JP3838970B2 - Electronic control electrode and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic control electrode for forming a deflection electrode of a thin CRT (Cathode Ray Tube) and a method for manufacturing the same.
[0002]
[Prior art]
For example, the electrons generated from the electron generation source in the vacuum space are deflected and controlled or focused by electrodes orthogonal to each other, and guided to a desired position on the phosphor screen to excite the phosphor with an electron beam. A thin CRT that displays a desired image by emitting light is known. For example, an MDS type flat matrix display or the like. Such a CRT has an advantage that it can be made thinner than a structure in which electrons emitted from an electron gun are deflected (see, for example, Non-Patent Document 1).
[0003]
[Non-Patent Document 1]
Tani Chizuka, “Advanced Display Technology”, first edition, first edition, Kyoritsu Shuppan, December 28, 1998, p.78-88
[0004]
[Problems to be solved by the invention]
By the way, among the electrodes provided in the thin CRT as described above, for example, the horizontal deflection electrode and the vertical deflection electrode constituting the X, Y matrix need to be electrically independent for each row or each column. Therefore, it is divided into bowls. Therefore, it is necessary to fix a large number of thin metal plates for constituting them to a glass container or to each other with a low softening point frit or the like, which increases the number of parts and makes handling and high-precision assembly work difficult. There was a serious problem.
[0005]
In addition, 426 alloy or the like whose thermal expansion coefficient is generally similar to that of glass is generally used as the metal material in the case of such assembly work, but even if the thermal expansion coefficient is matched, in the heating process of the fixing process, The temperature rise of a thin metal plate having a good thermal conductivity and a small heat capacity is faster than that of glass. Therefore, the frit is fixed in a fixed state at the fixing point, and the metal is fixed in an expanded state, so that there is a problem that the curve or distortion occurs. In addition, since it is necessary to sequentially perform the process of fixing the electrodes of a plurality of layers (for example, five layers in MDS) with a frit or the like, repeated heat treatment makes it more difficult to achieve high relative positional accuracy. That is, in an apparatus equipped with a large number of electrodes for inducing electrons, such as an MDS type CRT, it is necessary to handle an extremely large number of divided metal parts, and therefore high-accuracy electrode assembly is easily performed. It was difficult.
[0006]
The present invention has been made in the background of the above circumstances, and an object thereof is to provide an electronic control electrode capable of easily assembling a high-precision electrode and a method for manufacturing the same.
[0007]
[First Means for Solving the Problems]
In order to achieve such an object, the gist of the first invention is to provide a plurality of electron passage holes and to pass electrons in a desired direction by forming an electric field in the electron passage holes. An electronic control electrode comprising: (a) a thick film dielectric layer having a predetermined thickness dimension; and (b) a plurality of layers laminated on one and other surfaces of the thick film dielectric layer and electrically independent from each other A first thick film conductor layer and a second thick film conductor layer each comprising a strip of thick film conductor; and (c) the first thick film conductor layer and the strip thick film conductor and each of the first thick film conductor layers. The plurality of electron passage holes in which inner peripheral edges in the film conductor layer and the second thick film conductor layer are located at the same position in the plane direction and inside the inner peripheral edge in the thick film dielectric layer; d) the thick dielectric layer in the vicinity of each of the plurality of electron passage holes; And a plurality of through conductors for connecting and said one surface and the other surface of the strip thick film conductor mutually through is to contain.
[0008]
[Effect of the first invention]
In this way, the electronic control electrode is a sheet-like thick film laminate in which a plurality of strip-like thick film conductors are laminated on both sides of the thick film dielectric layer and each has an electron passage hole passing through them. It is composed of a membrane sheet member. Therefore, by simply fixing one electronic control electrode at a predetermined position of the device, a plurality of strip-shaped thick film conductors that can function as mutually independent electrodes can be provided in the device. Compared to the fixed case, the electrode arrangement becomes extremely easy, and the relative position accuracy is determined by the position accuracy of the thick film conductor on the electronic control electrode. Can do. At this time, the strip-like thick film conductors respectively provided in the first thick film conductor layer and the second thick film conductor layer are connected by the through conductors in the vicinity of the electron passage holes, and thus are maintained at substantially the same potential. Since the inner peripheral edge of the electron-passing hole protrudes inward from the inner peripheral edge of the thick film dielectric layer in accordance with the thickness dimension of the thick film dielectric layer and the applied voltage. The electric fields formed by the strip-shaped thick film conductors respectively provided on the one surface and the other surface are integrated with each other to a predetermined degree. Therefore, even if no conductor is provided in the middle part of the electron passage hole, the strip-like thick film conductor on one side and the other side functions as one electrode, so that the substantial thickness of the thick film conductor layer is kept small. The thickness can be made large enough to control the electrons.
[0009]
Incidentally, in the case of forming a thick film conductor, the cross-sectional shape at the peripheral portion is generally based on the viscosity and fluidity of the thick film conductor paste, the contact angle with the coated surface, etc. The surface is inclined so as to be smaller. Therefore, when printing and drying are repeated to increase the film thickness, the thick film conductor paste is sequentially applied to the top part, which is smaller than the bottom part. It is extremely difficult to increase the thickness. That is, for example, a thick film conductor that exceeds 20 (μm), which requires lamination, is formed so that its end face is perpendicular to the film formation surface, in other words, while maintaining a sharp edge shape. It is virtually impossible to increase the thickness dimension.
[0010]
In addition, in order to appropriately control the path of electrons, the electron passage hole is required to have a certain length or more in the electron traveling direction. This length dimension is, for example, one layer thickness of the thick film. Is a larger value. By the way, in the thick film sheet member in which a plurality of independent thick film conductors are integrated by providing the thick film conductor on the thick film dielectric, the electron passage hole is provided with the above length dimension, and When a thick film conductor is provided on the entire inner wall surface, the dielectric and the conductor must be printed alternately. For this reason, it is difficult to control the relative positions with high precision, so that it is more difficult to realize a sharp edge shape and to form an electron passage hole with a constant inner peripheral dimension in the electron traveling direction. Become. Therefore, if a thick film conductor is provided on the entire inner peripheral surface, it becomes necessary to enlarge the electron passage hole in accordance with the variation in the relative position, making it difficult to achieve high definition, and unevenness on the inner peripheral surface of the electron passage hole. This causes a disadvantage that the desired electronic control function cannot be obtained due to the occurrence of inclination.
[0011]
[Other aspects of the first invention]
Here, it is preferable that the electronic control electrode display a desired image by causing the electrons generated from the electron generation source in the vacuum space to be deflected by the electrodes orthogonal to each other and incident on the phosphor layer. This is used for thin CRTs. In this way, the electronic control electrode is provided with a plurality of strip-like thick film conductors having the second electron passage holes electrically and independently from each other, so that the strip-like thick film conductors are orthogonal to each other. It is possible to construct a so-called flat matrix drive thin CRT deflection electrode by simply stacking two electron control electrodes so as to extend in the direction of the light source and arranging them between the electron generation source and the phosphor screen. it can. That is, there is an advantage that the electrode can be fixed very easily and the relative positional accuracy of the electrode can be improved.
[0012]
In addition to the deflection electrode, the thin CRT includes a plurality of signal modulation electrodes that are electrically independent from each other. This signal modulation electrode can be easily configured by using similar electronic control electrodes. Can be arranged.
[0013]
The thin CRT is also provided with a common electron beam control electrode, a focusing electrode, and the like on the entire display surface, but the common electrode on the entire surface may be formed of a thick film sheet member in the same manner as the deflection electrode. . Such an electrode that does not require division is configured by integrally laminating a thick film conductor layer on the entire surface of the thick film dielectric layer. According to this aspect, since all of the plurality of electrodes for electron beam control provided in the thin CRT are configured by the thick film sheet member, as compared with the case of stacking with the electrode made of a thin metal plate. There is an advantage that it is not necessary to consider the difference in coefficient of thermal expansion and heat capacity at the time of fixation or use.
[0014]
However, since the common electrode as described above cannot cause a problem of relative position as in the case of arranging a plurality of thin metal plates, it is composed of a single thin metal plate having through holes at a plurality of appropriate locations. There is no problem. If differences in thermal expansion coefficient, heat capacity, etc. are not a particular problem, the electronic control electrode made of a thick film sheet member and the electronic control electrode made of a metal thin plate are fixed to each other in this way. Since the mechanical strength of the entire electrode is increased as compared with the case where the electrode is made of a thick film sheet member, the handling in the manufacturing process of the thin CRT becomes easier.
[0015]
[Second means for solving the problem]
Further, the gist of the second invention for achieving the above object is that a plurality of electron passage holes having a predetermined opening size are provided, and an electric field is formed in the electron passage holes to direct electrons in a desired direction. (A) a plurality of strip-like patterns having a first opening of the opening size at a position corresponding to the electron passage hole and spaced apart from each other. Forming a first conductor paste film made of a thick film conductor paste on a predetermined film forming surface using a thick film screen printing method; and (b) expanding outwardly by a predetermined value above the first opening. Forming a dielectric paste film made of a thick film dielectric paste in a predetermined thickness dimension on the first conductive paste film using a thick film screen printing method in a predetermined pattern having a second opening formed; c) Same as above the first opening. A second conductor paste film made of a thick film conductor paste is formed on the dielectric paste film using the thick film screen printing method with a third opening having an opening size and the same band-like pattern as the first conductor paste film. And (d) a first thick film conductor layer and a second thickness each having a plurality of strip-like thick film conductors from the first conductor paste film and the second conductor paste film by performing a baking process at a predetermined temperature. A firing step for producing a thick film dielectric layer from the dielectric paste film simultaneously with the production of the film conductor layer; and (e) a first thick film conductor layer, a thick film dielectric layer and a second film obtained by the firing step. And a peeling step of peeling the laminated body of the thick film conductor layers from the film forming surface.
[0016]
[Effect of the second invention]
In this case, the first conductive paste film having a plurality of strip-shaped patterns having the first opening having the same opening size as the electron passage hole, the dielectric paste film having the second opening larger than the first conductive paste film, and the first A second conductor paste film having a third opening having the same opening size as the opening is sequentially laminated on the film forming surface, and this is fired and peeled off from the film forming surface, whereby a plurality of strip-shaped thick film conductors are formed. An electronic control electrode comprising a thick film sheet member in which the first thick film conductor layer and the second thick film conductor layer are laminated via the thick film dielectric layer is manufactured. Therefore, since the obtained electronic control electrode can be provided with a plurality of strip-like thick film conductors that can function as mutually independent electrodes by simply fixing the electronic control electrode at a predetermined position of the device as described above, In addition to being extremely easy to install, the relative position accuracy is determined by the formation position accuracy of the thick film conductor on the electronic control electrode, so that an electronic control electrode capable of easily assembling the electrode with high accuracy is obtained.
[0017]
[Other aspects of the second invention]
Preferably, the thick dielectric paste film is formed in a planar shape having a through hole in the vicinity of the second opening, and the first thick film conductor layer and the thick film conductor layer are formed in the through hole. The method includes a through conductor paste film forming step of applying a thick film conductor paste for forming a through conductor that interconnects the belt-like patterns of the second thick film conductor layer. In this way, a through conductor is generated from the through conductor paste film in the firing step, and the first thick film conductor layer and the second thick film conductor layer laminated via the thick film dielectric layer are formed as electron passing holes. They are connected to each other by their through conductors in the vicinity. Therefore, regardless of the resistivity of the first thick film conductor layer and the second thick film conductor layer, the occurrence of a potential difference due to the resistance value is suppressed. Advantage of improving the uniformity of the electric field formed in the electron passage hole as compared with the case where the first thick film conductor layer and the second thick film conductor layer are connected at the periphery or outside of the film sheet member. There is.
[0018]
Preferably, the step of forming the second conductive paste film includes applying the first layer of the thick film conductive paste on the dielectric paste film and then forming the thick film conductive paste in the same pattern before drying. The second layer is applied. The second conductive paste film having a third opening having the same opening size as the first conductive paste film has an inner peripheral edge of the third opening formed on the dielectric paste film. Although it is necessary to be formed so as to protrude, the back surface of the screen is in a suspended state when the first layer is applied, so that it is not applied on the dried dielectric paste film. However, if the second layer is printed before the first layer is dried, the thick film conductor paste is applied in a wet state so that the thick film conductor paste is formed according to the opening shape provided on the screen. A second paste film that is applied and has a desired planar shape is suitably formed.
[0019]
Preferably, the electronic control electrode manufacturing method includes particles having a melting point higher than a first temperature at which the thick film dielectric paste and the thick film conductor paste are sintered combined with a resin. Including a support preparing step of preparing a support having a film forming surface composed of a high melting point particle layer, wherein the firing step is performed by sintering the thick film conductor paste and the thick film dielectric paste. The melting point particle layer is for firing the laminated body at the first temperature that is not sintered. In this case, the thick film dielectric paste film and the thick film dielectric paste film and the thick film conductor paste are formed on the film forming surface composed of the high melting point particle layer having a melting point higher than the sintering temperature (first temperature) of the thick film dielectric paste and the thick film conductor paste. After each thick film conductor paste film is formed, heat treatment is performed at a first temperature at which the thick film dielectric paste and the thick film conductor paste are sintered. A thick film sheet member, that is, an electronic control electrode, to which the first thick film conductor layer and the second thick film conductor layer are fixed is generated. Therefore, since the high melting point particle layer that cannot be sintered at the heat treatment temperature is a layer in which only the high melting point particles are arranged by burning out the resin, the generated thick film is not fixed to the support. It can be easily peeled off from the film forming surface.
[0020]
Note that the thick film sintered on the layer in which only the high melting point particles are arranged as described above is not constrained by the formation surface at the time of contraction unlike the normal thick film formation. For this reason, warpage, deformation, and the like due to shrinkage resistance with the formation surface are suppressed, and as a result, generation of cracks and the like due to the warpage and deformation is also suppressed. Therefore, there is an advantage that distortion of the first thick film conductor layer and the second thick film conductor layer is further suppressed.
[0021]
Preferably, the supporting body preparing step forms the refractory particle layer on the surface of a predetermined substrate. In this way, since the dielectric paste film and the thick film conductive paste film are formed on the substrate, the shape of the support is maintained even after the heat treatment, and therefore the support is configured only by the high melting point particle layer. Compared to the case where the thick film sheet member is handled (for example, when the support is formed of a ceramic raw sheet), there is an advantage that handling of the thick film sheet member becomes easy. In addition, when such a support is used, the substrate on which the high melting point particle layer is interposed between the paste film and the paste film does not constrain the paste film during the heat treatment, and the surface of the paste film. Since only the surface roughness of the high melting point particle layer is reflected in the roughness, the influence on the quality of the thick film sheet member such as the flatness, surface roughness, and expansion coefficient of the substrate is reduced, so that the quality of the substrate is high. Is not required.
[0022]
Preferably, the substrate does not deform at the firing temperature. In this way, the shape of the film forming surface is maintained at the initial shape even when the heat treatment for generating the thick dielectric layer and the first and second thick film conductor layers is performed. By forming the high melting point particle layer on the surface, there is an advantage that it can be used repeatedly as a support. As the substrate, an appropriate one that satisfies the above-mentioned conditions is selected. For example, general glass, heat-resistant glass, a ceramic plate, a metal plate, or the like can be used.
[0023]
Preferably, the high melting point particles are made of an inorganic material such as ceramics or glass frit. As the high melting point particle, an appropriate inorganic material can be used as long as it does not soften even after the resin constituting the high melting point particle layer is burned out. In addition, a specific material is suitably selected according to the kind of thick film material which comprises a thick film sheet member, its baking temperature, etc.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
[0025]
FIG. 1 is a perspective view showing a basic configuration of a thin CRT 10 in which an electrode is constituted by an electronic control electrode according to an embodiment of the present invention in a state where its constituent parts are separated from each other. In the figure, the thin CRT 10 includes a front plate 16 and a back plate 18 arranged in parallel with each other at a predetermined interval so that the substantially flat surfaces 12 and 14 face each other. The front plate 16 and the back plate 18 are hermetically sealed at their peripheral portions via, for example, a spacer, glass, etc. (not shown), thereby forming an airtight space inside the thin CRT 10. The front plate 16 and the back plate 18 are both slightly larger than the display unit having a size of about 350 × 450 (mm), for example, about 450 × 550 (mm) and 10 to 20 (10 to 20 mm) capable of withstanding atmospheric pressure. BaO-SrO-Si0 having a uniform thickness dimension of about mm), translucency, and a softening point of about 700 (° C) ₂ It is made of system glass.
[0026]
Like the conventional CRT face glass using an electron gun, the inner surface 12 of the front plate 16 is divided into a grid or arranged in one direction as shown by a broken line in the figure (ie For each region divided by a plurality of lines (in the form of stripes), a plurality of types of phosphor layers that emit light of three types, for example, red, green, and blue (RGB), that are excited by an electron beam are provided. In this embodiment, the inner surface 12 of the front plate 16 corresponds to a fluorescent screen. The size of each section is set according to the resolution of the CRT 10. For example, in the case of a stripe shape, the phosphor layer having a width dimension of about 50 to 100 (μm) and the width dimension of 30 to 50 are used. Black stripe layers having a width dimension of about (μm) are alternately provided. The thickness dimension of the phosphor layer is a value determined for each color within a range of, for example, about 10 to 20 (μm), and the thickness dimension of the black stripe layer is, for example, 0.1 to 10 (μm). Degree.
[0027]
On the other hand, a plurality of filamentary cathodes (cathodes) 20 extending in one direction and parallel to each other are provided on the inner surface 14 of the back plate 18 at an appropriate center interval. In the drawing, the cathode 20 is drawn so as to be disposed directly on the inner surface 14, but in practice, for example, both ends are fixed to a support member having an appropriate height so that the cathode 20 is fixed from the inner surface 14. It is located at the height position. In the present embodiment, the filamentary cathode 20 corresponds to an electron generation source.
[0028]
A plurality of layers, for example, five layers of electrodes are provided between the front plate 16 and the back plate 18. These five layers of electrodes are an electron beam control electrode (electron beam control electrode) 22, a signal modulation electrode 24, a focus electrode (focusing electrode) 26, a vertical deflection electrode 28, and a horizontal deflection electrode 30 in order from the back plate 18 side. is there. Each of these is composed of a single thin plate having substantially the same external dimensions. In the figure, the signal modulation electrode 24, the vertical deflection electrode 28, and the horizontal deflection electrode 30 are all depicted as being composed of a plurality of spatially separated parts. In this way, each of the plurality of electrode portions is divided and provided on one thin plate. In FIG. 1 and FIG. 2 to be described later, the connection portion to the external circuit is omitted.
[0029]
The electron beam control electrode 22 has a thickness dimension of about 0.1 to 0.2 (mm), for example, and a diameter of about 0.2 to 0.4 (mm) or a rectangle of about 0.2 to 0.4 (mm) on one side, for example, A plurality of electron passage holes 32 having a size of about 0.26 × 0.32 (mm) are provided. The electron passage hole 32 has a value corresponding to the pixel density of the CRT 10 along, for example, the X direction along the one side located on the upper side in the drawing and the Y direction perpendicular thereto, for example, 1.0 to 2.0 in the X direction. They are arranged at center intervals of about 4 to 6 (mm) in the Y direction.
[0030]
The signal modulation electrode 24 has a thickness dimension of about 0.1 to 0.2 (mm), for example, and a large number of rectangular electron passage holes 34 with sides of about 0.3 to 0.6 (mm). It is provided with the same center interval. That is, the electron passage hole 34 is provided with an opening size slightly larger than the electron passage hole 32.
[0031]
The focus electrode 26 has a thickness dimension of about 0.1 to 0.2 (mm), for example, and a large number of rectangular electron passage holes 36 each having a side of about 0.5 to 1.0 (mm) are the same as the electron passage holes 32. It is provided with a proper center distance. The electron passage hole 36 is provided with a larger opening size than the electron passage hole 34.
[0032]
The vertical deflection electrode 28 has a thickness dimension of about 0.1 to 0.2 (mm), for example, and a short side within a range of 0.6 to 1 (mm), for example, about 1 (mm). A plurality of electron passing holes 38 are provided. The center interval of the electron passage holes 38 is the same value as that in the X direction of the electron passage holes 32.
[0033]
The horizontal deflection electrode 30 has, for example, a plurality of rectangular electron passing holes 40 having a thickness dimension of about 0.1 to 0.2 (mm) and a short side of about 0.5 to 1.5 (mm). It is provided at the same center interval as the electron passage hole 32. For example, the electron passage hole 40 has a smaller dimension in the Y direction and a larger dimension in the X direction than the focus electrode 26. As is clear from the relationship between the outer dimensions described above and the dimensions of the electron passage holes 32, 34, etc., the thin CRT 10 is provided with an extremely large number of electron passage holes. In FIG. 2 and the like, for convenience of illustration, the opening dimension and the center interval are drawn very roughly with respect to the outer dimension.
[0034]
Each of the five layers of electrodes 22 to 30 is composed of a thick film sheet member in which a thick film conductor layer is laminated on both surfaces of a thick film dielectric layer. The detailed configuration of the thick film sheet member will be described by taking the signal modulation electrode 24 as an example.
[0035]
FIG. 2 is a perspective view schematically showing the whole of the signal modulation electrode 24, and FIG. 3 is a view showing a main part of a section taken along line III-III (that is, a section along the longitudinal direction of the strip-shaped thick film conductor 48). It is. In both figures, the signal modulation electrode 24 is composed of a thin plate-like support dielectric layer 42 and a number of strip-like thick film conductors 48 laminated on the upper surface 44 and the lower surface 46 thereof. In FIG. 2, only the strip-shaped thick film conductor 48 on the upper surface 44 is shown, but the strip-shaped thick film conductor 48 on the lower surface 46 is, for example, a strip-shaped thickness on the upper surface 44 with the thick film dielectric layer 42 interposed therebetween. The film conductor 48 is provided symmetrically.
[0036]
The support dielectric layer 42 is made of, for example, PbO-B ₂ O _Three -SiO ₂ -Al ₂ O _Three -ZnO-TiO ₂ It consists of a low-softening point glass such as a system or a combination of these, and a thick film dielectric material such as a ceramic filler such as alumina. The thickness of the support dielectric layer 42 is, for example, in the range of 50 to 100 (μm), for example, about 60 (μm). It is configured. Further, as shown in FIG. 3, a through hole 50 is provided at a position corresponding to the electron passage hole 34 of the support dielectric layer 42.
[0037]
The strip-shaped thick film conductor 48 is made of, for example, a thick film conductor containing aluminum (Al), silver (Ag), nickel (Ni), copper (Cu), carbon, or the like as a conductive component. The strip-shaped thick film conductor 48 is formed in a longitudinal shape with a constant width dimension in the range of 0.5 to 1.0 (mm), for example, about 0.8 (mm), and one of two opposing sides of the support dielectric layer 42 is formed. However, the ones adjacent to each other are alternately positioned on one or the other of the two sides. ing. In addition, the strip | belt-shaped thick film conductor 48 is provided with the same center space | interval as the electron passage hole 34, and the mutual space | interval with an adjacent thing is about 0.2-0.4 (mm), for example. The strip-shaped thick film conductor 48 a provided on the upper surface 44 has a thickness dimension of, for example, about 20 (μm) within the range of 40 to 80 (μm), for example, and is provided on the lower surface 46. For example, 48b has a thickness dimension in the range of 10 to 30 (μm), for example, about 65 (μm). That is, in the present embodiment, one and the other of the first thick film conductor layer and the second thick film conductor layer are constituted by the multiple strip-shaped thick film conductors 48a and 48b provided on the upper surface 44 and the lower surface 46, respectively. However, their thickness dimensions are different from each other.
[0038]
The strip-shaped thick film conductors 48 are insulated from each other on the supporting dielectric layer 42, and are connected to, for example, wirings (not shown) at the respective ends, independently or as needed. A drive voltage is applied to a plurality of lines collectively. For this reason, the signal modulation electrode 24 is integrally configured by being fixed on one support dielectric layer 42 even though the signal modulation electrodes 24 are independent from each other.
[0039]
Further, the above-mentioned band-like thick film conductors 48 a and 48 b are also provided with through holes 52 and 52 at positions corresponding to the electron passage holes 34, respectively, but their opening dimensions are larger than those of the through holes 50 of the supporting dielectric layer 42. It is small and has a positional relationship in which the inner peripheral edge protrudes inward. The electron passage hole 34 is constituted by these through holes 50, 52, 52 provided at the same position (that is, coaxially) in the surface direction of the support dielectric layer 42. A stepped hole having a smaller opening area than the portion is formed. The opening dimension of the electron passage hole 34 described above is a value at both opening ends. The protruding amount of the inner peripheral edge of the strip-shaped thick film conductors 48 a and 48 b is, for example, about 30 to 50 (μm) from the inner peripheral edge of the support dielectric layer 42. Further, as shown in the drawing, the inner peripheral edges of the through holes 52 and 52 of the strip-shaped thick film conductors 48 a and 48 b are located at substantially the same position in the surface direction of the support dielectric layer 42. However, as will be described later, since both the strip-like thick film conductor 48 and the supporting dielectric layer 42 are printed thick films, the inner periphery of the opening is not actually a flat surface as shown in the figure. .
[0040]
Further, in the vicinity of the electron passage hole 34, for example, within a range of 1 to 2.5 (mm), for example, about 1.5 (mm), a through conductor 54 penetrating the support dielectric layer 42 in the thickness direction thereof is provided. It is provided for each of the plurality of electron passage holes 34. The through conductor 54 has a circular cross section with a diameter of about 0.3 (mm), for example. The through conductor 54 is made of a thick film conductor material similar to the strip-shaped thick film conductors 48a and 48b, and is connected to them at both ends thereof. For this reason, these strip-shaped thick film conductors 48 a and 48 b provided on both surfaces of the support dielectric layer 42 are conducted through the through conductors 54.
[0041]
As described above, the other electrodes 22, 26, 28, and 30 are configured in the same manner as the signal modulation electrode 24. The shapes of the support dielectric layer and the thick film conductor layer are shown in FIG. It is determined according to each function so as to obtain such a divided state.
[0042]
FIG. 4 is a diagram for explaining the configuration of the portion between the filamentary cathode 20 and the front plate 16 in the cross section of the CRT 10, that is, each of the multiple layers of electrodes in the cross section. As shown in the figure, the electron beam control electrode 22, the signal modulation electrode 24, the focus electrode 26, the vertical deflection electrode 28, and the horizontal deflection electrode 30 have respective electron passage holes 32 to 40 substantially in the surface direction of the electrode. They are stacked so that they are located at the same position, that is, coaxially so that the electron beam can pass straight through. 4 shows a cross section along the longitudinal direction (Y direction) of the vertical deflection electrode 28. The vertical deflection electrode 28 is continuous in the left-right direction in the figure, but for the sake of convenience of description, it has an intermittent shape. The electron passage hole 38 is shown.
[0043]
As described above, each of the electrodes 22 to 30 is formed of a thick film sheet member, and the electron beam control electrode 22 is formed on the entire surface of the support dielectric layer 56 on both sides of the thick film conductor layer 58, 58 is laminated. The focus electrode 26 is constructed by laminating thick film conductor layers 62 and 62 on the entire surface of both surfaces of the support dielectric layer 60, respectively. As described above, these thick film conductor layers 62 and 62 are continuously provided on the entire surface, and those provided on both surfaces are connected to each other by a through conductor similar to the through conductor 54.
[0044]
The vertical deflection electrode 28 is formed by laminating thick film conductor layers 66 and 66 on the entire surface of the support dielectric layer 64. The horizontal deflection electrode 30 is formed by laminating thick film conductor layers 70 and 70 on the entire surface of the support dielectric layer 68. These thick film conductor layers 66 and 70 are each composed of a plurality of strip-shaped thick film conductors independent of each other, like the signal modulation electrode 22. The thick film conductor layers 66 and 70 are also connected to each other by through conductors provided on both sides. In this figure, this through conductor is omitted for any thick film conductor layer.
[0045]
The thickness dimensions of the support dielectric layers 56, 60, 64, and 68 are, for example, all within the range of 50 to 100 (μm), for example, about 60 (μm), similar to the support dielectric layer 42. Further, the thickness dimensions of the thick film conductor layers 58, 62, 66, and 70 are, for example, 10 to 30 (μm) which are located on the lower side in the drawing, that is, the cathode side, like the thick film conductor layer 48, for example. In the range of, for example, about 65 (μm), the one located on the upper side, that is, on the front plate 16 side is in the range of 40 to 80 (μm), for example, about 20 (μm). Further, as in the case of the signal modulation electrode 24, the thick film conductor layers 58 to 70 protrude from the supporting dielectric layers 56 to 68 by a slight dimension of about 30 to 50 (μm).
[0046]
Further, the electrodes 22 to 30 are fixed to each other by an inorganic adhesive 72 such as glass frit at a plurality of positions in the plane direction with a predetermined mutual interval. In the signal modulation electrode 24, the vertical deflection electrode 28, and the horizontal deflection electrode 30 where the exposed portion exists on the surface of the support dielectric layer, the fixing position is a position that is out of the exposed portion, that is, the strip-shaped thick film conductor 48 and the like. . The inorganic adhesive 72 includes spherical bodies 74 such as glass beads made of an inorganic material. This spherical body 74 is for making the above-mentioned mutual interval a constant value. That is, the distance between the electrodes is a constant value determined according to the diameter of the spherical body 74. Such a spherical body 74 can be obtained, for example, by removing coarse particles having a diameter equal to or larger than the above diameter from commercially available glass beads using a sieve or the like. The spherical body 74 obtained in this way includes one having a diameter smaller than the opening of the sieve, but this small diameter does not hinder the setting of the distance between the electrodes to a predetermined value.
[0047]
The distance between the electrodes is determined according to the configuration of the CRT 10 such as the control circuit configuration and resolution. For example, in this embodiment, the intervals among the electron beam control electrode 22, the signal modulation electrode 24, the focus electrode 26, the vertical deflection electrode 28, and the horizontal deflection electrode 30 are all set to about 0.3 to 0.5 (mm). ing.
[0048]
The CRT 10 configured as described above, for example, constantly transmits a predetermined heat current to the plurality of filamentary cathodes 20 and applies a predetermined voltage to the electron beam control electrode 22 and the focus electrode 26. For example, scanning is performed by sequentially applying a positive voltage to each of the plurality of signal modulation electrodes 24. When a predetermined positive voltage is applied to a desired one of the vertical deflection electrode 28 and the horizontal deflection electrode 30 in synchronization with the scanning timing, the electrons generated from the filamentary cathode 20 are applied with the voltage. The light is incident on a desired position on one surface 12 of the front plate 16, that is, the phosphor screen, while being deflected according to the combination of electrodes and the potential difference between applied voltages. Therefore, by changing the applied voltage over time according to the input data while sequentially scanning the signal modulation electrode 24, the position corresponding to the input data on the phosphor screen is sequentially emitted, and a desired image is displayed. It will be.
[0049]
At the time of such driving, the electrodes 22 to 30 are connected to each other through the through conductors 54 and the like with the thick film conductor layers 48 and the like formed on both surfaces of the support dielectric layer 42 and the like as described above. Therefore, the driving voltage is simultaneously applied to the thick film conductors on both sides. In addition, the thick film conductor layer 48 and the like are provided in the electron passage hole 32 and the like so as to protrude to the inner peripheral side from the support dielectric layer 42 and the like, and the support dielectric layer 42 and the like are extremely thick as described above. Since it is thin, the electric fields formed in the electron passage holes by the thick film conductors provided on both surfaces of each electrode 22 and the like are integrated. That is, since the conductor for constituting the electrode is provided substantially on the entire inner wall surface of the electron passage hole 32 or the like, the entire thickness of the electrode 22 or the like contributes to the control of the electron beam. It has a sufficient thickness dimension as an electrode. Note that a detailed driving method is not necessary for understanding the present embodiment, and thus will be omitted.
[0050]
Here, in this embodiment, the signal modulation electrode 24 or the like has a plurality of strip-like thick film conductors 48a and 48b laminated on both surfaces of the support dielectric layer 42 and the like, and has an electron passage hole 34 or the like penetrating therethrough. Since it is composed of the thick film sheet member provided, it is possible to provide a plurality of strip-shaped thick film conductors 48 that can function as mutually independent electrodes simply by fixing one thick film sheet member at a predetermined position. As compared with the case where a large number of thin metal plates are fixed, the electrode arrangement becomes extremely easy, and the relative position accuracy is determined by the formation position accuracy of the strip-shaped thick film conductor 48 on the support dielectric layer 42 and the like. Therefore, there is an advantage that the electrode can be easily assembled with high accuracy. At this time, no conductor is provided on the inner peripheral surface of the intermediate portion in the electron passage direction of the electron passage hole 34, but the thick film conductors on both sides laminated via the thin support dielectric layer 42 and the like are the support dielectric. Since it protrudes to the inner peripheral side from the body layer 42 etc. and is located at the same plane direction position, the electric field formed by them is integrated and functions substantially as one electrode, so the signal modulation electrode 24 etc. substantially That is, the conductor having the necessary thickness is provided in the electron passage hole 34 or the like.
[0051]
In the present embodiment, the signal modulation electrode 24, the vertical deflection electrode 28, and the horizontal deflection electrode 30 are each formed by laminating a plurality of strip-like thick film conductors 48 on both sides of the support dielectric layer 42 and the like and penetrating them. The sheet-like thick film laminate including the electron passage holes 32 and the like, that is, a thick film sheet member. Therefore, a plurality of strip-like thick film conductors 48 that can function as mutually independent electrodes can be provided simply by fixing one signal modulation electrode 24 or the like at a predetermined position such as a fixed frame for constituting the CRT 10. Therefore, it is extremely easy to arrange the electrodes as compared with the case where a large number of thin metal plates are fixed, and the relative position accuracy is determined by the position accuracy of the thick film conductor on the support dielectric layer 42 and the like. Therefore, there is an advantage that the electrode can be easily assembled with high accuracy.
[0052]
By the way, the CRT 10 as described above includes, for example, the front plate 16, the back plate 18, the filamentary cathode 20, and the electrodes 22 to 30 which are separately manufactured or processed, and the spherical body 74 having an appropriate size. It is manufactured by bonding together with an inorganic adhesive 72. Among these manufacturing steps or processing steps, the phosphor layer is provided on the inner surface 12 in the processing of the front plate 16. In the processing of the back plate 18, for example, a filamentary cathode 20 is installed on the inner surface 14. Moreover, each electrode 24-30 which consists of a thick film sheet member is manufactured according to process drawing shown, for example in FIG. 5, using a well-known thick film printing technique. Hereinafter, the manufacturing method of the signal modulation electrode 24 will be described with reference to FIGS. 6A to 6E and FIGS. 7F to 7H showing the states of the main steps of the manufacturing process. . The other electrode manufacturing steps are the same as those described below except that the thick film printing pattern is different.
[0053]
First, in the substrate preparation step 76, a substrate 78 (see FIG. 6) on which thick film printing is performed is prepared, and an appropriate cleaning process is performed on the surface 80 and the like. The substrate 78 is hardly deformed or altered during the heat treatment described later. For example, the thermal expansion coefficient is 87 × 10 8. ^-7 A glass substrate made of soda lime glass or the like having a softening point of about 740 (° C.) and a strain point of about 510 (° C.) at (/ ° C.) is preferably used. The thickness dimension of the substrate 78 is about 2.8 (mm), for example, and the size of the surface 80 is sufficiently larger than the planar dimension of the signal modulation electrode 24.
[0054]
Next, in the release layer forming step 82, the release layer 84 to which the high melting point particles are bonded with a resin is provided on the surface 80 of the substrate 78 with a thickness of about 5 to 50 (μm), for example. The above high melting point particles are, for example, a mixture of a high softening point glass frit with an average particle size of about 0.5 to 3 (μm) and a ceramic filler such as alumina or zirconia with an average particle size of about 0.01 to 5 (μm). It is. The above-mentioned high softening point glass has a softening point of, for example, about 550 (° C.) or more, and the softening point of the high melting point particles as a mixture is, for example, about 550 (° C.) or more. The resin is, for example, an ethyl cellulose resin that is burned off at about 350 (° C.). The release layer 84 is formed, for example, by using an inorganic material paste 86 in which the above-described high melting point particles and resin are dispersed in an organic solvent such as butyl carbitol acetate (BCA) as shown in FIG. It is provided by applying almost the entire surface of the substrate 78 using a printing method and drying at room temperature, but it can also be provided by applying a coater or a film laminate. FIG. 6B shows a stage where the release layer 84 is formed in this way. In FIG. 6A, reference numeral 88 denotes a screen and 90 denotes a squeegee. In this embodiment, the substrate 78 provided with the release layer 84 corresponds to the support, and the surface of the release layer 84 corresponds to the film formation surface. The substrate preparation step 76 and the release layer formation step 82 support the substrate. Corresponds to the body preparation process.
[0055]
In the subsequent thick film paste layer forming step 92, the plurality of strip-shaped thick film conductors 48a and 48b, that is, the thick film conductor paste 94 for forming the thick film conductor layer, and the support dielectric layer 42 are formed. Thick film dielectric paste 96 (see FIG. 6A) is sequentially applied in a predetermined pattern on release layer 84 using a screen printing method or the like, similarly to inorganic material paste 86, and dried. Thereby, the conductor printed layer 98 and the support dielectric layer 42 for forming a plurality of strip-like thick film conductors 48b (that is, second thick film conductor layers) laminated and fixed on the lower surface 46 of the support dielectric layer 42 are provided. In order to form the dielectric printed layer 100 for forming, the through conductor printed film 102 for forming the through conductor 54, and the plurality of strip-like thick film conductors 48a laminated and fixed on the upper surface 44 of the support dielectric layer 42. The conductor print layers 104 are sequentially formed.
[0056]
At this time, the conductor print layers 98 and 106 are formed in a perforated shape having the through holes 106 and 108 at positions corresponding to the through holes 52, respectively, and the dielectric print layer 100 is penetrated to a position corresponding to the through holes 50. The holes 110 are formed in a perforated shape having the through holes 112 at positions where the through conductors 54 are provided. The through conductor printed film 102 is formed by applying a thick film conductor paste 94 into the through hole 112 after the dielectric printed layer 100 is formed. 6C shows the stage where the conductor printed layer 98 is formed, FIG. 6D shows the stage where the dielectric printed layer 100 is formed, and FIG. 6E shows the through conductor printed film 102 formed. FIG. 7 (f) shows a stage where the conductor printing layer 104 is formed. In the present embodiment, the through hole 106 corresponds to the first opening, the through hole 110 corresponds to the second opening, and the through hole 108 corresponds to the third opening.
[0057]
Further, as described above, since the through hole 52 has an opening size larger than that of the through hole 50, the through holes 106 and 108 are formed with an opening size smaller than that of the through hole 110. When the conductor print layer 98 is formed on the release layer 84 and when the dielectric print layer 100 is formed on the conductor print layer 98, an intended pattern according to the opening pattern provided on the screen 88 is used. Since the thick film printing pastes 94 and 96 are applied in the shape having the through holes 106 and 110 having the opening size, no technical problem occurs, but on the other hand, the conductor printing layer 104 is formed on the dielectric printing layer 100. In this case, it is necessary to apply the thick film conductor paste 94 so that the opening edge is located on the inner peripheral side with respect to the opening edge. However, in the portion that protrudes to the inner peripheral side from the dielectric printed layer 100, The coating film is formed in a state of floating in the air. However, in the thick film screen printing, the thick film printing paste extruded from the screen 88 is transferred to the printing surface by being pressed against the printing surface, and thus it is difficult to completely transfer the thick film printing paste according to the opening pattern.
[0058]
FIGS. 8A and 8B are schematic views for explaining an implementation state of the printing process for forming the conductor print layer 104 described above. In the figure, the screen 88 is provided with a plurality of openings 114 provided in a shape corresponding to the planar shape of the conductor print layer 104 to be formed. As described above, when the thick film conductor paste 94 is supplied onto the screen 88 and the squeegee 90 is slid on the screen 88, the thick film conductor paste 94 is pushed out from the opening 114, and the dielectric print layer 100 is formed. Is transcribed. At this time, the inner peripheral edge of the opening 114 is positioned on the substantially inner peripheral edge of the conductor printed layer 98 as shown by a one-dot chain line in the figure, but the inner peripheral edge of the through hole 110 of the dielectric printed layer 100 is more than that. Since the thick film conductor paste 94 is not transferred to the inner side of the inner peripheral edge of the through-hole 110, a part of the thick film conductor paste 94 remains in the opening 114. FIG. 8A shows this stage.
[0059]
However, in this embodiment, before the applied thick film conductor paste 94, i.e., the first layer 104a of the conductor print layer, is dried, the thick film conductor paste 94 is printed in the same pattern as it is immediately overlaid thereon. Therefore, the thick film conductor paste 94 excessive in the opening 114 is extruded from the opening 114, and the undried first layer 104a having a high viscosity and the newly applied thick film conductor paste 94 are integrated. Therefore, the second layer 104b of the conductor print layer applied by the second printing is formed in a planar shape following the opening pattern. That is, the conductor printed layer 104 having the through hole 106 having the same size and the same size as the through hole 106 of the conductor printed layer 98 is obtained. FIG. 8B shows this stage. The conductor printed layer 104 formed in this way has an inner peripheral edge of the through hole 106 that is not perpendicular to the coating surface. However, in FIG. ing.
[0060]
The thick film conductor paste 94 is, for example, a conductor material powder such as silver powder, glass frit, and resin dispersed in an organic solvent. Further, the thick film dielectric paste 96 is, for example, a dielectric material powder such as alumina or zirconia, glass frit, and resin dispersed in an organic solvent. The glass frit is, for example, PbO-B ₂ O _Three -SiO ₂ -Al ₂ O _Three -TiO ₂ A low softening point glass or the like is used, and the same resin and solvent as those of the inorganic material paste 86 are used. The conductor printing layer 98 is formed by, for example, one thick film printing, but the dielectric printing layer 100 is formed by repeatedly printing and drying an appropriate number of times until an appropriate thickness dimension is obtained.
[0061]
After the thick film printed layers 98 to 104 are formed and dried to remove the solvent as described above, in the baking step 116, the substrate 78 is placed in the furnace chamber 118 of a predetermined baking apparatus, and the thick film conductor paste is formed. Heat treatment is performed at a firing temperature of about 550 (° C.), for example, according to the type of 94 and the thick film dielectric paste 96. FIG. 7F shows a state during the heat treatment.
[0062]
In the above heat treatment process, since the thick film printing layers 98 to 104 have a sintering temperature of, for example, about 550 (° C.), the resin component is burned out and the dielectric material, the conductor material, and the glass frit are formed. By sintering, the supporting dielectric layer 42, the strip-shaped thick film conductor 48, and the through conductor 54 are generated, and the signal modulation electrode 24 is obtained. FIG. 7 (g) shows this state. At this time, since the inorganic component particles have a softening point of 550 (° C.) or higher as described above, the release layer 84 is burned away, but the high melting particles (glass powder and ceramic)・ Filler) cannot be sintered. Therefore, when the resin component is burned off as the heat treatment proceeds, the release layer 84 becomes a particle layer 122 made of only the high melting point particles 120 (see FIG. 9).
[0063]
FIG. 9 is a diagram schematically showing a state of progress of sintering in the above heat treatment by enlarging a part of the right end of FIG. 7 (g). The particle layer 122 generated by burning off the resin component of the release layer 84 is a layer in which the high melting point particles 120 are simply stacked, and the high melting point particles 120 are not constrained to each other. Therefore, when the thick film printing layers 98 to 104 contract from the end position before firing indicated by a one-dot chain line in the figure, the high melting point particles 120 act like a roller. Thereby, since the force which prevents the shrinkage does not act between the lower surface side of the thick film printing layers 98 to 104 and the substrate 78, it is contracted in the same manner as the upper surface side, so that the density difference due to the difference in the contraction amount. There is no warping.
[0064]
In this embodiment, when the thick printed layers 98 to 104 start to be sintered, the substrate 78 does not prevent the firing shrinkage by the action of the particle layer 122 as described above. Thus, the thermal expansion of the substrate 78 does not substantially affect the quality of the thick film produced. When the substrate 78 is used repeatedly or when the heat treatment temperature is increased, heat resistant glass having a higher strain point (for example, a thermal expansion coefficient of 32 × 10 6 is used). ^-7 Borosilicate glass with a softening point of about 820 (° C) at about (/ ° C) and a thermal expansion coefficient of 5 × 10 ^-7 (Such as quartz glass having a softening point of about 1580 (° C.)). Also in this case, since the thermal expansion amount of the substrate 78 is extremely small in a temperature range where the bonding force of the dielectric material powder or the like is small, the thermal expansion does not affect the quality of the thick film that is generated.
[0065]
Returning to FIG. 5, in the peeling step 124, the produced thick film, that is, the laminated body of the supporting dielectric layer 42 and the thick film conductor layer is peeled from the substrate 78. Since the high melting point particles 120 are simply stacked on the particle layer 122 interposed between them, the peeling treatment can be easily performed without using any chemicals or apparatus. At this time, the high melting point particles 120 can be attached to the back surface of the laminate with a thickness of about one layer, but the attached particles are removed using an adhesive tape, air blow, or the like as necessary. In addition, since the board | substrate 78 from which the thick film was peeled is a thing which is hard to deform | transform and change in quality at the said baking temperature as mentioned above, it is repeatedly used for the same use. The thick film sheet member, that is, the signal modulation electrode 24 is manufactured in this manner.
[0066]
Here, in this embodiment, a plurality of strip-shaped conductor print layers 98 having through holes 106 having the same opening dimensions as the electron passage holes 34 and a dielectric print layer 100 having through holes 110 larger than that. , And the conductor printed layer 104 having the through hole 108 having the same opening size as the through hole 106 is sequentially laminated on the substrate 78, and fired and peeled off from the substrate 78, whereby a plurality of strip-like thick films A signal modulation electrode 24 or the like made of a thick film sheet member in which a thick film conductor layer having the conductor 48 is laminated via a support dielectric layer 42 is manufactured. Therefore, a plurality of strip-like thick film conductors 48 that can function as mutually independent electrodes can be provided simply by fixing the thick film sheet member at a predetermined position of a fixing member for constituting the CRT 10. Since the relative position accuracy is determined by the formation position accuracy of the thick film conductor on the thick film sheet member, the signal modulation electrode 24 or the like that can easily assemble the electrode with high accuracy is provided. can get.
[0067]
In addition, in the present embodiment, each of the electrodes 24 to 30 has a structure in which a thick film conductor layer is laminated via the support dielectric layer 42 and the like as described above. 98, the dielectric print layer 100, and the conductor print layer 104 need only be sequentially laminated. As a result, the opening dimensions at both ends of the electron passage hole 34 and the like are substantially the same, so that the strip-shaped thick film conductor 48 and the like provided on both surfaces of the support dielectric layer 42 and the like are substantially one electrode. Therefore, there is an advantage that a suitable electronic control function is realized.
[0068]
Incidentally, when the signal modulation electrode 24 or the like is formed of a thick film sheet member, it is conceivable to provide a conductor film on the entire inner peripheral surface of the electron passage hole 34. FIG. 10 is a diagram schematically showing a cross section in the vicinity of the electron passage hole 128 of the thick film sheet member 126 that can be used as a signal modulation electrode having such a structure. In the thick film sheet member 126, thick film conductor layers 132 and 134 are laminated on both surfaces of the support dielectric layer 130, and the thick film conductor layer 136 is fixed to the inner peripheral surface of the electron passage hole 128. In the sheet member 126 having such a structure, for example, after forming a conductor print layer for generating the thick film conductor layer 134, the dielectric print layer for generating the support dielectric layer 130 is repeatedly printed and dried. In this way, the conductor printed layer for generating the thick film conductor layer 136 on the inner wall surface of the electron passage hole 128 is stacked by repeating printing and drying, and further the thick film conductor layer 132 is generated. For example, it can be manufactured by printing a conductor printed layer and performing a baking treatment. In the figure, the alternate long and short dash line represents the boundary between layers during printing lamination.
[0069]
At this time, since the dielectric print layer composed of a plurality of layers and the conductor print layer for generating the thick film conductor layer 136 need to be provided at the same height position, one does not hinder the formation of the other film. Thus, since it is necessary to apply the paste alternately for each layer, there is a disadvantage that alignment during printing becomes extremely difficult. In addition, since the fluidity is relatively high when the conductor printed layer is formed by lamination, the opening edge on the electron passage hole 128 side gradually recedes from each layer to be laminated. For this reason, as shown in the figure, the inner peripheral surface 138 of the thick film conductor layer 136 is inclined with different opening dimensions at both end surfaces, making it difficult to obtain an appropriate electronic control function. According to the present embodiment, since no conductor is provided on the inner peripheral surface in the intermediate portion of the electron passage hole 34, such an inclined surface 138 is preferably avoided, and as described above, the electron passage hole 34. The opening dimensions at both ends of the are matched.
[0070]
In the present embodiment, in the thick film paste layer forming step 92, the dielectric print layer 100 is formed in a planar shape having a through hole 112 in the vicinity of the through hole 110, and the through hole A through conductor printed film forming step of applying a thick film conductor paste 94 for forming a through conductor 54 for connecting the strip-like thick film conductors 48a and 48b to each other in the 112 is performed, so that the through conductor is formed in the firing step 116. A through conductor 54 is generated from the printed film 102, and the strip-like thick film conductors 48 a and 48 b laminated via the support dielectric layer 42 are connected to each other by the through conductor 54 in the vicinity of the electron passage hole 32. Therefore, regardless of the resistivity of the strip-shaped thick film conductors 48a and 48b, the occurrence of a potential difference due to the resistance value is suppressed, so that the uniformity of the electric field formed in the electron passage hole 32 is improved. It is done.
[0071]
In this embodiment, when a thin CRT 10 is manufactured by laminating a plurality of electronic control electrodes such as the signal modulation electrode 24, the electronic control electrodes are all laminated with a thick dielectric layer on a supporting dielectric layer. It is comprised by the thick film sheet member formed. Therefore, even in the signal modulation electrode 24 having a plurality of independent strip thick film conductors 48 etc., the strip thick film conductors 48 etc. are integrally provided on the supporting dielectric layer 42 etc. Therefore, in the case where the electrode is formed of a metal thin plate, the distortion of the electrode due to the heat treatment at the time of fixing is suitably suppressed, and the manufacturing process is simplified.
[0072]
As mentioned above, although this invention was demonstrated in detail with reference to drawings, this invention can be implemented also in another aspect.
[0073]
For example, in the embodiment, the case where the present invention is applied to the signal modulation electrode 24 or the like constituting the MDS type thin CRT 10 has been described. However, the present invention is not limited to a plurality of independent strip thick film conductors 48 or the like. Is applied to other types of thin CRTs. For example, Gabor tube, Aiken tube using flat electron source, flat tube, electron multiplier method, sheet beam method using linear electron source, beam guide method, CRP method, display using planar electron source and hybrid plasma method The same applies to a thin CRT or the like. Further, the present invention is not limited to the CRT, and can be similarly applied to electrodes for other uses for controlling an electron beam.
[0074]
In addition, the thin CRT 10 of the embodiment is of a type that includes three color phosphor layers for full color display, but the present invention includes one color, two colors, or four or more color phosphor layers. The same applies to thin CRTs.
[0075]
Further, the thickness dimension of the thick film sheet member for constituting the signal modulation electrode 24 and the like, the thickness dimension of the supporting dielectric layer 42 and the strip-like thick film conductor 48 constituting the same, the planar dimension, the shape, etc. The values are not limited to the values shown in the embodiments, and are appropriately determined according to the use of the electrode and the required function.
[0076]
In the embodiment, the support for manufacturing the signal modulation electrode 24 and the like is configured by providing the release layer 84 on the surface 80 of the substrate 78. However, the ceramic raw sheet (unfired sheet-like ceramics) is used. ) Can also be used as a support. In this case, the composition of the raw sheet may be determined so that the heat treatment temperature in the firing step 116 is such that the ceramic raw sheet is not sintered but the resin component contained therein is sufficiently burned out. .
[0077]
Further, in the CRT 10 of the embodiment, the three saddle-shaped electrodes, that is, the signal modulation electrode 24, the vertical deflection electrode 28, and the horizontal modulation electrode 30 are all formed of a thick film sheet member. Judgment whether to constitute with a thick film sheet member is determined in consideration of required characteristics, handleability, etc., and some of these can be composed of a thin metal plate.
[0078]
Further, in the embodiment, all the electrodes including the common electron beam control electrode 22 and the focus electrode 26 are formed of the thick film sheet member on the entire surface that is not divided into a plurality of parts. 22 and 26 etc. can also be comprised with a metal material. As the metal material, for example, an inexpensive iron material or a nickel iron-based alloy such as amber having a thermal expansion coefficient substantially the same as that of a glass material for constituting an airtight container of the CRT 10 can be suitably used. In addition, the electrode thickness in the case of comprising a metal material is, for example, about 0.05 to 0.15 (mm). Such an electron beam control electrode 24 and the like are manufactured by a well-known etching process or punching by a press.
[0079]
In the embodiment, the signal modulation electrode 24 is configured by providing the strip-shaped thick film conductors 48 a and 48 b with the same planar shape on both surfaces of the support dielectric layer 42. It is sufficient that the same electrode shape can be obtained at the open end and a voltage can be simultaneously applied to both sides of the desired electron passage hole 34. Therefore, the planar shapes of the strip-shaped thick film conductors 48a and 48b may be different. Absent.
[0080]
In addition, although not illustrated one by one, the present invention can be variously modified without departing from the gist thereof.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a basic configuration of an example of a thin CRT of the present invention.
2 is a perspective view schematically showing an entire signal modulation electrode provided in the CRT of FIG. 1. FIG.
3 is a view showing a main part of a cross section along a longitudinal direction of a strip-shaped thick film conductor of the signal modulation electrode of FIG. 2;
4 is a diagram for explaining a main part of a cross-sectional structure of the CRT in FIG. 1;
FIG. 5 is a process diagram illustrating a manufacturing process of a sheet member used in the CRT of FIG.
6A to 6E are diagrams showing states of a substrate and a thick film at a main stage of the manufacturing process of FIG.
7 (f) to (h) are views subsequent to FIG. 6 (e) for showing the state of the substrate and the thick film at the main stage of the manufacturing process of FIG.
FIGS. 8A and 8B are schematic diagrams for explaining an implementation state of a conductor paste layer forming step for forming the strip-shaped thick film conductor 48a shown in FIG. 7F.
9 is a diagram for explaining shrinkage behavior in the firing step of FIG. 7; FIG.
FIG. 10 is a diagram illustrating a problem when a conductor is provided over the entire length of an electron passage hole in a signal modulation electrode.
[Explanation of symbols]
10: Thin CRT
16: Front plate
18: Back plate
24: Signal modulation electrode
34: Electron passage hole
42: Support dielectric layer
48: Strip thick film conductor

Claims (4)

An electron control electrode comprising a plurality of electron passage holes and allowing electrons to pass in a desired direction by forming an electric field in the electron passage holes,
A thick dielectric layer of a predetermined thickness dimension;
A first thick film conductor layer and a second thick film conductor layer each comprising a plurality of strip-like thick film conductors laminated on one surface and the other surface of the thick film dielectric layer and electrically independent from each other;
The thick film dielectric layer penetrates through the thick film dielectric layer and the strip-shaped thick film conductor, and the inner peripheral edge in each of the first thick film conductor layer and the second thick film conductor layer is at the same position in the plane direction. The plurality of electron passage holes positioned on the inner side of the inner peripheral edge in the layer;
A plurality of through conductors that pass through the thick film dielectric layer in the vicinity of each of the plurality of electron passage holes and interconnect the strip-like thick film conductors on the one surface and the other surface. Electronic control electrode. 2. The electron according to claim 1, which is used in a thin CRT of a type in which a desired image is displayed by deflecting electrons generated from an electron generation source in a vacuum space with electrodes orthogonal to each other and entering the phosphor layer. Control electrode. A method of manufacturing an electronic control electrode comprising a plurality of electron passage holes having a predetermined opening size, and passing an electron in a desired direction by forming an electric field in the electron passage hole,
A plurality of strip-like patterns having a first opening of the opening size at a position corresponding to the electron passage hole and made of a thick film conductor paste using a thick film screen printing method on a predetermined film forming surface Forming a first conductor paste film;
A dielectric composed of a thick film dielectric paste using a thick film screen printing method on the first conductive paste film in a predetermined pattern having a second opening on the first opening that is enlarged outward by a predetermined value. Forming a body paste film in a predetermined thickness dimension;
A thick film conductor paste having a third opening having the same opening size on the first opening and having the same strip-like pattern as the first conductor paste film is formed on the dielectric paste film using a thick film screen printing method. Forming a second conductive paste film comprising:
Simultaneously generating a first thick film conductor layer and a second thick film conductor layer each having a plurality of strip-shaped thick film conductors from the first conductor paste film and the second conductor paste film by performing a firing process at a predetermined temperature. A firing step of generating a thick dielectric layer from the dielectric paste film;
A peeling step of peeling off the laminate of the first thick film conductor layer, the thick film dielectric layer, and the second thick film conductor layer obtained by the firing step from the film forming surface. A method of manufacturing an electronic control electrode comprising a sheet member The thick dielectric paste film is formed in a planar shape having a through hole in the vicinity of the second opening,
A through-conductor paste film forming step of applying a thick-film conductor paste for forming a through-conductor that interconnects the strip-like patterns of the first thick-film conductor layer and the second thick-film conductor layer in the through-hole. The method for producing an electronic control electrode according to claim 3.

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