JPH076692A - Electrode connecting method and spacer transfer sheet used in this method and manufacture of this spacer transfer sheet - Google Patents

Abstract

PURPOSE:To stably attain mass production in products of high quality by arranging many granular spacers of prescribed grain size in a plane manner by a prescribed pattern between electrodes connected to each other, and connecting the electrode and the spacer by a low melting point connecting agent. CONSTITUTION:Many granular spacers 2 having a prescribed grain size are arranged by a prescribed pattern in a plane manner between electrodes 1A, 1B connected to each other, to connect these electrodes and spacers by a low melting point connecting agent 3. The electrodes 1A, 1B are formed of good electric conductor, preferable to provide rigidity of a degree capable of holding a plate or foil shape in at least one of the electrodes. The shape of these electrodes, when formed in the plate or a foil shape of the electrode connected by providing a prescribed insulation gap, is not particularly limited. The spacer 2 is necessary for having insulation and rigidity of a degree not deformed at a temperature in use of the electrodes 1A, 1B as a mechanical characteristic, preferable to provide a small thermal expansion factor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode joining method for joining electrodes at predetermined intervals, a spacer transfer sheet used for the method, and a method for manufacturing the spacer transfer sheet.

[0002]

2. Description of the Related Art In recent years, display devices have tended to be made thinner, and in this trend, display devices called flat CRTs or color flat panels (hereinafter referred to as CFPs) have been proposed.

For example, as shown in FIG. 29, the CFP includes a large number of linear filament cathodes 103, grid electrodes 104, vertical deflection electrodes 105 between a face plate 101 made of an insulator such as glass and a back panel 102. The structure is such that the signal modulation electrode 106 and the horizontal deflection electrode 107 are arranged, and the phosphor stripe 108 is formed on the inner surface of the face plate 101.

In this CFP, the electrons emitted from the filament cathode 103 are directed by the grid electrode 104, and the vertical deflection electrode 105 controls the deflection angle of the electrons passing through the grid electrode 104 in the vertical direction, and the signal modulation electrode. The current is controlled by 106 to modulate the amount of electrons toward the face plate 101, and further, the horizontal deflection electrode 107 controls the vertical deflection angle to cause electrons to collide with the phosphor stripe 108 to excite the phosphor stripe 108. Then, the image is displayed by emitting light.

As described above, the CFP has a structure in which a large number of cathode ray tubes are gathered, so that it has a large number of pixels and can display a high-definition image. It is possible to obtain a high-quality image with little image distortion. Also, the width of the scanning line is very narrow,
Filament cathode 103 to phosphor stripe 10
The distance up to 8 can be shortened, which is very advantageous in terms of thinning.

By the way, in this CFP, it is necessary to provide a predetermined gap between a large number of electrodes and to insulate each electrode from each other. However, when the screen becomes large, the electrodes vibrate due to vibration, and the gap Fluctuates, and an error may occur in the direction control of the electron to cause distortion in the image, or an error may occur in the brightness control and the brightness may change.
In some cases, the electrodes may come into contact with each other.

Conventionally, in order to solve such a problem,
For example, as shown in FIG. 30, a rod-shaped glass rod having an insulating property is arranged as a spacer 202 on an electrode 201, and a rod-shaped low melting point bonding material 203 made of low melting point crystalline glass is provided on both sides of this spacer 202. The low melting point bonding material 203 is arranged and the electrode 204 is placed on it and then baked, without causing the spacer 202 to be permanently deformed by softening.
Is melted and then cooled to solidify the bonding material 203 to bond the electrodes to each other as shown in FIG. 31, for example.

[0008]

However, the spacer 202 made of the glass rod and the low melting point bonding material 203 are
For example, it is necessary to manufacture with an accuracy of about 400 ± 15 μm, which is expensive, and there are large variations in thickness, bending, twisting, etc., and the quality is unstable. Moreover, the spacer 202 and the low melting point bonding material 203 are easily broken, and the yield is reduced.

Further, since the quality is unstable, it is difficult to dispose the spacer 202 and the low melting point bonding material 203 on the electrode 201 with high precision, and the spacer 202 and the spacer 202 and Arranging the low melting point bonding material 203 on the electrode 201 requires a considerably long process time, which is disadvantageous in mass production and cost reduction.

Further, as described above, since there are many variations in thickness, bending, twisting, etc., it is difficult to obtain the gap accuracy, and the characteristics of the product may become unstable.

The present invention has been completed in view of the above technical problems, and a large number of granular spacers having a predetermined particle size are planarly arranged in a predetermined pattern between electrodes to be bonded to each other. It is an object of the present invention to provide an electrode joining method by which these electrodes and spacers are joined with a melting point joining material, which enables stable mass production of high-quality products at low cost, a spacer transfer sheet used therefor, and a manufacturing method of the spacer transfer sheet. To aim.

[0012]

In order to achieve the above-mentioned object, an electrode joining method according to the present invention (hereinafter referred to as the present invention method) has a large number of particles having a predetermined particle size between electrodes to be joined to each other. It is characterized in that the granular spacers are arranged in a plane in a predetermined pattern, and the low melting point bonding material is melted and then cooled to bond both electrodes and the spacers.

Further, in the method for producing a spacer transfer sheet according to the present invention (hereinafter referred to as the method for producing the present invention), in order to produce the present invention, a heat sublimable adhesive or a heat After sticking an adhesive bonding material in which a sublimable adhesive and a low melting point bonding material are mixed, a number of granular spacers are arranged in a plane in a predetermined pattern on the heat sublimable adhesive or the adhesive bonding material. It is characterized by being adhered to.

Hereinafter, the present invention will be described in more detail. In order to make the explanation as simple as possible, first, the method of the present invention will be described in detail, and the spacer transfer sheet according to the present invention (hereinafter referred to as the present invention product) will be described as appropriate. The description of the manufacturing method of the present invention or the other manufacturing method of the present invention is woven together to proceed with the description.

In the method of the present invention, the electrodes to be joined to each other are naturally made of a good electric conductor such as metal, and at least one of them preferably has rigidity enough to maintain a plate-like or foil-like shape. . In addition, the shape of these electrodes is not particularly limited as long as they are plate-shaped or foil-shaped electrodes that are joined with a predetermined insulating gap therebetween, and for example, like electrodes used in CFP, they are spaced from each other by a predetermined distance. Those which are placed in an insulating state and have a large number of holes arranged in a slit or a matrix through which electrons pass are included.

The granular spacer used in the present invention needs to have an insulating property as an electrical property, and has a mechanical property that it has a rigidity such that it is not deformed at the operating temperature of the electrode. It is preferable that the expansion coefficient is small. Further, the granular spacer used in the present invention has a chemical property that the softening point of the low melting point bonding material is higher than the softening point, and the use temperature of the electrode and the softening point of the low melting point bonding material or lower are carbon, metal, etc. It is necessary not to release or deposit good electric conductor of.

As long as these properties are satisfied, the spacer may be made of an organic substance or an inorganic substance, but it is preferable to use an inorganic substance rather than an organic substance which may contain carbon that is liberated or precipitated for some reason. preferable.

Examples of inorganic materials used as spacers include soda-lime glass and ceramics such as alumina.

The shape of the spacer may be granular, but it is particularly preferably spherical and has no direction.

The particle size of the spacer may be equal to or smaller than the size of the gap set between the electrodes to be joined, but in order to improve the gap accuracy, it is preferable to be equal to the size of the gap. Higher sphericity is preferable.

In the method of the present invention, the method of arranging a large number of granular spacers having a predetermined particle size between the electrodes to be joined in a plane is not particularly limited, but the spacers close the slit-shaped openings of the electrodes. Therefore, it is necessary to arrange the spacers in a plane so as to form a predetermined pattern on one of the electrodes to be joined.

As a method for arranging the spacers on the electrode in a predetermined pattern in a plane, for example, a joining method or a method of using two or more of these methods together can be considered.

A method of forming concavities and convexities having a predetermined pattern on an electrode and arranging spacers in a planar manner in the concavities. A method in which a mask having a predetermined pattern cut out is placed on the surface of an electrode, and spacers are arranged in a plane in the pattern. The property of sublimating by heating below a predetermined temperature on the surface of the electrode, that is, forming a negative pattern having thermal sublimation,
A method of filling spacers in a pattern formed between negative patterns. A method in which an adhesive tape is attached to the surface of an electrode to form irregularities having a predetermined pattern, and the recesses formed between the adhesive tapes are filled with spacers. A method in which spacers are arranged in a plane in a predetermined pattern on a surface of an electrode via a heat-sublimable pressure-sensitive adhesive and supported.

In the above method, since it is necessary to form a pattern on the electrode, the processing cost of the electrode becomes expensive. Although this pattern can be formed by dry etching or the like, it is often difficult to form the pattern, especially when a high-definition pattern such as an electrode of CFP is formed.

Further, in the method, since the spacers arranged in the pattern may jump out from the recess due to vibration and reduce the gap accuracy, an adhesive having a heat sublimation property is disposed in the recess and the heat sublimation property is applied to the electrode. It is preferable that the spacers are prevented from jumping out of the pattern by adhering the spacers via an adhesive and the spacers attached to the electrodes outside the pattern are removed by, for example, vacuum suction.

In the above method, in order to remove the mask after the electrodes are superposed on each other, it is necessary to form the mask so that it can be divided, and furthermore, it is necessary to provide a draft in the non-opening portion of the mask. High-definition patterns cannot be formed. Further, if the mask is removed before the electrodes are overlapped, the pattern of the spacers may be disturbed, the openings of the electrodes may be blocked, or the spacing between the spacers may be widened to deteriorate the insulation characteristics.

Therefore, in the case of adopting the method of (1), it is preferable that the electrode is preliminarily adhered with the heat sublimable adhesive agent and then covered with a mask to prevent the spacers filled in the pattern from jumping out of the pattern. . Further, it is preferable that the heat sublimation adhesive to be adhered to the electrode in advance is formed in a predetermined pattern so that the spacer attached to the electrode outside the pattern can be removed by, for example, vacuum suction.

In the above method, when the mask is made of a resin having a thermal sublimation property, the spacer is filled, the electrodes are superposed, and then the mask is removed by heating the resin above the sublimation point. Since it can be done, it is not necessary to remove the mask before joining the electrodes,
In addition, it is possible to prevent the spacer pattern from being disturbed by the time when the electrodes are overlapped.

In the above method, as in the case where the mask of the above method is formed of a resin having a heat sublimation property, after filling the spacers, the electrodes are superposed and then heated to a temperature above the sublimation point of the resin. Since the negative pattern can be removed by this, it is not necessary to remove the negative pattern before joining the electrodes, and it is possible to prevent the spacer pattern from being disturbed before the electrodes are superposed.

In the case where the mask is formed of a resin having a heat sublimation property in the above method, or in the method, after the spacer is filled and before the electrodes are superposed, the spacer pops out of the pattern due to vibration and blocks the opening of the electrode. However, it may affect the insulation characteristics.Therefore, place a pressure-sensitive adhesive that has a thermal sublimation property on the pattern to make it thinner than the mask or negative pattern, and insert this thermal sublimation adhesive to the electrode. It is preferable to prevent the spacer from jumping out of the pattern by adhering the spacer with the spacer. Further, it is preferable that the spacers are prevented from sticking to the mask or the negative pattern, and the spacers protruding outside the pattern are removed by, for example, vacuum suction before the electrodes are overlapped.

The above method is extremely difficult to form a high-definition pattern by sticking an adhesive tape, and has the same problem as the method of using a mask for removing the adhesive tape. Therefore, it is practical. Not.

In the above method, since the spacer is attached to the electrode by the heat sublimable adhesive, it is possible to prevent the spacer from jumping out of the pattern.

In this method, the heat sublimable pressure sensitive adhesive is attached to the surface of the electrode by directly printing the heat sublimable pressure sensitive adhesive on the surface of the electrode or on a support different from the electrode. A method of printing a heat sublimable pressure-sensitive adhesive and transferring the heat sublimable pressure-sensitive adhesive to the electrode, or sticking the heat sublimable pressure-sensitive adhesive together with the support to the electrode is considered.

Among these methods, the method of directly printing the heat sublimable adhesive on the surface of the electrode is such that the heat sublimable adhesive printed on the surface of the electrode carries a spacer or the other electrode is There is a risk of damage before stacking.

If the heat sublimable adhesive is damaged and the pattern is deformed or damaged, the spacer cannot be arranged in a high-definition pattern. Therefore, expensive electrodes are also scrapped or the damaged pattern is removed. It is necessary to print again, which is disadvantageous for cost reduction.

Therefore, when the method of the present invention is adopted, it is recommended to print a heat sublimable pressure-sensitive adhesive on a support other than the electrode and transfer it from the support to the surface of the electrode. .

As a method of supporting a large number of granular spacers in a predetermined pattern on one or both of the electrodes to be bonded by the above-mentioned method via the heat-sublimable adhesive, the heat-sublimable adhesive is attached to the electrodes. There are a method of carrying the step and the spacer stepwise, and a method of carrying them simultaneously.

As a method of gradually supporting the heat sublimable adhesive and the spacer on the electrode, after transferring the heat sublimable adhesive to the entire surface of the electrode, a large number of granular spacers are formed on the heat sublimable adhesive. And a method of adhering in a plane in a predetermined pattern using a mask, and transferring the heat sublimable adhesive formed in a predetermined pattern on the surface of the electrode, a large number of heat sublimable adhesive having this pattern A method of arranging the granular spacers in a plane and adhering them is considered.

Of these methods, it is preferable to stick the material in a predetermined pattern in order to save the waste of the material. Especially, as described later, when the low-melting-point bonding material is mixed with the heat sublimable adhesive, it is not necessary to add it. It is preferable to adhere a predetermined pattern to the material in order to omit the work of removing the low melting point bonding material and prevent the deterioration of the electrical characteristics due to the low melting point bonding material.

When a large number of granular spacers are arranged in a plane and adhered to a heat sublimable adhesive having a predetermined pattern adhered to the electrodes, the region where the spacers are adhered is set within the pattern of the heat sublimable adhesive. Although it does not prevent the use of a mask having a predetermined pattern for the purpose of limitation, in the case of using the mask, it is necessary to manufacture the mask, align the mask with the electrode on which the heat sublimable adhesive is adhered, and stack the mask. Yes, the number of steps increases.

Therefore, when the heat sublimable adhesive is adhered to the electrode in a predetermined pattern and then the spacer is adhered to the heat sublimable adhesive, the heat sublimable adhesive is applied without using a mask. It is recommended to employ a method in which spacers are scattered on the adhered electrodes, pressure is applied to adhere the spacers to the pattern of the heat sublimable adhesive, and then the extra spacers are collected by, for example, vacuum suction.

By the way, the method of stepwise supporting the heat-sublimable adhesive and the spacer on these electrodes has a large number of steps, which is disadvantageous in terms of cost reduction, and the transfer of the heat-sublimable adhesive is also disadvantageous. When the spacers are attached later, the spacers may be three-dimensionally bulged to open a large gap between the spacers attached to the surface of the heat-sublimable adhesive, and the insulation between the electrodes may be reduced.

Therefore, in the case of adopting the method of supporting a large number of granular spacers in a predetermined pattern on one or both of the electrodes to be bonded through the heat sublimable adhesive by the above method, these electrodes are It is preferable to adopt a method of simultaneously supporting the heat sublimable adhesive and the spacer on the electrode, rather than a method of gradually supporting the heat sublimable adhesive and the spacer.

As a method of simultaneously supporting the heat sublimable adhesive and the spacer on the electrode, a method of printing the heat sublimable adhesive mixed with the spacer on the electrode and a method of supporting the heat sublimable adhesive supporting the spacer on the electrode Is considered to be a method of transferring it from another support to the electrode, but the method of printing a heat sublimable adhesive mixed with a spacer on the electrode requires complicated ink management and the spacer density is low, In addition to not being able to obtain the insulating property, the pattern accuracy of the spacer also decreases.

As a method for transferring the thermally sublimable pressure sensitive adhesive carrying the spacer from the support other than the electrode to the electrode, the spacer is made to adhere to the surface of the thermally sublimable pressure sensitive adhesive adhered to the above support. It is possible to consider a method of placing it and a method of adhering a heat sublimable pressure sensitive adhesive containing a spacer to the support.

The method in which the spacer is adhered to the surface of the heat sublimable pressure-sensitive adhesive adhered to the above-mentioned support can omit the step of mixing the heat sublimable pressure-sensitive adhesive and the spacer, and ensures the spacer. It is advantageous in that it can be supported side by side in a plane, and the method of sticking the heat sublimable adhesive with the spacer mixed to the support is the method of sticking the heat sublimable adhesive to the opposite side of the support. Since the surface is exposed, it is advantageous in that the heat sublimable adhesive and the spacer can be easily adhered to the electrode.

Therefore, in the above method, when the method of transferring the adhesive from the support to the electrode is adopted as the method of adhering the heat sublimable adhesive to the surface of the electrode, the spacer is planarly formed in a predetermined pattern. Adhere to the support through the heat sublimable pressure-sensitive adhesive formed side by side in a predetermined pattern,
It is most preferable to adopt a method in which the spacer is transferred together with the heat sublimable adhesive to one of the electrodes joined from the support, and thereby the spacer is carried on the surface of the electrode via the heat sublimable adhesive.

The low melting point bonding material for bonding the electrode and the spacer to be bonded to each other has an insulating property as an electrical property, and is softened or melted at a temperature lower than the softening point of the spacer as a chemical property and cooled by cooling. It is necessary to solidify and easily bond to the electrodes and spacers, and to use a material that does not liberate or precipitate a good electrical conductor such as carbon or metal when softened or melted.

The low-melting-point bonding material may be composed of an organic material as long as these characteristics are satisfied, but it is preferable to use an inorganic material rather than an organic material containing carbon that is liberated or precipitated for some reason.

Examples of the inorganic material used as the low melting point bonding material include water glass and frit glass.

This low melting point bonding material also needs to be as little as possible from the spacer pattern so as not to impair the predetermined electrical characteristics of the electrode. Therefore, the low melting point bonding material is The electrodes are carried in the same pattern as the spacer pattern.

Regarding the method of supporting the low melting point bonding material on the electrode in a predetermined pattern, the same method as the method of supporting the spacer on the electrode in a predetermined pattern can be considered. When the low melting point bonding material is transferred from the support to the electrode together with the pressure sensitive adhesive, a method of filling the low melting point bonding material between the spacers adhered to the heat sublimable pressure sensitive adhesive can be considered.

As a method of filling the low melting point bonding material between the spacers adhered to the heat sublimation adhesive, a method of filling a powdery or granular low melting point bonding material between the spacers,
A method of firing the low melting point bonding material filled between the spacers can be considered.

In the method of the present invention, the method of adhering the low melting point bonding material and the spacer to one electrode to be bonded via the heat sublimable adhesive is not particularly limited, but the support, the heat sublimable adhesive, the low melting point There are some differences depending on the laminated structure of the bonding material and the spacer.

That is, as a laminated structure of a support, a heat sublimation adhesive, a low melting point bonding material and a spacer, a layer of a heat sublimation adhesive or a low melting point bonding material mixed with the support is formed. And a spacer, a combination of a spacer and a low melting point bonding material,
Alternatively, the spacer and the layer of the joint material of the low melting point joint material are 2 in order.
In the structure laminated in layers, since the surface on the opposite side of the support is not an adhesive surface, for example, one edge of the support is peeled off with the support facing downward, and the support is peeled off. While aligning the edge of the agent and the edge of the electrode, press the edge of the heat sublimable adhesive against the edge of the electrode to make it adhere, and continuously invert and peel the support from the edge. , A method of continuously pressing the heat sublimable pressure sensitive adhesive exposed by peeling of the support to the electrode for adhesion, and after peeling the support, aligning the heat sublimable pressure sensitive adhesive and the electrode to obtain a heat sublimable pressure sensitive adhesive There is a method of adhering to the electrode.

Further, as a laminated structure of a support, a heat sublimation adhesive, a low melting point bonding material and a spacer, a layer of a heat sublimation adhesive obtained by mixing a support with a heat sublimable adhesive or a low melting point bonding material. And a spacer, an assembly of spacers and a low melting point bonding material, or a layer of a bonding material of spacers and a low melting point bonding material, and a heat sublimation adhesive, or a heat sublimation adhesive obtained by mixing a low melting point bonding material. In a structure in which the layers of 3 and 4 are sequentially laminated, for example, a method of peeling the support after the heat sublimable pressure sensitive adhesive on the opposite side of the support or the low melting point bonding material is overlapped and adhered to the electrode To be taken.

When the heat sublimable adhesive, the low melting point bonding material and the spacer are adhered to the electrode, it is not essential in the method of the present invention to press them, but the adhesive force to the electrode is increased and In order to facilitate the peeling, it is preferable to press the heat sublimable pressure sensitive adhesive, the low melting point bonding material and the spacer peeled from the support or onto the electrode by using, for example, a silicon rubber roller.

The support used in the method of the present invention is removed or exhausted by the time when the electrodes and the spacers are bonded by a low melting point bonding material in order to improve the gap accuracy and to obtain the required electrical characteristics and bonding strength. Preferably.

As a method of removing or exhausting this support by the time when the electrodes and the spacers are bonded by the low melting point bonding material, the support is heat sublimable adhesive, low melting point bonding before the other electrode is superposed. A method of peeling from the material and a large number of granular spacers, and a method of forming the support from a resin having a heat sublimation property can be considered.

In the method of peeling the support, the resistance value,
The electrical properties of the support, such as the dielectric constant, are not particularly problematic, but the mechanical properties include a suitable tensile strength that does not cause accidental breakage during handling, and a rigidity that can maintain an appropriate shape retention property. It is necessary to have a degree of elasticity.

The shape of the support is not particularly limited, but for convenience of handling, in order to prevent the electrode contacting the support from being deformed or damaged during transfer, a film, a sheet, or a foil is used. It is preferable to form it into a shape that can be easily and flexibly deformed, such as a sheet shape, a thin plate shape, a tape shape, or a ribbon shape.

However, when a large number of supports are arranged two-dimensionally on the electrodes at the same time or sequentially and the heat sublimable adhesive, the low melting point bonding material and a large number of granular spacers are transferred successively,
Since it may be difficult to secure the pattern accuracy of the heat sublimable adhesive, the low melting point bonding material, and the large number of granular spacers, use a support having a width of at least the short side of the electrode or more. Is preferred.

Further, the support needs to have a certain film thickness in order to prevent the support from being deformed or wrinkled during handling such as transfer, but so far, for example, polyethylene terephthalate or poly When using a film made of vinyl alcohol, 18 μm to 125
Good results have been obtained with a film thickness of about μm.

Although it is possible to form this support into a pattern corresponding to the pattern of a large number of granular spacers, in this case, the support is likely to be deformed or wrinkled during handling. It is necessary to keep in mind.

The material of this support is not particularly limited as long as it is a material to which the above-mentioned heat sublimable pressure sensitive adhesive adheres in a peelable manner, and metals, synthetic resins and the like can be used. It is recommended to use a film-like synthetic resin such as polyvinyl alcohol or polyethylene terephthalate, which is easy and inexpensive.

When the support is formed of a heat sublimable synthetic resin, the support is adhered to the electrode through the heat sublimable adhesive together with the heat sublimable adhesive, the low melting point bonding material and the spacer. It is possible to save the trouble of peeling.

The heat sublimable pressure-sensitive adhesive used in the method of the present invention preferably has a pressure-sensitive adhesive property with respect to the support, the spacer and the electrode, and further has a pressure-sensitive adhesive property with the low melting point bonding material and the spacer. There is no particular limitation as long as it is sublimated at a temperature equal to or lower than the firing temperature without carbonization.

In the temperature range below the sublimation point, the heat-sublimable adhesive is used alone or in the state of being mixed with the low melting point bonding material or in the state of being mixed with the low melting point bonding material and the spacer. Therefore, it is necessary to have a viscosity or a thixotropy to such an extent that a given pattern can be retained without being washed away.

As an example of such a heat sublimable adhesive,
Examples thereof include isodecyl methacrylate and a copolymer of isobutyl methacrylate and 2-ethylhexyl acrylate.

Since the thermally sublimable pressure-sensitive adhesive is completely sublimated and removed when the electrodes and the spacers are bonded by the low-melting-point bonding material, its electrical characteristics are not a problem.

In the present invention, as described above, for example, by transferring or pasting, one electrode to be joined carries the low-melting-point joining material and the spacer via the heat sublimable adhesive, and then the other is joined. Stack the electrodes of.

This superposition is performed while aligning the positions of both electrodes using, for example, a pin or a ruler. Then, by adhering the other electrode, the low-melting-point bonding material, and the spacer via the thermal sublimation adhesive, both electrodes are
It is possible to prevent temporary displacement of the electrodes, the low melting point bonding material and the spacer due to vibration.

When the other electrode is superposed on the heat sublimable adhesive, the low melting point bonding material and the spacer carried on one electrode, whether or not pressure is applied to both electrodes in a direction to bring them closer to each other is determined. Although it is free, while strengthening the temporary bonding of the spacer and both electrodes with the heat sublimable adhesive,
In order to eliminate a gap between the spacer and both electrodes, it is preferable to apply such pressure at the time of stacking.

The method of the present invention can also be applied to the case where three or more electrodes are joined, and when joining three or more electrodes, one surface has a low melting point via a heat sublimable adhesive. Stack the electrodes supporting the bonding material and spacers in order,
An electrode that does not carry a thermal sublimation adhesive, a low melting point bonding material and a spacer is stacked on the top or the bottom, or an electrode supporting a low melting point bonding material and a spacer on both sides, and a thermal sublimation adhesive, The melting point bonding material and the electrode not carrying the spacer may be alternately stacked.

In the method of the present invention, a large number of granular spacers having a predetermined particle size are arranged in a predetermined pattern between the electrodes to be bonded to each other, and the spacers are heated at a predetermined firing temperature to reduce the temperature. The melting point bonding material is softened and allowed to flow between the spacers, the heat sublimable adhesive is sublimated, and then cooled and the low melting point bonding material is bonded to both electrodes and the spacer.

Whether or not pressure is applied to both electrodes in the direction of bringing them closer to each other at the time of heating is also free, but in order to improve the gap accuracy by eliminating the gap between the spacer and both electrodes, it is possible to make such a difference at the time of heating. It is preferable to apply pressure.

The heating temperature, that is, the firing temperature, is higher than the sublimation point of the heat-sublimable adhesive (and the heat-sublimable synthetic resin constituting the support material) and the softening point of the low melting point bonding material, and is higher than the softening point of the spacer. Should be set low.

However, it is not necessary to heat the low melting point bonding material to a temperature at which the low melting point bonding material is completely melted and liquefied, but rather the liquefaction of the low melting point bonding material prevents the low melting point bonding material from largely flowing out from the pattern. Therefore, it is preferable to set the temperature close to the softening point of the low melting point bonding material.

For example, when the low melting point bonding material is made of frit glass and the spacer is made of soda lime glass, the softening point of soda lime glass (about 1000 ° C.) is higher than the softening point of frit glass (about 400 ° C.). The temperature is set to 450 ° C to 500 ° C, which is lower than (° C). Further, the heating time is appropriately empirically determined according to the addition amount of the low melting point bonding material and the like.

Of course, the heating may be performed using a batch type heating furnace or a continuous type heating furnace.

Cooling after heating may be performed by natural heat radiation, for example, forced cooling by blowing cooling air, but due to the difference in thermal expansion coefficient, peeling between the electrode and the low melting point bonding material during cooling, a low melting point bonding material, In order to prevent the occurrence of spacer cracks, it is preferable to cool as slowly as possible,
In some cases, it may be possible to cool while exposing to slightly warm air.

Next, the spacer transfer sheet according to the present invention
(Hereinafter, referred to as the present invention.) Is simple and reliable,
A support and a heat-sublimable adhesive releasably adhered to the support in order to arrange a plurality of granular spacers having a predetermined particle size between electrodes to be bonded to each other in a plane in a predetermined pattern. A low melting point bonding material carried on the heat sublimable adhesive, and a large number of granular spacers carried on the heat sublimable adhesive in a state of being arranged in a plane in a predetermined pattern. .

Hereinafter, the present invention will be described in detail. Here, points that overlap with the description of the method of the present invention will be omitted as much as possible to avoid duplication.

The low melting point bonding material is adhered to the support by being adhered to the surface of the heat sublimable adhesive adhered to the support or mixed with the heat sublimable adhesive adhered to the support. It is carried by a heat sublimable pressure sensitive adhesive.

Among these, the structure in which the low melting point bonding material is adhered to the surface of the heat sublimable adhesive has a tendency that the amount of the low melting point bonding material attached to the surface of the heat sublimable adhesive becomes too small. Therefore, only a part of the low melting point bonding material is adhered to the surface of the heat sublimable adhesive, and the remaining low melting point bonding material is mixed with the heat sublimable adhesive, or the above heat sublimable adhesive, or adhesive. It is preferably carried on another layer which is adhered to the bonding material.

The constitution in which the low-melting point bonding material is mixed with the above-mentioned heat-sublimable adhesive allows the proper amount of the low-melting point bonding material to be blended with the heat-sublimable adhesive, and at the same time forming the pattern of the heat-sublimable pressure-sensitive adhesive This is advantageous because the material can be patterned. In addition, the adhesive surface on the surface of the heat-sublimable adhesive is not narrowed by the adhesion of the low-melting-point bonding material, and the spacers arranged in a plane in a predetermined pattern are adhered at high density to enhance the insulation property of the spacer layer. Is advantageous in that

When the low melting point bonding material is mixed with the heat sublimation adhesive, a part of the low melting point bonding material is mixed with the heat sublimation adhesive, and the remaining low melting point bonding material is mixed with the heat sublimation adhesive. It may be supported on another layer which is further adhered to the.

Examples of the other layer further adhered to the heat sublimable pressure sensitive adhesive include a spacer layer and another heat sublimable pressure sensitive adhesive layer.

When the low melting point bonding material is carried on the spacer layer, a viscous low melting point bonding material having a thixotropy property, or the low melting point bonding material is a solid low melting point bonding material formed in a powder or granular form. The material is filled between the spacers, and the particle size of the low melting point bonding material formed in the form of powder or granules is set to one of the particle diameters of the spacers so that the spacers are in close contact with each other and arranged in a plane. It is preferably / 4 or less.

The structure in which the low-melting-point bonding material is carried on the other layer in the state before sintering is suitable for being adhered to the thermally sublimable pressure-sensitive adhesive layer having adhesive property or mixed and carried. The structure in which a viscous low melting point bonding material before sintering or a low melting point bonding material in a sintered state is carried on another layer is mixed or bonded to a spacer layer whose layer composition does not have adhesiveness. It is suitable for being carried.

In order to prevent the low-melting-point bonding material during handling from flowing out or falling off from the spacer layer, an adhesive bonding material is used in which the spacer layer is filled and then sintered or the spacer layer is adhered. Another layer of heat-sublimable adhesive or adhesive bonding material can be provided on the opposite side.

The above-mentioned spacer is mixed with a heat sublimable adhesive or an adhesive bonding material which is adhered to a support, or is adhered to a heat sublimable adhesive or an adhesive bonding material which is adhered to a support. And a heat-sublimable adhesive that is adhered to the support, or
It is carried by the adhesive bonding material.

Further, a part of the spacers is mixed with a heat sublimable adhesive or an adhesive bonding material which is adhered to the support, and the remaining spacers are adhered to the support or a part thereof is adhered to the support. The heat-sublimable pressure-sensitive adhesive to be used, or while being mixed with the adhesive bonding material, the remaining spacer is another heat-sublimable pressure-sensitive adhesive,
Alternatively, a heat-sublimable pressure-sensitive adhesive mixed with the pressure-sensitive adhesive bonding material, or all spacers are adhered to the support, or another heat-sublimable pressure-sensitive adhesive laminated on the pressure-sensitive adhesive bonding material, or another pressure-sensitive adhesive bonding material. It is also possible to support it on the heat-sublimable pressure-sensitive adhesive by mixing it with.

Among these constitutions, the constitution in which the spacer is mixed with another heat-sublimable pressure-sensitive adhesive to be laminated on the above-mentioned heat-sublimable pressure-sensitive adhesive or another pressure-sensitive adhesive bonding material tends to complicate the constitution. In addition, although the number of manufacturing steps also increases, for example, when the spacer is mixed with another heat sublimable adhesive layer, adhesive surfaces are provided on both surfaces of the spacer, and the spacers are bonded to each other. Will be able to adhere to the electrode.

On the other hand, the structure in which all the spacers are mixed with the heat sublimable adhesive allows the spacers to be adhered to both electrodes bonded to each other via the heat sublimable adhesive, The spacer pattern can be formed at the same time as the pattern formation, and the advantage that the number of manufacturing steps can be reduced is obtained.

Further, in these structures, from the viewpoint of ensuring that the spacers carried by the heat-sublimable adhesive on the support are arranged in a plane in order to ensure a certain gap accuracy, The structure in which the whole is adhered to the surface of the heat sublimable adhesive is most advantageous.

From the above, as the constitution of the present invention, the support, the heat sublimable adhesive which is adhered to the support and mixed with the low melting point bonding material, and the surface of the heat sublimable adhesive are predetermined It is recommended that the structure be provided with a granular spacer that is arranged in a plane in the above pattern.

Further, in the present invention, in order to facilitate the transfer of the heat sublimable adhesive, the low melting point bonding material and the spacer to the electrode and to improve the transfer accuracy,
It is preferable that the above-mentioned structure further comprises another heat-sublimable pressure-sensitive adhesive laminated on the heat-sublimable pressure-sensitive adhesive via a spacer, and further the bonding strength between both electrodes and the low melting point bonding material is made uniform. Therefore, by mixing the heat-sublimable adhesive obtained by mixing the low-melting-point bonding material with the other heat-sublimable adhesive described above, the adhesive bonding material is evenly laminated on both sides of the spacers arranged in a plane. Most preferred.

Further, in the present invention, in order to protect the above-mentioned laminate, it is preferable to adhere a release paper to the surface opposite to the support.

In this case, a film or sheet in which the support itself has a releasability may be used. With such a structure, the structure can be further simplified and the cost can be reduced.

In the above construction, the support can be made of a heat sublimable synthetic resin. In this case, the support need not be peeled off at the time of transfer, and workability can be improved. The pattern of the heat sublimable adhesive, the low melting point bonding material, the spacer and the like can be prevented from being shredded or disturbed as the support is peeled off, and the pattern accuracy can be improved.

Next, in the method for producing the present invention, in order to produce the above-mentioned present invention, a heat sublimable adhesive, a low melting point bonding material and a large number of spacers are attached to a support in a predetermined pattern. Characterize.

Hereinafter, the manufacturing method of the present invention will be described in detail, but in order to avoid duplication, the description common to the method of the present invention or the description of the present invention will be omitted as much as possible.

In the manufacturing process of the present invention, a heat sublimation adhesive, a low melting point bonding material and a large number of spacers can be adhered to both sides of the support, but the transfer or adhesion work to the electrode can be simplified. And to improve handling,
The heat sublimable pressure sensitive adhesive, the low melting point bonding material and the large number of spacers are preferably adhered to one side of the support.

The heat sublimable pressure-sensitive adhesive to be adhered to the support includes
A low melting point bonding material can be mixed, and in this case, the low melting point bonding material can be adhered to the support through the heat sublimable pressure sensitive adhesive at the same time as adhesion of the heat sublimable pressure sensitive adhesive. It can be adhered or transferred from the body to the electrodes.

Further, the heat sublimable adhesive or the adhesive bonding material in which the heat sublimable adhesive and the low melting point bonding material are mixed may be adhered over the entire surface of the support, but in order to save the waste of the material, a predetermined amount is used. It is preferable to adhere to the pattern of, especially in the case of the adhesive bonding material, not only to save the waste of the material but also to eliminate the work of removing the extra low melting point bonding material, and the deterioration of the electrical characteristics due to the low melting point bonding material. In order to prevent this, it is preferable to adhere to a predetermined pattern.

The method for adjusting the heat-sublimable pressure-sensitive adhesive or the pressure-sensitive adhesive compounding material to be adhered to the support is not particularly limited. For example, the method for adjusting the pressure-sensitive adhesive compounding material includes a solvent, a heat-sublimable resin in the form of pellets, and a low melting point. A method of dissolving the heat sublimable resin in the solvent and dispersing the low melting point bonding agent in the solution by putting the bonding agent and the bonding agent in a mixing treatment tank at a predetermined mixing ratio and stirring and mixing, a viscous material-like heat. A method of adding a low-melting-point bonding material to a sublimable pressure-sensitive adhesive and kneading is considered.

The heat sublimable adhesive or the adhesive bonding material to be adhered to the support is preferably adhered to have a uniform and predetermined thickness. For example, a doctor blade, a roll coater,
It may be adhered to the support using a spray or the like, or may be printed on the support by a known printing method such as a screen, letterpress, intaglio, or gravure, and the heat-sublimable adhesive is formed into a predetermined pattern to support. A known printing method such as a screen, letterpress, intaglio, or gravure may be used as the method of sticking to the body.

After the heat sublimable adhesive or the adhesive bonding material is adhered to the support, when the spacer is adhered to the heat sublimable adhesive or the adhesive bonding material, the spacer is adhered in a predetermined pattern. It does not prevent that the spacers are three-dimensionally overlapped and adhered to the heat-sublimable adhesive or the adhesive bonding material.

However, when the spacers are three-dimensionally overlapped and adhered to the heat sublimable adhesive or the adhesive bonding material, in order to improve the gap accuracy, the electrodes are pressed during sintering to form a three-dimensional spacer. It is necessary to eliminate such overlapping, and this pressure may cause the spacer to protrude the pattern and reduce the pattern accuracy.

Therefore, in the production method of the present invention,
It is preferable that the spacers are arranged in a predetermined pattern and are arranged in a plane to be adhered to the heat sublimable adhesive or the adhesive bonding material.

Thermally sublimable pressure sensitive adhesive adhered to a support, or
The following two methods are conceivable as a method of adhering a large number of granular spacers to the adhesive bonding material so as to be arranged in a predetermined pattern in a plane.

In the first method, a large number of granular spacers are filled in a groove formed in a predetermined pattern so as to be arranged in a plane, and a heat sublimable adhesive or an adhesive bonding material is adhered from above. It is a method of applying a pressure on the support.

In the first method, the depth of the groove is not particularly limited. However, if the depth of the groove is set to be equal to or smaller than the grain size of the spacer, the groove and the spacer can be lifted up and slid on the spacer to ensure the depth. It is possible to prevent the spacers from overlapping in a three-dimensional manner, and to arrange the spacers in a predetermined pattern in a plane and densely. Moreover, the spacers remain outside the predetermined pattern, that is, the groove. It is possible to prevent sticking to the sublimable pressure-sensitive adhesive or the pressure-sensitive adhesive bonding material, and improve the pattern accuracy.

In the first method, if the method of covering the heat sublimable adhesive formed in a predetermined pattern or the adhesive bonding material from above is adopted, it is ensured that the spacer is adhered outside the predetermined pattern. It is possible to prevent this, and it is possible to further improve the pattern accuracy.

In the first method, the spacer may be pressed into the heat sublimable adhesive or the adhesive bonding material by pressurization. In this case, another heat sublimation is used. The adhesive surface is exposed on the surface opposite to the support without laminating a conductive adhesive or another adhesive bonding material, which facilitates transfer to the electrode. Also, in this case,
In order to prevent foreign matter from adhering to the adhesive surface on the opposite side of the support and damage to the pattern, it is preferable to adhere release paper to the opposite side of the support.

In this case, a film or sheet in which the support itself has a releasability may be used. With such a structure, the structure can be further simplified and the cost can be reduced.

Thermally sublimable pressure sensitive adhesive adhered to a support, or
The second method of adhering a large number of granular spacers to the adhesive bonding material so as to be arranged in a plane in a predetermined pattern is a thermal sublimation adhesive or a support to which the adhesive bonding material is adhered. The agent or the adhesive bonding material is spread upward, a mask with a predetermined pattern cut out is placed thereon, and a large number of granular spacers are arranged in the pattern so that a large number of granular spacers are arranged in a plane. It is a method of pressurizing after filling.

In the second method, spacers are three-dimensionally laid on the heat sublimable adhesive or the adhesive bonding material, and the spacer is adhered to the heat sublimable adhesive or the adhesive bonding material when pressure is applied. There is a risk that a large gap will be created between the spacers, which deteriorates the insulating property of the spacer layer. Further, the heat sublimable adhesive, or an extra spacer remains on the spacer adhered to the adhesive bonding material, and further another heat sublimable adhesive, or
When another adhesive bonding material is laminated, the spacer layer is a heat-sublimable adhesive agent on the support side, or a layer of the spacer adhered to the adhesive bonding material, and a heat-sublimable adhesive agent that is subsequently laminated, or
There is a possibility that the layer of the spacer adhered to the adhesive bonding material is separated and peeled off. Furthermore, this extra spacer also causes a decrease in gap accuracy.

However, these problems are caused by the fact that the heat sublimable adhesive agent sprayed on the mask or the spacers placed on the spacers adhered to the adhesive bonding material is blown off by air or vacuumed. After removing the pattern from the pattern by brushing lightly, the spacer in the pattern is pressed to increase the adhesive force between the spacer and the heat sublimable adhesive or the adhesive bonding material.

In addition, in the second method, the extra spacer left on the mask when the mask is removed spills out from the pattern hole of the mask, the heat sublimable adhesive, or
It may adhere to the side surface of the pattern of the adhesive bonding material, or may be a heat sublimable adhesive outside the pattern, or may adhere to the adhesive bonding material to reduce the pattern accuracy. It is necessary to remove spacers spilled between the adhesive bonding material patterns.

However, in order to solve these problems, the extra spacers are easily removed from the mask by, for example, vacuum suction before removing the mask.

In the manufacturing method of the present invention, in order to facilitate the transfer work to the electrode and improve the transfer accuracy,
A heat sublimable pressure sensitive adhesive or a spacer carried via a pressure sensitive adhesive bonding material on the support may be further laminated with another heat sublimable pressure sensitive adhesive or another pressure sensitive adhesive bonding material.

In this case, it is considered that both sides of the spacer are the heat sublimable adhesive or the adhesive bonding material, and one side of the spacer is the heat sublimable adhesive and the other is the adhesive bonding material. In order to make the bonding structure with the electrode more uniform, it is preferable that both sides of the spacer are a heat-sublimable pressure sensitive adhesive or a pressure sensitive bonding agent having the same component.

In the production method of the present invention, when another heat sublimable adhesive or another adhesive bonding material is laminated,
In order to prevent foreign matter from being scratched or the pattern from being scratched on the surface of this another heat sublimable adhesive or another adhesive bonding material, a release paper may be attached to the side opposite to the support. preferable.

In this case, a film or sheet in which the support itself has a releasability may be used. With such a structure, the structure can be further simplified and the cost can be reduced.

In another method for producing the present invention, in order to produce the above-mentioned present invention, a mixture of a heat sublimable adhesive, a low melting point bonding material and a large number of spacers is adhered to a support in a predetermined pattern. Is characterized by.

In this case, the surface on the side opposite to the support becomes an adhesive surface. Therefore, in order to prevent foreign matter from adhering to the adhesive surface and damage to the pattern, a release paper is provided on the surface opposite to the support. It is preferable to make it sticky.

[0129]

Since the spherical spacer used in the method of the present invention may be made of, for example, glass beads that are generally produced, it can be produced at a lower cost than a high-precision glass rod having no warp or twist, and can be bent. Since there is no fear of occurrence, the yield is good and the cost can be further reduced.

Further, since the low melting point bonding material used in the method of the present invention may be water glass, powder or granular frit glass, etc., as compared with a highly accurate rod-shaped low melting point bonding material without warping or twisting. Since it can be manufactured at a low cost and there is no fear of breakage, the yield is good and the cost can be further reduced.

Further, according to the method of the present invention, the spacer and the low-melting-point bonding material can be arranged in a predetermined pattern on the electrode with high precision by using, for example, a heat sublimable adhesive easily and within a short time. Therefore, the pattern accuracy and the gap accuracy can be easily obtained, and the product characteristics can be stabilized.

In the production method of the present invention, a heat sublimable pressure sensitive adhesive or a pressure sensitive adhesive bonding material obtained by mixing a heat sublimable pressure sensitive adhesive and a low melting point bonding material is adhered to a support, and then the heat sublimable pressure sensitive adhesive, Alternatively, by adhering a large number of granular spacers to the adhesive bonding material in a predetermined pattern, a support, a heat sublimable adhesive releasably adhered to the support, and the heat sublimable adhesive are carried. It is possible to manufacture the present invention including the low melting point bonding material and a large number of granular spacers carried on the heat sublimable adhesive in a state of being arranged in a plane in a predetermined pattern.

According to another production method of the present invention, by adhering a mixture of a heat sublimable adhesive, a low melting point bonding material and a large number of spacers to a support in a predetermined pattern,
A support, a heat sublimable adhesive that is releasably adhered to the support, a low melting point bonding material carried on the heat sublimable adhesive, and the heat sublimable adhesive is planar in a predetermined pattern. It is possible to manufacture the present invention including a large number of granular spacers that are supported in a line.

Furthermore, the product of the present invention produced in this manner comprises a support, a heat sublimable pressure sensitive adhesive which is releasably adhered to the support, and a low melting point carried by the heat sublimable pressure sensitive adhesive. Since a bonding material and a large number of granular spacers which are carried in the heat sublimable adhesive in a state of being arranged in a plane in a predetermined pattern are provided, a low melting point bonding material and a thermally sublimable adhesive carrying the spacers are provided. Just stick it to the electrode or transfer it,
The low melting point bonding material and the spacer can be arranged in a predetermined pattern on one of the electrodes to be bonded easily and in a short time.

[0135]

Embodiments of the method of the present invention, the product of the present invention and the method of manufacturing the present invention will be specifically described below with reference to the drawings.
The electrode bonding method according to one embodiment of the method of the present invention is, for example, as shown in the schematic sectional view of FIG.
A large number of granular spacers 2 having a predetermined particle size are arranged in a plane between A and 1B in a predetermined pattern, and these electrodes and spacers are bonded by a low melting point bonding material 3.

Of course, it is preferable that the electrodes 1A and 1B are formed of a good electric conductor such as metal, and at least one of them has a rigidity such that it can maintain a plate-like or foil-like shape. Further, the shape of these electrodes is not particularly limited as long as it is a plate-shaped or foil-shaped electrode that is joined with a predetermined insulating gap, but here, they are arranged in an insulating state with a predetermined distance from each other, and The electrodes 1A and 1B used for the CFP having a large number of openings a arranged in a slit or a matrix through which electrons pass are joined.

The spacer 2 is required to have an insulating property as an electrical characteristic, and it is necessary to have a rigidity as a mechanical characteristic so as not to be deformed at the operating temperature of the electrodes 1A and 1B. It is preferable that the expansion coefficient is small. In addition, the spacer 2 has a chemical characteristic that it has a softening point higher than the softening point or melting point of the low melting point bonding material 3,
It is necessary that the electric conductors such as carbon and metal are not liberated or deposited below the operating temperature of the electrodes 1A and 1B and the softening point of the low melting point bonding material 3.

As long as these properties are satisfied, the spacer 2 may be made of an organic material or an inorganic material, but it is preferable to use an inorganic material rather than an organic material which may contain carbon liberated or precipitated for some reason. Therefore, the spacer 2 formed of soda lime glass is used here.

The shape of the spacer 2 may be any granular shape, but it is particularly preferable that it is a spherical granular shape having no directionality.

The particle size of the spacer 2 is the same as that of the electrode 1A to be joined.
Although it may be equal to or smaller than the size of the gap set between 1B, in this embodiment, in order to improve the gap accuracy, the size of the gap is equal to, for example, 400 μm, and the error of the particle size is about ± 15 μm.

The method of arranging a large number of granular spacers 2 having a predetermined particle size between the electrodes 1A and 1B in a plane is not particularly limited, but the spacer 2 should not block the slit-shaped openings a of the electrodes. First, it is necessary to arrange the spacers 2 in a plane so as to form a predetermined pattern on the one electrode 1A to be joined.

As a method of arranging the spacers 2 on the electrode 1A in a plane in a predetermined pattern, for example, the following methods, or a method of using two or more of these methods together can be considered. .

That is, as shown in FIG. 2, a method of forming a groove g having a predetermined pattern in the electrode 1A and arranging the spacers 2 in a plane in the groove g.

As shown in FIG. 3, a method in which a matrix M in which a predetermined pattern is cut out is placed on the surface of the electrode 1A and the spacers 2 are arranged two-dimensionally in the pattern.

As shown in FIG. 4, negative patterns NP having a property of being sublimated by heating at a predetermined temperature or lower, that is, having a thermal sublimation property are formed on the surface of the electrode 1A, and patterns formed between the negative patterns NP. A method of filling the spacer 2 with the.

As shown in FIG. 5, a method in which an adhesive tape T is attached to the surface of the electrode 1A to form irregularities having a predetermined pattern, and the groove g formed between the adhesive tape T is filled with the spacer 2 .

As shown in FIG. 6, a method of supporting the spacers 2 on the surface of the electrode 1A by arranging the spacers 2 in a predetermined pattern in a plane with the heat sublimable adhesive 4 interposed therebetween.

In the above method, since it is necessary to form a pattern on the electrode 1A, the processing cost of the electrode 1A becomes expensive. This pattern can be formed by wet etching, dry etching or the like.
When a high-definition pattern such as a P electrode is formed, it is often difficult to form the pattern itself.

Further, in the above method, the spacers 2 arranged in the pattern may vibrate out from the groove g due to vibration and reduce the gap accuracy. Therefore, the adhesive 4 having thermal sublimability is arranged in the groove g. This heat sublimable adhesive 4 is applied to the electrode 1A.
It is preferable that the spacer 2 is adhered via the spacer to prevent the spacer 2 from jumping out of the pattern and remove the spacer 2 attached to the electrode 1A outside the pattern by, for example, vacuum suction.

In the above method, in order to remove the mask M after the electrodes 1B are superposed on each other, it is necessary to form the mask M so that it can be divided, and furthermore, it is necessary to provide the non-opening portion of the mask M with a draft. Therefore, a high-definition pattern cannot be formed.

If the mask M is removed before the electrodes 1B are overlaid, the pattern of the spacers 2 is disturbed, and the electrodes 1A are removed.
There is a risk that the opening of 1B will be blocked or the spacing between the spacers 2 will widen and the insulation characteristics will deteriorate.

Therefore, in the case of adopting the above method, the electrode 1A is preliminarily adhered with the heat-sublimable adhesive 4 and then the mask M is covered to prevent the spacers 2 filled in the pattern from jumping out of the pattern. It is preferable to prevent it. Further, it is preferable that the heat sublimation adhesive 4 to be adhered to the electrode 1A is formed in a predetermined pattern in advance so that the spacer 2 attached to the electrode 1A outside the pattern can be removed by, for example, vacuum suction.

In the above method, when the mask M is formed of a resin having a thermal sublimation property, the spacers 2 are filled, the electrodes 1B are superposed, and then heated above the sublimation point of the resin. Since the mask M can be removed, it is not necessary to remove the mask M before joining the electrodes 1A and 1B, and the pattern of the spacer 2 can be prevented from being disturbed before the electrodes 1B are superposed.

The above method is the mask M of the above method.
The negative pattern NP can be removed by filling the spacer 2 and then overlapping the electrodes 1B and then heating the resin to a temperature not lower than the sublimation point of the resin, as in the case where is formed of a resin having thermal sublimation property. Therefore, it is not necessary to remove the negative pattern NP before joining the electrodes 1A and 1B,
Further, it is possible to prevent the pattern of the spacer 2 from being disturbed by the time when the electrodes 1B are overlapped.

When the mask M is formed of a resin having a heat sublimation property in the above method, or in the above method, after the spacer 2 is filled, the spacer 2 pops out of the pattern due to vibration before the electrodes 1B are overlapped with each other. Since the openings a of 1A and 1B may be blocked or the insulation characteristics may be affected, the adhesive 4 having a thermal sublimation property is arranged in the pattern so as to be thinner than the mask M or the negative pattern NP. However, it is preferable to prevent the spacer 2 from jumping out of the pattern by adhering the spacer 2 to the electrode 1A via the heat sublimable adhesive 4. Further, it is preferable that the spacers 2 not stick to the mask M or the negative pattern NP, and before the electrodes 1B are overlapped, the spacers 2 protruding outside the pattern are removed by, for example, vacuum suction.

In the above method, it is extremely difficult to form a high-definition pattern by attaching the adhesive tape T, and there is a problem similar to the method of using the mask M for removing the adhesive tape T. Not practical.

In the above method, since the spacer 2 is adhered to the electrode by the heat sublimable adhesive 4, it is possible to prevent the spacer 2 from jumping out of the pattern.

In this method, as a method of adhering the heat sublimable adhesive 4 to the surface of the electrode 1A, a method of directly printing the heat sublimable adhesive 4 on the surface of the electrode 1A and a method of separately from the electrode 1A are used. The sublimable adhesive 4 is printed on the support 5 of
A method of transferring the heat sublimable pressure-sensitive adhesive 4 to the electrode or adhering the heat sublimable pressure-sensitive adhesive 4 together with the support 5 to the electrode is considered.

Among these methods, the method of directly printing the heat sublimable pressure-sensitive adhesive 4 on the surface of the electrode 1A includes a method in which the heat sublimable pressure-sensitive adhesive 4 printed on the surface of the electrode 1A causes the spacer 2 to be carried. However, it may be damaged before the other electrode 1B is overlapped.

If the heat sublimable adhesive 4 is damaged and the pattern is deformed or damaged, the spacer 2 cannot be arranged in a high-definition pattern.
It is necessary to dispose of them together or to print again after removing the scratched pattern, which is disadvantageous for cost reduction.

Therefore, in this embodiment, in the method of (1), the method of printing the heat sublimable pressure sensitive adhesive 4 on the support 5 different from the electrode 1A and transferring it from the support 5 to the surface of the electrode 1A is adopted. It

In this example, the electrode 1A to be joined is
As a method of supporting a large number of granular spacers 2 in a predetermined pattern on one or both of 1B via the heat sublimable pressure sensitive adhesive 4, the heat sublimable pressure sensitive adhesive 4 and the spacers 2 are gradually added to the electrode 1A. There are a method of supporting and a method of supporting simultaneously.

The heat sublimable adhesive 4 and the spacer 2 are provided on the electrode 1A.
As a method of supporting and in a stepwise manner, as shown in FIG. 7, after transferring the heat sublimable adhesive 4 to the entire surface of the electrode 1A, as shown in FIG. A method of arranging a large number of granular spacers 2 on a plane in a predetermined pattern using a mask M and adhering them, and as shown in FIG.
After transferring the heat sublimable pressure sensitive adhesive 4 formed in a predetermined pattern on the surface of the electrode 1A, as shown in FIG. 10, a large number of granular spacers 2 are arranged on the heat sublimable pressure sensitive adhesive 4 in a plane and adhered. The method of making it possible is considered.

Among these methods, it is preferable that the heat sublimable pressure sensitive adhesive 4 is adhered in a predetermined pattern in order to save the waste of materials. Particularly, as described later, the heat sublimable pressure sensitive adhesive 4 is adhered.
When the low-melting point bonding material 3 is mixed with the above, the work of removing the extra low-melting point bonding material 3 outside the pattern is omitted, and in order to prevent the deterioration of the electrical characteristics due to the low-melting point bonding material 3, the thermal sublimation adhesive is used. It is preferable to adhere the agent 4 in a predetermined pattern.

It is to be noted that a large number of granular spacers 2 are attached to the heat sublimable adhesive 4 having a predetermined pattern adhered to the electrode 1A.
In the case of using the mask M, it is possible to use a mask M having a predetermined pattern in order to limit the region to which the spacer 2 is adhered to within the pattern of the heat sublimable adhesive 4, Requires the mask M to be manufactured and the mask to be aligned and overlapped with the electrode 1A to which the heat sublimable adhesive 4 is adhered, which increases the number of steps.

Therefore, when the heat sublimation adhesive 4 is adhered to the electrode 1A in a predetermined pattern and then the spacer 2 is adhered to the heat sublimation adhesive 4, the heat sublimation property is eliminated without using the mask M. The spacers 2 are scattered on the electrodes to which the adhesive 4 is adhered, and the spacers 2 are applied to the pattern of the heat sublimable adhesive 4 by applying pressure.
It is recommended to adopt a method of collecting the extra spacers 2 outside the pattern by, for example, vacuum suction after adhering them.

By the way, the method of stepwise supporting the heat sublimable adhesive 4 and the spacer 2 on these electrodes 1A has a large number of steps, and is costly. Therefore, as shown in FIG. In addition, when the spacer 2 is adhered after the transfer of the heat sublimable adhesive 4, the spacer 2 is three-dimensionally bulged and a large gap is opened between the spacers 2 adhered to the surface of the heat sublimable adhesive 4, and the electrode 1A. There is a possibility that the insulating property between 1B may be reduced, or the spacer 2 may be adhered to the outside of the pattern so that the pattern accuracy may be reduced.

Therefore, in this embodiment, a method is adopted in which a large number of granular spacers 2 are supported in a predetermined pattern on one or both of the electrodes 1A and 1B to be joined via the heat sublimable adhesive 4. , FIG. 12, FIG. 13, or FIG.
As shown in FIG. 4, among these methods, the method of simultaneously supporting the heat sublimable adhesive 4 and the spacer 2 on the electrode 1A is adopted.

In the method shown in FIG. 12, the spacer transfer sheet S in which the spacer 2 is adhered to the layer of the heat sublimable adhesive 4 adhered to the support 5 is used.
Is superposed on the electrode 1A with the support 5 facing downward, and the heat sublimable adhesive 4 is adhered to the electrode 1A while the support 5 is inverted from one end side and peeled off.

In the method shown in FIG. 13, the spacer 2 is adhered to the layer of the heat sublimable adhesive 4 adhered to the support 5, and the layer of the spacer 2 is further adhered to the layer of the spacer 2. The spacer transfer sheet S in which the heat transfer sublimation adhesive sheet 4 is laminated is used, and the spacer transfer sheet S is superposed on the electrode 1A with the thermal sublimation adhesive agent 4 laminated later on the electrode 1A. Is peeled off.

Furthermore, in the method shown in FIG.
Is used, a spacer transfer sheet S in which a spacer 2 is mixed or a layer of the thermally sublimable pressure-sensitive adhesive 4 that has been pressed is adhered, and the spacer transfer sheet S is superposed on the electrode 1A with the support 5 facing upward. The support 5 is peeled off while the spacer 2 is mixed or the thermally sublimable pressure-sensitive adhesive 4 that has been pushed in is adhered.

[0172] In these methods, the heat sublimable adhesive 4 in which the support 5 is peeled off and then the spacer 2 is adhered
2 or the spacer 2 may be mixed, or the layer of the thermally sublimable pressure-sensitive adhesive 4 that has been pushed in may be superposed on the electrode 1A.

Among these methods, in the method shown in FIG. 12 or FIG. 13, it is possible to arrange the spacers 2 densely in a plane without carrying the heat sublimable adhesive 4 between the spacers 2 and carry them on the electrode 1A. Since it can be done, it is free from the point that there is no gap between the spacers 2 and the insulating property is not deteriorated.
The thermal sublimation adhesive 4 and the spacer 2 cannot be directly adhered to the electrode 1A by printing or the like at the same time, and the transfer from the support 5 is unavoidable.

Further, in the method of FIG. 12, since the heat sublimable adhesive 4 is not exposed on the opposite side of the electrode 1A, both electrodes 1A.
When joining 1B, the distribution of the low melting point bonding material 3 is different on both sides, the bonding strength between the electrodes 1A and 1B and the low melting point bonding material 3 is different, and there is a risk that one of the electrodes 1A and 1B will be easily peeled off. However, as shown in FIG. 13, this problem can be easily solved by laminating another heat sublimable adhesive 4 on the opposite side of the heat sublimable adhesive 4 adhered to the electrode 1A.

In the method shown in FIG. 14, a pattern can be formed by directly printing the heat sublimable adhesive 4 in which the spacer 2 is mixed with the electrode 1A without using the support 5 and forming the pattern.
Since the adhesive surface of the heat sublimable adhesive 4 is exposed on the side opposite to A, it is advantageous because the other electrode 1B can be adhered to the one electrode 1A via the heat sublimable adhesive 4, and particularly, When the low melting point bonding material 3 is mixed with the heat sublimable adhesive 4, it is advantageous in that the bonding structure of the electrodes 1A and 1B, the low melting point bonding material 3 and the spacer 2 can be the same on both sides.

However, in this case, since the thermally sublimable pressure sensitive adhesive 4 is interposed between the spacers 2, the spacing between the spacers 2 becomes large, and the insulating property deteriorates.
No method has so far been found that can solve this problem.

Therefore, in this embodiment, the method shown in FIG. 13 is adopted as a method for supporting the spacer 2 on the surface of the electrode 1A via the heat sublimable adhesive 4.

The low-melting-point bonding material 3 for bonding the electrode and the spacer 2 to be bonded to each other has an insulating property as an electrical property, and is softened or melted at a temperature lower than the softening point of the spacer 2 as a chemical property, and cooled. Therefore, it is necessary to solidify and easily bond to the electrodes 1A and 1B and the spacer 2 and to use a material that does not liberate or precipitate a good electrical conductor such as carbon or metal when softened or melted.

As long as these characteristics are satisfied, the low melting point bonding material 3
May be formed of an organic substance, but it is preferable to use an inorganic substance rather than an organic substance containing carbon that is liberated or precipitated for some reason.

Examples of the inorganic material used as the low melting point bonding material 3 include water glass and frit glass. In this example, the low melting point bonding material 3 made of powdery frit glass having excellent handleability. Is used.

The low melting point bonding material 3 also needs to be as little as possible from the pattern of the spacer 2 in order not to impair the predetermined electrical characteristics of the electrode. 3 is carried on the electrode 1A in the same pattern as that of the spacer 2.

Regarding the method of supporting the low melting point bonding material 3 on the electrode 1A in a predetermined pattern, the spacer 2 is used as the electrode 1
A method similar to the method of supporting a predetermined pattern on A can be considered, and when the spacer 2 is adhered to the surface of the heat sublimable adhesive 4, a low melting point bonding material is used on the surface of the heat sublimable adhesive 4. When the adhesive 3 is adhered, the low melting point bonding material 3 is filled between the spacers 2 adhered to the heat sublimable adhesive 4.

As a method of filling the low melting point bonding material 3 between the spacers 2 adhered to the heat sublimation adhesive 4, a method of filling a powdery or granular low melting point bonding material 3 between the spacers 2, A method of further firing the powdery or granular low melting point bonding material 3 filled between the spacers 2 can be considered.

In this embodiment, since the low melting point bonding material 3 is carried on the electrode 1A in the same pattern as the spacer 2 as easily as possible, the thermal sublimation adhesive 4 formed in the same pattern as the spacer 2 is used. The method of mixing the powdery low melting point bonding material 3 is adopted.

When the heat sublimable pressure sensitive adhesive 4, the low melting point bonding material 3 and the spacer 2 are adhered to the electrode 1A, they are adhered to the electrode 1A.
Although pressing against A is not essential in the method of the present invention, in order to increase the adhesive force to the electrode 1A and facilitate the peeling of the support 5, for example, using a silicon rubber roller R or the like from above the support 5, Alternatively, it is preferable to press the thermally sublimable pressure sensitive adhesive 4, the low melting point bonding material 3 and the spacer 2 peeled from the support 5 against the electrodes.

By thus supporting the spacer 2 on the electrode 1A via the heat sublimable adhesive 4, the spacer 2 is prevented from moving on the electrode 1A due to vibration, and the pattern accuracy is improved.

The support 5 should be removed or exhausted by the time the electrode 1A and the spacer 2 are bonded by the low melting point bonding material 3 in order to improve the gap accuracy and to obtain the required electrical characteristics and bonding strength. Is preferred.

As a method of removing or exhausting the support 5 by the time when the electrode 1A and the spacer 2 are bonded by the low melting point bonding material 3, the support 5 is thermally sublimed before the other electrode 1B is superposed. A method of peeling from the adhesive 4, the low melting point bonding material 3 and a large number of granular spacers 2, and a method of forming the support 5 with a resin having a thermal sublimation property and sublimating the low melting point bonding material 3 at the stage of sintering. You could think so.

In the method of peeling the support 5, the electrical properties of the support such as resistance and dielectric constant are not particularly problematic, but the mechanical properties are such that they are not broken by care during handling. It is necessary to have a sufficient tensile strength and sufficient rigidity to maintain the shape retention property, and a certain degree of elasticity.

The shape of the support 5 is not particularly limited, but for convenience of handling, in order to prevent the electrode contacting the support 5 from being deformed or scratched during transfer, a film or sheet is used. , Foil, thin plate, tape,
It is preferably formed into a shape such as a ribbon shape that can be easily and flexibly deformed.

However, when a large number of supports 5 are two-dimensionally arranged at the same time or sequentially on the electrodes and the heat sublimable adhesive 4, the low melting point bonding material 3 and a large number of granular spacers 2 are transferred in sequence, Since it may be difficult to ensure the pattern accuracy of the sublimable pressure-sensitive adhesive 4, the low-melting-point bonding material 3, and the large number of granular spacers 2, the support 5 is at least the electrode 1A.
It is preferable to use one having a width of not less than the short side.

Further, the support 5 needs to have a certain film thickness in order to prevent the support 5 from being deformed or wrinkled during handling such as transfer, but so far, for example, polyethylene terephthalate. When using a film made of polyvinyl alcohol or polyvinyl alcohol,
Good results have been obtained with a film thickness of about 5 μm.

Although it is possible to form the support 5 in a pattern corresponding to the pattern of a large number of granular spacers 2, for example, in this case, the support 5 is deformed or wrinkled during handling. However, it is necessary to keep in mind that it becomes difficult to maintain an accurate pattern.

The material of the support 5 is not particularly limited as long as it is a material to which the heat sublimable pressure sensitive adhesive 4 is releasably adhered.
Although metal, synthetic resin or the like can be used, in this embodiment, a readily available and inexpensive synthetic resin such as film-like polyvinyl alcohol or polyethylene terephthalate is used.

When the support 5 is made of a heat sublimable synthetic resin, the heat sublimable adhesive 4 and the low melting point bonding material 3 are used.
Also, the support 5 together with the spacer 2 can be adhered to the electrode via the heat sublimable pressure-sensitive adhesive 4, and the time and effort for peeling the support 5 can be saved.

The heat sublimable adhesive 4 preferably has adhesiveness with the support 5, the spacer 2 and the electrode 1A, and further has adhesiveness with the low melting point bonding material 3 and the spacer 2. However, it is not particularly limited as long as it can be sublimated at a temperature equal to or lower than the firing temperature described below without being carbonized.

The heat-sublimable adhesive 4 is used alone or in the low melting point bonding material 3 in the temperature range below the sublimation point.
It is necessary to have a viscosity or thixotropy to such an extent that a given pattern can be retained without being washed away, in a state of being mixed with the low melting point bonding material 3 and the spacer 2. is there.

Examples of such a heat-sublimable pressure-sensitive adhesive 4 include acrylic resins having a glass transition temperature of 40 ° C. or lower, such as isodecyl methacrylate and a copolymer of isobutyl methacrylate and 2-ethylhexyl acrylate. As.

Since the heat sublimable adhesive 4 is sublimated and removed when the electrodes and the spacers 2 are bonded by the low melting point bonding material, their electrical characteristics are not a problem.

As described above, after transferring the low melting point bonding material 3 and the spacer 2 to the one electrode 1A to be bonded by the transfer through the heat sublimable pressure sensitive adhesive 4, as shown in FIG. , The other electrode 1B to be joined is overlaid.

This superposition is performed while aligning the positions of both electrodes using, for example, a pin or a ruler. Then, in the method of FIG. 13 in which the heat sublimable adhesive 4 is exposed on both surfaces of the spacer 2, or in the case of the method of FIG. 14, the other electrode 1B, the low melting point bonding material 3 and the spacer 2 are heat sublimated. Both electrodes are provisionally joined by adhering via the adhesive 4, and both electrodes 1A and 1B due to vibration and the low melting point joining material 3
Further, it is possible to prevent the positional deviation from the spacer 2 and further improve the pattern accuracy.

When the heat sublimable adhesive 4, the low melting point bonding material 3 and the spacer 2 carried on one electrode 1A of the other electrode 1B are overlapped with each other, the electrodes 1A and 1B are brought close to each other in the direction in which they are brought close to each other. Although it is free to apply pressure to or not, the temporary bonding of the spacer 2 and the electrodes 1A and 1B with the heat-sublimable adhesive 4 is strengthened, and the spacer 2 and the electrodes 1A and 1B are bonded to each other. In order to eliminate the gap, it is preferable to apply such pressure at the time of stacking.

This electrode bonding method is described in, for example, FIG.
As shown in FIG. 18, the present invention can be applied to the case where three or more electrodes 1 are joined, and when joining three or more electrodes 1, as shown in FIG. Electrode 1 carrying low melting point bonding material 3 and spacer 2 via
A is stacked in order, and the heat sublimable adhesive 4, the low melting point bonding material 3, and the electrode 1B that does not carry the spacer 2 are stacked on the uppermost stage (or the lowermost stage), or as shown in FIG. The electrode 1A carrying the low melting point bonding material 3 and the spacer 2 via the adhesive 4 and the electrode 1B not carrying the thermal sublimation adhesive 4, the low melting point bonding material 3 and the spacer 2 may be alternately stacked. .

Among these methods, the method shown in FIG. 18 is recommended for easy handling.

As described above, a large number of granular spacers 2 having a predetermined grain size are arranged in a plane between the electrodes 1 (1A and 1B) to be bonded to each other in a predetermined pattern, and then a predetermined firing temperature is set. The low melting point bonding material 3 is softened by flowing into the space between the spacers 2 by heating at 1, and the heat sublimable adhesive 4 is sublimated and removed, and then cooled to cool the low melting point bonding material 3 Is solidified and the electrodes 1A and 1B and the spacer 2 are joined (FIG. 1).

Whether or not pressure is applied to both electrodes 1A and 1B in the direction of bringing them closer to each other at the time of heating is arbitrary, but the gap accuracy is eliminated by eliminating the gap between the spacer 2 and both electrodes 1A and 1B. In order to increase the temperature, it is preferable to apply such pressure during heating.

The heating temperature, that is, the firing temperature is higher than the sublimation point of the heat sublimable adhesive 4 (and the heat sublimable synthetic resin forming the support 5) and the softening point of the low melting point bonding material 3, and the spacer 2 It should be set lower than the softening point of.

However, it is not necessary to heat the low melting point bonding material 3 to a temperature at which the low melting point bonding material 3 is completely melted and liquefied. Rather, the low melting point bonding material 3 largely flows out of the pattern due to the liquefaction of the low melting point bonding material 3. In order to prevent this, it is preferable to set the temperature close to the softening point of the low melting point bonding material 3.

In this embodiment, since the low melting point bonding material 3 is made of frit glass and the spacer 2 is made of soda lime glass, the firing temperature is higher than the softening point (about 400 ° C.) of the frit glass, It is set at 500 ° C, which is lower than the softening point of lime glass (about 1000 ° C). Moreover, the heating time was appropriately empirically determined according to the addition amount of the low melting point bonding material 3 and the like.

Of course, the heating may be carried out using a batch type heating furnace or a continuous type heating furnace.

Cooling after heating was performed by natural heat dissipation, but it is also possible to perform forced cooling by blowing cooling air, for example. However, due to the difference in coefficient of thermal expansion, the electrodes 1A and 1B are cooled during cooling.
It is preferable to cool as slowly as possible in order to prevent the peeling of the low melting point bonding material 3 and the generation of cracks in the low melting point bonding material 3 and the spacers 2. In some cases, it may be possible to cool while exposing to a slight warm air. .

Next, the spacer transfer sheet S and the manufacturing method thereof will be specifically described with reference to the drawings.
The points that overlap with the description of the electrode bonding method according to the embodiment of the present invention will be omitted as much as possible in order to avoid duplication.

The spacer transfer sheet S is, for example, as shown in FIG.
2, as shown in FIG. 13 or FIG. 14, a support 5 and a heat sublimable adhesive 4 that is releasably adhered to the support 5,
A low melting point bonding material 3 carried on the heat sublimable adhesive 4,
The heat-sublimable adhesive 4 is provided with a large number of granular spacers 2 supported in a plane in a predetermined pattern.

The low melting point bonding material 3 may be adhered to the surface of the heat sublimable pressure sensitive adhesive 4 adhered to the support 5, but in these examples, a required amount of the low melting point bonding material 3 is carried. For this purpose, it is admixed with the heat sublimable pressure sensitive adhesive 4 adhered to the support 5 and adhered to the support 5 as an adhesive bonding material 4 + 3.

The spacer 2 has the structure shown in FIG. 12 or FIG.
In the spacer transfer sheet S shown in FIG.
3 is adhered to the surface of the layer, and in the embodiment shown in FIG. 14, it is wrapped in the layer of the adhesive bonding material 4 + 3.

That is, in the embodiment of the method of manufacturing the spacer transfer sheet S shown in FIGS. 12 and 13, as shown in FIG. 20, the heat sublimable adhesive 4 and the low melting point bonding material 3 are mixed and adhesively bonded. A common procedure in which the material 4 + 3 is formed, then the adhesive bonding material 4 + 3 is adhered to the support 5 in a predetermined pattern, and then the spacers 2 are planarly arranged and adhered to the pattern of the adhesive bonding material 4 + 3. Is included.

In the embodiment of the method for manufacturing the spacer transfer sheet S shown in FIG. 13, after this, a procedure for further adhering another adhesive bonding material 4 + 3 adhered to the release paper 6 to the spacer 2 is added.

The release paper 6 is formed by applying the adhesive bonding material 4 to the electrode 1A.
Before sticking +3 and spacer 2, all peel off,
The adhesive bonding material 4 + 3 and the spacer 2 can be peeled off while adhering to the electrode 1A.

Since the release paper 6 is not particularly limited in its material, the same material as the support 5 is used here. Therefore, when the pattern of the adhesive bonding material 4 + 3 formed on the support body 5 and the pattern of the adhesive bonding material 4 + 3 formed on the release paper 6 are the same, two supports having the same pattern of the adhesive bonding material 4 + 3 are formed. The body 5 should be prepared.

The adhesive bonding material 4 + 3 adhered to the support 5 or the release paper 6 is preferably adhered to a uniform predetermined thickness, for example, a doctor blade, a roll coater,
It may be adhered to the support 5 or the release paper 6 using a spray or the like, or printed on the support 5 or the release paper 6 by a known printing method such as a screen, letterpress, intaglio, or gravure. In each of the above examples, the adhesive bonding material 4+
Support 3 (and release paper 6) by forming 3 in a predetermined pattern
A screen printing method was adopted as a method of sticking to the.

The pattern width of the adhesive bonding material 4 + 3 is, for example, if the particle diameter of the spacer 2 is d and the integer of 0 or 1 or more is n,

[0222]

[Formula 1]

The film thickness is determined in consideration of the required blending amount of the low melting point bonding material 3.

In the spacer transfer sheet S shown in FIG. 12 or FIG. 13, a part of the low melting point bonding material 3 may be adhered to the surface of the adhesive bonding material 4 + 3 or filled between the spacers 2. However, in order to allow the spacers 2 to be closely adhered to the entire surface of the adhesive bonding material 4 + 3, in the embodiment shown in FIG. 12, the entire amount of the low melting point bonding material 3 is mixed with the layer of the adhesive bonding material 4 + 3, In the embodiment shown in FIG. 13, a half of each of the adhesive bonding material 4 + 3 directly adhered to the support 5 and another layer of the adhesive bonding material 4 + 3 laminated on the adhesive bonding material 4 + 3 via the spacers 2 is used. Are mixed.

In the method of manufacturing the spacer transfer sheet S according to the embodiment shown in FIG. 12 or FIG. 13, after the adhesive bonding material 4 + 3 is adhered to the support 5, the adhesive bonding material 4 + 3 is adhered.
When the spacer 2 is adhered to the spacer 2, it is sufficient that the spacer 2 is adhered in a predetermined pattern, and the spacer 2 does not prevent the spacer 2 from being three-dimensionally overlapped and adhered to the adhesive bonding material 4 + 3 as shown in FIG. 21, for example. .

However, when the spacer 2 is three-dimensionally overlapped and adhered to the adhesive bonding material 4 + 3, in order to improve the gap accuracy, the electrode 1 (1A · 1B) is pressed during sintering to form a three-dimensional shape of the spacer 2. It is necessary to eliminate such overlapping, and this pressure may cause the spacer 2 to stick out the pattern and reduce the pattern accuracy.

Therefore, in these methods of manufacturing the spacer transfer sheet S, the spacers 2 are formed in a predetermined pattern.
Moreover, it is preferable that the adhesive bonding materials 4 + 3 are arranged in a plane and adhered to each other.

The following two methods are conceivable as a method of adhering a large number of granular spacers 2 to the adhesive bonding material 4 + 3 adhered to the support so as to be arranged in a predetermined pattern in a plane.

In the first method, as shown in FIG. 22, for example, a large number of granular spacers 2 are filled in a groove g formed in a predetermined pattern so as to be two-dimensionally arranged, and as shown in FIG. This is a method in which the support 5 to which the adhesive bonding material 4 + 3 has been adhered is covered from above and the pressure is applied to the support 5 with the adhesive bonding material 4 + 3 facing down.

In the first method, the depth of the groove g is not particularly limited. However, if the depth of the groove g is set to be equal to or smaller than the grain size of the spacer 2, the groove g and the spacer 2 are raised on the groove g. The spacers 2 can be arranged in a predetermined pattern two-dimensionally and densely without surely overlapping the spacers three-dimensionally by sliding off with a brush, a blade, or the like.
Further, outside the predetermined pattern, that is, the extra spacer 2 in the groove g can be easily removed by cleaning with a brush or the like.
As a result, it is possible to prevent the spacer 2 from remaining outside the groove g and adhere to the adhesive bonding material 4 + 3, thereby improving the pattern accuracy.

In this first method, the adhesive bonding material 4
Even if +3 is adhered to the entire surface of the support body 5, the spacers 2 are closely arranged in a predetermined pattern in a plane and the adhesive bonding material 4 is formed.
Although it can be adhered to +3, if the method of covering the adhesive bonding material 4 + 3 formed in a predetermined pattern from above is adopted, the material cost can be saved and the spacer 2 can be surely adhered outside the predetermined pattern. It is possible to prevent this, and it is possible to further improve the pattern accuracy.

In this first method, as shown in FIG. 24, the pressure-sensitive adhesive bonding material 4 + 3 is pushed from between the spacers 2 to the bottom of the groove g so that the spacer 2 is placed inside the pressure-sensitive adhesive bonding material 4 + 3. You may be able to push it in.

In this case, even if another adhesive bonding material 4 + 3 is not laminated, the adhesive surface is exposed on the surface opposite to the support 5, and transfer to the electrode 1A is facilitated. Further, in this case, in order to prevent foreign matter from adhering to the adhesive surface on the side opposite to the support 5 and the pattern from being damaged, immediately after the spacer 2 and the adhesive bonding material 4 + 3 are projected from the groove g. It is preferable that the release paper 6 is adhered to the opposite side of the support 5.

A second method of adhering a large number of granular spacers 2 to the adhesive bonding material 4 + 3 adhered to the support 5 so as to be arranged in a plane in a predetermined pattern is as shown in FIG.
The support 5 to which the adhesive bonding material 4 + 3 is adhered is attached to the adhesive bonding material 4
+3 is expanded and a mask M in which a predetermined pattern is cut out is placed on it, and a large number of granular spacers 2 are filled in the pattern so as to be arranged in a plane. This is a method of applying pressure from above.

In the second method, the extra spacer 2 remains on the spacer 2 adhered to the adhesive bonding material 4 + 3, and when another adhesive bonding material 4 + 3 is further laminated, the layer of the spacer 2 becomes a support member. The layer of the spacer 2 adhered to the adhesive bonding material 4 + 3 on the 5 side and the adhesive bonding material 4 + 3 laminated later
The layer of the spacer 2 adhered to the layer 2 may be separated and peeled off. Further, this extra spacer 2 also causes a decrease in gap accuracy and pattern accuracy.

However, these problems are caused by the fact that the spacer 2 which is sprayed on the mask M and placed on the thermally sublimable adhesive or the spacer 2 adhered to the adhesive bonding material 4 + 3 is blown off by air, or the vacuum is applied. After removing from the mask M by sucking or lightly sweeping with a brush, the spacer 2 in the pattern is pressed and the spacer 2 and the heat sublimation adhesive, or
This can be solved by increasing the adhesive strength with the adhesive bonding material 4 + 3.

In the second method, the adhesive bonding material 4+
It is easy for the spacers 2 to be three-dimensionally overlapped and placed on top of the spacers 3, and a large gap may be created between the spacers 2 that are adhered to the adhesive bonding material 4 + 3 during pressurization, which may reduce the insulation properties of the spacer 2 layers.

In addition, in the second method, the extra spacers 2 remaining on the mask M when the mask M is removed are spilled out from the pattern holes of the mask M, and are formed on the side surface of the adhesive bonding material 4 + 3 formed in the pattern. Adhesive or support 5
There is a risk that the accuracy of the pattern will be reduced by sticking to the adhesive bonding material 4 + 3 on the entire surface of the adhesive outside the pattern, and the spacer 2 spilled between the patterns of the adhesive bonding material 4 + 3 must be removed. Become.

However, in order to solve these problems, the extra spacers 2 are easily removed from the mask M by, for example, vacuum suction before removing the mask M.

In the spacer transfer sheet S shown in FIG. 14, as shown in FIG. 26, the mixture C prepared by mixing the above-mentioned heat sublimable adhesive 4, the low melting point bonding material 3 and the spacer 2 is adhered to the support 5. Alternatively, as shown in FIG. 24, it is manufactured by pushing the spacer 2 into the adhesive bonding material 4 + 3 adhered to the support 5.

As shown in FIG. 27, this spacer transfer sheet S is provided on the opposite side of the support 5 in order to prevent foreign matter from adhering to the adhesive surface on the side opposite to the support 5 and the pattern from being damaged. It is preferable to adhere release paper 6 to the side.

As shown in FIG. 12, FIG. 13 or FIG. 14, in the embodiment in which the low melting point bonding material 3 is mixed with the heat sublimable adhesive 4, an appropriate amount of the low melting point bonding material 3 is used. Is advantageous because the low melting point bonding material 3 can be formed simultaneously with the pattern formation of the heat sublimable pressure sensitive adhesive 4. Further, the adhesive surface on the surface of the heat sublimable adhesive 4 is not narrowed by the adhesion of the low melting point bonding material 3, and the spacers 2 arranged in a plane in a predetermined pattern are adhered at high density to form the spacer 2 layer. It is also advantageous in that the insulating property can be improved.

When the powdery or granular solid low melting point bonding material 3 is carried on the layer of the spacer 2,
The low melting point bonding material 3 is filled between the spacers 2, and the particle size of the powdery or granular low melting point bonding material 3 is as shown in FIG. The diameter of the spacer 2 so that
It is preferably ¼ or less of d.

When the low melting point bonding material 3 is carried on the layer of the spacer 2, the spacer 2 of the low melting point bonding material 3 being handled is handled.
Of the low melting point bonding material 3 is filled with the spacer 2 layer of the low melting point bonding material and then sintered, or adhered to the support 5 (or the heat sublimation property) in order to prevent it from flowing out or falling off. Another layer of the adhesive bonding material 4 + 3 (or the heat sublimable adhesive 4) can be provided on the side opposite to the layer of the adhesive 4).

Further, although not shown, the spacer 2 is mixed with the heat sublimable pressure sensitive adhesive 4 or the adhesive bonding material 4 + 3 which is partially adhered to the support 5, and the remaining spacers 2 are heated to the same temperature. Sublimable adhesive 4 or adhesive bonding material 4 + 3
Can be adhered to, or mixed with the heat sublimable adhesive 4, or another heat sublimable adhesive 4 that is further adhered to the adhesive bonding material 4 + 3, or the adhesive bonding material 4 + 3.

Further, the spacer 2 has a part of the heat sublimable adhesive 4 which is adhered to the support 5, or the adhesive bonding material 4.
+3, and the remaining spacers 2 can be mixed with the heat sublimable adhesive 4 or another heat sublimable adhesive 4 or the adhesive bonding material 4 + 3 which is further adhered to the adhesive bonding material 4 + 3.

In these constitutions, the spacer 2 is mixed with another heat sublimable adhesive 4 or another adhesive bonding material 4 + 3 which is laminated on the above-mentioned adhesive bonding material 4 + 3 (or the heat sublimable adhesive 4). As for the composition, the composition tends to be complicated, and the number of manufacturing steps increases, but for example, when the spacer 2 is mixed with another heat sublimable adhesive 4 (or the adhesive bonding material 4 + 3),
Adhesive surfaces will be provided on both sides of the spacer 2 so that both electrodes 1 (1A and 1B) that join the spacers 2 to each other
You will be able to stick to.

Since the spacer transfer sheet S shown in FIG. 13 or FIG. 14 has the adhesive surface on both sides of the spacer 2, the heat sublimable adhesive 4, the low melting point bonding material 3, and the low melting point bonding material 3 from the support 5 to the electrode 1A. When the spacer 2 is transferred, the pattern can be smoothly transferred without disturbing the pattern, the transfer accuracy can be improved, and the support 5 can be peeled off to adhere the other electrode 1B. , Heat sublimation adhesive 4
By adhering the spacer 2 to both electrodes 1A and 1B via the spacers, the positional displacement of the spacer 2 can be prevented more reliably and the pattern accuracy can be improved.

Also, the spacer transfer sheet S shown in FIG.
Moreover, the pattern formation of the spacer 2 and the low melting point bonding material 3 can be performed simultaneously with the pattern formation of the heat sublimable pressure-sensitive adhesive 4, and the advantage that the number of manufacturing steps can be reduced is obtained. However, the adhesive bonding material 4 + 3 is interposed between the spacers 2 to form a gap between the spacers, which lowers the insulating property.

Further, the spacer transfer sheet S shown in FIG.
Another heat-sublimable adhesive 4 instead of another adhesive bonding material 4 + 3
Although it is conceivable to provide the above, in order to make the bonding strength between both electrodes 1 (1A and 1B) and the low melting point bonding material 3 uniform, it is preferable to stack the above-mentioned other adhesive bonding material 4 + 3.

In the spacer transfer sheet S according to each of the above embodiments, the support 5 can be made of a heat sublimable synthetic resin.
It is not necessary to peel the support 5 as shown in FIG. 14 to improve workability, and the support 5 can be used when the heat sublimable adhesive 4, the low melting point bonding material 3 and the spacer 2 are transferred. The pattern of the heat sublimable adhesive 4, the low melting point bonding material 3, the spacer 2, etc. is shredded along with the peeling of
The possibility of being disturbed can be eliminated, and the pattern accuracy can be further improved.

[0252]

As described above, according to the method of manufacturing the spacer transfer sheet of the present invention, the support, the heat sublimable adhesive which is releasably adhered to the support, and the heat sublimation property. It is possible to obtain a spacer transfer sheet of the present invention comprising a low melting point bonding material carried on an adhesive and a large number of granular spacers carried on the heat sublimable adhesive in a state of being arranged in a plane in a predetermined pattern. it can.

Further, in the spacer transfer sheet of the present invention, the heat sublimable adhesive adhered to the support carries the low melting point bonding material and a large number of granular spacers arranged in a plane in a predetermined pattern. By adhering or transferring the electrode to be bonded to the heat sublimable adhesive, the low melting point bonding material and the predetermined pattern can be planarized on the electrode easily and in a short time with high accuracy. It is possible to support a large number of granular spacers arranged side by side. Therefore, after supporting the low melting point bonding material and a large number of granular spacers arranged in a plane in a predetermined pattern on the electrode, the other electrodes to be bonded to each other are overlapped, and the low melting point bonding material is sintered, By sublimating the heat sublimable adhesive, the electrodes and the spacers can be bonded with a low melting point bonding material.

In the electrode bonding method of the present invention, a large number of granular spacers are used to provide gaps between the electrodes. For example, glass beads or the like which are generally manufactured may be used as the spherical spacers, so that warpage or The manufacturing cost can be reduced compared to a high-precision glass rod that does not twist, and
Since there is almost no possibility that the manufactured spacer will become unusable due to bending or the like, the yield is good and the cost can be further reduced.

Further, since the low melting point bonding material used in the electrode bonding method of the present invention may be water glass, powder or granular frit glass, etc., it is a highly accurate rod-shaped low melting point bonding material free from warpage and twisting. It can be manufactured at a lower cost compared to, and there is no danger of it becoming unusable due to breakage,
The yield is good and the cost can be further reduced.

Further, in the electrode joining method of the present invention, since a large number of granular spacers are arranged in a plane in a predetermined pattern, the gap accuracy can be improved, high quality products can be produced stably, and, for example, By using the spacer transfer sheet of the present invention, it is possible to arrange a large number of granular spacers in a predetermined pattern on one electrode that is easily joined to each other in a predetermined pattern, which is optimal for mass production.

[Brief description of drawings]

FIG. 1 is a schematic sectional view for explaining an electrode joining method of the present invention.

FIG. 2 is a schematic cross-sectional view for explaining one method of arranging spacers on an electrode in a plane in the method of the present invention.

FIG. 3 is a schematic sectional view for explaining another method of arranging the spacers on the electrodes in a plane in the method of the present invention.

FIG. 4 is a schematic cross-sectional view for explaining another method of arranging spacers on an electrode in a plane in the method of the present invention.

FIG. 5 is a schematic sectional view for explaining still another method of arranging the spacers on the electrodes in a plane in the method of the present invention.

FIG. 6 is a schematic sectional view for explaining another method of arranging the spacers on the electrodes in a plane in the method of the present invention.

FIG. 7 is a schematic cross-sectional view for explaining one method of adhering a heat sublimable adhesive to an electrode in the method of the present invention.

FIG. 8 is a schematic cross-sectional view for explaining one method of adhering the spacer to the heat sublimable adhesive adhered to the electrode in the method of the present invention.

FIG. 9 is a schematic sectional view for explaining another method of adhering a heat sublimable adhesive to an electrode in the method of the present invention.

FIG. 10 is a schematic cross-sectional view for explaining another method of adhering the spacer to the heat sublimable adhesive adhered to the electrode in the method of the present invention.

FIG. 11 is a schematic cross-sectional view for explaining the adhesion state of the spacer to the heat sublimable adhesive in the method of the present invention.

FIG. 12 is a schematic cross-sectional view for explaining an example of the method of the present invention using the spacer transfer sheet according to the embodiment of the present invention.

FIG. 13 is a schematic cross-sectional view for explaining an embodiment of the method of the present invention using a spacer transfer sheet according to another embodiment of the present invention.

FIG. 14 is a schematic sectional view for explaining an embodiment of the method of the present invention using a spacer transfer sheet according to another embodiment of the present invention.

FIG. 15 is a schematic cross-sectional view for explaining a state before firing in an example of the method of the present invention using the spacer transfer sheet according to an example of the present invention.

FIG. 16 is a schematic cross-sectional view for explaining a state before firing in an embodiment of the method of the present invention using a spacer transfer sheet according to another embodiment of the present invention.

FIG. 17 is a schematic cross-sectional view for explaining an embodiment of the method of the present invention in which three electrodes are joined using a spacer transfer sheet according to another embodiment of the present invention.

FIG. 18 is a schematic cross-sectional view for explaining an embodiment of the method of the present invention in which three electrodes are joined using a spacer transfer sheet according to another embodiment of the present invention.

FIG. 19 is a schematic cross-sectional view for explaining another embodiment of the method of the present invention in which three electrodes are joined using a spacer transfer sheet according to another embodiment of the present invention.

FIG. 20 is a flow chart of a method for manufacturing a spacer transfer sheet according to an embodiment of the present invention and a spacer transfer sheet according to another embodiment.

FIG. 21 is a schematic cross-sectional view for explaining the adhesive state of the spacer to the heat sublimable adhesive in the method of the present invention.

FIG. 22 is a schematic cross-sectional view showing a method of arranging spacers in a predetermined pattern in a method of manufacturing a spacer transfer sheet according to one embodiment of the present invention and a spacer transfer sheet according to another embodiment of the present invention.

FIG. 23 is a schematic cross-sectional view showing one method of adhering a spacer to an adhesive bonding material in a method of manufacturing a spacer transfer sheet according to an embodiment of the present invention and a spacer transfer sheet according to another embodiment of the present invention. .

FIG. 24 is a schematic cross-sectional view showing another method of adhering the spacer to the adhesive bonding material in the manufacturing method of the spacer transfer sheet according to one embodiment of the present invention and the spacer transfer sheet according to another embodiment. is there.

FIG. 25 is a schematic cross-sectional view showing another method of adhering a spacer to an adhesive bonding material in a method of manufacturing a spacer transfer sheet according to an embodiment of the present invention and a spacer transfer sheet according to another embodiment of the present invention. Is.

FIG. 26 is a flow chart of a method of manufacturing a spacer transfer sheet according to another embodiment of the present invention.

FIG. 27 is a schematic sectional view of a spacer transfer sheet according to another embodiment of the present invention.

FIG. 28 is an explanatory view for explaining the particle size design of the low melting point bonding material when the powdery low melting point bonding material is carried on the spacer layer in the spacer transfer tape and the manufacturing method thereof according to the present invention. is there.

FIG. 29 is an exploded perspective view of FIG. 29CFP.

FIG. 30 is an explanatory diagram of a conventional electrode bonding method before sintering a low melting point bonding material.

FIG. 31 is an explanatory diagram after sintering a low melting point bonding material in a conventional electrode bonding method.

[Explanation of symbols]

 1, 1A, 1B Electrode 2 Spacer 3 Low melting point bonding material 4 Thermal sublimation adhesive 4 + 3 Adhesive bonding material 5 Support 6 Release paper M Mask NP Negative pattern T Adhesive tape a Opening section g Groove

Claims (32)

[Claims] 1. A plurality of granular spacers having a predetermined grain size are arranged in a plane in a predetermined pattern between electrodes to be bonded to each other, and the electrodes and the spacers are bonded with a low melting point bonding material. Electrode bonding method. 2. The electrode bonding method according to claim 1, wherein unevenness having a predetermined pattern is formed on the electrodes to be bonded, and the recesses are provided with spacers arranged in a plane. 3. The electrode bonding method according to claim 1, wherein a mask having a predetermined pattern cut out is placed on the surfaces of the electrodes to be bonded, and the spacers are arranged in a plane in the pattern. 4. A negative pattern having a thermal sublimation property, which is sublimated by heating at a predetermined temperature or lower, is formed on the surfaces of electrodes to be joined, and a spacer is filled in a pattern formed between the negative patterns. The electrode bonding method according to claim 1. 5. The adhesive tape is attached to the surfaces of the electrodes to be joined to form irregularities having a predetermined pattern, and the recesses formed between the adhesive tapes are filled with spacers. The electrode joining method according to. 6. A plurality of granular spacers are arranged in a plane in a predetermined pattern on a surface of an electrode to be bonded via a heat sublimable adhesive, and the surface of the electrode is bonded via the heat sublimable adhesive. The low melting point bonding material is carried in a predetermined pattern, the low melting point bonding material is sintered, and the thermally sublimable adhesive is sublimated to bond these electrodes and spacers with the low melting point bonding material. The electrode bonding method according to claim 1. 7. A support, which is separate from the electrode, carries a large number of granular spacers and a low melting point bonding material, which are arranged in a plane in a predetermined pattern, via a heat sublimable adhesive, and this support is used. By transferring the thermal sublimation adhesive, the spacer and the low melting point bonding material to one of the electrodes to be bonded, a large number of granular spacers and the low melting point bonding material are bonded to one of the electrodes to be bonded via the thermal sublimation adhesive. 7. The electrode bonding method according to claim 6, wherein and are carried in a predetermined pattern. 8. A support made of a heat-sublimable resin is supported by a plurality of granular spacers closely arranged in a predetermined pattern and a low-melting-point bonding material via a heat-sublimable adhesive, and bonded. By adhering a spacer, a low melting point bonding material and a support to one of the electrodes via the heat sublimation adhesive,
The electrode bonding method according to claim 6, wherein a large number of granular spacers and a low melting point bonding material are carried in a predetermined pattern on one of the electrodes to be bonded via a heat sublimable adhesive. 9. A support, a heat sublimable adhesive which is releasably adhered to the support, a low melting point bonding material carried on the heat sublimable adhesive, and a predetermined amount for the heat sublimable adhesive. A plurality of granular spacers carried in a state of being arranged in a plane in the pattern of 1. 10. The spacer transfer sheet according to claim 9, wherein a part or all of the low melting point bonding material is mixed with the heat sublimation adhesive. 11. The spacer transfer sheet according to claim 9, wherein a part or all of the low melting point bonding material is filled between the spacers adhered by the heat sublimation adhesive. 12. The spacer transfer sheet according to claim 11, wherein the low-melting-point bonding material is sintered. 13. The spacer transfer sheet according to claim 9, wherein a part or all of the spacer is mixed with the heat sublimation adhesive. 14. The spacer transfer sheet according to claim 9, wherein a part or all of the spacer is adhered to the surface of the heat-sublimable adhesive. 15. The spacer transfer sheet according to claim 9, wherein a heat sublimable pressure-sensitive adhesive is arranged on the surface opposite to the support. 16. The spacer transfer sheet according to claim 15, wherein a release paper that is releasably attached is provided on the surface opposite to the support. 17. The spacer transfer sheet according to claim 16, wherein the support is a peelable film or sheet. 18. The spacer transfer sheet according to claim 9, wherein the support is made of a heat sublimable synthetic resin. 19. A heat-sublimable pressure-sensitive adhesive or a pressure-sensitive adhesive bonding material obtained by mixing a heat-sublimable pressure-sensitive adhesive and a low-melting-point bonding material is adhered to a support, and then the heat-sublimable pressure-sensitive adhesive or the pressure-sensitive adhesive bonding material. A method for manufacturing a spacer transfer sheet, characterized in that a large number of granular spacers are adhered to a predetermined pattern. 20. The method of manufacturing a spacer transfer sheet according to claim 19, wherein the heat sublimable adhesive or the adhesive bonding material is formed in a predetermined pattern. 21. The method for manufacturing a spacer transfer sheet according to claim 19, wherein the spacers are arranged in a plane in a predetermined pattern and adhered to the heat sublimable adhesive or the adhesive bonding material. 22. A groove formed in a predetermined pattern is filled with a large number of granular spacers so as to be arranged in a plane, and a heat sublimable adhesive or an adhesive bonding material is placed on the large number of the granular spacers. The heat-sublimable pressure-sensitive adhesive, or the pressure-sensitive adhesive bonding material is covered, and the heat-sublimable pressure-sensitive adhesive or the pressure-sensitive adhesive bonding material is bonded to the large number of granular spacers by pressing. Item 22. A method for manufacturing a spacer transfer sheet according to any one of Items 19 to 21. 23. A low-melting-point bonding material is filled between a plurality of spacers arranged in a pattern, and then a heat-sublimable adhesive or a support adhered with the adhesive bonding material is covered. 22. A method for manufacturing a spacer transfer sheet according to item 22. 24. The low-melting-point bonding material filled between the spacers is sintered and then covered with a heat-sublimable adhesive or a support having the adhesive bonding material adhered thereto.
A method for manufacturing the spacer transfer sheet according to [4]. 25. A heat-sublimable pressure-sensitive adhesive or a support to which a pressure-sensitive adhesive bonding material is adhered is spread with the heat-sublimable pressure-sensitive adhesive or the pressure-sensitive adhesive bonding material facing upward, and a predetermined pattern is cut out on it. A mask is placed, and a large number of granular spacers are filled in the pattern so that the plurality of granular spacers are arranged in a plane. After that, pressure is applied to the thermal sublimation adhesive or the adhesive bonding material to form a large number of granular spacers. 22. The method of manufacturing a spacer transfer sheet according to claim 19, wherein a spacer or a mixture of a large number of granular spacers and a low melting point bonding material is adhered. 26. The method for manufacturing a spacer transfer sheet according to claim 25, wherein the pattern is filled with a low melting point bonding material at the same time as or after the filling of a large number of granular spacers. 27. Laminating another heat sublimable adhesive or adhesive bonding material on a large number of granular spacers adhered to the support through the heat sublimable adhesive or adhesive bonding material. The method for manufacturing a spacer transfer sheet according to any one of claims 19 to 26, wherein: 28. A plurality of spacers arranged in a plane in a predetermined pattern are pressed into a heat sublimable adhesive or an adhesive bonding material, and the heat sublimable adhesive is provided on the opposite surface of the support.
27. The method for manufacturing a spacer transfer sheet according to claim 19, wherein the adhesive bonding material is exposed. 29. A method of manufacturing a spacer transfer sheet, comprising adhering a mixture of a heat sublimable adhesive, a low melting point bonding material and a large number of spacers to a support in a predetermined pattern. 30. The method for manufacturing a spacer transfer sheet according to claim 27, wherein a release paper is attached to the surface opposite to the support. 31. The method for manufacturing a spacer transfer sheet according to claim 29, wherein the support is a peelable film or sheet. 32. The method of manufacturing a spacer transfer sheet according to claim 19, wherein the support is formed of a heat sublimable synthetic resin.