receptacle communicating with the receptacle for insertion of a bonding tool in a second side of the mold.
  • Yet another aspect of the present invention relates to a kit for producing a printed circuit board, preferably a printed circuit board according to claim 7, preferably by the method according to one of claims 1 to 6, comprising a mold according to claim 8, at least one conductor element which can be arranged in the receptacle, and at least an insertable into the opening connection tool.
  • the kit includes matched components and tools for making the circuit board.
  • a mold in the sense of this invention is a tool that is used to make the circuit board.
  • the mold has for this purpose at least one receptacle for a conductor element.
  • the mold may have at least one of the following features:
  • the mold consists of a dielectric or electrically insulating material, for example a composite material consisting of epoxy resin and glass fiber fabric.
  • the mold is designed as a plate.
  • the shape extends essentially in one plane.
  • the mold comprises an upper surface, which is preferably flat.
  • the mold comprises a bottom which is preferably flat.
  • the top and bottom of the mold are parallel to each other.
  • the mold has a thickness of 1 to 5 mm, preferably 1, 5 to 3 mm, preferably 2 mm.
  • the shape has a polygonal, preferably rectangular or square outline.
  • the recording of the shape has an inner contour which is matched to the outer contour of the conductor element.
  • the recording of the shape has an outer contour which is matched to the inner contour of the conductor element.
  • the depth of the recording is matched to the height / thickness of the conductor element.
  • the mold has a separate receptacle for each conductor element.
  • the receptacle extends from a first side of the mold into the mold.
  • the receptacle is incorporated from a first side of the mold into the mold, preferably milled.
  • the first side of the mold forms the top of the mold.
  • the depth of the recording is in the range from 50 to 1000 .mu.m, preferably in the range from 100 to 500 .mu.m, preferably in the range from 300 to 400 .mu.m, particularly preferably at 350 .mu.m.
  • the mold has at least one opening formed as a passage and communicating with the receptacle for introducing a tool from the second side of the mold.
  • the passage extends substantially perpendicular to the plane of extent of the mold.
  • the passage extends from the second side of the mold into the respective receptacle.
  • Each receptacle is associated with at least one opening formed as a passage, preferably in each case two openings formed as a passage, which are preferably arranged at different ends of the receptacle.
  • a printed circuit board in the sense of this invention is a carrier for electronic components.
  • the circuit board is used e.g. mechanical fastening and electrical connection of electronic components.
  • Almost every electronic device contains one or more printed circuit boards.
  • a circuit board can also be referred to as a printed circuit board, circuit board or printed circuit board and corresponds to what is known in English as Printed Circuit Coard (PCB).
  • PCB Printed Circuit Coard
  • the printed circuit board preferably has at least one of the following features:
  • the printed circuit board comprises one or more layers, preferably several identical layers.
  • the printed circuit board is a printed circuit board according to EP 1 842 402 A2.
  • the printed circuit board is a printed circuit board according to DE 10 201 1 102 484 A1.
  • the printed circuit board is a printed circuit board according to DE 10 2013 223 143 A1.
  • the circuit board extends in a plane.
  • the circuit board has parallel tops and bottoms.
  • At the top of the circuit board are at least two connection points.
  • At the top of the circuit board is at least one line path.
  • At least one conductor element is embedded in the printed circuit board, with the conductor element, with the exception of the connection points, being embedded in insulating material.
  • a conductor element in the sense of this invention is an object for the transport of electrical energy and / or heat and / or for signal transmission in line-based communications technology and conducted radio-frequency technology.
  • the conductor element can be part of an electrical circuit or power network and thus connect power source and consumer.
  • electrons flow as a conductor current through the conductor element.
  • the conductive material should have a high electrical conductivity, to which some metals are particularly well suited.
  • the cross-sectional area of the conductor is preferably designed for the permissible current density.
  • the conductor element preferably has at least one of the following features:
  • the conductor element is a conductor wire, preferably a round wire with a round cross section or a rectangular wire with a rectangular cross section, wherein the conductor wire preferably has a constant over its length cross section.
  • the conductor element is preferably a conductor wire according to EP 1 842 402 A2.
  • the conductor element is a molded part, preferably a molded part according to DE 10 201 1 102 484 A1.
  • the molded part may, for example, have the following features: o
  • the molded part extends essentially in one plane.
  • the molding is made of metal, preferably copper.
  • the molded part comprises at least sections a concave contour and / or at least partially a convex contour.
  • the molding is at least partially, preferably completely, embedded in the circuit board.
  • the tops of the circuit board and the molding are aligned substantially parallel to each other.
  • the molded part is cut out of a plate-shaped workpiece, preferably by punching, eroding or shaving, preferably by water jet cutting.
  • the molded part has a thickness in the range from 10 to 2000 .mu.m, preferably in the range from 100 to 1000 .mu.m, preferably in the range from 200 to 500 .mu.m.
  • a length and / or width of the molded part is at least five times, preferably at least ten times, preferably at least twenty times, preferably at least fifty times or preferably at least one hundred times as large as the thickness of the molded part and / or the thickness of the printed circuit board.
  • the molded part comprises a substantially rectangular cross-section. The cross-sectional shape of the molding is not constant over the width and / or the length of the molding. The thickness of the molding is constant over its entire surface.
  • the molding includes a curvature in one, two, three or more planes of curvature.
  • the molding is at least partially out of the insulating material.
  • the molding is not produced or manufactured by extrusion.
  • the molded part comprises at least one recess, which is incorporated starting from an edge side of the molded part in the molded part.
  • the recess is at least partially filled with insulating material.
  • the molded part comprises at least one opening which extends from the upper side, the lower side or an edge side of the molded part in sections into the molded part, wherein the opening preferably at least in the region of its mouth a circular, oval, polygonal, preferably triangular, quadrangular, pentagonal, preferably rectangular or square outline, wherein the opening is preferably substantially groove-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably at least in sections runs parallel to an edge side of the molded part, wherein the opening is particularly preferably at least partially filled with insulating material.
  • the molding comprises at least one opening, which extends transversely, preferably perpendicular, to the top, the bottom or an edge side of the molding through the molding, wherein the opening preferably a circular, oval, polygonal, preferably triangular, square, pentagonal, rectangular or square outline, wherein the opening is preferably formed substantially slit-shaped and extends continuously or discontinuously along a straight or curved line, this line particularly preferably extends at least partially parallel to an edge side of the molding, the breakthrough particularly preferably at least in sections with insulating material is filled.
  • the molded part is essentially L-shaped, T-shaped, H-shaped, S-shaped, O-shaped, E-shaped, F-shaped, X-shaped, Y-shaped, Z-shaped, C-shaped, U-shaped or W-shaped. o Several moldings are arranged in the same plane or in different planes, preferably in mutually parallel planes within the printed circuit board.
  • the conductor element is a resistor, preferably a precision resistor, preferably a precision resistor according to DE 10 2013 223 143 A1.
  • the precision resistor may have the following characteristics: o
  • the precision resistor comprises a resistance value in the range of 0.1 to 300 m ⁇ , preferably in the range of 1 to 100 m.
  • the precision resistor comprises a variance of less than +/- 5%, preferably a variance of less than +/- 2%, preferably a variance of +/- 1% or less.
  • the temperature coefficient of electrical resistance of the precision resistor for the temperature range between 20 and 60 ° C is in the range of 0.1 ppm / K to 200 ppm / K, preferably in the range of 0.5 ppm / K to 100 ppm / K, preferably in the range of 1 ppm / K to 50 ppm / K.
  • the precision resistor is made of metal, preferably of at least one of the elements copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (AI), silicon (Si) or tin (Sn), preferably from an alloy containing at least one of copper (Cu), manganese (Mn), nickel (Ni), chromium (Cr), aluminum (AI), silicon (Si) or tin (Sn), for example manganin, zeranine or isohm.
  • the conductor element contacts the connection points.
  • the conductor element is electrically conductively and / or mechanically connected to at least one of the connection points, preferably all connection points.
  • the conductor element is welded to the connection points.
  • the conductor element is at least predominantly, preferably completely, embedded in the printed circuit board.
  • An upper side and / or a lower side and / or at least one of the edge sides of the conductor element extends at least in sections, preferably completely, flush with an upper side and / or a lower side and / or at least one of the edge sides of an adjacent layer of insulating material.
  • Edge sides of the circuit board and the conductor element are aligned parallel to each other.
  • Edge sides of the conductor element and of the electrically conductive surface element are aligned parallel to one another.
  • the conductor element can be produced or produced by the extrusion process.
  • the conductor element is designed as a flat wire.
  • the conductor element extends substantially in one plane.
  • the conductor element comprises a rectangular cross-section, wherein preferably the side of the cross-section with the greater extent to the surface of the circuit board has.
  • the conductor element has a thickness in the range from 10 to 2000 .mu.m, preferably in the range from 50 to 1000 .mu.m, preferably in the range from 100 to 500 .mu.m.
  • the conductor element comprises or consists of an electrically conductive material.
  • the conductor element comprises or consists of a composite or hybrid material, of which one section is designed to be electrically conductive and the other is designed to be electrically insulating.
  • the conductor element comprises or consists of metal, preferably copper.
  • the conductor element comprises at least one connecting means section, preferably of a material which is different from the conductor element, preferably brazing material, particularly preferably silver.
  • the connecting means portion is connected to the conductor element, preferably cohesively, for example by welding.
  • the connecting means portion is formed, for example, plate-shaped.
  • the conductor element comprises a bonding agent for improving the connection to the insulating material.
  • the conductor element comprises a roughened surface for improving the connection to the insulating material, preferably with the following features: o
  • the surface of the conductor element is at least partially roughened before the conductor element comes into contact with insulating material, preferably before step B and / or before step C.
  • the roughening of the surface of the conductor element is carried out by chemical etching, wherein the chemical etching is preferably carried out by immersing the conductor element in a liquid etching the material of the conductor element or by spraying the conductor element with such a liquid.
  • the surface of the conductor element is roughened by mechanical treatment, for example by sandblasting or by spraying pumice or quartz powder under high pressure.
  • An insulating material in the context of this invention is a non-conductive material, which therefore has only an extremely low and thus negligible electrical conductivity. Insulating materials are used in electrical engineering to limit the flow of electrical current to the live parts. Insulating material is preferably applied in the plastic or flowable state and cured after reaching the intended shape. Insulating material can be applied, for example, as a composition or as a prepreg mat.
  • the prepreg mat comprises a fabric layer which provides internal cohesion and already provides an existing basic structure, wherein the fabric layer is impregnated with flowable or plastic resin and thus allows an adaptation of the mold.
  • the electrically conductive surface element in the sense of the invention is a planar element such as e.g. a sheet of electrically conductive material.
  • the electrically conductive surface element preferably has at least one of the following features:
  • the electrically conductive surface element comprises or consists of an electrically conductive material.
  • the electrically conductive surface element comprises or consists of metal, preferably copper.
  • the electrically conductive surface element is formed as a film.
  • the electrically conductive surface element has a thickness in the range from 10 to 1000 ⁇ m, preferably in the range from 15 to 200 ⁇ m, preferably in the range from 18 to 105 ⁇ m, particularly preferably at 35 ⁇ m.
  • Fig. 1 in view (a) is a perspective view of a mold with a plurality of receptacles for the arrangement of conductor elements and in view (b) is a schematic sectional view, in each case a receptacle in longitudinal section and a receptacle in cross section through a respective through hole is shown.
  • Fig. 2 is a perspective view of a conductor element with end applied on an upper side connecting means sections, wherein the conductor element is designed as a conductor wire with a rectangular cross-sectional area.
  • Fig. 3a shows the schematic sectional view of the form shown in Figure 1 b.
  • FIG. 3b shows an arrangement comprising the form shown in Figure 1 b and 3a and two conductor elements shown in Figure 2 in a schematic sectional view, wherein the conductor elements are arranged in the longitudinal section or in cross section shots of the mold such that the tops of the conductor elements flush with the top of the mold and projecting from the tops of the conductor elements projecting connecting portions over the top of the mold.
  • FIG. 3c shows the arrangement according to FIG. 3b, wherein additionally on the upper side of the mold, over which the connecting means sections protrude, an insulating surface element in the form of a prepreg mat is arranged, which has a plurality of openings matched to the positions and shapes of the connecting means sections the upper sides of the connecting means sections are arranged flush with the upper side of the insulating surface element in a plane.
  • FIG. 4 in view (a) is a perspective view and in view (b) is a schematic sectional view of a printed circuit board produced by the method according to the invention.
  • FIG. 5 shows a flow chart of the method according to the invention for producing a printed circuit board.
  • Fig. 6 in view (a) is a perspective view and in view (b) is a schematic sectional view of a prepared according to the inventive circuit board of another embodiment.
  • a mold 3 for producing a printed circuit board 1 is shown in a perspective view in view (a) of FIG. 1.
  • the mold comprises a total of six receptacles 3 c for a total of six conductor elements 2 formed as rectangular wires.
  • Each of the receptacles 3 c comprises a substantially parallelepiped-shaped cavity, which opens toward a first side 3 a of the mold 3 designated as the upper side.
  • a second side 3b of the mold referred to as the underside, in each case two openings 3d formed as passages extend into each of the receptacles 3c.
  • the first and second sides 3a, 3b of the mold 3 are spaced apart and extend in parallel planes.
  • the mold 3 can have different receptacles 3 c for differently shaped conductor elements 2. These different receptacles 3 c can be located on different sides 3 a, 3 b of the mold 3.
  • the mold 3 is made, for example, of an electrically insulating material, for example FR4 (composite panel consisting of epoxy resin and glass fiber fabric).
  • the receptacles 3c are milled, for example, starting from the first side 3a of the mold 3.
  • the passages 3d formed as passages are preferably made after the formation of the receptacles 3c, for example drilled.
  • a mold 3 for producing a printed circuit board 1 for the description of the method according to the invention is shown schematically and simplified in a sectional view.
  • This form 3 has only two receptacles 3 c, which extend along different and mutually perpendicular edges of the mold 3. It can be seen how the receptacles 3c open to the first side 3a of the mold and the passages formed as passages 3d starting from the second side 3b of the mold 3 in the respective Take 3c lead.
  • the openings 3d may extend in a funnel shape towards the second side 3b of the mold 3 to facilitate insertion of tools 6b.
  • FIG. 2 shows a perspective view of a conductor element 2, which is designed as a parallelepiped conductor wire 2 with a rectangular cross-sectional area and fits into each of the receptacles 3c of the shape shown in FIG.
  • the two largest faces of the parallelepipedic conductor element 2 form the top side 2a and the bottom side 2b of the conductor element 2.
  • Rectangular connection means sections 2c are applied to opposite ends of the conductor element 2 on its top side 2a, e.g. welded.
  • the conductor element 2 In a state accommodated in the receptacle 3c, the upper side 2a of the conductor element 2 extends in a plane with the upper side 3a of the mold 3 and terminates flush therewith, the connecting medium sections 2c projecting over the upper side 3a of the mold 3. Notwithstanding the illustration in Figure 2, the conductor element 2 may have a different shape. In particular, the conductor element 2 may also be, for example, a molded part, a round wire or a precision resistor. The receptacle 3c of the mold 3 is then to be adapted accordingly in the rule.
  • the inventive method for producing a printed circuit board 1 with at least one conductor element 2 extending in the printed circuit board 1 between connection points 1 d comprises the following steps:
  • Step A Providing a mold 3 with at least one receptacle 3c for a conductor element 2.
  • Sub-step A1 includes providing the mold 3 shown in FIG. 1 (b).
  • the mold 3 is arranged so that the top (first side) 3a of the mold 3 extends in a horizontal plane (substep A2).
  • Step B Arranging a conductor element 2 in the receptacle 3 c of the mold 3.
  • Sub-step B1 includes the provision of conductor elements 2.
  • each conductor element 2 is formed as a rectangular conductor wire 2 with end and top side applied connecting means sections 2c, as shown in Figure 2.
  • each conductor element 2 is arranged in the receptacle 3c in such a way that the conductor element 2 is aligned parallel to the plane of extent of the mold 3 and is accommodated in the receptacle 3c almost positively with respect to the plane of extent of the mold 3 (sub-step B2). Subsequently, each conductor element 2 is inserted into the corresponding receptacle 3c such that the side 2a of the conductor element 2 provided with the connecting medium sections 2c is substantially flush with the top side (first side) 3a of the mold 3 and only the connecting medium sections 2c are closed over the top side (first Side) 3a of the mold 3 (substep B3).
  • an insulating sheet 4 having openings 4c matched to the positions and possibly shapes of the connecting portions 2c, for example in the form of an apertured prepreg mat, may be formed on the first side 3a of the mold 3 to be ordered. This makes it possible to completely surround each conductor element with the exception of the connecting means 2c with insulating material and thus completely decouple electrically from the environment.
  • the insulating surface element 4 lies with its underside (second side) 4b preferably flat on the upper side (first side) 3a of the mold 3 and the upper side (first side) 2a of the accommodated in the receptacle 3c of the mold 3 conductor element 2, wherein the Connecting means sections 2c upper side flush with a top (first side) 4a of the insulating surface element 4 complete (sub-step B4).
  • Step C connecting the conductor element 2 arranged in the receptacle 3c of the mold 3 to an electrically conductive surface element 5 at positions of the provided connection points Id.
  • an electrically conductive sheet 5 e.g. in the form of a copper foil on the upper side (first side) 3a of the mold 3, so that it covers the upper side (first side) 4a of the insulating surface element 4 and the connecting sections 2c flush therewith completely (substep C1).
  • an electrically conductive sheet 5 e.g. in the form of a copper foil on the upper side (first side) 3a of the mold 3, so that it covers the upper side (first side) 4a of the insulating surface element 4 and the connecting sections 2c flush therewith completely (substep C1).
  • connection points 1 d electrically conductive connections between the conductor element 2 and the electrically conductive surface element 5 are produced via the connecting means sections 2 c at the positions of the provided connection points 1 d. This is done for example by welding, in particular by resistance welding, ultrasonic welding, or by brazing or the like.
  • a first electrode 6 a of a resistance welding tool is disposed on the top side (first side) 3 a of the mold 3 so that the first electrode 6 a is in contact with the top surface (first side) 5 a of the electrically conductive surface element 5.
  • the position of the first electrode 6a is In this case, the position of an intended connection point 1d or the position of a connection means section 2c is coordinated (substep C2).
  • a second electrode 6b of the bonding tool is disposed on the lower side (second side) 3b of the mold 3 such that the second electrode 6b penetrates an opening 3d in the lower side (second side) 3b of the mold 3 in contact with the second side 2b of the conductor element 2 is (sub-step C3).
  • each connecting-medium section 2c is heated until the required working temperature has been reached, so that the conductor element 2 and the electrically conductive surface element 5 are joined by welding via the connecting-medium section 2c by force and by melting / solidifying the material of the connecting-medium section 2c, by diffusion or in solid phase (sub-step C6).
  • the electrodes 6a, 6b are removed (substeps C7 and C8).
  • Step D embedding the connected to the electrically conductive surface element 5 conductor element 2 in insulating 4. 7.
  • the conductor element 2 is removed from the mold 3 (substep (D1).
  • insulating material 7 in a formable state in the form of an insulating surface element 7 such. a prepreg mat on the underside (second side) 5b of the electrically conductive surface element 5 connected to the conductor element 2.
  • the insulating material 7 is preferably connected to the lower side (second side) 4b of the insulating material surface element 4 already arranged on the underside (second side) 5b of the electrically conductive surface element 5.
  • the insulating material 7 can also be applied as a flowable mass.
  • the insulating material 7 is preferably applied in such a way that it completely surrounds the conductor element 2, with the exception of the positions of the provided connection points 1c (sub-step D2), and consequently embeds the conductor element 2 almost completely.
  • step D3 The optional application of pressure and possibly heat to the insulating material 4, 7 in the direction of the electrically conductive surface element 5 can cause the insulating material 4, 7, the conductor element 2 surrounds contour near (step D3). If an insulating surface element 4 is already present between the conductor element 2 and the electrically conductive surface element 5, can the application of pressure and possibly heat to the subsequently applied Isolierstoff- surface element 7, a connection between the two insulating surface elements 4, 7 improve.
  • Step E Working out of the connection points 1d from the electrically conductive surface element 5.
  • step D the surface of the circuit board 1 is completely covered with the electrically conductive surface element 5, wherein the conductor element 2 extends within the circuit board 1 and is embedded in insulating material 4, 7.
  • connection points 1 d At the positions of the provided connection points 1 d, at which the conductor element 2 is connected to the electrically conductive surface element 5 via the connecting means sections 2c, the connection points 1c are then subsequently worked out by locally removing portions of the electrically conductive surface element 5 (substep E1). This is preferably accomplished by etching.
  • a conductor 1e is preferably in electrically conductive connection with at least one connection point 1d.
  • FIG. 4 shows a printed circuit board 1 produced using the mold 3 shown in FIG. 1 in a perspective view (view a) and in a schematic sectional view (view b).
  • the circuit board 1 has a substantially rectangular outline and a cuboid shape.
  • the cuboid conductor element 2 extends between two arranged on the upper side 1 a of the circuit board 1 connection points 1 d, for example, by etching from a copper foil (5) are worked out, and with the exception of the positions of the connection points 1d completely in insulating material 1d (4, 7) embedded.
  • the structural design of the circuit board 1 is clearly visible.
  • the top 1 a of the circuit board 1 is formed by the first insulating surface element 4, which was applied in step B (sub-step B4) on top of the mold 3.
  • the bottom 1 b of the circuit board 1 is formed by the second insulating surface element 7, which only after the connection between the Conductor element 2 and the electrically conductive surface element 5 has been applied via the connecting means sections 2c on the underside of the first insulating surface element 4 in order to embed the conductor element almost completely in insulating material 1c.
  • connection points 1d and conductor tracks 1e arranged on the upper side 1a of the printed circuit board 1 are made of the material of the electrically conductive surface element (5) which was arranged on the upper side of the first insulating surface element 4 in step C (part step C1).
  • FIG. 6 likewise shows a printed circuit board 1 produced using the mold 3 shown in FIG. 1 in a perspective view (view a) and in a schematic sectional view (view b).
  • the circuit board 1 has substantially the same configuration as the circuit board 1 of the first embodiment. Thus, identical features have the same reference numerals.
  • the printed circuit board 1 of the second embodiment also has a rectangular outline and a cuboid shape. Also in the second embodiment, the cuboid conductor element 2 extends between two arranged on the upper side 1a of the circuit board 1 connection points 1 d.
  • connection points 1 d effect a mechanical and electrical connection of the electrically conductive surface element 5 to the conductor element 2
  • the connection points 1 d in the second exemplary embodiment produce a substantially purely mechanical connection.
  • the connection points 1 d have the function of structurally bonding the electrically conductive surface element 5 to the conductor element 2.
  • the electrically conductive surface element 5 is a very thin element and therefore can be easily deformed.
  • connection of the electrically conductive surface element 5 to the conductor element 2 via the connection points 1d deformation and / or displacement of the electrically conductive surface element 5 during, for example, the pressing for attaching the insulating material 4, 7 (step D) can be reduced, preferably prevented.
  • a high manufacturing precision can be achieved.
  • connection between the electrically conductive surface element 5 and the conductor element 2 does not necessarily have to be designed in an electrical manner.
  • the connecting-medium section 2c may also be formed from a non-electrically conductive connecting material.
  • the connecting material is preferably weldable to achieve a material connection.
  • the connection can be made for example by pressure welding.
  • connection points 1d are worked out from the electrically conductive surface element 5 after the pressing in step D, that is to say after the action of the mechanical loads (step E).
  • the connection points 1 d of conductor tracks 1 e are at least electrically insulated from the electrically conductive surface element 5 as shown in FIGS. 6 (a) and (b). Therefore, the connection points 1d in the finished printed circuit board 1 are no longer electrically connected to the conductor tracks 1e as in the first embodiment. It is also conceivable to completely etch away the connection points 1d, since they no longer have any electrical function, but merely serve for the mechanical support during the compression in step D.
  • contacting points 1f, 1g can be formed, for example, by plated-through hole, wherein a bore 1f, which generates on its inner circumference with an electrically conductive layer 1g, preferably of metal, preferably of copper, the contact between conductor element 2 and conductor tracks 1e, as in FIG Figs. 6 (a) and 6 (b) are shown.
  • the bore 1f may, for example, be copper-plated along its inner surface up to a conductor track 1e on the one side and a conductor element 2 on the other side so as to ensure an electrical connection between the conductor track 1e and the conductor element 2.
  • the contacting points 1f with 1g can be mounted in a step E0, in which the holes 1f are mounted in a state in which the complete electrically conductive surface element 5 is connected to the intended connection points 1d with conductor elements 2.
  • the mechanical loads during the attachment of the contacting points 1f 1g can be taken over the intended connection points 1 d and a high manufacturing precision can be achieved. Only then are the connection points 1 d worked out, as described above.
  • the contacting points 1f are attached to 1g in the vicinity of the intended connection points 1d.
  • the conductor element 2 can comprise a hybrid or composite material which is electrically conductive in a section between contacting points 1 g and 1f and is electrically insulating in the section between a contacting point 1f with 1g and an intended connection point 1d. So dark currents can be prevented.
  • connection points 1 d are provided on the printed circuit board 1, which preferably span a surface in which the centroid of the electrically conductive surface element 5 is located. This ensures that the electrically conductive surface element 5 is securely held in position.
  • connection points 1 d ensure a pure mechanical connection during, for example, pressing, and the contacting points 1f with 1g ensure the electrical connection, it can be achieved that the contacting points 1f with 1g are not damaged by possible damage to the connection points 1d be affected.
  • connection points 1d of a printed circuit board 1 can be etched away completely or electrically insulated and additionally contacting points 1f with 1g for electrical connection between conductor tracks 1e and conductor elements 2 and possibly external components are attached, and other connection points 1d of a printed circuit board 1 can, as in first embodiment, interconnects 1 e and conductor elements 2 electrically connect together.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une carte de circuit imprimé ayant au moins un élément conducteur s'étendant dans la carte de circuit imprimé entre des points de branchement. Pour augmenter la productivité du procédé connu de fabrication d'une carte de circuit imprimé ayant au moins un élément conducteur s'étendant dans la carte de circuit imprimé entre des points de branchement, le procédé selon la revendication 1 comprend les étapes suivantes consistant à : - étape A : préparer un moule (3) ayant au moins un logement (3c) pour un élément conducteur (2) ; - étape B : disposer un élément conducteur (2) dans le logement (3c) du moule (3) ; - étape C : relier l'élément conducteur (2) disposé dans le logement (3c) du moule (3) à un élément de surface électroconducteur (5) à des positions des points de branchement prévus ; - étape D : insérer l'élément conducteur (2) relié à l'élément de surface électroconducteur (5) dans une substance isolante (4) ; - étape E : dégager les points de branchement de l'élément de surface électroconducteur (5).
EP19710657.8A 2018-03-12 2019-03-11 Procédé de fabrication d'une carte de circuit imprimé à l'aide d'un moule pour éléments conducteurs Pending EP3766310A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018203715.9A DE102018203715A1 (de) 2018-03-12 2018-03-12 Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer Form für Leiterelemente
DE202018106030 2018-10-22
PCT/EP2019/055991 WO2019175090A1 (fr) 2018-03-12 2019-03-11 Procédé de fabrication d'une carte de circuit imprimé à l'aide d'un moule pour éléments conducteurs

Publications (1)

Publication Number Publication Date
EP3766310A1 true EP3766310A1 (fr) 2021-01-20

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Country Link
US (1) US11395411B2 (fr)
EP (1) EP3766310A1 (fr)
JP (1) JP7244531B2 (fr)
KR (1) KR102413296B1 (fr)
CN (1) CN111869334B (fr)
WO (1) WO2019175090A1 (fr)

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JPS5034224B1 (fr) * 1970-03-07 1975-11-06
KR960000640B1 (ko) 1993-07-07 1996-01-10 신현택 경량기포콘크리트(alc) 부산물을 이용한 가축분비료의 고속 제조방법
KR950008884Y1 (ko) * 1993-07-31 1995-10-16 오리온전기 주식회사 점용접 장치
JPH0786717A (ja) * 1993-09-17 1995-03-31 Fujitsu Ltd プリント配線板構造体
US6323549B1 (en) * 1996-08-29 2001-11-27 L. Pierre deRochemont Ceramic composite wiring structures for semiconductor devices and method of manufacture
DE60205655D1 (de) * 2001-11-23 2005-09-22 Nagraid Sa Herstellungsverfahren für ein modul mit mindestens einem elektronischen element
WO2004001848A1 (fr) * 2002-06-19 2003-12-31 Sten Bjorsell Fabrication de circuits electroniques
WO2004014114A1 (fr) * 2002-07-31 2004-02-12 Sony Corporation Procede de realisation de carte a dispositif integre, carte a dispositif integre, procede de realisation de carte imprimee, carte imprimee
JP2004119863A (ja) * 2002-09-27 2004-04-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
DE202005001161U1 (de) 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Drahtgeschriebene Leiterplatte oder Platine mit Leiterdrähten mit rechteckigem oder quadratischem Querschnitt
JP2007278810A (ja) * 2006-04-05 2007-10-25 Jsr Corp 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置
JP5383621B2 (ja) * 2010-10-20 2014-01-08 三菱電機株式会社 パワー半導体装置
DE102011102484B4 (de) 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung
JP5821825B2 (ja) * 2012-11-16 2015-11-24 日立金属株式会社 ケーブルアッセンブリおよびその製造方法
US20140158414A1 (en) * 2012-12-11 2014-06-12 Chris Baldwin Recessed discrete component mounting on organic substrate
DE102013223143A1 (de) 2013-11-13 2015-05-28 Jumatech Gmbh Leiterplatte mit wenigstens einem eingebetteten Präzisionswiderstand
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JP6626697B2 (ja) * 2015-11-24 2019-12-25 京セラ株式会社 配線基板およびその製造方法
US10453587B2 (en) * 2015-12-22 2019-10-22 Panasonic Intellectual Property Management Co., Ltd. Conductor assembly, electronic component using same, and manufacturing method thereof

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Publication number Publication date
JP2021515990A (ja) 2021-06-24
WO2019175090A1 (fr) 2019-09-19
JP7244531B2 (ja) 2023-03-22
KR102413296B1 (ko) 2022-06-27
CN111869334B (zh) 2024-04-30
US11395411B2 (en) 2022-07-19
CN111869334A (zh) 2020-10-30
KR20200128432A (ko) 2020-11-12
US20210029831A1 (en) 2021-01-28

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