JP3073488B2 - Image forming apparatus and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus in which an image forming means and a spacer for keeping a space inside the container are arranged in a container, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as a flat type image forming apparatus using a cold cathode electron source, an apparatus having a cross section shown in FIG. 10 is known (Japanese Patent Laid-Open No. 2-299136).

In this image forming apparatus, a cold cathode electron source called a surface conduction electron-emitting device is used as an electron-emitting device.
An electron-emitting device 205 including an electron-emitting portion 204 formed between 2 and 203 is manufactured. The face plate 206 disposed to face the substrate 201 has a fluorescent screen 208 and a metal back 211 formed on the inner surface of a glass plate 207. In the color image forming apparatus, the phosphor screen 208 is formed by a black conductive material 209 usually called a black stripe or the like as shown in FIG. A metal back 211 is formed so as to cover both the stripe 209 and the phosphor 210. The purpose of providing the black stripe 209 is to make the three primary color phosphors required for the color phosphor screens black by separating the coating portions between the respective phosphors 210 so that color mixing and the like are not noticeable. To prevent a decrease in contrast caused by reflecting light.

The purpose of the metal back 211 is to prevent charges (electrons) from accumulating in the phosphor 210 having a high specific resistance, generally 10 ¹⁰ to 10 ¹² Ω · cm, to prevent the potential from lowering, and to reduce the voltage for electron beam acceleration. Acting as an electrode for applying the light, and improving the luminance by mirror-reflecting the light emitted from the phosphor 208 toward the inner surface of the device,
There is protection of the phosphor 210 from damage caused by the collision of negative ions, and Al is usually used as a material suitable for the above purpose. After forming the pattern of the black stripe 209 and the phosphor 210, the metal back 211 is formed by vacuum mounting of Al after a process called filming (coating an organic film on the black stripe 209 and the phosphor 210). The organic film is completed by baking and removing, but the strength of the phosphor screen 208 after metal back treatment, particularly the strength of the metal back 211, is weak enough to be peeled off with a finger.

In order to maintain the substrate 201 on which the electron-emitting devices 205 are formed and the face plate 206 at a substantially constant interval with respect to the pressure received from the atmosphere, a plurality of spacers 212 as anti-atmospheric pressure support members are arranged. Have been.
The spacer 212 is formed by forming an insulating film or a conductive film on a spacer material on the substrate 201.

[0006]

As described above, some image forming apparatuses in which a spacer is provided inside the container include:
There is a type in which a large number of atmospheric pressure-resistant spacers are arranged between a face plate and a rear plate by an adhesive member such as frit glass. In that case, it is often installed with high precision on the wiring of the rear plate and then glued to the face plate, and applied an adhesive member of frit glass on the wiring of the rear plate to apply the atmospheric pressure resistant spacer with high precision Installed in
Although a process of performing alignment while uniformly heating the entire substrate was performed, this process was complicated or required a long time.

Accordingly, an object of the present invention is to reduce a heating step in a process of manufacturing an image forming apparatus. Another object of the present invention is to reduce a heating step at a high temperature in a process of manufacturing an image forming apparatus. Another object of the present invention is to reduce damage to an image forming unit due to a heating process in a process of manufacturing an image forming apparatus.

Another object of the present invention is to provide a simple method for manufacturing an image forming apparatus. Another object of the present invention is to provide a method of manufacturing an image forming apparatus for forming a high-quality image.

[0009]

In order to achieve the above object, the present invention provides a container comprising a pair of first and second substrates which are spaced from each other;
What is claimed is: 1. A method for manufacturing an image forming apparatus comprising: an image forming unit disposed inside a container; and a spacer for maintaining the distance, wherein the spacer is formed on the first substrate by using a chemically reactive adhesive. A step of bonding and a step of bonding the first substrate and the second substrate via an outer frame member.
The first substrate is an image forming member of the image forming unit.
And the second substrate has an electron-emitting device disposed thereon.
The adhesive is an alkali metal silicate-based adhesive,
What is acidic metal phosphate adhesive, colloidal silica
Using any one of them, between the second substrate and the spacer
Is characterized in that the adhesive does not exist .

[0010]

According to the present invention, there is provided a container comprising a member including a pair of first and second substrates arranged at a distance from each other, an image forming means disposed inside the container, In an image forming apparatus including a spacer for maintaining the distance, the spacer is bonded to the first substrate via a chemical reaction type adhesive, and the first substrate and the second substrate are separated from each other. Glued through the outer frame member,
The first substrate is provided with an image forming member of the image forming unit.
The second substrate is provided with an electron-emitting device,
The adhesive is made of an alkali metal silicate adhesive, acidic gold
Any one of the group phosphate adhesive and colloidal silica
One between the second substrate and the spacer.
It is characterized in that no adhesive is present .

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described.
This will be described in detail with reference to the drawings.

[Explanation of Configuration] First, an image forming apparatus according to the present invention includes an image display device such as a liquid crystal display panel, a plasma display panel, and an electron beam display panel. These image forming apparatuses have a configuration in which an image forming unit and a spacer for maintaining an interval in the container are arranged in the container.

For example, the image forming means in the electron beam display panel includes an electron-emitting device and an image-forming member for forming an image by irradiating electrons from the electron-emitting device. , An electrode for accelerating the electrons, and a luminous body that emits light when irradiated with the electrons.

The containers in the electron beam display panel are, for example, arranged at an interval from each other.
It is constituted by a member including a first substrate having an electron-emitting device and a second substrate having the image forming member.

Further, the spacer according to the image forming apparatus of the present invention includes both an insulating spacer and a conductive spacer.

Further, the bonding member used in the present invention is preferably an inorganic bonding material. This is because the gas generated when heating the bonding material is supplied to the above-mentioned image formed on the substrate to which the spacer is bonded. The influence on the forming means can be reduced as compared with the organic adhesive. Further, the adhesive particularly preferably used in the present invention is a chemical reaction type adhesive, and can be bonded to a heat melting type adhesive such as frit glass at a relatively low temperature and has excellent heat resistance. .

Examples of the chemically reactive adhesive include an alkali metal silicate adhesive, an acidic metal phosphate adhesive, and colloidal silica.

In the present invention, any of the above-mentioned inorganic adhesives of the chemical reaction type can be used, but an alkali adhesive which can be heated and bonded at a low temperature of about 300 ° C. and has heat resistance to withstand a high temperature of 1000 ° C. or more. Metal silicate-based adhesives and acidic metal phosphate-based adhesives are preferred, and alkali metal silicate-based adhesives are particularly preferred.

The above alkali metal silicate-based adhesive,
Each of the acidic metal phosphate adhesives has a binder and an aggregate, and the alkali metal silicate adhesive has M ₂ O · mSiO ₂ .nH ₂ O (where M is N
a, K or Li, and m and n are integers of 1 or more), and one of alumina, silica and zirconia as an aggregate. doing. Further, the acidic metal phosphate-based adhesive is used as a binder for MO · mP ₂ O _5.
NH ₂ O (where M is Al or Mg, m,
(n is an integer of 1 or more) and a metal phosphate represented by the general formula: and any one of alumina, silica, and zirconia as an aggregate.

In the present invention, when a conductive member is used as the bonding member, metal particles are mixed with the above-mentioned chemical reaction type inorganic bonding material. In this case, for example, silver or the like is used as the metal particles, and is mixed at a ratio of 10 to 50% by weight of the entire bonding member.

Hereinafter, a method of manufacturing an image forming apparatus according to the present invention will be specifically described based on preferred embodiments.

[Embodiment 1] As a preferred embodiment of the present invention, an image forming apparatus using the surface conduction electron-emitting device shown in FIG. 1 will be described.

FIG. 1 is a schematic sectional view of an image forming apparatus using a surface conduction electron-emitting device. In FIG. 1, 1
01 is a rear plate made of soda lime glass, etc., 1
03 is a wiring electrode, and 102 is a surface conduction electron-emitting device. The electron-emitting devices 102 are electrically connected to row wirings and column wirings, and are matrix-wired with both wirings.

Reference numeral 104 denotes a conductive film 1 on the surface of the insulating substrate.
A conductive anti-atmospheric pressure supporting member (spacer) coated with 05, a spacer 104 and a rear plate 101
107b is a connecting member between the spacer and the rear plate that adheres the
8 is a connecting member between the spacer and the face plate bonding the spacer 8 to the spacer.

The face plate 108 includes an acceleration electrode 109 serving as a metal back and a black stripe 11.
0, and the phosphor 111.

An outer frame member 105 is disposed between the face plate 108 and the rear plate 101.
12 is a face plate 108 and a rear plate 101
And a connection member that bonds the outer frame member 112 to the outer frame member 112. The face plate 108 and the rear plate 101;
The container is formed by tightly fixing the inside with the connecting member 112.

Here, an anti-atmospheric pressure support member (spacer) 1
No. 04 will be described. The anti-atmospheric pressure support member (spacer) 104 is connected to the face plate 108 and the rear plate 101 by connection members 107b and 106b. The space between the face plate 108 and the rear plate 101 of the container including the face plate 108, the rear plate 101, and the outer frame member 105 is mechanically held by the spacers 104 arranged as described above.

A method for producing the above-described container of the image forming apparatus will be described below with reference to FIG. First, a paste-like adhesive material 106a for forming a connecting member 106b between the spacer 104 and the rear plate 101 is applied on the row wiring 103 on the rear plate 101 by a dispenser, and before the paste is dried, the paste-resistant material is supported. The member (spacer) 104 was positioned by the robot hand 113, pressed against the applied portion, and held until the paste was dried (FIG. 2A). In this embodiment, the adhesive 10
As 6a, a mixture of an alkali metal silicate-based adhesive (Aron Ceramic W; manufactured by Toagosei Co., Ltd.) and silver particles was used.

As shown in FIG. 2B, all the spacers 10
4 is fixed by drying. Thereafter, as shown in FIG. 2C, the rear plate 101 on the face plate 108
A conductive frit glass is applied by a dispenser as an adhesive 107a for forming a connecting member 107b between the spacer 104 and the face plate 108 at a position corresponding to the above wiring (FIG. 2 (c)). The firing was performed.

The frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the rear The container was assembled by positioning the plate 101 and heating to 420 ° C.

[Second Embodiment] In the image forming apparatus shown in FIG. 1 described in the first embodiment, an embodiment using an insulating spacer as the spacer 104 will be described with reference to FIG. Will be explained.

First, the row wiring 10 on the rear plate 101
3. An adhesive 10 forming a connecting member 106b between the spacer 104 made of an insulating substrate and the rear plate 101
6a was applied by a dispenser, and before the adhesive was dried, the anti-atmospheric pressure support member (spacer) 104 was positioned by a robot hand, pressed against the applied portion, and held until the adhesive was dried ((a in FIG. 2). )). Here, an alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) was used as the adhesive 106a.

As shown in FIG. 2B, all the spacers 10
After fixing 4 by drying, on the face plate 108,
A connection member 1 between the spacer 104 and the face plate 108 is provided at a position on the rear plate 101 corresponding to the wiring.
Frit glass was applied by a dispenser as an adhesive 107b for forming 07a (FIG. 2 (c)), and then calcined.

The frit glass 112 is applied to both contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the The container including the face plate 108, the rear plate 101, and the outer frame member 105 shown in FIG. 1 was assembled by positioning the rear plate 101 and heating to 420 ° C.

Third Embodiment Another manufacturing method of the image forming apparatus shown in FIG. 1 described in the second embodiment will be described below with reference to FIGS.

First, the spacer 104 made of an insulating substrate
An alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) 106 a is applied to one end of the
4 was positioned and pressed by the robot hand 113 and held until the adhesive was dried (FIG. 3).

Hereinafter, as in the second embodiment, all the spacers 1
04 was fixed by drying (FIG. 2 (b)). The spacer 104 and the face plate 1 are placed on the face plate 108 at positions corresponding to the wiring on the rear plate 101.
After frit glass is applied with a dispenser as an adhesive 107a for forming the connection member 107b between the layers 08 and 08,
Preliminary firing was performed (FIG. 2C).

The frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the The container including the face plate 108, the rear plate 101, and the outer frame member 105 shown in FIG. 1 was assembled by positioning the rear plate 101 and heating to 420 ° C.

In this embodiment, the insulating spacer is used as the atmospheric pressure resistant support member (spacer) 104. However, the same conductive spacer 104 and adhesives 106a and 107a as in the first embodiment are used. The image forming apparatus shown in FIG. 1 in which the conductive spacers are arranged as the spacers 104 can be manufactured by the same method as in the present embodiment.

In the above first to third embodiments, the bonding between one end of the spacer 104 and the substrate of the rear plate 101 and the face plate 108 is performed by pressing the spacer on the substrate via an adhesive without heating at a high temperature. This is performed by drying, and the number of heating steps in the manufacturing process can be reduced.

In the first to third embodiments,
Adhesion between one end of the spacer 104 and the substrate on which the electron-emitting devices are arranged is performed by pressing the spacer 104 onto the substrate via an adhesive and drying the substrate without heating at a high temperature. The deterioration of the characteristics of the electron-emitting device due to the heating step can be suppressed.

In the first to third embodiments,
The bonding between one end of the spacer and the substrate was performed by pressing the spacer on the substrate via an adhesive without drying at high temperature, and drying it.However, the chemically reactive adhesive used could be dried only. It is possible to fix the spacer,
Due to the heating at the time of assembling the container thereafter, it had a sufficient holding function as an atmospheric pressure resistant spacer.

In the first to third embodiments,
An inorganic adhesive is used to bond one end of the spacer to the substrate on which the electron-emitting device is arranged, and even when heated during assembly of the container, electron emission due to a gas released as in the case of using an organic adhesive. It is possible to suppress the deterioration of the characteristics of the element.

[Fourth Embodiment] Still another manufacturing method of the image forming apparatus shown in FIG. 1 described in the second embodiment will be described below with reference to FIG.

First, a connecting member 107b between the spacer 104 made of an insulating substrate and the face plate 108 is placed on the black stripe 110 on the face plate 108.
Is applied by a dispenser, and before the adhesive is dried, the anti-atmospheric pressure supporting member (spacer) 104 is positioned by the robot hand 113,
It was pressed against the applied portion and held until the adhesive was dried (FIG. 4A). Here, as the adhesive 107a,
An alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toa Gosei Co., Ltd.) was used.

As shown in FIG. 4B, all the spacers 10
After fixing 4 by drying, the upper wiring 103 on the rear plate 101 is provided at a position corresponding to the black stripe 110 on the face plate 108 as an adhesive material 106a for forming a connecting member 106b between the spacer 104 and the rear plate 101. After the frit glass was applied by a dispenser, temporary baking was performed (FIG. 4C).

The frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the The container including the face plate 108, the rear plate 101, and the outer frame member 105 shown in FIG. 1 was assembled by positioning the rear plate 101 and heating to 420 ° C.

In this embodiment, the insulating spacer is used as the atmospheric pressure resistant support member (spacer).
The same conductive spacer 104 as that of the first embodiment and the adhesives 107a and 107a that are the same as those of the first embodiment are used as the adhesives 107a and 106a, respectively. Thus, the image forming apparatus shown in FIG.

[Fifth Embodiment] Still another method of manufacturing the image forming apparatus shown in FIG. 1 described in the second embodiment will be described below with reference to FIGS.

First, the spacer 104 made of an insulating substrate
An alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) 107a is applied to one end of the base plate, and the spacer 104 is positioned on the black stripe 110 on the face plate 108 by a robot hand, pressed, and bonded. The material was held until dry (FIG. 5).

Hereinafter, as in the fourth embodiment, all the spacers 1
04 was fixed by drying (FIG. 4 (b)). The face plate 10 of the upper wiring 103 on the rear plate 101
8 at a position corresponding to the black stripe 110,
Connection member 10 between spacer 104 and rear plate 101
As an adhesive 106a for forming 6b, frit glass was applied by a dispenser, and then pre-baked (FIG. 4).
(C)).

The frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the The container including the face plate 108, the rear plate 101, and the outer frame member 105 shown in FIG. 1 was assembled by positioning the rear plate 101 and heating to 420 ° C.

In this embodiment, an insulating spacer is used as the anti-atmospheric pressure support member (spacer) 104. However, the same conductive spacer as that of the first embodiment and the adhesives 107a and 106a are used. The image forming apparatus shown in FIG. 1 in which the conductive spacers are arranged as the spacers 104 can be produced by the same method as that of the present embodiment using the same adhesives 106a and 107a as those of the first embodiment.

In the fourth and fifth embodiments as well, the bonding between one end of the spacer and the substrate is performed by pressing the spacer against the substrate via an adhesive without drying the substrate at a high temperature, and drying the spacer. The number of heating steps in the manufacturing process can be reduced.

Further, in the above fourth and fifth embodiments,
The bonding between one end of the spacer 104 and the substrate was performed by pressing the spacer 104 onto the substrate via an adhesive without drying the substrate at a high temperature and drying the spacer. However, the chemically reactive adhesive used was dried. The spacer 104 can be fixed only by itself, and has a sufficient holding function as the atmospheric pressure resistant spacer 104 by heating at the time of assembling the container thereafter.

[Embodiment 6] In this embodiment, a method for manufacturing the image forming apparatus shown in FIG. 6 will be described below.

The image forming apparatus shown in FIG. 6 differs from the image forming apparatus of FIG. 1 described in the above embodiment in that there is no connecting member between the face plate 108 and the spacer 104. I have.

The rear plate 101, the face plate 108, and the outer frame member 1 of the image forming apparatus shown in FIG.
The method of making the container 05 is described below.

First, the row wiring 10 on the rear plate 101
3. An adhesive 10 forming a connecting member 106b between the spacer 104 made of an insulating substrate and the rear plate 101
6a is applied by a dispenser, and before the adhesive 106a is dried, the anti-atmospheric pressure support member (spacer) 104 is positioned by the robot hand 113, pressed against the applied portion, and held until the adhesive 106a is dried (FIG. 2).
(A)). Here, an alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) was used as the adhesive 106a.

Next, as shown in FIG. 2B, all the spacers 104 were fixed by drying.

After the frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, preliminary firing is performed, and the outer frame member 105, the face plate 108, By aligning the rear plate 101 and heating to 420 ° C., the face plate 1 shown in FIG.
08, a rear plate 101, and an outer frame member 105 were assembled.

In this embodiment, the insulating spacer is used as the anti-atmospheric pressure support member (spacer) 104. However, the conductive spacer 104 and the adhesive 106a similar to those in the first embodiment are used. By the same method as in the embodiment, the image forming apparatus shown in FIG.

In the sixth embodiment, the spacer 1
The bonding between one end of 04 and the substrate, without heating at high temperature,
This is performed by pressing the spacer 104 onto the substrate via the adhesive 106a and drying the spacer. In the sixth embodiment, the other end of the spacer 104 is also attached to the adhesive 10a.
Since the heat bonding using 6a is not performed, the number of heating steps in the manufacturing process can be further reduced.

Also, in the sixth embodiment described above, the bonding between one end of the spacer 104 and the substrate on which the electron-emitting devices are arranged is performed without heating the substrate of the rear plate 101 and the face plate 108 with an adhesive material. This is performed by pressing the spacer 104 through the intermediary of the spacer 106a and drying the spacer 104. Further, in the sixth embodiment, the other end of the spacer 104 is not subjected to heat bonding using an adhesive, so that a plurality of high-temperature The deterioration of the characteristics of the electron-emitting device due to the heating step can be further suppressed.

In the sixth embodiment as well, the bonding between one end of the spacer 104 and the substrate is performed by pressing the spacer on the substrate via the adhesive 106a and drying the substrate without heating at a high temperature. However, the chemical reaction type adhesive used was capable of fixing the spacer only by drying, and had a sufficient holding function as an atmospheric pressure resistant spacer by heating at the time of assembling the container thereafter.

Also in the sixth embodiment, one end of the spacer 104 and the substrate on which the electron-emitting devices are arranged are bonded with an inorganic bonding material. It is possible to suppress the deterioration of the characteristics of the electron-emitting device due to the released gas as in the case where an organic adhesive is used.

[Embodiment 7] In this embodiment, a method for manufacturing the image forming apparatus shown in FIG. 7 will be described below.

The image forming apparatus shown in FIG. 7 is different from the image forming apparatus shown in FIG.
The difference is that there is no connecting member between the rear plate 101 and the spacer 104.

First, a connecting member 107b between the spacer 104 made of an insulating substrate and the face plate 108 is placed on the black stripe 110 on the face plate 108.
Is applied by a dispenser, and before the adhesive 107a is dried, the anti-atmospheric pressure support member (spacer) 104 is positioned by a robot hand, pressed against the applied portion, and held until the adhesive is dried. ((A) of FIG. 4). Here, an alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) was used as the adhesive 107a.

Next, as shown in FIG. 4B, all the spacers 104 were fixed by drying.

The frit glass 112 is applied to both contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member 105, the face plate 108 and the By aligning the rear plate 101 and heating to 420 ° C., the face plate 1 shown in FIG.
08, a rear plate 101, and an outer frame member 105 were assembled.

In this embodiment, an insulating spacer is used as the atmospheric pressure resistant support member (spacer) 104. However, the same conductive spacer as in the first embodiment and the adhesive 107a are used in the first embodiment. Adhesive 106a similar to
And the spacer 10 in the same manner as in this embodiment.
As No. 4, the image forming apparatus shown in FIG.

In the seventh embodiment, the spacer 1
The bonding between one end of 04 and the substrate, without heating at high temperature,
This is performed by pressing the spacer 104 against the substrate via the adhesive 107a and drying the spacer 104. Further, the other end of the spacer 104 is not subjected to heat bonding using the adhesive 107a. The number of heating steps can be further reduced.

In the seventh embodiment, since the spacer is in contact with the substrate on which the electron-emitting devices are disposed without using an adhesive, the characteristics of the electron-emitting devices are deteriorated by a plurality of high-temperature heating steps. Can be further suppressed.

Also, in the above-described embodiment 7, the bonding between the one end of the spacer 104 and the substrate is performed without heating the substrate to the spacer 104 via the adhesive 107a.
Was pressed and dried. However, the chemical reaction type adhesive used can fix the spacer 104 only by drying. It had a holding function.

In the seventh embodiment, since the spacer is in contact with the substrate on which the electron-emitting devices are arranged without using an adhesive, the deterioration of the characteristics of the electron-emitting devices due to the gas released from the adhesive is prevented. Can be suppressed.

[Embodiment 8] Still another manufacturing method of the image forming apparatus shown in FIG. 1 described in the above Embodiment 2 will be described below with reference to FIG.

First, a base 305 is applied to a thin film 302 of an alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) applied and formed on a substrate 301.
By pressing one end of an atmospheric pressure-resistant support member (spacer) 104 made of an insulating substrate held by a jig 303 fixed to the base (FIG. 8A) and removing the base 305 upward, one end of the spacer 104 is removed. The above adhesive pool 304
Was formed (FIG. 8B).

The spacers 104 were positioned and arranged on the row wirings 103 on the rear plate 101, and heated to 200 ° C. to form connection members 106b between the spacers 104 and the rear plate 101 (FIG. 8C). ).

A connecting member 107 between the spacer 104 and the face plate 108 is provided on the face plate 108 at a position corresponding to the wiring 103 on the rear plate 101.
Frit glass was applied by a dispenser as an adhesive 107a for forming b (FIG. 8 (d)), and then calcination was performed.

The frit glass 112 is applied to both contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the By aligning with the rear plate 101 and heating to 420 ° C., the frit glass 112 is melted to exhibit a function as an adhesive, and the face plate 108, the rear plate 101, and the , Outer frame member 105
Was assembled.

In this embodiment, the insulating spacer is used as the atmospheric pressure resistant support member (spacer).
The same conductive spacer and adhesive 106 as in the first embodiment.
a, 107a, and in the same manner as in this embodiment,
FIG. 1 in which conductive spacers are arranged as spacers 104
The image forming apparatus shown in FIG.

In the eighth embodiment, the bonding between the one end of the spacer and the substrate can be performed by heating at a low temperature of about 200 ° C. by using a chemical reaction type adhesive.
It is possible to suppress a decrease in characteristics of the electron-emitting device due to a plurality of high-temperature heating steps.

Also in Embodiment 8 described above, the one end of the spacer 104 and the substrate on which the electron-emitting devices are arranged are bonded with an inorganic bonding material. It is possible to suppress the deterioration of the characteristics of the electron-emitting device due to the released gas as in the case of using.

[Embodiment 9] In this embodiment, another method of manufacturing the image forming apparatus shown in FIG. 6 will be described below.

The image forming apparatus shown in FIG. 6 is different from the image forming apparatus of FIG. 1 described in the first to fifth and eighth embodiments in that a connecting member exists between the face plate 108 and the spacer 104. They differ in that they do not.

The rear plate 101, the face plate 108, and the outer frame member 1 of the image forming apparatus shown in FIG.
The method of making the container 05 is described below.

First, as shown in FIG. 8, a thin film 30 of an alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) applied and formed on a substrate 301 is formed.
2, an atmospheric pressure-resistant support member (spacer) 10 made of an insulating substrate held by a jig 303 fixed to a base 305;
4 is pressed (FIG. 8A), the base 305 is picked up, and the adhesive material 3
04 was formed (FIG. 8B).

The spacers 104 are positioned and arranged on the row wirings 103 on the rear plate 101 and heated to 200 ° C. to connect the spacers 104 between the spacers and the rear plate.
b was formed (FIG. 8C).

The frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member, the face plate 108 and the By aligning with the rear plate 101 and heating to 420 ° C., the face plate 108 shown in FIG.
A container including the rear plate 101 and the outer frame member 105 was assembled.

In this embodiment, the insulating spacer is used as the anti-atmospheric pressure support member (spacer) 104. However, the conductive spacer 104 and the adhesive 106a similar to those of the first embodiment are used. By the same method as in the example, the image forming apparatus shown in FIG.

In the ninth embodiment described above, the bonding between one end of the spacer and the substrate can be performed by heating at a low temperature of about 200 ° C. by using a chemical reaction type adhesive.
It is possible to suppress a decrease in characteristics of the electron-emitting device due to a plurality of high-temperature heating steps.

Also in Embodiment 9 described above, the one end of the spacer 104 and the substrate of the rear plate 101 on which the electron-emitting devices are arranged are bonded with an inorganic bonding material. In addition, it is possible to suppress the deterioration of the characteristics of the electron-emitting device due to the released gas as in the case where the organic adhesive is used.

In the ninth embodiment described above, the bonding between one end of the spacer 104 and the substrate can be performed by heating at a low temperature of about 200 ° C. by using a chemical reaction type adhesive. The other end of 104 also has adhesive 1
Since the heat bonding using the 07a is not performed, the number of heating steps in the manufacturing process can be further reduced.

In the ninth embodiment, the bonding between one end of the spacer 104 and the substrate can be performed by heating at a low temperature of about 200 ° C. by using the chemical reaction type adhesive 106a. Since the other end of the spacer 104 is not heated and bonded using the adhesive 107a, the deterioration of the characteristics of the electron-emitting device due to the multiple high-temperature heating steps can be further suppressed.

Also, in the ninth embodiment, the one end of the spacer 104 and the substrate of the rear plate 101 on which the electron-emitting devices are arranged are bonded with an inorganic adhesive, and by heating the adhesive 106a. In addition, it is possible to suppress the deterioration of the characteristics of the electron-emitting device due to the released gas as in the case of using the organic adhesive.

[Embodiment 10] In this embodiment, another method of manufacturing the image forming apparatus shown in FIG. 7 will be described below.

The image forming apparatus shown in FIG. 7 is different from the image forming apparatus of FIG. 1 described in the first to fifth and eighth embodiments in that a connecting member exists between the rear plate 101 and the spacer 104. They differ in that they do not.

First, as shown in FIG. 8, a thin film 30 of an alkali metal silicate-based adhesive (Aron Ceramic W, manufactured by Toagosei Co., Ltd.) applied and formed on a substrate 301 is formed.
2, an atmospheric pressure-resistant supporting member (spacer) 10 made of an insulating substrate held by a jig 303 fixed to a base 305;
4 (FIG. 8 (a)), and then the base 305
Then, the above-mentioned adhesive pool 304 was formed at one end of the spacer 104 (FIG. 8B).

The spacer 104 was positioned and arranged on the black stripe 110 on the face plate 108, and heated to 200 ° C. to form a connecting member 107b between the spacer 104 and the face plate 108 (FIG. 9).

The frit glass 112 is applied to both the contact surfaces of the outer frame member 105 on the face plate 108 side and the rear plate 101 side, and then pre-baked, and the outer frame member 105, the face plate 108, By aligning the rear plate 101 and heating to 420 ° C., the face plate 10 shown in FIG.
8. A container including the rear plate 101 and the outer frame member 105 was assembled.

In this embodiment, an insulating spacer is used as the anti-atmospheric pressure support member (spacer) 104. However, this embodiment uses the same conductive spacer and adhesive 106a as in the first embodiment. By the same method as in the example, an image forming apparatus shown in FIG.

In the tenth embodiment as well, the bonding between one end of the spacer and the substrate can be performed by using a chemically reactive adhesive at a low temperature of about 200 ° C. Also, since the heat bonding using the adhesive is not performed, the number of heating steps in the manufacturing process can be further reduced.

Also in Embodiment 10 described above, the bonding between one end of the spacer 104 and the substrate can be performed by heating at a low temperature of about 200 ° C. by using a chemical reaction type adhesive. Since the other end of the spacer 104 is not heated and bonded using an adhesive, it is possible to further suppress the deterioration of the characteristics of the electron-emitting device due to a plurality of high-temperature heating steps.

Also in Embodiment 10 described above, since the spacer 104 is in contact with the substrate of the rear plate 101 on which the electron-emitting devices are arranged without using an adhesive, a plurality of high-temperature heating steps are performed. The deterioration of the characteristics of the electron-emitting device can be further suppressed.

Also, in the tenth embodiment, since the spacer is in contact with the substrate on which the electron-emitting devices are arranged without using an adhesive, the characteristics of the electron-emitting devices are degraded by the gas released from the adhesive. Can be suppressed.

[0108]

As described above, according to the present invention, the number of heating steps in the process of manufacturing an image forming apparatus can be reduced. Further, according to the present invention, it is possible to reduce a heating step at a high temperature in a process of manufacturing an image forming apparatus.

Further, according to the present invention, it is possible to reduce damage to the image forming means due to the heating step in the process of manufacturing the image forming apparatus. Further, it is possible to provide a simple method of manufacturing an image forming apparatus. Further, according to the present invention, it is possible to provide a method of manufacturing an image forming apparatus for forming a high-quality image.

[Brief description of the drawings]

FIG. 1 is a sectional view illustrating an example of a configuration of an image forming apparatus according to the present invention.

FIG. 2 is a diagram illustrating an example of a method of manufacturing the image forming apparatus of FIG.

FIG. 3 is a diagram for explaining another example of the method for manufacturing the image forming apparatus of FIG. 1;

FIG. 4 is a view for explaining still another example of the method for manufacturing the image forming apparatus of FIG. 1;

FIG. 5 is a view for explaining still another example of the method for manufacturing the image forming apparatus of FIG. 1;

FIG. 6 is a cross-sectional view for explaining another example of the configuration of the image forming apparatus according to the present invention.

FIG. 7 is a cross-sectional view illustrating still another example of the configuration of the image forming apparatus according to the present invention.

FIG. 8 is a view for explaining still another example of the method for manufacturing the image forming apparatus of FIG. 1;

FIG. 9 is a diagram for explaining an example of a method of manufacturing the image forming apparatus of FIG.

FIG. 10 is a cross-sectional view illustrating an example of a conventional image forming apparatus.

FIG. 11 is a diagram illustrating an example of a phosphor of a conventional image forming apparatus.

[Explanation of symbols]

 Reference Signs List 101 rear plate 102 electron-emitting device 103 row wiring 104 spacer 105 outer frame member 106 connecting member 107 connecting member 108 face plate 109 metal back (acceleration electrode) 110 black stripe 111 fluorescent substance 112 frit glass 113 robot hand 201 rear plate 202, 203 Electrode 204 Electron emission section 205 Electron emission element 206 Face plate 207 Transparent glass 208 Phosphor 211 Metal back 301 Substrate 302 Alkali metal silicate adhesive (thin film) 303 Jig 304 Pool 305 Base

Continuation of the front page (56) References JP-A-9-92155 (JP, A) JP-A-1-302462 (JP, A) JP-A-2-299136 (JP, A) JP-A-6-310054 (JP) , A) JP-A-7-5821 (JP, A) JP-A-54-83939 (JP, A) JP-A-62-99904 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB Name) H01J 9/24 H01J 29/86-29/87 H01J 31/12

Claims (4)

(57) [Claims] 1. A container constituted by a member including a pair of first and second substrates arranged at a distance from each other, an image forming means arranged inside the container, and holding the space. A method of manufacturing an image forming apparatus, comprising: a step of bonding the spacer to the first substrate using a chemical reaction type adhesive; and a step of bonding the first substrate and the second substrate to each other. possess a step of bonding via the outer frame member, the
The first substrate is provided with an image forming member of the image forming means.
The second substrate is provided with an electron-emitting device;
The dressing materials are alkali metal silicate adhesives and acidic metal foils.
Use any one of sphate adhesive and colloidal silica
Used, wherein the adhesive is provided between the second substrate and the spacer.
A method for manufacturing an image forming apparatus, wherein no material is present . Wherein said image forming means, a manufacturing method of an image forming apparatus according to claim 1 and an image forming member for forming an electron image by irradiation of from the electron-emitting devices. 3. The method for manufacturing an image forming apparatus according to claim 1, wherein when the adhesive is used as a conductive member, metal particles are mixed with a chemical reaction type inorganic adhesive. 4. A container constituted by a member including a pair of first and second substrates arranged at an interval from each other, and an image forming means arranged inside the container and maintaining the interval An image forming apparatus comprising: a spacer that adheres to the first substrate via a chemical reaction type adhesive; and the first substrate and the second substrate form an outer frame member. And the first base
The plate is provided with an image forming member of the image forming means,
The second substrate is provided with an electron-emitting device, and the adhesive is:
Alkali metal silicate adhesive, acid metal phosphate
Using either adhesive or colloidal silica
The adhesive is present between the second substrate and the spacer.
An image forming apparatus characterized by not performing.