JP2000251767A - Image display device, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device high in assembling accuracy, high in image quality, and high in productivity, by placing a spacer and a support frame for supporting between a first substrate and a second substrate and providing a flexible portion projecting from the support frame. SOLUTION: A vessel is made of glass or the like and is constituted with a first and a second substrate 1, 2 having patterns such as electrodes and wiring and a support frame 3. For an image forming device using an electron emitting element, its inside is vacuumed. Into the image display device using a plasma, gas is filled. Flexible portions movable vertically are provided at four edges of the support frame 3 through a cutting means such as polishing means, and are bent and deformed by a pressurizing means applied through the first and the second substrate 1, 2. The support frame 3 is made of the same material as the first and the second substrate 1, 2, and even if the material is a flexible portion of the same material or small in size, it has sufficient elastic coefficient and excellent airtightness. Because the flexible portions are provided at the four edges of the support frame 3, and positional displacement in the screen horizontal direction is certainly prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat plate type image forming apparatus and a method for manufacturing the same, and more particularly, to an image forming apparatus having a vacuum-tight airtight container having a first base and a second base and / or a support frame. And its manufacturing method.

[0002]

2. Description of the Related Art In recent years, an active matrix type liquid crystal has been used as a flat panel type image forming apparatus instead of a CRT. In addition, since the active matrix type liquid crystal is not a self-luminous type, display is performed using a backlight. However, since the light use efficiency is low, a brighter image forming apparatus has been desired.

For this reason, electrons emitted from a cold cathode electron-emitting device such as a plasma display, a field electron-emitting device, and a surface conduction electron-emitting device (for example, Japanese Patent Application Laid-Open No. 7-235255) are accelerated to collide with a phosphor. Then, the development of a self-luminous type image forming apparatus that performs display by causing a phosphor to emit light is being put to practical use. These flat-panel image forming apparatuses have been increasing in area to several tens of inches. In particular, in these image forming apparatuses, a highly accurate and easy assembling method is desired.

FIG. 11 shows a liquid crystal display device as an example of a method of assembling these flat plate type image forming apparatuses. This will be described using the method of assembling the flat plate type image forming apparatus described in Japanese Patent Application Laid-Open No. Hei 5-232451. The alignment of a pair of liquid crystal glass substrates 1 and 2 (hereinafter, a first substrate (body) and a second substrate (body)) will be described. The first substrate and the second substrate are provided with an electrode pattern, a positioning pattern, and a sealing material (S11, S12). These first and second substrates are installed in an alignment device. The first substrate and the second substrate are heated and kept warm by the alignment device (S13). Next, the first substrate and the second substrate
With the softening of the sealing material, alignment is performed via the alignment pattern (S14). Next, the first substrate and the second substrate are pressed and aligned at the same time (S15, S16). Finally, after the pressurized state is maintained for a predetermined time, the pressurization is released (S17), and the assembled liquid crystal cell is removed from the alignment device.

[0005] In this way, even if a positional shift occurs in a high temperature state, the alignment is performed, so that the first substrate and the second substrate can be aligned with high accuracy. The publication also describes, as a conventional technique, a method of performing temporary fixing with a photocurable adhesive after positioning at room temperature, and further heating and curing the sealing material.

[0006]

In a flat plate type image forming apparatus, the elements on the first base and the image forming members on the second base are in a one-to-one correspondence, and pixels of several tens μ to several hundred μ are provided. To form At this time, if the alignment between the element and the image forming member is insufficient, the brightness of the pixels may vary, and in the case of color, the colors of the RCB may be mixed or the image quality may be impaired. For this reason, it is necessary that the alignment between the element on the first base and the image forming member on the second base be highly accurate.

In the above-mentioned liquid crystal, the first substrate and the second substrate are heated at a high temperature, and the adhesive disposed between the first substrate and the second substrate is pressurized while being softened. After the first base and the second base are aligned in this state, the adhesive is solidified to perform the first base and the second base. For this reason, alignment is performed in a high-temperature bath, or a heater is installed in a pressing jig.

For this reason, the alignment apparatus requires a high-temperature specification accuracy or a complicated process, which causes a problem such as a decrease in productivity.

Further, in an image forming apparatus for causing an electron beam generated from the electron-emitting device to collide with a phosphor and emit light,
Further, since it is necessary to constitute a vacuum container, the first
The bonding material corresponding to the adhesive disposed between the first substrate and the second substrate is bonded using a glass material so as to maintain a vacuum. At this time, in the case of the liquid crystal, since the adhesive is an organic adhesive, the softening temperature is about 150 ° C., whereas the glass material has a high temperature of 400 ° C. or more. The problem becomes severe.

[0010] On the other hand, as pointed out in the same publication, in the manufacturing method using room temperature alignment and temporary fixing, problems such as displacement occur due to softening of the adhesive material.

An object of the present invention is to provide a flat plate type image forming apparatus with high assembling accuracy of these flat type image forming apparatuses, high image quality and high productivity, and a method of manufacturing the same.

[0012]

An image forming apparatus according to the present invention comprises a first base, a second base, a spacer for supporting the first base and the second base, and a support frame. An image forming apparatus provided with a flexible portion protruding from the support frame.

The image forming apparatus according to the present invention is characterized in that the flexible portions are provided at four corners of the support frame.

In the image display device of the present invention, an electron-emitting device such as a cold cathode electron-emitting device is provided on the first base, and an image forming member such as a phosphor is provided on the second base. An image display device, a plasma display, and the like, which are provided, but are not necessarily limited thereto, and an image that requires alignment between the first base and the second base and a spacer. The present invention is applied to a display device.

The method for manufacturing an image forming apparatus according to the present invention is a manufacturing method having the following steps.

A first step of disposing a first adhesive and a second adhesive on the first substrate and the second substrate or the support frame, positioning the first substrate and the second substrate, A second step of temporarily fixing the first base and the second base by using the first adhesive by bringing the first base and the second base into contact with the support frame, a third step of pressing the first base and / or the second base, A fourth step of softening the first adhesive provided on the first substrate and the second substrate or the second adhesive provided on the support frame by a heating step, and solidifying the second adhesive; The fifth step of joining the base and the support frame.

The method of manufacturing an image forming apparatus according to the present invention is a method of manufacturing an image forming apparatus, wherein the first adhesive is disposed on a flexible portion protruding from the support frame.

[0018] The method of manufacturing an image forming apparatus according to the present invention is characterized in that the first adhesive is an inorganic adhesive and the second adhesive is frit glass. Is the way.

[Operation] According to the present invention, the first base member,
In an image forming apparatus in which a second base, a spacer for supporting between the first base and the second base, and a support frame are provided, a flexible portion protruding from the support frame is provided. The substrate and / or the second substrate can be moved in the vertical direction of the screen while maintaining the positional relationship in the horizontal direction of the screen, and there is no need to perform positioning using a separate jig or the like.

Further, since the flexible portions are provided at the four corners of the support frame, the displacement in the horizontal direction of the screen can be reliably prevented.

Since the image forming apparatus of the present invention has the above configuration, an electron-emitting device such as a cold-cathode electron-emitting device is provided on the first base, and a fluorescent material or the like is provided on the second base. The vacuum container of the image forming apparatus in which the image forming member is provided and the container of the plasma display can also be configured.

The method for manufacturing an image forming apparatus of the present invention is a manufacturing method having the following steps.

A first step of disposing a first adhesive and a second adhesive on the first substrate and the second substrate or the support frame; positioning the first substrate and the second substrate; A second step of temporarily fixing the first base and the second base by using the first adhesive by bringing the first base and the second base into contact with the support frame, a third step of pressing the first base and / or the second base, A fourth step of softening the first adhesive provided on the first substrate and the second substrate or the second adhesive provided on the support frame by a heating step, and solidifying the second adhesive; And a fifth step of joining the support frame and the support frame.

Further, a method of manufacturing an image forming apparatus according to the present invention is a method of manufacturing an image forming apparatus, wherein the first adhesive is disposed on a flexible portion protruding from the support frame.

Further, the method of manufacturing an image forming apparatus according to the present invention is characterized in that the first adhesive is an inorganic adhesive and the second adhesive is frit glass. It is a manufacturing method of.

According to the method of manufacturing an image forming apparatus of the present invention, the first substrate or the second substrate can be aligned and temporarily fixed at or near room temperature, and the bonding material can be softened and solidified. In the high-temperature heating / cooling process for performing the positioning, it is not necessary to perform the positioning, and thus the positioning can be performed with high precision and easy. Furthermore, an alignment device corresponding to a high temperature is not required, and the device can be simplified.

As described above, according to the image forming apparatus and the method of manufacturing the same of the present invention, high-precision assembly can be easily performed without a complicated alignment apparatus.
An inexpensive and high-quality image forming apparatus can be realized.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described.
This will be described in detail with reference to the drawings.

[First Embodiment] This embodiment is directed to a field emission device of a plasma, especially a cold cathode electron emission device,
An object of the present invention is to provide a novel configuration and a manufacturing method of a flat-panel image forming apparatus in which a plurality of electron-emitting devices such as surface conduction electron-emitting devices are arranged, and an image forming member such as a phosphor emits light to display.

First, an example of a main configuration of the image forming apparatus of the present invention will be described with reference to FIGS.

FIG. 1 shows each block configuration of the image forming apparatus of the present invention, wherein 1 is a first base, 2 is a second base, 3 is a support frame, and 4 is an atmospheric pressure support member. It is a spacer. At four corners of the support frame 3, flexible portions (also referred to as leaf spring portions) made by polishing or the like are arranged.

FIG. 2 is a view showing a method of manufacturing the image forming apparatus of the present invention, wherein 5 is an adhesive for temporary fixing, 6 is an adhesive for permanent fixing, and reference numerals 1 to 3 are the same as those in FIG. It is the same as the same reference numeral, and the duplicate description will be omitted. FIG. 3 is a partially enlarged view of the flexible portion of the image forming apparatus after assembly. Reference numerals 1 to 3 and reference numerals 5 and 6 are the same as those in FIG.

4 to 6 show another structural example of the present invention. In FIG. 4, reference numeral 31 denotes a support frame having a structure different from that of the support frame 3, and reference numeral 41 denotes a spacer 4 FIG. 5 is a cross-sectional view illustrating a procedure of a forming method of the image forming apparatus corresponding to FIG. 2, and FIG. 6 is a supporting frame 31, a first base 1, and a second base.
FIG. 3 is a local cross-sectional view in which a base 2 is formed.

In FIGS. 1 to 3, the first base 1 is
This is a rear plate made of glass or the like, on which patterns such as electrodes and wiring are formed. Further, in an image forming apparatus using an electron-emitting device, an electron-emitting device is provided.
In a plasma display panel, a partition for limiting a plasma region is provided, and in a reflection type, a phosphor or the like is provided.

The second base 2 is a face plate made of glass or the like, on which patterns such as electrodes and wirings are formed. Furthermore, in an image forming apparatus using an electron-emitting device, a phosphor that emits light by colliding with electrons is arranged. Further, in the plasma display panel, wirings and, if necessary, phosphors are provided.

The support frame 3 is made of the same material as the bases 1 and 2, and the basics 1 and 2 and the support frame 3 constitute a container. In an image forming apparatus using an electron-emitting device, the inside is evacuated. In an image forming apparatus using plasma, gas is sealed.

At the four corners of the support frame 3, there are provided flexible portions which can be moved up and down by cutting means such as polishing.
And bendable by pressing means applied via the Note that the support frame 3 is made of the same material as the bases 1 and 2, and in the present embodiment, even if it is a flexible portion (leaf spring) made of the same material, even if it is slightly dimensional,
It has a sufficient modulus of elasticity and excellent airtightness. Further, since the flexible portions are provided at the four corners of the support frame, the flexible portions have a function of reliably preventing the screen from being displaced in the horizontal direction.

As shown in FIG. 1, a flexible portion may be provided so as to be in contact with the bases 1 and 2 at the symmetrical positions of the corners of the rectangular frame of the support frame 3, and as shown in FIG. At the same position of the corner, the base 1,
A flexible portion may be provided so as to contact both of them.

The positions where the flexible portions are provided may be two or more for each of the substrates 1 and 2.

As the bonding between the support frame 3 and the base 1 and the base 2, a first adhesive 5 for temporary fixing and a second adhesive 6 for permanent fixing are used, and the first adhesive for temporary fixing is used. 5 is applied to the flexible portion, and the second adhesive 6 for permanent fixing is applied so as to be disposed on the support frame 3 other than the flexible portion.

The first adhesive 5 is bonded at room temperature,
An inorganic adhesive or the like that does not soften even at high temperatures is used. As the second adhesive 6, frit glass or the like that softens and adheres at about 400 ° C. is used. In addition, the second adhesive 6
Is applied evenly between the base 1 and the support frame 3 and between the second base and the support frame 3 to prevent leakage as a vacuum vessel or a gas-filled vessel.

The spacer 4 is a support for supporting the atmospheric pressure when the container of the image forming apparatus is filled with a low pressure gas such as a vacuum or a plasma display panel.
Designed to withstand atmospheric pressure. Various forms such as a columnar shape, a flat plate shape, and an irregular shape are applied to the form and arrangement of the spacer 4. The material constituting the spacer 4 is glass, organic polymer, ceramics, or a conductive material having a secondary electron emission coefficient close to 1 such as Si, CrO ₂ , CuO on the surface thereof.
, A metal oxide or the like, an insulating layer, or the like is laminated in one layer or a plurality of layers.

When used as a vacuum container, the inside of the container is evacuated from an exhaust pipe (not shown), and after the vacuum is formed, the exhaust pipe is sealed. When introducing a gas, the gas is introduced and sealed after evacuation.

According to the above-described structure, the assembling accuracy of the image forming apparatus can be increased, and accurate alignment can be achieved.
An image forming apparatus with high image quality and high productivity can be provided.

[Second Embodiment] Next, as a second embodiment, a part of a method of manufacturing an image forming apparatus of the present invention will be described with reference to FIGS. Hereinafter, the procedure of the manufacturing method will be described sequentially.

(1) An electrode, a wiring,
An element or the like is formed. When forming an electron-emitting device,
A plurality of electron-emitting devices are formed, and electrodes to which a voltage is applied are formed on both end electrodes of each of the electron-emitting devices by wiring in a matrix. The formation method differs depending on each electron-emitting device, and an example thereof will be described later.
Also, in the case of a plasma display panel, the first substrate is formed by applying an electrode for applying an electric field to the plasma and a fluorescent material that emits fluorescence by ultraviolet rays from the plasma for each pixel, although different for the AC drive and the DC drive. Form one.

(2) The electrodes, wirings,
A phosphor or the like is formed. In the case of the second substrate 2 corresponding to the cold cathode electron-emitting device, a phosphor of each color is applied to a glass substrate to form a metal back electrode to which a high voltage is applied. In the case of a plasma display panel, a phosphor is applied, a Y electrode for the X electrode of the first base 1 is formed, and a dielectric layer and a protective layer are formed.

(3) The substrates 1 and 2 are set on a positioning device (not shown).

(4) The support frame 3 and the spacer 4 are provided on the base 1. Note that the temporary fixing adhesive 5 and the permanent fixing adhesive 6 are applied to the support frame 3 in advance. When the spacer 4 is provided on the base 2, the spacer 4 is bonded in advance to a position where the spacer 4 comes into contact with the base 2 with frit glass or the like.

(5) The positioning of the substrates 1 and 2 is performed by the positioning device.

(6) The base 1 and the temporary fixing adhesive 5
2. Temporarily fix the support frame 3.

(7) The temporarily fixed bases 1 and 2 and the support frame 3 are placed in a firing furnace, and the bases 1 and 2 are pressurized by a pressing means.

(8) The bases 1, 2 and the like are heated in a firing furnace to cause the permanent fixing adhesive 6 to flow, and are heated and pressed for a desired time.

(9) Thereafter, cooling is performed.

(10) Release the pressurizing means and take it out of the positioning device.

Thus, the container of the image forming apparatus is manufactured. Incidentally, steps for forming an electron-emitting device and steps for forming a predetermined electrode and a dielectric layer in the case of a plasma display panel are appropriately inserted into the above-mentioned manufacturing steps.

[0057]

[Embodiment 1] A first embodiment of the present invention is shown in FIG.
Is an image forming apparatus using the container having the configuration shown in FIG.

FIG. 1 shows the structure of an image forming apparatus according to the present invention, wherein 1 is a first base, 2 is a second base, 3 is a support frame, and 4 is a spacer which is an atmospheric pressure support member. is there. At the four corners of the support frame 3, flexible portions made by polishing or the like are arranged.

FIG. 2 is a view showing a method of manufacturing the image forming apparatus of the present invention, wherein 5 is an adhesive for temporary fixing, and 6 is an adhesive for permanent fixing. FIG. 3 is a partially enlarged view of a flexible portion of the image forming apparatus after assembly.

In this embodiment, a plurality of surface conduction electron-emitting devices, which are cold cathode electron-emitting devices, are formed on a first substrate as electron-emitting devices, and a phosphor is provided on a second substrate. A color image forming apparatus having an effective display area of 15 inches diagonally and an aspect ratio of 3: 4 was prepared. First, an image forming apparatus according to the present invention will be described with reference to FIG. 8, and then a manufacturing method thereof will be described.

FIG. 8 is a perspective view of the image forming apparatus used in this embodiment, in which a part of the panel is cut away to show the internal structure.

In the figure, 85 is a rear plate, 86 is a support frame, 87 is a face plate, and 85 to 87 form an airtight container for maintaining the inside of the display panel at a vacuum. When assembling the airtight container, it is necessary to seal the joint of each member to maintain sufficient strength and airtightness. Reference numeral 80 denotes a flat spacer, which is a spacer provided with conductivity.

On the rear plate 85, N × M surface conduction emission devices 82 are formed. N and M are 2
The above positive integer is set as appropriate according to the target number of display pixels. For example, in a display device for displaying high quality television, N = 3000, M =
It is desirable to set the number to 1000 or more. In this embodiment, N = 333 and M = 250. N ×
The M surface-conduction-type emission elements 82 include M row-direction wirings 8.
3 (sometimes referred to as upper wiring) and N column-directional wirings 8
4 (may be referred to as a lower wiring). In the present embodiment, an example in which the surface conduction electron-emitting device 82, the row wiring 83, and the column wiring 84 are formed on the substrate 81 is shown.
The rear plate 85 may also be used.

Next, the structure of a surface conduction electron-emitting device applicable to the present invention will be described with reference to FIG. FIG.
9A is a plan view, and FIG. 9B is a cross-sectional view.

In FIG. 9, 91 is a substrate, 92 and 93 are device electrodes, 94 is a conductive thin film, and 95 is an electron emitting portion. The surface conduction electron-emitting device is a substrate 9 such as a glass substrate.
1. Device electrodes 92 and 94 made of conductive Al, Cu, alloys, oxides thereof, etc. are formed on the substrate 1 by vacuum deposition or printing technology,
A typical conductive thin film 94 such as PdO is formed by a printing technique, a photolithography technique, or the like. Thereafter, a predetermined pulse voltage is applied to the device electrodes 92 and 93 connected to the row direction wiring 83 and the column direction wiring 84 in a predetermined atmosphere, and the electron emitting portion 95 is formed by an energization forming process. Subsequently, a current activation process and a stabilization process are performed to form a stable surface conduction electron-emitting device. It should be noted that the energization forming process is more convenient if performed after forming the airtight container, since the first substrate is not exposed to the air, and thus the forming process is more convenient.

Further, the conductive thin film 94 is subjected to an energization forming process through the device electrodes 92 and 93 to locally destroy, deform or deteriorate the conductive thin film 94.
Forming an electron emitting portion 95 in an electrically high resistance state,
Further, an activation step for remarkably improving the emission current is performed by applying a voltage to the conductive thin film 94 of the surface conduction electron-emitting device and causing a current to flow through the device.
5 to emit electrons. It is the same as that described in Japanese Patent Application Laid-Open No. Hei 7-235255.

On the other hand, on the second substrate 2, a fluorescent film 88 is formed on the lower surface of the face plate 87. Since this embodiment is a color display device, the fluorescent film 88
The phosphors of the three primary colors of red, green, and blue used in the field of CRT are separately applied to the portions. The phosphors of each color are separately applied in a stripe shape as shown in FIG. 10A, for example, and a black conductor 1 is interposed between the phosphor stripes.
01 is provided. The purpose of providing the black conductor 101 is to prevent the display color from being shifted even if the electron beam irradiation position is slightly shifted, and to prevent the reflection of external light to prevent the display contrast from being lowered. And preventing charge-up of the fluorescent film by the electron beam. Although graphite was used as a main component for the black conductor 101,
Other materials may be used as long as they are suitable for the above purpose.

The method of applying the three primary color phosphors is not limited to the stripe arrangement shown in FIG. 10A, but may be, for example, a delta arrangement as shown in FIG. Other arrangements may be used.

When a monochrome display panel is formed, a monochromatic phosphor material may be used for the phosphor film 88, and a black conductive material may not be necessarily used.

A metal back 89 known in the field of CRT is provided on the surface of the fluorescent film 88 on the rear plate side. The purpose of providing the metal back 89 is to improve the light utilization rate by mirror-reflecting a part of the light emitted from the fluorescent film 88, to protect the fluorescent film 88 from the collision of negative ions, and to increase the electron beam acceleration voltage. To act as an electrode for applying the electric field, or to act as an electron conduction path for exciting the fluorescent film 88.

The metal back 89 is formed by forming a fluorescent film 88 on the face plate substrate 87, smoothing the surface of the fluorescent film, and vacuum-depositing Al thereon. When a fluorescent material for low voltage is used for the fluorescent film 88, the metal back 89 is not used.

Although not used in this embodiment, for the purpose of applying an acceleration voltage and improving the conductivity of the fluorescent film, a transparent material made of, for example, ITO is provided between the face plate substrate 87 and the fluorescent film 88. Electrodes may be provided.

Further, Dx1 to Dxm and Dy1 to Dy
n and Hv are electric connection terminals having an airtight structure provided for electrically connecting the display panel and an electric circuit (not shown). Dx1 to Dxm are electrically connected to the row wiring 83 of the multi-electron beam source, Dy1 to Dyn are connected to the column wiring 84 of the multi-electron beam source, and Hv is electrically connected to the metal back 89 of the face plate.

The basic configuration of the image forming apparatus to which the present invention is applied, particularly the configuration of the surface conduction electron-emitting device has been described.

Next, a method of manufacturing the image forming apparatus of the present invention will be described.

In this embodiment, as shown in FIG. 1, the flexible portions are provided so as to be in contact with the base 1 and the base 2 at two places, respectively, and the positions thereof are also at diagonal positions of the support frame.

The flexible portion was manufactured by polishing the four corners of the support frame 3 with a grindstone, and the thickness of the flexible portion was set to 1 mm.

<< Preparation of Base 1 >> (Step-1) A silicon oxide film was formed on a blue glass substrate as a first base by a sputtering method, and a lower wiring was formed thereon by screen printing. Next, an interlayer insulating layer was formed between the lower wiring and the upper wiring, and an upper wiring was further formed. Next, device electrodes 92 and 93 connected to the lower wiring and the upper wiring were formed. Next, a conductive thin film 94 is formed by a sputtering method and then patterned to obtain a desired form.

Through the above steps, a surface conduction electron-emitting device having a simple matrix wiring on the substrate 1 was formed.

<< Preparation of Substrate 2 >> (Step-2) A phosphor and a black conductor were formed on a blue plate glass substrate as a second substrate by a printing method. A smoothing treatment was performed on the inner surface of the fluorescent film, and thereafter, Al was deposited using vacuum evaporation or the like to form a metal back.

Further, a flat spacer having a thickness of 200 μm and a height of 4.0 mm was bonded with frit glass. The spacer was made of glass, and was provided with conductivity by laminating CrO ₂ on its surface.

Through the above steps, the phosphors of the three primary colors were arranged in stripes on the substrate 2, and the spacers were fixed.

(Step-3) A frit glass layer 6 for permanently fixing the support frame 3 to the bases 1 and 2 was applied to a desired position by a dispenser device and formed by calcination (380 ° C.). Frit glass is LS-30 manufactured by NEC Corporation
81 was used as a paste.

After the preliminary firing of the frit glass 6, an adhesive 5 for temporarily fixing the support frame was applied to the flexible portion.

As the adhesive 5 for temporary fixing, an inorganic adhesive (CERAMABOND 569 manufactured by AREMCO) was used.

The adhesive material 5 for temporary fixing is not limited to this, and any material may be used as long as the adhesive strength does not decrease at a temperature at which the frit glass for final fixing softens.

(Step-4) Next, the bases 1 and 2 and the support frame 3 are connected to a CCD (Charge Coupled Device) of an area sensor.
e) and an XY stage were installed on a positioning device (not shown) to perform positioning. The alignment was performed by observing the alignment marks provided on each of the bases 1 and 2 with a CCD and adjusting the XY stage so that the support frame 3 was at a desired position (FIG. 2A).

(Step-5) After completion of the positioning, the substrates 1, 2
And the support frame 3 were brought into contact with each other, and fixed with the temporary fixing adhesive 5. At that time, in order to shorten the curing time, the whole was raised to about 70 ° C. to perform an operation (FIG. 2B).

(Step-6) The temporarily fixed image forming apparatus was introduced into a heating furnace, and kept at 420 ° C. for 10 minutes in order to soften the frit glass for permanent fixing. At this time, in order to increase the adhesive strength of the frit glass for permanent fixing, a load of about 10 kg was applied from above the base 2 by a pressing means (FIG. 2 (c)).

Although the frit glass is softened, the base 2 sinks. However, since the flexible portion can move in the height direction (up and down direction in FIG. 3), even if the sink occurs, XY
Directional positioning is maintained.

(Step-7) After a desired time, the heating furnace is gradually cooled to harden the frit. Finally, the pressurizing means was removed, and the container for the image forming apparatus to which the substrates 1 and 2 and the support frame 3 were adhered was taken out.

(Step-8) The atmosphere in the container completed as described above is exhausted by a vacuum pump through an exhaust pipe (not shown), and after reaching a sufficient degree of vacuum, the external terminal Dx
1 to Dxm and Dy1 to Dyn, a voltage is applied to the electron-emitting device to cause the electron-emitting portion 125 to
24 was produced by performing a forming step and an activation step. Further, after a series of processes, at 250 degrees, 10
Time baking was performed.

(Step-9) Next, at room temperature, the air was evacuated to a degree of vacuum of about 10 −8 torr, and an exhaust pipe (not shown) was welded by heating with a gas burner to seal the envelope. went. Preferably, thereafter or before encapsulation, an energization forming process for forming an electron emission portion of the above-described surface conduction electron-emitting device, an energization activation process for improving electron emission efficiency, and an energization stabilization process are performed.

Finally, in order to maintain the degree of vacuum after sealing,
Getter treatment was performed by a high-frequency heating method.

In the image display device of the present invention completed as described above, the scanning signals and the modulation signals are respectively supplied to the respective electron-emitting devices by signal generating means (not shown) through the external terminals Dx1 to Dxm and Dy1 to Dyn. , By applying electrons, a few kV is applied to the metal back 89 or a transparent electrode (not shown) through the high voltage terminal Hv.
The above high pressure is applied to accelerate the electron beam, and the fluorescent film 88
Then, the image was displayed by exciting and emitting light.

As a result, there was no displacement of the electron-emitting device and the phosphor, and there was no variation in luminance and no color mixing caused by the displacement.

In this embodiment, as shown in FIG. 1, the flexible portions are provided so as to be in contact with two different places on the base 1 and the base 2, respectively, so that the movable range of the flexible portion can be widened. Even if the amount of sinking of the base 2 is large due to the pressing means, the movement can be absorbed.

[Embodiment 2] The second embodiment of the present invention is different from the first embodiment in the structure of the flexible portion formed on the support frame. ing. Therefore, at the time of temporary fixing, it can be fixed to four places on each base.

Further, the method of disposing the spacers is different, and the spacers are arranged in a staggered manner in which short spacers are alternately arranged.

FIG. 5 is a view showing a method of manufacturing the image forming apparatus of the present invention, wherein 5 is an adhesive for temporary fixing, and 6 is an adhesive for permanent fixing. FIG. 6 is a partially enlarged view of the flexible portion of the image forming apparatus after assembly.

The size of the effective display area of the image forming apparatus is an aspect ratio of 3: 4 and a diagonal of 10 inches.

In this embodiment, as shown in FIG. 4, the flexible portions are arranged so as to be in contact with the base 1 and the base 2 at four places, respectively, and the positions are also at the four corners of the support frame.

The flexible portion was manufactured by polishing four corners of the support frame 3 with a grindstone, and the thickness of the flexible portion was set to 1 mm.

The basic structure of an image forming apparatus to which the present invention is applied is the same as that described in the first embodiment.

Next, a method for manufacturing the image forming apparatus of the present invention will be described.

<< Preparation of Base 1 >> (Step-1) Example 1 was applied to a 10-inch substrate shown in FIG.
In the same manner as in (Step 1), a device electrode, a lower wiring, an interlayer insulating layer, and an upper wiring were formed in this order by a printing method. The conductive thin film was prepared by applying a droplet of an aqueous solution of an organometallic compound by an inkjet method, and then baking the substrate at 350 ° C. to thermally decompose the organometallic compound to form a conductive film of a metal oxide. In this case, the step of patterning the conductive thin film applied by the ink jet method is not required.

Through the above steps, a surface conduction electron-emitting device in which simple matrix wiring was performed on the substrate 1 was formed.

<< Preparation of Substrate 2 >> (Step-2) A phosphor and a black conductor were formed on a blue glass substrate by a printing method. A smoothing treatment was performed on the inner surface of the fluorescent film, and then Al was deposited using vacuum evaporation or the like to form a metal back.

Further, a flat spacer having a thickness of 200 μm and a height of 4.0 mm was bonded with frit glass. The spacer was made of glass, and was provided with conductivity by laminating CrO ₂ on its surface.

Through the above steps, the phosphors of the three primary colors were arranged in stripes on the substrate 2 and the spacers were fixed.

(Step-3) A frit glass layer 6 for permanently fixing the support frame 3 to the bases 1 and 2 was applied to a desired position by a dispenser device and formed by calcination (380 ° C.). Frit glass is LS-30 manufactured by NEC Corporation
81 was used as a paste.

After the preliminary firing of the frit glass 6, an adhesive 5 for temporarily fixing the support frame was applied to the flexible portion.

As the temporary fixing adhesive 5, an inorganic adhesive (CERAMA BOND 569 manufactured by AREMCO) was used.

The adhesive material 5 for temporary fixing is not limited to this, and any material may be used as long as the adhesive strength does not decrease at a temperature at which the lit glass 6 for permanent fixing is softened.

(Step-4) Next, the substrates 1 and 2 and the support frame 3 were set on a positioning device (not shown) composed of a CCD and an XY stage of an imaging device, and alignment was performed. The alignment was performed while observing the alignment marks provided on the respective substrates with a CCD and adjusting them with an XY stage so as to come to a desired position (FIG. 5A).

(Step-5) After the positioning is completed, the substrates 1, 2
And the support frame 3 were brought into contact with each other, and fixed with a temporary fixing adhesive. At that time, the whole was raised to about 70 ° C. in order to shorten the curing time (FIG. 5B).

(Step-6) The temporarily fixed image forming apparatus was introduced into a heating furnace, and kept at 420 ° C. for 10 minutes to soften the frit glass for permanent fixing. At this time, a load of about 10 kg was applied from above the substrate 2 by pressing means to increase the adhesive strength of the frit glass for permanent fixing (FIG. 5 (c)).

Although the frit glass is softened, the base 2 sinks. However, since the flexible portion can move in the height direction (up and down direction in FIG. 6), even if the sink occurs, XY
Directional positioning is maintained.

(Step-7) After a desired time, the heating furnace is gradually cooled to harden the frit. Finally, the pressurizing means was removed, and the container for the image forming apparatus to which the substrates 1 and 2 and the support frame 3 were adhered was taken out.

(Step-8) The atmosphere in the container completed as described above is exhausted by a vacuum pump through an exhaust pipe (not shown), and after reaching a sufficient degree of vacuum, the external terminals Dx1 to Dxm are connected. A voltage is applied to the electron-emitting device through Dy1 to Dyn to cause the electron-emitting portion 125 to
Was produced by performing a forming step and an activation step. Furthermore, after a series of processes, baking was performed at 250 degrees for 10 hours.

(Step-9) Next, at room temperature, the air was evacuated to a degree of vacuum of about 10 −8 torr, and the exhaust pipe (not shown) was welded by heating with a gas burner to seal the envelope. went.

Finally, to maintain the degree of vacuum after sealing,
Getter treatment was performed by a high frequency heating method.

In the image display device of the present invention completed as described above, the scanning signal and the modulation signal are supplied to the respective electron-emitting devices by signal generating means (not shown) through the external terminals Dx1 to Dxm and Dy1 to Dyn. , By applying electrons, a few kV is applied to the metal back 89 or a transparent electrode (not shown) through the high voltage terminal Hv.
The above high pressure is applied to accelerate the electron beam, and the fluorescent film 88
Then, the image was displayed by exciting and emitting light.

As a result, there was no displacement between the electron-emitting device and the phosphor, and there was no variation in luminance or color mixing caused by the displacement.

In the present embodiment, as shown in FIG. 4, since the flexible portions are provided so as to be in contact with the same portions on the base 1 and the base 2, respectively, the temporary fixing is performed at four places for each base. Could be done. For this reason, the temporary fixing can be firmly performed on the flexible portion, and the displacement is less likely to occur.

[0126]

According to the present invention, there are provided a first base, a second base, a spacer for supporting between the first base and the second base, and a support frame provided with a flexible portion. In the image forming apparatus, the first substrate or the second substrate can be positioned and temporarily fixed at or near room temperature, and can be positioned at a high temperature heating and cooling step for softening and solidifying the bonding material. Since alignment is not required, highly accurate and easy alignment can be performed. Furthermore, an alignment device corresponding to a high temperature is not required, and the device can be simplified.

Further, since the portion where the first base and the second base are temporarily fixed is the flexible portion provided on the support frame, the first base, the second base and the support frame are bonded ( At the time of the actual fixing, the screen can be moved in the vertical direction while being restrained in the horizontal direction of the screen, and the positional displacement in the horizontal direction of the screen can be prevented.

As described above, according to the image forming apparatus and the method of manufacturing the same of the present invention, an accurate and high-quality image forming apparatus can be easily manufactured with a high yield, so that an inexpensive and high-quality image forming apparatus can be realized. it can.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an image forming apparatus of the present invention.

FIG. 2 is a view illustrating a method of manufacturing the image forming apparatus of the present invention.

FIG. 3 is a partially enlarged view of the image forming apparatus of the present invention.

FIG. 4 is a configuration diagram of a second embodiment of the image forming apparatus of the present invention.

FIG. 5 is a diagram illustrating a method of manufacturing an image forming apparatus according to a second embodiment of the present invention.

FIG. 6 is a partially enlarged view of Embodiment 2 of the image forming apparatus of the present invention.

FIG. 7 is an assembly flowchart of the image forming apparatus of the present invention.

FIG. 8 is a perspective view of the image forming apparatus according to the first embodiment.

FIG. 9 shows a cold cathode surface conduction electron-emitting device used in Example 1.

FIG. 10 is an example of a fluorescent film used in Example 1.

FIG. 11 is a conventional assembly flowchart.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st base | substrate 2 2nd base | substrate 3,31 Support frame 4,41 Spacer 5 Temporary adhesive 6 Adhesive for fixing 80 Spacer 81 Electron source board 82 Surface conduction type emission element 83 Row direction wiring (upper wiring) ) 84 column direction wiring (lower wiring) 85 rear plate 86 support frame 87 face plate 88 fluorescent film 89 metal back 91 substrate 92, 93 device electrode 94 conductive thin film 95 electron emitting portion 101 black conductor

 ────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shinya Koyama 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 5C012 AA05 BC03 BC05 5C032 AA01 BB16 5C036 EF01 EF06 EG02 EG50

Claims (10)

[Claims] 1. An image forming apparatus comprising: a first base, a second base, a spacer for supporting between the first base and the second base, and a support frame, wherein the support frame is An image forming apparatus having a protruding flexible portion. 2. The image forming apparatus according to claim 1, wherein the flexible portions are provided at four corners of the support frame. 3. The image forming apparatus according to claim 1, wherein an electron-emitting device is provided on the first base, and an image forming member is provided on the second base. Image forming device. 4. The image forming apparatus according to claim 3, wherein the image forming member is a phosphor. 5. The image forming apparatus according to claim 3, wherein the electron-emitting device is a cold cathode electron-emitting device. 6. The image forming apparatus according to claim 5, wherein said cold cathode electron-emitting device is a surface conduction electron-emitting device. 7. The method for manufacturing an image forming apparatus according to claim 1, wherein a first adhesive and a second adhesive are provided on the first base and the second base or the support frame. A first step of disposing an adhesive material, and positioning the first base and the second base, and bringing the first base and the second base into contact with the support frame to form a first bond A second step of temporarily fixing using a material, and a third step of pressing the first base and / or the second base.
A step of softening the first adhesive provided on the first base and the second base or the support frame by a heating step, and solidifying the second adhesive And a fifth step of joining the first base, the second base, and the support frame to each other. 8. The method according to claim 7, wherein the first adhesive is provided on a flexible portion protruding from the support frame. 9. The method according to claim 7, wherein the first adhesive is an inorganic adhesive. 10. The method according to claim 7, wherein the second adhesive is frit glass.