JP2000090829A - Manufacture for image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform a high accurate alignment and to reduce misalignment even in a high temperature process, in assembling of a plate-type image forming device. SOLUTION: In this method, a sealed container formed by connecting a first substrate 1 with a second substrate 7 through support frames 2 is manufactured. This method includes a first process for arranging the support frames 2 on the first substrate 1 and fixing positioning fixing members 4 to other part than the support frames 2, a second process for forming a positioning connecting layer 6 on each positioning fixing member 4, a third process for positioning the first substrate 1 and the second substrate 7 and fixing them with the positioning connecting layer 6, a fourth process for pressurizing regions disposed with the support frames 2 of the first substrate 1 and/or the second substrate 7, and a fifth process for softening a seal agent 3 arranged on the first substrate 1 and the second substrate 7 or seal agent 3 arranged on the support frames 2 in a thermal process and bending, crushing, cooling, and solidifying the first substrate 1 or the second substrate 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an image forming apparatus, and more particularly, to a substrate on which electron-emitting devices and the like are arranged and a substrate on which phosphors and the like are arranged can be positioned and joined with high precision. The present invention relates to a method for manufacturing an image forming apparatus.

[0002]

2. Description of the Related Art Conventionally, an active matrix type liquid crystal has been used as a type image forming apparatus instead of a CRT. The active matrix type liquid crystal is not a self-luminous type, and performs display using a backlight. However, since the light use efficiency is low, a brighter image forming apparatus has been desired. For this reason, electrons emitted from a cold cathode electron-emitting device such as a plasma display, a field electron-emitting device, and a surface conduction electron-emitting device (for example, Japanese Patent Application Laid-Open No. 7-235255) are accelerated and collided to emit light from a phosphor. The development of a self-luminous image forming apparatus for displaying an image is being put to practical use. These flat-panel image forming apparatuses have been increasing in area to several tens of inches. In particular, in these image forming apparatuses, a highly accurate and easy assembling method is desired.

Referring to FIG. 7 and FIG.
A method of assembling the flat plate type image forming apparatus disclosed in Japanese Patent No. 2451 will be described. A pair of liquid crystal glass substrates 1,
2 (hereinafter, the first substrate and the second substrate) will be described. The first substrate and the second substrate are provided with an electrode pattern, a positioning pattern, and a sealing material. These first,
The second substrate is set on the alignment device. The first substrate and the second substrate are heated and kept warm by the alignment device. Next, the first substrate and the second substrate are aligned through an alignment pattern. Next, the first substrate and the second substrate are pressurized and simultaneously aligned. Finally,
After being held for a predetermined time in the pressurized state, the pressurization is released, and the assembled liquid crystal cell is removed from the alignment device. In this way, even if the positional shift occurs in a high temperature state, the alignment is performed, so that the first substrate and the second substrate can be aligned with high accuracy. The publication also describes, as a conventional technique, a method of performing temporary fixing with a photocurable adhesive after positioning at room temperature, and further heating and curing the sealing material.

[0004]

However, in the above-mentioned flat panel type image display device using the cold cathode electron-emitting device,
The elements on the first substrate correspond to the image forming members (light-emitting members) on the second substrate at a ratio of 1: 1. If the alignment of the image forming member on the substrate is insufficient, the brightness of the pixels may vary, and in the case of color, each color of RGB may be mixed,
The image quality may be impaired. Therefore, the alignment between the element on the first substrate and the image forming member on the second substrate is
High precision is required. In the above liquid crystal,
The first substrate and the second substrate are heated at a high temperature and pressurized while softening the adhesive disposed between the first substrate and the second substrate. Further, the positions of the first substrate and the second substrate are heated at a high temperature. After the alignment, the first substrate and the second substrate are assembled by solidifying the adhesive. For this reason, alignment is performed in a high-temperature bath, or a heater is installed in a pressing jig. For this reason, the problem that the accuracy of the high-temperature specification is required for the alignment apparatus and the process are complicated, and the problems such as the necessity of cost reduction occur. On the other hand, as pointed out in the same publication, in the manufacturing method using room temperature alignment and temporary fixing, there is a possibility that a problem such as displacement occurs due to softening of the adhesive.

On the other hand, in the above-mentioned image forming apparatus in which an electron beam generated from an electron-emitting device collides with a phosphor to emit light, it is necessary to further form a vacuum container, so that a space between the first substrate and the second substrate is required. The bonding material corresponding to the provided adhesive is bonded using a glass material so as to maintain a vacuum. For this reason, since the liquid crystal is an organic adhesive, the softening temperature is about 4 ° C. compared to about 150 ° C.
Since the temperature is as high as 00 ° C. or more, the problem of the high-precision alignment and assembling apparatus becomes severe.
In addition, the temperature distribution and the temperature difference for heating the first substrate and the second substrate cause a difference in thermal expansion between the first substrate and the second substrate, which causes a decrease in alignment accuracy and generation of a stress. In some cases, destruction occurred.

In view of the above, according to the present invention, in assembling these flat plate type image forming apparatuses, positioning can be performed with high accuracy.
It is still another object of the present invention to provide a method of manufacturing a flat-plate type image forming apparatus which has a small displacement even in a high-temperature process.

[0007]

SUMMARY OF THE INVENTION The present invention for solving the above-mentioned problems is a method for manufacturing a sealed container in which a first substrate and a second substrate are joined via a support frame, and wherein the method comprises the steps of: To
Arranging a support frame, fixing a positioning fixing member outside the support frame, forming a positioning bonding layer on the positioning fixing member, positioning the first substrate and the second substrate, A step of fixing with the positioning bonding layer, a step of pressing a region where the support frame of the first substrate and / or the second substrate is disposed, and a step of applying heat to the first substrate and the second substrate by heating. The method includes a step of softening the sealant or the sealant disposed on the support frame, and a step of cooling and solidifying the sealant.

Further, in the present invention, the first substrate is a substrate provided with an electron-emitting device for emitting electrons based on an image signal, and the second substrate is irradiated with the electrons emitted from the electron-emitting device. A method for manufacturing an image forming apparatus, comprising: a substrate provided with a light emitting member that emits light according to (1), wherein the first substrate and the second substrate are joined via the support frame. Manufactures the closed container.

That is, in the present invention, after positioning the other frame with the support frame disposed on the substrate, and a plurality of positioning and fixing members fixed on the outer substrate, the other frame is positioned on the other frame. Are temporarily fixed by joining the plurality of positioning fixing members. Subsequently, the sealing material formed on the support frame is crushed by pressing the inside of the support frame region of the substrate while heating, and the substrate is bent accordingly, thereby performing the hermetic sealing. At this time, the position between the substrates can be defined with high precision without causing a positional shift because the position is temporarily fixed by the plurality of positioning and fixing members.

Further, between the first substrate and the second substrate,
Since the plurality of positioning and fixing members are temporarily fixed, alignment is not required even when assembling at a high temperature, and a complicated device is not required, so that the device can be simplified.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a process chart of a method for manufacturing an image forming apparatus according to the present invention.

In the figure, 1 is a first substrate, 2 is a support frame, 3 is a sealing material, 4 is a positioning and fixing member, 5 is an image forming member (electron-emitting device), 6 is a bonding layer, 7 is a second substrate, Reference numeral 8 denotes an image display member (light emitting member), and a plurality of positioning and fixing members 4 are arranged outside the support frame so as to fix the first substrate and the second substrate.

First, the positioning and fixing member 4 is placed on the first substrate 1.
Is fixed. The first substrate 1 is a rear plate made of glass or the like. In an image forming apparatus using the electron-emitting devices, the electron-emitting devices are arranged. In the case of the plasma display, a partition for limiting the plasma region is provided, and in the case of the reflection type, a phosphor or the like is provided. The positioning and fixing member 4 can be made of a material such as glass or ceramics, but preferably has a thermal expansion coefficient similar to that of the first substrate 1. The distance between the first substrate and the second substrate is 1 m.
In the case where the positioning and fixing member 4 can be fixed only by the bonding layer at about m or less, the positioning fixing member 4 can be omitted. Further, the positioning and fixing member 4 and the first substrate 1 are joined at an arbitrary position with frit glass, a heat-resistant adhesive, or the like. Further, the support frame 2 on which the sealing material 3 is formed is installed at an arbitrary place. The sealing material 3
Although an organic adhesive or the like can be used for this, when it is used as a vacuum container, heat resistance and airtightness are required, so that frit glass mainly containing lead oxide is preferably used. If the distance between the first substrate and the second substrate is about 1 mm or less and the sealing can be performed only with the sealing material, the supporting frame 2 is used.
Can be omitted. (FIG. 1A) Subsequently, the positioning and fixing member 4 disposed on the first substrate 1
The bonding layer 6 is formed thereon. The bonding layer 6 includes a first substrate and a second substrate.
It is used to temporarily fix the substrate, but after the temporary fixation, it is necessary that no displacement occurs even in the heat process of softening the sealing material in the subsequent process. For this reason, it is preferable to use an inorganic adhesive having high heat resistance, which hardens at or around room temperature and does not soften even at the softening temperature of the sealing material, as the bonding layer. It is also possible to use frit glass having a softening point higher than the softening temperature of the sealing material, frit glass having a lower curing temperature than the softening temperature of the sealing material, but being crystallized. (FIG. 1B) Next, after positioning the second substrate 7 and the first substrate 1, the first substrate
By bringing the substrate 1 and the second substrate 7 closer to an arbitrary interval, the bonding layer 6 on the positioning and fixing member 4 arranged on the first substrate and the second substrate 7 are bonded. At this time, since the sealant of the support frame does not deform, the bonding layer 6 needs to be formed higher so as to come in contact with the sealant of the support before the sealant. The second substrate 2 is a face plate made of glass or the like. In an image forming apparatus using an electron-emitting device, a phosphor that collides with electrons and emits light is arranged. Also,
In the plasma display, wiring and the like are provided.
In the case where frit glass having a higher melting point than the sealing material is used for the bonding layer 6, this can be achieved by increasing the temperature of the bonding layer from near the sealing material by local heating. When an inorganic adhesive that cures at or near room temperature is used, it is necessary to make contact after the coating is formed and before curing.
Is solidified to temporarily fix the first substrate and the second substrate. Note that the planar arrangement of the positioning and fixing member needs to be disposed outside the support frame as shown in FIG. In this case, it is possible to cut out a plurality of cells from a large-area substrate, or to install the cells outside the external drawer wiring of each image forming apparatus, which is advantageous in arrangement. The number of positioning and fixing members may be three as shown in the figure, but is not limited to three.
(FIG. 1 (c)) Next, pressure is applied by applying a load to the support frame of the first substrate 1 or the second substrate 7 and the image display area inside the support frame. Subsequently, after the sealing material 3 provided on the first substrate 1 and the second substrate 7 or the support frame is softened by heating, the sealing material 3 is solidified by cooling. Since the positioning and fixing member 4 is temporarily fixed, no deformation occurs. However, since the area where the sealing material is disposed is pressurized, the substrate is deformed as the sealing material 3 is softened. The sealing material 3 is crushed, and sealing is ensured. Here, since the first substrate 1 and the second substrate are temporarily fixed by the positioning and fixing member 4, there is no occurrence of positional displacement. At this time, the sealing material 3 may be softened by raising the temperature in this state. However, if the unit is pressurized and put into an electric furnace or the like, it can be processed in a batch manner, which is advantageous for mass production. it can. (FIG. 1D) Next, the substrate of the image forming apparatus is manufactured by cooling and removing the substrate. (FIG. 1E) For example, in an image forming apparatus using an electron-emitting device, the inside of the container is evacuated.
In an image forming apparatus using plasma, gas is sealed. In addition, the support frame 2 and the positioning and fixing member 4 may use a printing partition, or may be integrated with a face plate or a rear plate.
It is not necessary to be a separate member from the first substrate and the second substrate. When used as a vacuum container, an exhaust pipe (not shown)
After the inside of the container is evacuated and a vacuum is formed, the exhaust pipe is sealed. Alternatively, if the container is formed in a vacuum chamber, an exhaust pipe is not necessarily required.

Thus, the container of the image forming apparatus is manufactured. As described above, the first substrate and the second substrate are temporarily fixed at or near room temperature on the substrate end side from the region where the sealing material is formed, and further heated while heating the region where the sealing material is disposed. By pressurizing, the sealing material is softened,
A hermetic seal can be obtained by bending the substrate accordingly. At this time, since the plurality of positioning and fixing members are temporarily fixed, the position between the substrates can be defined with high accuracy without causing a position shift. Therefore, it is possible to assemble with high positional accuracy even at a high temperature.

[0016]

Embodiment 1 Embodiment 1 of the present invention will be described with reference to FIG. In the present embodiment, a plurality of surface conduction electron-emitting devices, which are cold cathode electron-emitting devices, are formed on a first substrate as electron-emitting devices, and a phosphor is provided on a second substrate.
A color image forming apparatus having an effective display area of 3 inches diagonally and an aspect ratio of 3: 4 was manufactured.

First, as the production of the first substrate 1, a lower wiring was formed by screen printing on a substrate in which a silicon oxide film was formed on a soda lime glass by a sputtering method. Next, an interlayer insulating layer was formed between the lower wiring and the upper wiring, and an upper wiring was further formed. Next, device electrodes connected to the lower wiring and the upper wiring were formed.

Next, a conductive thin film was formed by a sputtering method and then patterned to obtain a desired form, and an electron-emitting device group 5 before forming was formed. Note that N × M surface conduction type emission elements are formed on the rear plate.
(N and M are positive integers of 2 or more and are appropriately set according to the target number of display pixels. For example, in a display device for displaying high-definition television, N = 3.
It is desirable to set a number of 000, M = 1000 or more. The N × M surface conduction electron-emitting devices are arranged in a simple matrix by M row-directional wirings (sometimes referred to as upper wirings) and N column-directional wirings (sometimes referred to as lower wirings). ing. In this embodiment, the number is 100 each. The surface conduction electron-emitting device will be described with reference to FIG. FIG.
FIGS. 2A and 2B are schematic views showing a configuration of a surface conduction electron-emitting device to which the present invention can be applied. FIG. 2A is a plan view and FIG. 2B is a cross-sectional view.

In FIG. 2, 71 is a substrate, 72 and 73 are device electrodes, 74 is a conductive thin film, and 75 is an electron emitting portion.
By forming the conductive thin film 74 through the device electrodes 72 and 73, the conductive thin film is locally broken,
An activation step of deforming or altering the material to form an electrically high-resistance portion and significantly improving the emission current is performed by the above-described conductive thin film 7 of the surface conduction electron-emitting device.
By applying a voltage to 4 and flowing a current to the device, the above-described electron-emitting portion 75 was formed. (It is the same as that of Japanese Patent Application Laid-Open No. Hei 7-235255 described in the prior art.) Then, the positioning and fixing member 4 is moved to the position shown in FIG.
Fixed in places. The positioning and fixing member 4 is made of soda lime glass and has a height of 3 mm and a diameter of 4 mm.
It was fixed with a Ceramabond 503 made by EMCO. Subsequently, the support frame 2 on which the sealing material 3 was formed was set on the first substrate. The support frame 2 is made of soda lime glass. After applying frit glass as a sealing material 3 on the upper and lower surfaces of the support frame 2 using a dispenser, drying at 120 ° C. for 10 minutes, 380 ° C.
What was formed by performing temporary baking for 10 minutes was used. The frit glass is LS3081 made by NEC Glass
And the thickness was 0.2 mm. (FIG. 1A) Next, a bonding layer 6 was formed on the upper surface of the positioning and fixing member 4 provided on the first substrate 1. The same inorganic adhesive AREMC as used for fixing the positioning fixing member 4 is used for the bonding layer 6.
The O-cerama bond 503 was formed by potting so as to be higher than the sealing material of the support frame.

Subsequently, the second substrate was set on the first substrate 1, and the first substrate 1 and the second substrate 7 were positioned.
(FIG. 1B) As a second substrate 7, a phosphor and a black conductor were formed on a blue glass substrate by a printing method. Further, the inner surface of the fluorescent film was smoothed with a resin, and then Al was deposited by vacuum evaporation or the like, and then the resin was burned off to form a metal back, thereby forming an image display section 8.
Note that a fluorescent film is formed on the lower surface of the face plate. In a color display device, phosphors of three primary colors of red, green, and blue used in the field of CRT are separately applied to the fluorescent film portion. I have. The phosphor of each color is, for example, as shown in FIG.
As shown in the figure, the stripes are separately applied, and a black conductor is provided between the phosphor stripes. The purpose of providing the black conductor is to prevent the display color from shifting even if there is a slight shift in the irradiation position of the electron beam,
The purpose is to prevent reflection of external light to prevent a decrease in display contrast, and to prevent charge-up of a fluorescent film by an electron beam. Although graphite is used as a main component for the black conductor, any other material may be used as long as it is suitable for the above purpose.

The method of applying the phosphors of the three primary colors is not limited to the stripe arrangement shown in FIG. 4A, but may be, for example, a delta arrangement as shown in FIG. Other arrangements may be used.

When a monochrome display panel is manufactured, a monochromatic phosphor material may be used for the phosphor film, and a black conductive material may not be necessarily used.

Also, the surface of the fluorescent film on the rear plate side is
A known metal back is provided in the field of CRT. The purpose of the metal back is to improve the light utilization rate by mirror-reflecting a part of the light emitted from the fluorescent film, to protect the fluorescent film from the collision of negative ions, and to apply an electron beam acceleration voltage. To act as an electrode, or to act as a conductive path for the excited electrons of the fluorescent film. When a low-voltage fluorescent material is used for the fluorescent film,
No metal back is used. A transparent electrode made of, for example, ITO may be provided between the face plate substrate and the fluorescent film for the purpose of applying an acceleration voltage or improving the conductivity of the fluorescent film. Subsequently, the first substrate 1 and the second substrate 7 are brought close to each other, and the second substrate 7 is pressed against the sealing material 3 on the support frame 2, and the temperature is raised to 70 ° C. and held for 30 minutes, thereby joining the substrates. The layer 6 was fixed to the second substrate. (Figure 1
(C)) Next, the substrates 1 and 2 were set in a pressure device. FIG. 5 is a conceptual diagram of the pressurizing device. (The components having the same reference numerals as those in FIG. 1 are the same as those in FIG. 1).
1, a lower holder 92, a pressing means 9, a holder slide guide 94 and the like.

On the lower holder 92, the first substrate 1 and the second substrate 7, which have been temporarily fixed, are set. After that, the upper holder 91 is set on the second substrate 7 through the holder slide guide. At this time, the upper holder 91 is arranged so that the convex portion (the portion in contact with the second substrate 7) spans the region of the support frame 2. Subsequently, pressure is applied by the pressing means 9. At this time, a 1 kg weight was used as a pressing means. The effective size of the pressurizing means 9 was substantially the same as the area surrounded by the support frame 2. (FIG. 1 (d)) Subsequently, the pressure device was introduced into an electric furnace, heated to 400 ° C. to soften the frit and held for 10 minutes, and then the electric furnace was gradually cooled to solidify the frit. Finally, the image forming apparatus to which the first substrate 1, the second substrate 7, and the support frame 2 were adhered was taken out from the pressing device. (FIG. 1 (e)) At this time, the second substrate 7 sinks with the softening of the sealing material 3, so that the sealing material 3 is crushed and an airtight container can be obtained.

Thus, a desired image forming apparatus was manufactured.

The atmosphere in the image forming apparatus completed as described above is evacuated by a vacuum pump through an exhaust pipe (not shown), and after reaching a sufficient degree of vacuum, through an external terminal (not shown). A voltage was applied to the electron-emitting device, and an electron-emitting portion was formed by a conductive thin film forming step and an activation step. Further, after a series of processes, at 250 ° C., 1
Baking was performed for 0 hours.

Next, the chamber was evacuated to a degree of vacuum of about 10 ^-6 Pa at room temperature, and the envelope was sealed by heating an exhaust pipe (not shown) with a gas burner.

Finally, to maintain the degree of vacuum after sealing,
Getter treatment was performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, each electron-emitting device is connected to a terminal outside the container.
By applying a scanning signal and a modulation signal from signal generation means (not shown), electrons are emitted and the high voltage terminal H
An image was displayed by applying a high voltage of several kV or more to a metal back or a transparent electrode (not shown) through v, accelerating the electron beam, colliding with the fluorescent film, and exciting and emitting light.

As a result, no luminance variation or color mixing due to the displacement between the electron-emitting device and the phosphor was observed.

Example 2 In Example 2 of the present invention, in order to reduce the weight, a device was manufactured in the same manner as in Example 1 except that a spacer was provided as an atmospheric pressure resistant member. Note that the size of the effective display area of the image forming apparatus has a vertical to horizontal ratio of 3:
4 is 10 inches diagonal. FIG. 7 shows a schematic process diagram after the temporary fixing. In the figure, 20 is a black conductor, and 21 is a spacer. The spacer is a flat plate-shaped spacer made of glass and having a thickness of 200 μm and a height of 3.6 mm.
Using a film having a secondary electron emission efficiency of less than 2 and a high-resistance film (CrOx is used in this embodiment), a conductive frit is formed on a black conductor formed in an image display portion of the second substrate. Glued using glass. As shown in FIG. 7 (a), after the temporary fixation, the second substrate abuts on the sealing material formed on the support frame, so that the spacer is the substrate 1
They are arranged with a spacing of several hundred μm from above. Next, it was set in a pressure device in the same manner as in Example 1, introduced into an electric furnace, heated to 400 ° C. to soften the frit and held for 10 minutes, and then the electric furnace was gradually cooled to solidify the frit.
The total height of the positioning and fixing member 4 and the bonding layer 16 may be equal to or greater than the total height of the support frame 2 and the sealing material 3. FIG. 7 (b) Finally, the first substrate 1 and the second substrate 7 are
Then, the image forming apparatus to which the support frame 2 was adhered was taken out. At this time, the second substrate 7 is deformed due to the softening of the sealing material 3 at this time, so that the sealing material 3 is crushed and a container of the image forming apparatus can be obtained. Further, in this method, since the spacer is separated from the second substrate in the step after the temporary fixing, not only does the image forming portion not be damaged during assembly, but also the spacer having a thickness of several tens to several hundreds μm is damaged. I do not give.
Furthermore, it was found that the spacers can regulate the distance between the substrates even at the center of the screen, so that the assembly can be performed with high accuracy.

Further, when the completed image display device of the present invention emits light and displays an image in the same manner as in the first embodiment, the brightness variation due to the displacement between the electron-emitting device and the phosphor,
No color mixing was observed. In this embodiment, the spacer is fixed on the second substrate first, but may be fixed on the first substrate first.

[Embodiment 3] In Embodiment 3 of the present invention, a point that a field emission device which is a kind of cold cathode electron emission device is used as an electron emission device, and a distance between a sealing material and a substrate is defined without using a support frame. Example 1 was prepared in the same manner as in Example 1 except that the first substrate and the second substrate were temporarily fixed only with the bonding layer without using the positioning and fixing member.

Incidentally, the size of the effective display area of the image forming apparatus is 2 inches diagonally with an aspect ratio of 3: 4. The field emission device having the configuration shown in FIG. 6 was used. 13 in the figure
1 is a rear plate, 132 is a face plate, 133
Is a cathode, 134 is a gate electrode, 135 is an insulating layer, 136
Is a focusing electrode. A cathode, a gate electrode, a wiring, and the like were prepared by a conventionally known manufacturing method. The cathode material was MO. After applying frit glass on the first substrate using a dispenser, the sealing material is dried at 120 ° C. for 10 minutes,
What was formed by performing temporary baking for 10 minutes was used. The frit glass is LS3081 made by NEC Glass
And the thickness was 0.3 mm. A part of the coating frit is used as a member for defining the distance between the substrates.
A μm glass piece was dispersed. As a result, it was found that the temporary fixing can be reliably performed in the same manner as in Example 1, and that a good image display device without displacement can be manufactured.

Further, when the completed image display device of the present invention emits light and displays an image in the same manner as in the first embodiment, the brightness variation due to the misalignment between the field emission device and the phosphor,
No color mixing was observed.

[0036]

According to the present invention described above, after positioning the supporting frame disposed on the substrate, the plurality of positioning fixing members fixed on the outer substrate and the other substrate, and then positioning the other frame, The substrate and the plurality of positioning and fixing members on the substrate are joined and temporarily fixed, and then the inside of the support frame area of the substrate is pressed while being heated, and the sealing material formed on the support frame is bent by bending the substrate. Since the airtight seal is performed by crushing and solidifying, the position between the substrates can be defined with high accuracy without causing a positional shift.

According to the present invention, the first
Since a plurality of positioning and fixing members are temporarily fixed between the substrate and the second substrate, there is no need for alignment even when assembling at a high temperature, and a complicated device is not required. it can.

According to the present invention, a plurality of electron-emitting devices such as a field electron-emitting device and a surface conduction electron-emitting device are arranged, and a phosphor is emitted by the emitted electrons to display an image. Not only the image forming apparatus but also a liquid crystal display panel or a plasma display panel can be assembled and manufactured with high accuracy.

[Brief description of the drawings]

FIG. 1 is a process chart of a method for manufacturing an image forming apparatus of the present invention.

FIG. 2 is a plan view of the surface conduction electron-emitting device used in Example 1.

FIG. 3 is a plan view showing an example of the positioning and fixing member of the present invention.

FIG. 4 is a pattern example of a fluorescent film used in Example 1.

FIG. 5 is an image forming apparatus assembling apparatus (pressing apparatus) used in the first embodiment.

FIG. 6 is a diagram of a field emission device used in Example 3.

FIG. 7 is a schematic sectional view of a method for manufacturing the image forming apparatus according to the second embodiment.

FIG. 8 is a conventional assembly flowchart.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 support frame 3 sealing material 4 positioning fixing member 5 electron emission element 6 joining layer 7 2nd board 8 image display member (light emitting member) 9 pressurizing means 71 board | substrate 72, 73 device electrode 74 conductive thin film 75 electron Emission portions 801 and 20 Black conductor 21 Spacer 91 Upper holder 92 Lower holder 94 Holder slide guide 131 Rear plate 132 Face plate 133 Cathode 134 Gate electrode 135 Insulating layer 136 Focusing electrode

Continuation of the front page (72) Inventor Shinya Koyama 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 5C012 AA01 AA09 BC01 BC03

Claims (9)

[Claims] 1. A method for manufacturing a closed container in which a first substrate and a second substrate are joined via a support frame, wherein the support frame is disposed on the first substrate and positioned outside the support frame. Fixing a fixing member, forming a positioning bonding layer on the positioning fixing member, positioning the first substrate and the second substrate, and fixing the first substrate and the second substrate with the positioning bonding layer; Pressurizing a region where the support frame of the first substrate and / or the second substrate is disposed; and heating the substrate and / or the sealant disposed on the first substrate and the second substrate and / or the support frame. A method for producing a sealed container, comprising a step of softening a sealant and a step of cooling. 2. The method according to claim 1, wherein a plurality of the positioning and fixing members are provided. 3. The method according to claim 1, wherein the positioning and fixing member is fixed with an inorganic adhesive. 4. The method according to claim 1, wherein the positioning bonding layer is an inorganic adhesive layer. 5. The method according to claim 1, wherein the sealing material is frit glass. 6. The first substrate is a substrate on which an electron-emitting device that emits electrons based on an image signal is disposed, and the second substrate is a light-emitting member that emits light by irradiation of the electrons emitted from the electron-emitting device. A method of manufacturing an image forming apparatus including a sealed container in which the first substrate and the second substrate are joined via the support frame, wherein the sealed container is A method for manufacturing an image forming apparatus, which is manufactured by the method for manufacturing a closed container according to any one of 2, 3, 4, and 5. 7. The method according to claim 6, wherein the light emitting member is a phosphor. 8. The method according to claim 6, wherein the electron-emitting device is a cold cathode electron-emitting device. 9. The method according to claim 8, wherein the cold cathode electron-emitting device is a surface conduction electron-emitting device.