JP2004031265A - Thick film sheet member and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thick film sheet member that has a conductor film which is easy in handling and manufacture and capable of substituting a metal thin plate, and its manufacturing method. <P>SOLUTION: This is a thick film sheet 10 in which, after a dielectric printed layer and a conductor printed layer are formed on a separating layer having a melting point higher than the sintering temperature of a thick film dielectric paste and a thick film conductor paste, heat treatment is carried out, thereby, a conductor layer 18 is laminated on the surface of a core dielectric 12, and a belt-shaped reinforcement layer 22 is laminated crossing over the border of these. At this point, the separating layer becomes a particle layer wherein only high melting point particles are left side by side by burning of the resin, thereby the thick film generated is not adhered to the substrate and can be easily separated form its surface. This thick film sheet 10 can be used suitably for the manufacture of FED, and since the conductor layer 18 is laminated on the core dielectric 12, it has a good mechanical property, and cracks at the border of these can be suppressed appropriately by the belt-shaped reinforcement layer 22. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a sheet-like thick film that is not fixed to a substrate and has a conductive film fixed thereto, and a method for manufacturing the same.
[0002]
[Prior art]
For example, in a flat panel display device such as a field emission display device (Field Emission Display: FED) or a flat cathode ray tube (Flat Type Cathode Ray Ray Tube), for example, an electrode made of a thin metal plate is used to control the direction of electrons and the like. Are provided in layers. Such a thin metal plate is, for example, a method of chemically etching a metal sheet having a thickness of several (μm) to several (mm), a method of peeling a film formed by electroforming from an electric mold, a method of pressing, and the like. Manufactured in.
[0003]
[Problems to be solved by the invention]
However, when the above-mentioned electrodes are formed of a thin metal plate, it is necessary to divide the electrodes for each different electrode, so that there is a problem that the number of parts is remarkably increased and handling becomes complicated. In addition, even if it is not divided, if a large number of circular, lattice-like, or band-shaped holes are provided for the purpose of passing electrons or the like, manufacturing and handling becomes more difficult as the proportion of the area occupied by the holes increases. become. Further, in the above-described manufacturing method, the thickness, size, shape, and the like that can be manufactured are extremely limited, and the larger the area and the smaller the thickness, the more difficult it is to handle during manufacturing. In the etching method, there is a problem that deformation, wrinkles, and the like are likely to occur in a large area. Such a problem is not limited to the case where the electrode for the display device is formed as described above, and similarly occurs when it is necessary to provide an electrode or a conductor film which is divided into a large number or provided with a large number of holes. obtain.
[0004]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thick film sheet member having a conductor film which can be replaced with a thin metal plate and which is easy to handle and manufacture, and a method for manufacturing the same. It is in.
[0005]
[First means for solving the problem]
In order to achieve the above object, the gist of the thick film sheet member of the first invention is as follows: (a) a core dielectric made of a thin plate-like thick film dielectric having a predetermined thickness dimension; A thick-film conductor laminated on a part of the surface of the body, and (c) a thick-film dielectric material laminated on the surface of the core dielectric in a continuous shape across a boundary between the core dielectric and the thick-film conductor. And a boundary reinforcing dielectric made of:
[0006]
[Effect of the first invention]
According to this configuration, the thick-film sheet member is formed by laminating the thick-film conductor on the surface of the core dielectric, so that the thick-film conductor is used in place of a metal thin plate by forming the thick-film conductor into an appropriate shape. be able to. At this time, since the thick film sheet member has high mechanical properties based on the core dielectric, the mechanical strength is increased as compared with the case where a similar conductor is formed by a thin metal plate. Further, since a plurality of thick film conductors electrically independent from each other can be provided on the core dielectric, the handling becomes easier as compared with individually independent thin metal plates. Further, on the core dielectric, a boundary reinforcing dielectric which straddles the boundary with the thick-film conductor is laminated, so that cracks and the like at the boundary between the thick-film conductor and the core dielectric are preferably prevented. As a result, the mechanical strength of the thick film sheet member is further increased. As described above, a thick film sheet member which can be replaced with a thin metal plate and which is easy to handle and manufacture can be obtained.
[0007]
Incidentally, since the thick-film dielectric and the thick-film conductor have different coefficients of thermal expansion, cracks are likely to occur at the boundary between them when heated during manufacturing or during use. In particular, when the metal component constituting the thick-film conductor is easily diffused, such as silver, the composition of the thick-film dielectric changes at the boundary due to the diffusion of the metal component, resulting in a change in the mechanical strength. Therefore, cracks are more likely to occur. The above-described boundary portion reinforcing dielectric may be formed in an appropriate shape so as not to hinder the function of the thick film conductor. For example, if the thick-film conductor is to function as an electrode and is provided with a through-hole for passing electrons, the boundary reinforcing dielectric is passed through a position avoiding the through-hole. Provided. However, since the boundary reinforcing dielectric does not have conductivity, even when a plurality of thick film conductors are provided on the core dielectric, it is not necessary to consider their mutual electrical independence. .
[0008]
The vertical relationship between the thick film conductor and the boundary reinforcing dielectric is appropriately determined according to the required functions, properties, manufacturing convenience, and the like. That is, “laminated on the surface of the core dielectric” includes both the case of being directly laminated and the case of being laminated via the other. Whichever is located on the upper side, the occurrence of cracks and the like at the boundary between the thick film conductor and the core dielectric is suppressed by the boundary reinforcing dielectric.
[0009]
[Other aspects of the first invention]
Here, preferably, the thick film sheet member has a peripheral portion reinforcing dielectric made of a thick film dielectric material on a surface of a portion of the peripheral portion of the core dielectric where the thick film conductor is not provided. It is laminated so as to be continuous with the boundary portion reinforcing dielectric. With this configuration, the strength of the portion where the thick film conductor is not provided is increased by the peripheral edge reinforcing dielectric. In addition, since the peripheral reinforcing dielectric is continuous with the boundary reinforcing dielectric, even if there is a difference in the coefficient of thermal expansion between the peripheral reinforcing dielectric and the core dielectric, the boundary reinforcing dielectric is located at the boundary. The occurrence of cracks and the like is suitably suppressed by the boundary reinforcing dielectric. Therefore, even when the core dielectric is made of a dielectric material that is fragile and easily chipped, the occurrence of chipping at the peripheral portion is suitably suppressed. Since the thick film conductor contains a metal component and is relatively rich in ductility, the portion where the thick film conductor is laminated increases the mechanical strength of the thick film sheet member by the thick film conductor. Therefore, it is not necessary to reinforce such a part.
[0010]
Preferably, the boundary reinforcing dielectric is made of a material having a softening point equal to or lower than a softening point of a constituent material of the core dielectric. In this way, the boundary reinforcing dielectric material whose softening point is equal to or lower than that of the core dielectric is densified by the firing treatment to be equal to or more than the core dielectric. Has mechanical strength. Therefore, the reinforcing effect by the boundary reinforcing dielectric is further enhanced.
[0011]
Preferably, the boundary reinforcing dielectric is provided on both surfaces of the core dielectric. In this way, the mechanical strength of the core dielectric is further increased.
[0012]
Further, preferably, the boundary portion reinforcing dielectric is provided at a plurality of appropriate locations, each having a width within a range of 0.1 to 3.0 (mm), for example, about 0.2 (mm). Can be By doing so, the width dimension of the boundary portion reinforcing dielectric is set to a sufficiently small value, so that the possibility that the function of the thick film conductor is impaired is further reduced. Note that the width described above is sufficient for reinforcing the boundary portion, and for example, the thickness may be set in the range of 10 to 100 (μm).
[0013]
[Second means for solving the problem]
Further, the gist of the method for manufacturing a thick film sheet member according to the second invention for achieving the above object is as follows: (a) a method of forming a high-temperature sheet formed by bonding particles having a melting point higher than a predetermined first temperature with a resin; A support preparing step of preparing a support having a film-forming surface composed of a melting-point particle layer; and (b) forming constituent particles of a thick-film dielectric material sintered at the first temperature with a resin. A core dielectric paste film forming step of forming a core dielectric paste film in a predetermined shape on the film forming surface; and (c) forming constituent particles of the thick film conductor material sintered at the first temperature by a resin. Forming a conductive paste film on the film forming surface in a predetermined shape overlapping a part of the core dielectric paste film, and (d) a thick film dielectric material sintered at the first temperature. Composed of resin particles Forming a dielectric paste film for reinforcement on the film forming surface in a continuous shape across the boundary between the core dielectric paste film and the conductor paste film; and (e) forming the core dielectric. By heating the support provided with the paste film, the conductor paste film, and the reinforcing dielectric paste film at the first temperature, the core dielectric paste film can be formed without sintering the high melting point particle layer. , Sintering the conductor paste film, and the reinforcing dielectric paste film to obtain a core dielectric, a thick-film conductor, and a boundary reinforcement from the core dielectric paste film, the conductor paste film, and the reinforcing dielectric paste film. And a firing step for producing each of the dielectrics.
[0014]
[Effect of the second invention]
With this configuration, the high-melting-point particle layer having a melting point higher than the sintering temperature (first temperature) of the thick-film dielectric material and the thick-film conductor material (hereinafter, referred to as a thick-film material unless otherwise specified) is constituted. After a core dielectric paste film, a conductive paste film, and a reinforcing dielectric paste film are formed on the formed film forming surface, a heat treatment is performed at a first temperature at which they are sintered. A core dielectric, a thick-film conductor, and a dielectric for reinforcing the boundary are generated from the core dielectric, the thick-film conductor is laminated on the surface of the core dielectric, and the boundary is reinforced in a continuous shape across the boundary. A thick sheet member is obtained in which the dielectric is laminated on the surface of the core dielectric. At this time, the high-melting particle layer that cannot be sintered at the heat treatment temperature becomes a layer in which only the high-melting particles are lined up by burning out the resin, so that the generated thick film is not fixed to the support. , Can be easily separated from the film forming surface. Therefore, the thick film sheet member thus obtained can be used in place of the thin metal plate as described above, and the conductive paste film is formed so that a plurality of electrically independent thick film conductors are generated. When formed, it is easier to handle than individual metal sheets, and furthermore, in addition to the mechanical properties due to the lamination of the thick film conductor on the core dielectric, cracks are generated at the boundaries between them. It is preferably suppressed by the boundary reinforcing dielectric. Note that the paste film of the thick film material can be formed on the film formation surface in a relatively free pattern using simple equipment by using an appropriate method according to the material and application. In addition, since it is handled in a state of being temporarily fixed by being applied to the film forming surface until it is sintered by the heat treatment, the handling is easy. As described above, a thick film sheet member which can be replaced with a thin metal plate and which is easy to handle and manufacture can be obtained.
[0015]
Other aspects of the invention
Here, preferably, the supporting member preparing step is to form the high melting point particle layer on a surface of a predetermined substrate. In this case, since the paste film is formed on the substrate, the shape of the support is maintained even after the heat treatment, so that the support is composed of only the high melting point particle layer (for example, ceramics). This is advantageous in that the handling after the formation of the thick film is easier than in the case where the support is composed of a raw sheet. In addition, when such a support is used, the substrate on which the high melting point particle layer is interposed between the substrate and the paste film does not restrain the paste film at the time of heat treatment, and the surface of the paste film Since the roughness reflects only the surface roughness of the high melting point particle layer, the influence on the quality of the thick film sheet member such as the flatness, the surface roughness, and the expansion coefficient of the substrate is reduced. Is not required.
[0016]
Preferably, the substrate does not deform at the firing temperature. By doing so, the shape of the film forming surface is maintained in the initial shape even when heat treatment for forming a thick film is performed, so that the high melting point particle layer is formed on the surface, thereby supporting the film. It has the advantage that it can be used repeatedly as a body. As the substrate, an appropriate substrate that satisfies the above conditions is selected. For example, general glass, heat-resistant glass, a ceramic plate, a metal plate, or the like can be used.
[0017]
Preferably, the core dielectric paste film forming step, the conductor paste film forming step, and the reinforcing dielectric paste film forming step each include forming the core dielectric paste film and the conductor using a thick film screen printing method. A paste film and a reinforcing dielectric paste film are respectively formed. In this case, there is an advantage that a thick-film sheet member in which the thick-film conductor and the boundary reinforcing dielectric are laminated on the surface of the core dielectric can be obtained more easily.
[0018]
Preferably, the high melting point particles are made of an inorganic material such as ceramics or glass frit. As the high melting point particles, an appropriate inorganic material can be used as long as the resin constituting the high melting point particle layer does not soften at all even after being burned off. The specific material is appropriately selected according to the type of the thick film material constituting the thick film sheet member, the firing temperature thereof, and the like.
[0019]
Preferably, the thick film sheet member has a thickness of about 5 (μm) to several (mm). More preferably, the thickness dimension is 10 (μm) or more. Within such a thickness range, a thick film sheet member can be easily manufactured by using a normal thick film forming process such as a thick film screen printing method. In particular, according to the present invention, even when the thickness is reduced, the difficulty in handling at the time of manufacturing and processing is small.Thus, as the thickness is reduced, a thick film sheet member having the same size and shape is There is a great advantage as compared with the case of manufacturing by etching, pressing or the like used.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
[0021]
FIG. 1 is a perspective view showing a main part of a thick film sheet 10 as one application example of the thick film sheet member of the present invention. In the figure, a thick film sheet 10 is, for example, a rectangular thin member having a thickness of about 50 (μm) and a size of about 320 × 430 (mm), and a thin core dielectric (dielectric layer). ) 12 and a conductor layer 18 laminated and fixed at a part of the surface thereof, for example, at the same position on the upper surface 14 and the lower surface 16. This thick film sheet 10 is used for forming a gate electrode of, for example, an FED as described later.
[0022]
The core dielectric 12 is made of, for example, PbO-B₂O₃-SiO₂And a thick film dielectric material including a low-softening point glass whose main component is a ceramic filler such as alumina or zirconia, or the like, and has a thickness of, for example, about 20 to 50 (μm). The core dielectric 12 is provided with a large number of through holes 20 penetrating in its thickness direction, for example, at appropriate intervals. The opening diameter of the through holes 20 is, for example, about 100 (μm), and the mutual interval is, for example, about 150 (μm).
[0023]
The conductive layer 18 is made of a thick conductive material such as thick silver and has a uniform thickness of, for example, about 7 to 10 (μm). The conductor layer 18 is also fixed to the inner wall surface of the through hole 20 with a similar thickness, and covers the surface of the core dielectric 12.
[0024]
Further, a strip-shaped reinforcing layer 22 is laminated and fixed on the conductor layer 18 so as to be continuous over a boundary with a portion where the surface of the core dielectric 12 is exposed. That is, the belt-like reinforcing layer 22 is laminated on the surface of the core dielectric 12 directly or via the conductor layer 18. The band-shaped reinforcing layer 22 is made of a dielectric material similar to that of the core dielectric 12 or glass whose composition is adjusted by using similar components to reduce the glass softening point, or by reducing the amount of ceramic filler added. It is made of a thick-film dielectric material whose softening property is shifted to the low-temperature side, and has, for example, a width of about 100 (μm) and a thickness of about 10 to 20 (μm). As described above, the core dielectric 12 is provided with a large number of through holes 20, but the belt-shaped reinforcing layer 22 is provided at a position that does not overlap with the through holes 20. The reason why the narrow width is formed as described above is to provide the through hole 20 in this way. Although the figure shows the band-shaped reinforcing layer 22 provided on the upper surface 14 of the core dielectric 12, a similar band-shaped reinforcing layer 22 may be provided on the lower surface 16. In the present embodiment, the belt-shaped reinforcing layer 22 corresponds to a boundary portion reinforcing dielectric.
[0025]
Further, a reinforcing layer 26, for example, in a lattice shape is laminated on a peripheral portion of the surface of the core dielectric 12 where the conductor layer 18 is not provided, in the vicinity of the upper side 24 in the figure. The grid-like reinforcing layer 26 is made of, for example, the same material as the belt-like reinforcing layer 22, and has a thickness of, for example, about 10 to 20 (μm). The belt-like reinforcing layer 22 and the lattice-like reinforcing layer 26 are provided on the same plane, and are continuous with each other at a position outside the conductor layer 18, that is, on the core dielectric 12. That is, these two types of reinforcing layers 22 and 26 respectively constitute a part of the reinforcing layer provided on the core dielectric 12. Note that the grid-like reinforcing layer 26 can also be provided on the lower surface 16, but in this case also, it is formed so as to be continuous with the belt-like reinforcing layer 22.
[0026]
As described above, the thick film sheet 10 is a composite member formed by laminating a plurality of materials, that is, a thick film dielectric material and a thick film conductor material, and at a boundary portion thereof, for example, near the end 28 of the conductor film 18. Also, no cracks or the like are generated in the conductor film 18 and the core dielectric 12.
[0027]
FIG. 2 is a diagram illustrating the configuration of the FED 30 in which the thick film sheet 10 as described above is used to configure a gate electrode. In the figure, the FED 30 includes a front plate 36 and a rear plate 38 having substantially the same size and shape as each other and arranged parallel to each other at a predetermined interval so that the substantially flat surfaces 32 and 34 face each other. They are hermetically sealed at their peripheral edges to form an airtight space inside. The thick film sheet 10 is provided between the front plate 36 and the back plate 38, and the conductor layer 18 forms a gate electrode for controlling electrons. In addition, in FIG. 1 described above, only one band-shaped reinforcing layer 22 is shown, but actually, for example, a plurality of parallel reinforcing layers are provided at regular intervals. Each of the belt-shaped reinforcing layers 22 has a shape that passes over the plurality of gate electrodes 18 and is continuous in a direction orthogonal to the longitudinal direction. In FIG. 2, the lattice-like reinforcing layer 26 is omitted. In addition, for example, 6.7 × 10^-5(Pa) [5 × 10^{− 7}(Torr)].
[0028]
The front plate 36 and the rear plate 38 are translucent substrates made of, for example, soda lime glass or soft glass having a softening point of about 600 (° C.). Each of these has, for example, an external dimension of about 800 × 500 (mm) and a substantially uniform thickness of about 3 (mm), and their mutual interval is, for example, 1 to 2 (mm). Set to about. The material of the core dielectric 12 constituting the thick film sheet 10 is selected so as to have a thermal expansion coefficient substantially similar to those of the soda-lime glass substrates 36 and 38.
[0029]
On one surface (opposing surface) 32 of the front plate 36, a plurality of stripe-shaped transparent anodes 44 made of, for example, ITO (Indium Tin Oxide) or the like are provided side by side in one direction. ing. On each surface of the plurality of anodes 44, a phosphor layer 46 corresponding to any one of the three emission colors of R (red), G (green), and B (blue) is formed, for example, in one direction. R, G, and B are arranged repeatedly in the direction orthogonal to each other, and are provided intermittently so as to be independent for each light emitting unit in a direction along one direction corresponding to the longitudinal direction of the anode 44. The anode 44 is formed to a thickness of, for example, about 1 (μm) by a thin film method such as sputtering, and has a relatively high conductivity of about 10 (Ω / □) or less. Have. The phosphor layer 46 is made of, for example, ZnO: Zn, ZnS: Ag + In, which emits visible light by an electron beam.₂O₃And is provided with a thickness of about 10 to 20 (μm) by, for example, a thick film screen printing method, so that the sheet resistivity is 500 (Ω / cm).²) It has the following conductivity.
[0030]
FIG. 3 is an enlarged view showing a cross section of the FED 30. The front plate 36 has a black matrix (black mask) 48 made of glass containing a black pigment, for example, having a thickness of about 15 to 20 (μm) on the remaining surface of the one surface 32 where the phosphor layer 46 is not provided. The surface of the phosphor layer 46 and the surface of the black matrix 48 are provided on the entire surface 32 according to the surface shapes of the phosphor layer 46 and the black matrix 48. It is covered with a metal back 50 having a thickness of about 200 (nm). The black matrix 48 is provided by, for example, a thick film screen printing method or the like, and forms a lattice shape passing between the phosphor layers 46 provided in a matrix as described above. When the phosphor layer 46 has a stripe shape, a stripe-shaped black mask passing therethrough is provided instead of the black matrix 48. The metal back 50 is provided by, for example, vapor deposition of an aluminum thin film and has a relatively smooth surface, but is formed in a thin film having a thickness that allows electrons to easily pass therethrough. .
[0031]
Further, as shown in FIG. 3 and FIG. 2 described above, a plurality of cathode electrodes 52 are orthogonal to the conductor layer on the thick film sheet 10, that is, the gate electrode 18 on one surface (opposing surface) 34 of the back plate 38. In addition, they are provided in a state where they are insulated from each other. The relative positions of the cathode electrode 52 and the gate electrode 18 are determined such that the through-hole 20 is located at the intersection thereof. The through hole 20 functions as an electron passage hole (gate hole) for passing electrons generated from the emitter (cold cathode) 58 provided on the cathode electrode 52 toward the phosphor layer 46. . The opening diameter of the gate hole 20 is determined by the trade-off relationship between the electron emission effect and the emission area (aperture ratio). In the case of this embodiment, the dot size is about 3 (mm). For this reason, it is set to about 100 (μm) as described above.
[0032]
The cathode electrode 52 is made of a conductive material such as gold (Au) or thick silver formed by a thin film method such as sputtering or a thick film method such as printing. Further, the emitter 54 is, for example, a dense body of a very large number of nanotubes (CNT) oriented toward the gate electrode 18, has a film thickness of about C = 20 (μm), and has a distance from the gate electrode 18. Is about G = 27 to 30 (μm). In addition, the emitter 54 may be a conical cold cathode having a height of about 1 (μm) called a spindt type made of molybdenum (Mo) or the like.
[0033]
In addition, the thick film sheet 10 is positioned at a fixed height position where the gate electrode 18 is separated from the emitter 54 by being supported by the spacer 56 in a portion where the conductor layer 18 is not fixed. The thickness dimension of the spacer 56 is, for example, about 20 to 50 (μm).
[0034]
As described above, in the present embodiment, a plurality of gate electrodes 18 are constituted by a plurality of thick film conductor layers on the thick film sheet 10, and the thick film sheet 10 is provided on the surface of the core dielectric 12. And has high mechanical properties based on the core dielectric 12, so that even if the film thickness of the gate electrode 18 is extremely thin as described above, a sufficiently high mechanical strength is obtained. Will be provided. Therefore, even if the gate electrodes 18 are made of a thin metal plate, they are less likely to be damaged even if they are thinner, and since the plurality of gate electrodes 18 are integrally provided on the core dielectric 12, they are individually formed. Higher relative position accuracy is realized as compared with the case where the conductors are formed by independent conductors.
[0035]
In driving the FED 10 configured as described above, when a predetermined signal voltage and a predetermined scanning voltage are applied to the cathode electrode 52 and the gate electrode 18, respectively, the field emission (electric field emission) generated based on a large voltage gradient between them. Electrons are emitted from the emitter 54 by Field (Emission). These electrons fly toward the anode 44 through the electron passage holes 36 when a predetermined positive voltage is applied to the anode 44 provided on the front plate 36. As a result, electrons collide with the phosphor layer 46 provided on the anode 44, and the phosphor layer 46 emits light. At this time, the phosphor layer 46 is covered with a metal back 50. Since the metal back 50 is a thin film formed by vapor deposition and has a thickness enough to easily transmit electrons, the metal back 50 is The electrons emitted and attracted to the anode 44 pass through the metal back 50, enter the phosphor layer 46, and collide with the phosphor. On the other hand, the light generated by the phosphor layer 46 is directed not only to the front plate 36 side but also to the rear plate 38 side, but the light directed to the rear plate 38 side is reflected by the metal back 50 toward the front plate 36 side. . Therefore, most of the generated light is transmitted through the front plate 36 and emitted, and the substantial luminous efficiency is improved. For this reason, the light emission of the phosphor layer 46 cannot be observed from the back plate 38 side, and the FED 30 is configured as a so-called transmissive display device for observing the light transmitted through the phosphor layer 46 from the front plate 36 side. I have.
[0036]
At the time of the above-described driving, the gate electrode 18 through which the driving current flows is caused to generate heat, and the temperature is increased to cause thermal expansion. In this case, in the present embodiment, since the belt-shaped reinforcing layer 22 is provided so as to straddle the boundary between the gate electrode 18 and the core dielectric 12, the core dielectric 12 to which the gate electrode 18 is fixed is provided. However, despite the fact that it is made of a thick-film dielectric material as described above and has a different coefficient of thermal expansion from the gate electrode 18 made of a thick-film conductor material, there is no crack or the like in the core dielectric 12 during driving. Does not occur. That is, the occurrence of cracks due to the difference in the thermal expansion coefficient is suitably suppressed by the belt-shaped reinforcing layer 22.
[0037]
By the way, the thick film sheet 10 as described above is manufactured by applying a conventionally known thick film printing technique, for example, according to a process shown in FIG. Hereinafter, the manufacturing method will be described with reference to FIGS. 5A to 5F showing the state in the main part stage of the manufacturing process.
[0038]
First, in a substrate preparing step 60, a substrate 62 (see FIG. 5) on which thick film printing is to be performed is prepared, and an appropriate cleaning process is performed on its surface 64 and the like. The substrate 62 is hardly deformed or deteriorated during a heat treatment described later. For example, the substrate 62 has a thermal expansion coefficient of 85 × 10^-7(/ ° C.), a glass substrate made of soda lime glass or the like having a softening point of about 740 (° C.) and a strain point of about 510 (° C.) is preferably used. The thickness of the substrate 62 is, for example, about 3 (mm), and the size of the surface 64 is sufficiently larger than that of the thick film sheet 10.
[0039]
Next, in a release layer forming step 66, a release layer 68 in which the high melting point particles are bonded with a resin is provided on the surface 64 of the substrate 62 with a thickness of, for example, about 5 to 50 (μm). The high melting point particles are, for example, a high softening point glass frit having an average particle size of about 0.5 to 3 (μm) and a ceramic filler such as alumina and zirconia having an average particle size of about 0.01 to 5 (μm). Are mixed. The above-mentioned glass having a high softening point has a softening point of, for example, about 550 (° C.) or more, and the softening point of the high melting point particles as a mixture is, for example, about 550 (° C.) or more. The resin is, for example, an ethylcellulose-based resin which is burned off at about 350 (° C.). For example, as shown in FIG. 5 (a), the release layer 68 is made of an inorganic material paste 70 in which the above-mentioned high melting point particles and resin are dispersed in an organic solvent such as butyl carbitol acetate (BCA). The coating is performed by applying the coating to substantially the entire surface of the substrate 62 by using a printing method and drying the coating at room temperature. Alternatively, the coating may be performed by applying a coater or a film laminate. FIG. 5B shows a stage in which the release layer 76 is formed in this manner. In FIG. 5A, reference numeral 72 denotes a screen, and 74 denotes a squeegee. In this embodiment, the substrate 62 provided with the above-mentioned release layer 68 corresponds to a support, and the surface of the release layer 68 corresponds to a film-forming surface. Corresponds to the body preparation process.
[0040]
In a subsequent thick film paste layer forming step 76, a thick film dielectric paste 78 for forming the core dielectric 12 and the reinforcing layers 22 and 26 and a thick film for forming the gate electrode (conductor layer) 18 are formed. A conductive paste 80 (see FIG. 5A) is sequentially applied in a predetermined pattern on the release layer 68 by using a screen printing method or the like, similarly to the inorganic material paste 70. The thick film dielectric paste 78 is obtained by dispersing a dielectric material powder such as alumina and zirconia, a glass frit, and a resin in an organic solvent. The thick film conductor paste 80 is obtained by dispersing a conductor material powder such as a silver powder, a glass frit, and a resin in an organic solvent. The above glass frit is, for example, PbO-B₂O₃-SiO₂System material and PbO-B₂O₃-SiO₂-Al₂O₃-TiO₂For example, a resin and a solvent similar to those of the inorganic material paste 70 are used. FIGS. 5C to 5E show a conductor printing layer 82 for forming a portion of the conductor layer 18 located on the lower surface 18 side and a dielectric printing for forming the core dielectric 12 as described above. The layer 84, the conductor print layer 86 for forming a portion of the conductor layer 18 located on the upper surface 16 side, and the dielectric print layer 88 for forming the reinforcing layers 22 and 26, respectively (hereinafter collectively referred to as these). In the case of handling, thick film print layers 82 to 88) are sequentially laminated. In this embodiment, these thick print layers 82 to 88 correspond to paste films (dielectric paste film and conductor paste film).
[0041]
In FIG. 5C, the conductor print layer 86 is drawn in the same shape as the conductor print layer 82, but the inner wall surface of the through hole 20 is covered with the conductor layer 18 as described above. For this purpose, it is necessary to flow the thick film conductor paste 80 into the through hole 20 along the inner wall surface. Therefore, the conductor printing layer 86 applied from the upper side is formed by using the screen 72 having an opening pattern such that the thick film conductor paste 80 is applied to a position slightly inside the inner wall surface of the through-hole 20. It is formed. At this time, when the same thing as that at the time of forming the conductor printing layer 82 is used, when the fluidity of the thick film conductor paste 80 is insufficient, the paste in which the particle size of the conductor particles is reduced or the solvent amount is increased is used. Good to use.
[0042]
After the thick print layers 82 to 88 are formed as described above and the solvent is removed in a drying step 90, for example, by drying this, the substrate 62 is put in a furnace chamber of a firing furnace (not shown) in a firing step 92. The heat treatment is performed at a firing temperature of, for example, about 550 (° C.) according to the type of the thick film dielectric paste 78 and the thick film conductor paste 80.
[0043]
In the above heat treatment process, since the sintering temperature of the thick film print layers 82 to 88 is, for example, about 550 (° C.), the resin component is burned off, and the dielectric material, the conductor material, and the glass frit are removed. By being sintered, the core dielectric 12, the conductor layer 18, and the reinforcing layers 22 and 26 are generated, and the thick film sheet 10 is obtained. FIG. 5F shows this state. At this time, since the inorganic component particles of the release layer 68 have a softening point of 550 (° C.) or more as described above, the resin component is burned off, but the high melting point particles (glass powder and ceramic) are used.・ Filler) cannot be sintered. Therefore, when the resin component is burned off as the heat treatment proceeds, the release layer 68 becomes a particle layer 96 composed of only the high melting point particles 94 (see FIG. 6).
[0044]
FIG. 6 is an enlarged view of a part of the right end of FIG. 5 (f), schematically showing the progress of sintering in the above-described heat treatment. The particle layer 96 formed by burning out the resin component of the release layer 68 is a layer in which the high-melting particles 94 are merely stacked, and the high-melting particles 94 are not restricted to each other. Therefore, when the thick print layers 82 to 88 shrink from the end positions before firing indicated by the dashed line in the drawing, the high melting point particles 94 act like a roller. As a result, a force that prevents contraction of the thick print layers 82 to 88 does not act on the lower surface side of the thick print layers 82 to 88, so that the thick print layers 82 to 88 are contracted in the same manner as the upper surface side. No warpage or the like has occurred.
[0045]
Further, in the heat treatment as described above, for example, in a cooling process in which the sintering of the thick film has progressed, the generated core dielectric 12 and the conductor layer 18 are each contracted. At this time, stress may act between them due to the difference in their thermal expansion coefficients. In the present embodiment, however, a strip-shaped member provided so as to straddle the core dielectric layer 12 and the conductor layer 18 is provided. The contraction of the conductor layer 18 is suppressed by the reinforcing layer 22. Therefore, cracks and the like do not occur at the boundary between the core dielectric 12 and the conductor layer 18 due to the stress, and the thick film sheet 10 having no defect can be obtained with a high yield.
[0046]
In the present embodiment, when the sintering of the thick print layers 82 to 88 starts, the substrate 62 does not hinder the shrinkage of the substrate 62 by the action of the particle layer 96 as described above. Thus, thermal expansion of the substrate 62 does not substantially affect the quality of the thick film produced. When the substrate 62 is used repeatedly or when the heat treatment temperature is increased, heat-resistant glass having a higher strain point (for example, having a thermal expansion coefficient of 32 × 10^-7(/ ° C.) and a borosilicate glass having a softening point of about 820 (° C.) or a thermal expansion coefficient of 5 × 10^-7(/ ° C.) and a softening point of about 1580 (° C.) quartz glass or the like) can be used. Also in this case, the thermal expansion of the substrate 62 is extremely small in a temperature range where the bonding force of the dielectric material powder or the like is small, and the thermal expansion does not affect the quality of the generated thick film.
[0047]
Returning to FIG. 4, in the peeling step 98, the generated thick film sheet 10 is peeled from the substrate 62. Since the high melting point particles 94 are merely stacked in the particle layer 96 interposed therebetween, the above-described peeling treatment can be easily performed without using any chemicals or equipment. At this time, the high melting point particles 94 can be attached to the back surface of the thick film sheet 10 with a thickness of about one layer, and the attached particles can be removed by using an adhesive tape or an air blow in a subsequent particle removal step 100 as necessary. To remove. The substrate 62 from which the thick film has been peeled is hardly deformed or deteriorated at the above-mentioned firing temperature as described above, and thus is repeatedly used for the same purpose.
[0048]
The FED 30 fixes the thick film sheet 10 manufactured as described above on the back plate 38 provided with the cathode electrode 52 and the emitter 54 separately, and further separates the anode 44, the black matrix 48, and the phosphor. It is manufactured by overlapping and joining together a front plate 36 provided with a layer 46 and a metal back 50. In the process of manufacturing in this manner, in the present embodiment, since the grid-like reinforcing layer 26 is provided on the peripheral portion of the thick film sheet 10, the thick film sheet 10 is transported or assembled after manufacturing. In handling, it is unlikely that chipping or the like occurs in the peripheral portion. The grid-like reinforcing layer 26 is provided to prevent such breakage during handling.
[0049]
In short, in this embodiment, the dielectric printing layers 84 and 88 and the conductors are formed on the film forming surface composed of the release layer 68 having a melting point higher than the sintering temperature of the thick film dielectric paste 78 and the thick film conductor paste 80. After the print layers 82 and 86 are formed in a predetermined pattern, a heat treatment is performed at a temperature at which the print layers 82 and 86 are sintered, so that a thick film dielectric and a thick film conductor are generated, and the surface 14 of the core dielectric 12 is formed. , 16 and the thick film sheet 10 in which the continuous band-shaped reinforcing layer 22 straddling these boundaries is laminated on the surfaces 14, 16 of the core dielectric 12. At this time, the release layer 68 that is not sintered at the heat treatment temperature becomes a particle layer 96 in which only the high-melting particles 94 are arranged by burning out the resin, so that the generated thick film is not fixed to the substrate 62. Therefore, it can be easily separated from the surface 64. Therefore, the thick film sheet 10 thus obtained can be suitably used for manufacturing the FED 30 as described above, and has a structure in which the conductor layer 18 is laminated on the core dielectric 12. In addition to the mechanical properties, cracks at their boundaries are suitably suppressed by the belt-like reinforcing layer 22. Therefore, a thick film sheet 10 which can constitute a gate electrode instead of a metal thin plate and is easy to handle and manufacture is obtained.
[0050]
Further, in this embodiment, since the support to which the thick film pastes 78 and 80 are applied is formed by forming the release layer 68 on the surface of the substrate 62, the shape of the support after heat treatment is maintained. Since the support is maintained, there is an advantage that the handling after the generation of the thick film sheet 10 becomes easy as compared with the case where the support is constituted only by the release layer 68. Since the release layer 68 is interposed between the thick-film print layers 82 to 88 and the substrate 62, the thick-film print layers 82 to 88 are not restricted at all during the heat treatment. The flatness, surface roughness, etc. are not particularly problematic.
[0051]
Further, in this embodiment, since the thick-film printing layers 82 to 88 are formed by using the thick-film screen printing method, there is an advantage that the apparatus is simple and there is little waste of material, so that the cost is low.
[0052]
As described above, the present invention has been described in detail with reference to the drawings. However, the present invention can be implemented in other embodiments.
[0053]
For example, in the embodiment, the case where the present invention is applied to the thick film sheet 10 for forming the gate electrode 18 of the FED 30 has been described. It is useful in devices to replace the sheet metal. For example, in addition to the FED 30, the present invention is suitably applied to electrodes such as a flat CRT and inorganic EL, various grid electrodes, and the like.
[0054]
Further, in the thick film sheet 10 of the embodiment, the grid-like reinforcing layer 26 for reinforcing the peripheral portion is provided in addition to the belt-like reinforcing layer 22. However, the reinforcing layer 26 at the peripheral portion is the core dielectric 12 itself. May be provided as necessary according to the strength of the steel and required mechanical properties. In addition, in the case of providing, the shape is not limited to a lattice shape, and may take various shapes that can function as reinforcement.
[0055]
Further, in the embodiment, the conductor layer 18, the reinforcing layers 22, 26, and the like are provided on both surfaces 14, 16 of the core dielectric 12, but the present invention is similarly applied to a case where it is provided on only one surface. Is done. In addition, when the conductor layer 18 is provided on both sides, it is possible to use only one of the reinforcing layers 22 and 26 in consideration of the required strength for preventing cracks. , The reinforcing layers 22 and 26 may be provided on both sides.
[0056]
Further, in the embodiment, the belt-like reinforcing layer 22 and the lattice-like reinforcing layer 26 are provided in a shape continuous with each other, but these may be provided independently. However, in the case where cracks may occur at the discontinuous portion if provided independently, it is necessary to provide them continuously as shown in the embodiment.
[0057]
In the embodiment, one continuous band-shaped reinforcing layer 22 is provided on the plurality of gate electrodes 18. However, an independent band-shaped reinforcing layer 22 may be provided for each gate electrode 18.
[0058]
In the embodiment, the reinforcing layers 22 and 26 are made of a thick film material having a softening point equal to or lower than that of the constituent material of the core dielectric 12. However, if the reinforcing layers 22 and 26 can exhibit sufficient strength for reinforcement. Alternatively, the core dielectric 12 may be formed of a thick film material having a higher softening point than that of the constituent material.
[0059]
Although not specifically exemplified, the present invention can be variously modified without departing from the gist thereof.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a thick film sheet according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a configuration of an FED to which the thick film sheet of FIG.
FIG. 3 is a diagram illustrating a cross-sectional structure of the FED of FIG. 2;
FIG. 4 is a process chart illustrating a method for manufacturing the thick film sheet of FIG. 1;
5 (a) to 5 (f) are views showing a state of a substrate and a thick film at a main part stage of the manufacturing process of FIG. 4;
FIG. 6 is a view illustrating a shrinkage behavior in the firing step of FIG.
[Explanation of symbols]
10: Thick film sheet
12: Core dielectric
18: conductor layer (gate electrode)
22: Strip reinforcement layer (boundary reinforcement layer)
26: Lattice reinforcement layer (peripheral reinforcement layer)

Claims (7)

A core dielectric comprising a thin plate-like thick film dielectric having a predetermined thickness dimension;
A thick-film conductor laminated on part of the surface of the core dielectric,
And a boundary reinforcement dielectric made of a thick-film dielectric material laminated on the surface of the core dielectric in a continuous shape across the boundary between the core dielectric and the thick-film conductor. Sheet member. On the surface of the peripheral portion of the core dielectric where the thick film conductor is not provided, a peripheral reinforcing dielectric made of a thick film dielectric material was laminated so as to be continuous with the boundary reinforcing dielectric. 2. The thick film sheet member according to claim 1, wherein 3. The thick film sheet member according to claim 1, wherein the boundary reinforcing dielectric is made of a material having a softening point equal to or lower than a softening point of a constituent material of the core dielectric. A support preparation step of preparing a support having a film-forming surface composed of a high-melting particle layer formed by bonding particles having a melting point higher than a predetermined first temperature with a resin;
A core dielectric paste film forming step of forming a core dielectric paste film formed by bonding constituent particles of the thick film dielectric material sintered at the first temperature with a resin on the film forming surface in a predetermined shape;
A conductive paste for forming a conductive paste film formed by bonding constituent particles of a thick film conductive material sintered at the first temperature with a resin on the film forming surface in a predetermined shape overlapping a part of the core dielectric paste film A film forming step;
A shape in which a reinforcing dielectric paste film formed by bonding constituent particles of a thick-film dielectric material sintered at the first temperature with a resin is continuous across a boundary between the core dielectric paste film and the conductor paste film. Forming a reinforcing dielectric paste film forming step on the film forming surface,
By heating the support provided with the core dielectric paste film, the conductor paste film, and the reinforcing dielectric paste film at the first temperature, the cores without sintering the high melting point particle layer. By sintering the dielectric paste film, the conductor paste film, and the reinforcing dielectric paste film, the core dielectric paste film, the conductor paste film, and the reinforcing dielectric paste film are converted into a core dielectric, a thick film conductor, and And a firing step for producing each of the boundary reinforcing dielectrics. 5. The method for manufacturing a thick film sheet member according to claim 4, wherein said supporting body preparing step includes forming said high melting point particle layer on a surface of a predetermined substrate. 6. The method according to claim 4, wherein the substrate does not deform at the firing temperature. The core dielectric paste film forming step, the conductive paste film forming step, and the reinforcing dielectric paste film forming step are respectively performed by using a thick film screen printing method to form the core dielectric paste film, the conductive paste film, and the reinforcing paste. 7. The method according to claim 4, wherein a dielectric paste film is formed.

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