JPH11317166A - Manufacture of image forming device, and image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately and easily install a flat-panel display, by bonding a face plate and a rear plate by using their through hole as a positioning member. SOLUTION: As for this manufacturing method, in an image forming device having a glass board 2 for a rear plate on which plural electron emission elements and wiring are formed, a glass board 1 for a face plate which is placed face to face with the rear plate and on which a fluorescent member and an accelerating electrode are formed, a spacer coated by a conductive film placed between the face plate and the rear plate, and a connecting member to electrically and mechanically connect the spacer, after forming a through hole 3 for alignment used when forming the fluorescent member, the accelerating electrode, the electron emission element and wiring on the glass material for the face plate and the rear plate, the plural electron emission elements, the wiring, the fluorescent member and the accelerating electrode are bonded by forming and using the through hole as an alignment mark and by using the through hole as a positioning member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method of manufacturing a flat type image forming apparatus having an atmospheric pressure resistant support member (spacer).

[0002]

2. Description of the Related Art CRTs have been widely used as image forming apparatuses for displaying images using electron beams.

In recent years, flat-panel display devices using liquid crystal have been widely used in place of CRTs. However, since they are not self-luminous, they have problems such as having to have a backlight. The development of a display device has been desired. As a self-luminous display device, a plasma display has recently been commercialized. However, the principle of light emission is different from that of a conventional CRT, and it is slightly inferior to a CRT due to the contrast of an image and the characteristics of coloring. It is. on the other hand,
If a plurality of electron-emitting devices are arranged and used in a flat panel image forming apparatus, it is expected that an image of the same quality as a CRT can be obtained, and much research and development has been carried out. For example, JP-A-4-163833 discloses a flat-plate electron beam image forming apparatus in which a linear hot cathode and a complicated electrode structure are enclosed in a vacuum vessel.

In an image forming apparatus using an electron source,
For example, a part of the electron beam incident on the image forming member may be scattered, collide with the inner wall of the vacuum vessel, discharge secondary electrons, and charge up to increase the potential of the part. This not only distorts the potential distribution inside the vacuum vessel and makes the trajectory of the electron beam unstable, but also causes a discharge inside, which may cause the device to be deteriorated or destroyed. ing.

[0005] For example, the charged portion has a higher potential, so that the electrons are attracted, the charge-up further proceeds, and a discharge is generated along the inner wall of the vacuum vessel. As a method of preventing charge-up of the inner wall of the vacuum vessel which causes such discharge, a method of forming an antistatic film having an appropriate impedance on the inner wall of the vacuum vessel and removing the charge generated as described above is used. Can be applied. As an example to which such a method is applied, JP-A-4-163833 discloses a configuration in which a conductive layer made of a high-impedance conductive material is provided on a side surface of an inner wall of a glass container of an image forming apparatus.

As a method of manufacturing the above-mentioned flat type image forming apparatus, a conventional example will be described with reference to FIGS.

FIG. 16 is a sectional view of a flat type image forming apparatus 200 (hereinafter, referred to as a flat panel display).

The flat panel display 200 includes a face plate 201 and a rear plate 202, and an outer frame 203 connecting the face plate 201 and the rear plate 202. Further, since the inside is in a vacuum, an anti-atmospheric pressure support member (spacer) 204 is provided inside to withstand the atmospheric pressure. Face plate 2
Reference numeral 01 includes a face plate substrate glass 205, a black stripe 206 serving as a light shielding member formed on the substrate glass 205, an RGB phosphor 207, and a metal back 208 for applying a voltage.

The rear plate 202 has a rear plate substrate glass 209, an electron source generator (not shown) formed on the substrate glass 209, and a driving XY matrix wiring (not shown). I have. Atmospheric pressure resistant support member 20
4 is the black stripe 2 of the face plate 201
06 and the upper wiring 210 of the driving XY matrix wiring of the rear plate 202, and is fixed by conductive adhesive members 211 and 212 while maintaining predetermined conductivity.

A flat panel display 200 will be described below.
Will be described.

FIG. 7 shows a cross section of the face plate 201. The face plate 201 has a face plate substrate glass 205, a black stripe 206 thereon,
An RGB phosphor 207 and a metal back 208 are formed. As shown in FIG. 8, in the face plate 201, in order to improve the bonding strength, the metal back 208 of the part to which the atmospheric pressure-resistant support member 204 is bonded is removed by means of laser processing or the like, and the opening 213 is formed. Provide.

Next, a conductive adhesive 214 is formed in the opening 213.
Is applied (FIG. 9). An assembly jig 216 having a positioning member 215 in which the atmospheric pressure-resistant support members 204 are arranged so as to match the position of the bonded portion of the atmospheric pressure-resistant support member 204 of the face plate 201 is used. Thus, the atmospheric pressure resistant support member 204 is fixed at a predetermined position of the face plate 201 (FIG. 10). By this step, a face plate member 217 in which the atmospheric pressure supporting member 204 is fixed at a predetermined position is obtained.
1).

Next, the rear plate 202 is placed on the upper wiring 210 of the driving XY matrix wiring X or the wiring Y on the rear plate substrate glass 209 (FIG. 12), and the conductive frit glass 218 and the outer frame are bonded. An insulating frit glass 219 is applied, dried and pre-fired (FIG. 13). A face plate member 217 having an atmospheric pressure-resistant support member 204 fixed at a predetermined position, and an insulating frit glass 218 applied to the face plate side, dried and pre-baked, and the outer frame 203 and the driving XY matrix wiring are formed. A conductive frit glass 218 is formed on the upper wiring 210.
Then, an insulating frit glass 219 for bonding the outer frame is applied (FIG. 14), and the dried and pre-baked rear plate substrate glass 209 is set at a predetermined position (FIG. 15). Then, the frit glass is softened and pressed after pressing to seal the flat panel display 200 (FIG. 16).

[0014]

However, in a later step, the entire flat panel display 200 is required to have heat durability when performing heat aging and / or baking and to secure sealing performance for maintaining vacuum. When the face plate 201 and the rear plate 202 are bonded and fixed, it is necessary to use frit glass that requires heating at 400 ° C. to 450 ° C.

In order to withstand the atmospheric pressure, it is necessary to provide an anti-atmospheric pressure support member 204 inside the flat panel display.

The frit glass 219, 2 of the outer frame 203
As shown in FIG. 15, it is necessary to form the adhesive layer 20 larger than the thickness after bonding before heating and to reduce the thickness by heating and pressing to secure the adhesive layer, as shown in FIG. is there. This thickness depends on the structure and dimensions, but needs to be about 0.5 to 2 mm. Due to the amount of frit glass sinking, the method of positioning the face plate and rear plate at room temperature, fixing them with clips, etc., and then heating them, will cause misalignment in the XY directions when the frit glass sinks. Occurs, and a flat panel display with high positional accuracy cannot be obtained.

Further, the face plate and the rear plate are each held by a plate-shaped heating element arranged vertically, and the heating is uniformly performed while the respective plate-shaped heating elements are aligned. There is a process of pressing and further lowering the temperature while performing further alignment, performing alignment until the frit glass is solidified, and obtaining a flat panel display with high positional accuracy. Panel of 10
In the case of large displays larger than inches, large heating furnaces are required, and the manufacturing equipment becomes complicated and costly.
There is a problem that the process time becomes long.

In the present invention, in order to solve the above drawbacks,
It is an object of the present invention to easily and accurately install a flat panel display by using and bonding through holes of a face plate and a rear plate as positioning members.

[0019]

A through hole is provided in the face plate and the rear plate, and the through hole is used as an alignment mark for forming a fluorescent member and an acceleration electrode of the face plate. Is used as an alignment mark for forming an electron-emitting device and a wiring, and this through hole is used as an alignment mark for positioning and pressing and bonding an atmospheric pressure-resistant support member (spacer) on a face plate member. By using the flat panel display as a positioning member when assembling the face plate and the rear plate, a flat panel display can be easily manufactured with high precision.

In the method of forming the fluorescent member, the accelerating electrode, the electron-emitting device and the wiring on the face plate and the rear plate and then providing a positioning means such as a through-hole and assembling, the hole is formed on the glass substrate. Although it is necessary to form the face plate mechanically, it is difficult to make the mechanical processing accuracy on the glass substrate to be less than ± 50 μm. By using the combination of and the rear plate,
The positional accuracy at the time of assembly could be made ± 20 microns.

[0021]

Embodiments of the present invention will be described in detail with reference to the drawings.

[Embodiment 1] As a first embodiment of the present invention, an image forming apparatus using the surface conduction electron-emitting device shown in FIGS. 1 to 6 will be described.

FIG. 1 shows a glass substrate 1 for a face plate.
FIG. 3 is a cross-sectional view in which a through-hole 3 is opened by superposing a glass substrate 2 for a rear plate.

On the face plate glass substrate 1 having the through-holes 3, black stripes 6 (not shown), RGB phosphors 7, RGB phosphors 7, and metal backs 8 for voltage application are formed using the through-holes 3 as alignment marks. Thus, a glass plate 4 for a face plate is obtained (FIG. 2).

An electron source generating section (not shown) formed on a substrate glass (not shown) is formed on the rear plate glass substrate 2 with the through holes 3 as alignment marks.
Y matrix wiring (not shown) is formed to obtain a rear plate glass substrate 5 (FIG. 2).

A face plate member 10 having an atmospheric pressure resistant support member 9 fixed at a predetermined position and an insulating frit glass 11 applied to the face plate side, dried and temporarily baked, and a driving XY matrix A conductive frit glass 14 and an insulating frit glass 15 for bonding an outer frame are applied on the upper wiring 13 of the wiring, and the dried and pre-baked rear plate substrate glass 16 is set at a predetermined position (FIG. 3). ), The ceramic positioning pins 17 having the same thermal expansion coefficient as the substrate glass are inserted into the through holes 3 of the face plate 10 and the rear plate 16 to fix the positions of the face plate and the rear plate (FIG. 4). .

Next, the panel structure is heated to a temperature at which the frit glass softens and pressed from above the panel, so that the frit glasses 11 and 15 of the outer frame portion 12 flow until the strength and sealing property can be ensured, and are crushed. After cooling, a flat panel display 18 was obtained (FIG. 5). Thereafter, the positioning pins 17 were removed (FIG. 6).

According to the present invention, an image forming apparatus having high position and distance accuracy can be provided by a simple apparatus in a short time.

Thereafter, the airtight flat panel display 18 is subjected to vacuum processing. Thus, the image forming apparatus supplies a high voltage to the metal back and supplies an image signal via the driving XY matrix wiring,
Images can be displayed.

[Second Embodiment] Next, a second embodiment of the present invention will be described. In the present embodiment, by using a combination of one set of face plate and rear plate, it is possible to achieve high positional accuracy at the time of assembling. By using a combination of a plate and a rear plate, it is possible to increase the number of units that can be combined with a quantitative effect and a variation reduction effect. Therefore,
The degree of freedom of combination can be increased without being limited to a specific set of face plate and rear plate.

Third Embodiment Next, a third embodiment of the present invention will be described. In the present embodiment, the first embodiment
Although a ceramic positioning pin having the same coefficient of thermal expansion as the substrate glass was used, during heating, it was larger than the substrate glass to prevent a decrease in positioning accuracy due to an increase in clearance between the pin and the through hole of the substrate. Using a ceramic positioning pin with a coefficient of thermal expansion,
By reducing the clearance between the pin and the through hole of the substrate during heating, it is possible to prevent a decrease in positioning accuracy.

By selecting the material of the ceramic positioning pins, the ceramic positioning pins having a larger coefficient of thermal expansion than the substrate glass of the face plate and the rear plate can be used. Since the temperature becomes higher than the temperature at the time of positioning, the positioning accuracy at the time of heating increases, and when the temperature becomes low after fixing and fixing, the positioning pin can be easily removed.

According to the method for manufacturing an image forming apparatus according to the above embodiment, pin holes for positioning remain in the rear plate and / or face plate of the image display device manufactured by this method. However, if the pin hole is inside the airtight container, leakage occurs during airtightness, and it is preferable that the pinhole is outside the airtight container. Also, the number of pin holes may be one or more. Further, a pin hole may be provided at a position where the inside of the outer frame portion 12 contacts, and the outer frame portion 12 may also serve as a pin.

[0034]

As described above, according to the present invention,
Through holes are provided in the face plate and the rear plate, and the through holes are used as alignment marks when forming a fluorescent member and an acceleration electrode of the face plate, and the through holes in the rear plate are used to form electron-emitting devices and wiring. Used as an alignment mark, this through hole
By using an atmospheric pressure resistant support member (spacer) as an alignment mark when positioning and pressing and bonding on the face plate member, and as a positioning member when assembling the face plate and the rear plate, the flat panel The display can be manufactured with high precision and easily.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 4 is a sectional view illustrating an embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating an embodiment of the present invention.

FIG. 6 is a cross-sectional view for explaining an embodiment of the present invention.

FIG. 7 is a schematic diagram for explaining a conventional example.

FIG. 8 is a schematic diagram for explaining a conventional example.

FIG. 9 is a schematic diagram for explaining a conventional example.

FIG. 10 is a schematic diagram for explaining a conventional example.

FIG. 11 is a schematic diagram for explaining a conventional example.

FIG. 12 is a schematic diagram for explaining a conventional example.

FIG. 13 is a schematic diagram for explaining a conventional example.

FIG. 14 is a schematic diagram for explaining a conventional example.

FIG. 15 is a schematic diagram for explaining a conventional example.

FIG. 16 is a schematic diagram for explaining a conventional example.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 glass plate for face plate 2 glass substrate for rear plate 3 through hole 4 glass substrate for face plate with clear through hole 3 5 glass plate for rear plate 6 black stripe 7 RGB phosphor 8 metal back for applying voltage 9 large resistance Atmospheric pressure support member 10 Face plate member having atmospheric pressure resistant support member 9 fixed at a predetermined position 11 Insulating frit glass 12 Outer frame on which insulating frit glass 11 is applied, dried and calcined 13 Driving XY matrix Upper wiring of wiring 14 Conductive frit glass 15 Insulating frit glass for bonding outer frame 16 Rear plate substrate glass on which frit glass is applied, dried and pre-baked 17 Positioning pin 18 Flat panel display 200 Flat panel display 201 Face Plate 202 Rear plate 203 Outer frame 204 Atmospheric pressure resistant support member 205 Face plate substrate glass 206 Black stripe 207 RGB phosphor 208 Metal back for applying voltage 209 Rear plate substrate glass 210 Upper wiring of XY matrix wiring for driving 211, 212 Conductivity Adhesive member 213 Opening 214 Conductive adhesive 215 Positioning member 216 Assembly jig 217 having positioning member 215 Face plate member 218 having atmospheric pressure resistant support member 204 fixed at a predetermined position 218 Conductive frit glass 219 Outer frame bonding Insulating frit glass for

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01J 31/12 H01J 31/12 C

Claims (7)

[Claims] 1. A rear plate on which a plurality of electron-emitting devices and wirings are formed, a face plate on which a fluorescent member and an acceleration electrode are arranged facing the rear plate, and the face plate and the rear plate An image forming apparatus having a spacer covered with a conductive film disposed between the spacer and a connecting member for electrically and mechanically connecting the spacer, wherein the glass material for the face plate and the rear plate is provided. After forming a through hole for alignment, which is used when forming a fluorescent member and an accelerating electrode, an electron-emitting device and wiring,
The plurality of electron-emitting devices and wiring, the fluorescent member and the accelerating electrode are formed with the through hole as an alignment mark, and the through hole is used as the alignment mark, and the spacer is positioned and pressed on a face plate member. A method of manufacturing an image forming apparatus, wherein the face plate and the rear plate to which the spacers are bonded are bonded using the through holes as positioning members. 2. The method for manufacturing an image forming apparatus according to claim 1, wherein the through holes of the face plate and the rear plate are simultaneously formed by overlapping both. 3. The method of manufacturing an image forming apparatus according to claim 1, wherein the plurality of through holes of the face plate and the rear plate are simultaneously formed by overlapping both. Manufacturing method. 4. The method for manufacturing an image forming apparatus according to claim 1, wherein the member for positioning through the through-hole is equal to a coefficient of thermal expansion of substrate glass of the face plate and the rear plate or the substrate. A method of manufacturing an image forming apparatus, having a larger thermal expansion coefficient than glass. 5. A rear plate on which a plurality of electron-emitting devices and wirings are formed, a face plate on which a fluorescent member and an accelerating electrode are arranged facing the rear plate, and the face plate and the rear plate An image forming apparatus having a spacer covered with a conductive film disposed between the spacer and a connecting member for electrically and mechanically connecting the spacer, wherein the glass material for the face plate and the rear plate is provided. Forming a plurality of through holes for alignment, forming the through holes as alignment marks, positioning the spacers on the face plate member using the through holes as the alignment marks, pressing and bonding, The face plate and the rear plate to which a spacer is adhered, the through hole is a positioning member. Method of manufacturing an image forming apparatus characterized by using, to adhere Te. 6. The method for manufacturing an image forming apparatus according to claim 5, wherein the member for positioning through the through-hole is equal to a coefficient of thermal expansion of substrate glass of the face plate and the rear plate or the substrate. A method of manufacturing an image forming apparatus, having a larger thermal expansion coefficient than glass. 7. An image display device manufactured by the method of manufacturing an image forming device according to claim 1.