JPH0767033B2 - 自動装着装置 - Google Patents

自動装着装置

Info

Publication number
JPH0767033B2
JPH0767033B2 JP62006553A JP655387A JPH0767033B2 JP H0767033 B2 JPH0767033 B2 JP H0767033B2 JP 62006553 A JP62006553 A JP 62006553A JP 655387 A JP655387 A JP 655387A JP H0767033 B2 JPH0767033 B2 JP H0767033B2
Authority
JP
Japan
Prior art keywords
positioning
suction nozzle
electronic component
suction
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62006553A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63174400A (ja
Inventor
一弘 日根野
修二 主山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP62006553A priority Critical patent/JPH0767033B2/ja
Priority to KR1019870015618A priority patent/KR900008670B1/ko
Priority to US07/144,060 priority patent/US4905370A/en
Priority to EP88100458A priority patent/EP0275103A3/de
Publication of JPS63174400A publication Critical patent/JPS63174400A/ja
Publication of JPH0767033B2 publication Critical patent/JPH0767033B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
JP62006553A 1987-01-04 1987-01-14 自動装着装置 Expired - Lifetime JPH0767033B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP62006553A JPH0767033B2 (ja) 1987-01-14 1987-01-14 自動装着装置
KR1019870015618A KR900008670B1 (ko) 1987-01-04 1987-12-31 자동장착장치
US07/144,060 US4905370A (en) 1987-01-14 1988-01-12 Electronic parts automatic mounting apparatus
EP88100458A EP0275103A3 (de) 1987-01-14 1988-01-14 Vorrichtung zur automatischen Montage von Bauteilen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62006553A JPH0767033B2 (ja) 1987-01-14 1987-01-14 自動装着装置

Publications (2)

Publication Number Publication Date
JPS63174400A JPS63174400A (ja) 1988-07-18
JPH0767033B2 true JPH0767033B2 (ja) 1995-07-19

Family

ID=11641523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62006553A Expired - Lifetime JPH0767033B2 (ja) 1987-01-04 1987-01-14 自動装着装置

Country Status (4)

Country Link
US (1) US4905370A (de)
EP (1) EP0275103A3 (de)
JP (1) JPH0767033B2 (de)
KR (1) KR900008670B1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828597B2 (ja) * 1989-04-21 1996-03-21 三菱電機株式会社 電子部品実装装置
JP2740348B2 (ja) * 1989-10-17 1998-04-15 三洋電機株式会社 テープ送出装置のカバーテープ剥離装置
DE3935930A1 (de) * 1989-10-27 1991-05-02 Adalbert Fritsch Bestueckungsgeraet
US5155903A (en) * 1990-04-18 1992-10-20 Matsushita Electric Industrial Co., Ltd. Electrical component placing apparatus and placing method therefor
US5208975A (en) * 1990-07-06 1993-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
US5278634A (en) 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
US5217273A (en) * 1992-05-14 1993-06-08 H-Square Corporation Serial pumping for portable handling tool of electronic workpieces
EP0578136B1 (de) * 1992-07-01 1995-11-22 Yamaha Hatsudoki Kabushiki Kaisha Verfahren zum Montieren von Komponenten und Vorrichtung dafür
JP3368923B2 (ja) * 1992-12-28 2003-01-20 松下電器産業株式会社 電子部品実装装置
EP0652699B1 (de) * 1993-10-29 1997-07-02 Sanyo Electric Co., Ltd. Vorrichtung und Verfahren zur automatischen Bestückung elektronischer Teile
JP3313224B2 (ja) * 1994-01-25 2002-08-12 松下電器産業株式会社 電子部品実装装置
JP3282938B2 (ja) * 1995-01-17 2002-05-20 松下電器産業株式会社 部品装着装置
JP3554615B2 (ja) * 1995-07-19 2004-08-18 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP3549073B2 (ja) * 1995-09-11 2004-08-04 松下電器産業株式会社 電子部品実装方法および電子部品実装装置
JP3402988B2 (ja) * 1997-01-31 2003-05-06 三洋電機株式会社 電子部品装着装置の上下動カム機構
JP3768038B2 (ja) * 1999-08-06 2006-04-19 株式会社日立ハイテクインスツルメンツ 電子部品装着装置及び電子部品装着装置の装着ヘッド
KR100311747B1 (ko) * 1999-08-20 2001-10-18 정문술 표면실장기의 인쇄회로기판 이송장치
JP4037593B2 (ja) * 1999-12-07 2008-01-23 松下電器産業株式会社 部品実装方法及びその装置
JP4397509B2 (ja) * 2000-05-01 2010-01-13 富士機械製造株式会社 電気部品保持ヘッド
WO2005011351A1 (en) * 2003-07-30 2005-02-03 Assembleon N.V. Component placement device, nozzle exchange device as well as method for the exchange of nozzles
CN101317502B (zh) * 2005-11-29 2011-02-16 松下电器产业株式会社 针对电路基板的操作装置和操作方法
US7746481B2 (en) 2007-03-20 2010-06-29 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
WO2008153885A1 (en) * 2007-06-05 2008-12-18 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
US20130269184A1 (en) * 2012-04-12 2013-10-17 Universal Instruments Corporation Pick and place nozzle
JP7279567B2 (ja) * 2019-07-30 2023-05-23 株式会社デンソーウェーブ ロボット用吸着ハンド

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503606A (en) * 1980-12-26 1985-03-12 Citizen Watch Company Limited Automatic assembling machine
JPS58105199U (ja) * 1982-01-12 1983-07-18 興亜電工株式会社 電子部品の吸着装置
JP2537770B2 (ja) * 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
US4747198A (en) * 1985-01-21 1988-05-31 Fuji Machine Mfg. Co., Ltd. Method and apparatus for detecting hold-position of electronic component, and apparatus for mounting electronic component
JPS62114289A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
US4727647A (en) * 1986-08-18 1988-03-01 Universal Instruments Corporation VCD tooling for DIP components of different widths

Also Published As

Publication number Publication date
JPS63174400A (ja) 1988-07-18
KR900008670B1 (ko) 1990-11-26
US4905370A (en) 1990-03-06
EP0275103A2 (de) 1988-07-20
EP0275103A3 (de) 1989-05-03
KR880009545A (ko) 1988-09-15

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