JPH0766335A - Electronic module - Google Patents

Abstract

PURPOSE:To prevent the characteristic deterioration of high-speed signals of semiconductor components and damages to the connecting sections between leads and a printed wiring boards by housing and fixing the printed wiring board in a metallic case while the inclined lower surface of a metallic block is in close contact with the inclined upper surface of a semiconductor mounting pedestal. CONSTITUTION:A metallic block 30 is attached to the package of a semiconductor component 1 by soldering the upper surface of the block 30 to the bottom surface 1A of the package. The lower surfaces of the four corners of a printed wiring board 5 are seated on the printed board supporting seats 14 of a metallic case 10 and fixed to the case 10 with screws. The upper surface of a semiconductor mounting pedestal 18 is inclined at the same angle as the inclined angle of the block 30. In addition, a pair of pedestals 13 with tapped holes for screws 25 are provided at the positions counterposed to the screwing pedestals 23 of a heat radiation and earth accelerating fittings 20 on both sides of the pedestal 18. Therefore, earthing is accelerated and the characteristics of the high- speed signals of the component 1 are improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for electronic modules.

[0002]

2. Description of the Related Art FIG. 10 is a diagram of a conventional example, (A) is a sectional view, and (B) is
FIG. 11 is a plan view of the heat dissipation / earth reinforcing metal fitting, and FIG.

In the drawing, 1 is a semiconductor component in which an LSI is metal-packaged, 2 is a Z-shaped lead formed in a substantially Z shape in a side view taken out from each side wall of the package of the semiconductor component, 5 is a semiconductor component 1 and It is a printed wiring board on which other electronic components are surface-mounted to form a desired functional circuit.

A rectangular window 6 larger than the semiconductor component 1 is provided at a desired portion of the printed wiring board 5, and pads 7 are arranged on the respective surface sides of the four side edges of the window 6. Each Z-shaped lead 2 is aligned with the corresponding pad 7, the semiconductor component 1 is inserted into the window 6, and reflow soldering is performed to mount the semiconductor component 1 on the printed wiring board 5.

Reference numeral 20 is a heat dissipation / earthing strengthening metal member made of a metal plate having good conductivity and good heat conductivity such as aluminum and copper-based metal. The heat dissipation / earth strengthening metal fitting 20 is provided with a fixing seat 21 which is recessed in a channel shape in a side view and adheres tightly to the upper flat surface 1B of the package of the semiconductor component 1 at the center of the elongated plate-like bridging board portion 22. Both ends of the bridging plate portion 22 are bent into substantially Z-shapes, and screwed seats 23 for seating on the surface of the printed wiring board 5 are provided.

The screwing seat 23 is provided with a screw hole 23A into which the neck of the screw 25 is inserted. Reference numeral 10 denotes a metal case made of aluminum or the like for accommodating and fixing a shallow box-shaped printed wiring board 5 having an upper opening, which is composed of a case bottom plate 11 and four side walls. The opening of the metal case 10 is made of aluminum or the like. It is adapted to be sealed with a lid 15 made of a metal plate.

The case bottom plate 11 has four printed wiring boards 5
A printed board support seat 14 is provided corresponding to the corner, and a screw hole is provided in the center of the printed board support seat 14. Therefore, the printed wiring board 5 is placed horizontally in the metal case 10, the lower surfaces of the four corners are seated on the printed board support seat 14, and then machine screws are inserted into the screw holes of the printed wiring board 5. The printed wiring board 5 is fixed to the metal case 10 by screwing the screw portion into the screw hole.

On the other hand, the printed wiring board 5 is attached to the case bottom plate 11.
A trapezoidal semiconductor mounting pedestal 12 is provided at a position corresponding to the window 6 of FIG.

The predetermined height of the semiconductor mounting base 12 is
The height at which the upper surface of the printed wiring board 5 is in close contact with the package bottom surface 1A of the semiconductor component 1 when the printed wiring board 5 is housed and fixed in the metal case 10.

A semiconductor mounting base 12 is attached to the case bottom plate 11.
A pair of pedestals 13 with a predetermined height having a screw hole into which a screw 25 is screwed is provided in the central portion on both sides of the radiating / grounding metal fitting 20 at positions facing the screwing seat 23.

The predetermined height of the pedestal 13 with screw holes means a height smaller than the height of the semiconductor mounting pedestal 12 by the thickness of the printed wiring board 5. The semiconductor component 1 is mounted on the printed wiring board 5 by being inserted into the window 6 and each Z-shaped lead 2 being reflow-soldered to the corresponding pad 7.

The printed wiring board 5 is housed in the metal case 10 so that the package bottom surface 1A of the semiconductor component 1 is in close contact with the upper surface of the semiconductor mounting base 12, and the lower surfaces of the four corners of the printed wiring board 5 are seated on the Bossund board support seat 14. The printed wiring board 5 is fixed to the metal case 10 by inserting a small screw into the screw hole of the printed wiring board 5 and screwing the screw into the screw hole of the Boston plate support seat 14.

On the other hand, the heat dissipation / grounding metal fitting 20 is a fixed seat.
21 is reflow-soldered (solder 29) to the package upper flat surface 1B of the semiconductor component 1 and fixed to the semiconductor component 1, and the screwing seat 23 is seated on the surface of the printed wiring board 5,
Insert the screw 25 into the screw hole 23A of the screw fixing seat 23 and the screw hole of the printed wiring board 5, and screw it into the screw hole of the pedestal 13 with the screw hole to dissipate the heat dissipation / earth strengthening bracket 20 of the metal case 10. It is fixed to the case bottom plate 11.

Therefore, the ground of the semiconductor component 1 is grounded to the semiconductor mounting pedestal 12 via the package bottom surface 1A, and the package upper flat surface 1B, heat dissipation / earth reinforcing metal fitting 20, screw 25
Since it is grounded to the pedestal 13 with a screw hole through the ground, the grounding is strengthened.

On the other hand, the heat of the semiconductor component 1 is transferred to the semiconductor mounting pedestal 12 through the package bottom surface 1A and radiated to the outside of the metal case, and the package upper flat surface 1B, the heat radiation / earth reinforcing metal fitting 20, and the screw 25 are connected. After that, it is transmitted to the pedestal with screw holes and discharged to the outside of the metal case.

Therefore, the semiconductor component 1 has improved heat dissipation. In order to bring the package bottom surface 1A of the semiconductor component 1 into close contact with the upper surface of the semiconductor mounting pedestal 12 with the printed wiring board 5 fixed to the metal case 10, the height of the semiconductor mounting pedestal 12 and the pedestal 13 with screw holes are It is necessary to process the height and the dimension between the lower surface of the screwing seat 23 and the lower surface of the fixing seat 21 of the heat dissipation / grounding metal fitting 20 with high accuracy.

However, it is difficult to process the above-mentioned dimensions with high precision, and the electronic module becomes expensive. Therefore, conventionally, the height of the semiconductor mounting pedestal 12 is made larger than the calculated value, and the legs of the Z-shaped lead and the like are made sufficiently long so that the lead has flexibility.

By doing so, even if the dimensional accuracy of the heat dissipation / earth reinforcing metal fitting, the pedestal with screw holes, etc. is poor, when the heat dissipation / earth reinforcing metal fitting 20 is fixed to the pedestal 13 with screw holes, the package bottom 1A is pressed against the upper surface of the semiconductor mounting base 12.

Then, the semiconductor component 1 being lifted upward as a result of pressing is absorbed by the bending of the Z-shaped lead 2 so that the peeling force acting on the soldered portion between the Z-shaped lead and the pad is minimized. ing.

[0020]

By the way, conventionally, by using the Z-shaped lead having the long leg portions as described above, the L line segment is generated in the lead and the characteristics of the high speed signal of the semiconductor component are deteriorated. There was a problem.

On the other hand, if the dimension of the Z-shaped lead is shortened, manufacturing errors of the heat dissipation / grounding metal fitting, the semiconductor mounting pedestal, the semiconductor component package, etc. cannot be alleviated by the lead portion, and the Z-shaped lead and pad There was a risk that cracks would occur at the soldered part with.

The present invention has been made in view of the above points, and has no deterioration of the characteristics of high-speed signals of semiconductor components, and there is no risk of damage to the connecting portions between the leads of the semiconductor components and the printed wiring board. Is intended to provide.

Another object of the present invention is to provide an electronic module in which a heat dissipation / ground reinforcing metal fitting can be easily attached.

[0024]

In order to achieve the above object, the present invention mounts a metal packaged semiconductor component on a printed wiring board as shown in FIG. In an electronic module to be sealed and housed in a case, a metal block 30 having a wedge shape with an inclined lower surface and an upper surface adhered to the package bottom surface 1A of the semiconductor component 1 and attached to the semiconductor component 1, and a window 6 into which the semiconductor component 1 is inserted The printed wiring board 5 sealed and housed in the metal case 10 provided with the Z-shaped leads 2 of the semiconductor component 1 are soldered and connected to the pads 7 arranged on the mounting surface along the four side edges of the window 6. With.

Further, the long and narrow plate-shaped bridging plate portion 22 and the bridging plate portion 22 are closely attached to the flat surface 1B of the semiconductor component 1 on the package.
The fixing seat 21 provided at the center of the board and the bridging board portion 22 are seated on the mounting surface of the printed wiring board 5 at substantially both ends.
A heat dissipation / ground strengthening fitting (20) having a screwing seat (23) bent and formed into a shape is provided.

Further, the upper surface of the case bottom plate 11 of the metal case 10 facing the semiconductor component 1 has a metal block.
Semiconductor mounting base 18 tilted at an angle equal to 30
And, through the printed wiring board 5, heat dissipation and ground reinforcement metal fittings 20
And a pedestal 13 with a screw hole provided on the case bottom plate 11 of the metal case 10 so as to face the screwing seat 23.

The printed wiring board 5 is housed and fixed in the metal case 10 with the inclined lower surface of the metal block 30 being in close contact with the inclined upper surface of the semiconductor mounting pedestal 18, and the fixing seat 21 of the heat dissipation / earth strengthening metal fitting 20 is fixed. Soldered to the flat surface 1B on the package, the screw 25 is inserted into the screw hole of the screw fixing seat 23 of the heat dissipation / grounding metal fitting 20 and the screw hole of the printed wiring board 5, and the screw portion is the pedestal 13 with the screw hole. Screw it into the screw hole,
The heat dissipation / ground strengthening bracket 20 is the bottom plate 11 of the metal case 10.
The structure is fixed to.

As shown in FIG. 3, half-broken through holes 40 are arranged and formed on the inner wall of the window 6 provided in the printed wiring board 5 into which the semiconductor component 1 is inserted. The flat lead 2-1 of the semiconductor component 1 is soldered to the above.

As illustrated in FIG. 4, the periphery of the window 6 provided in the printed wiring board 5 into which the semiconductor component 1 is inserted is formed in the flexible frame-shaped thin plate portion 9. Further, the pad 7 for soldering the flat leads 2-1 of the semiconductor component 1 is arranged and formed on the mounting surface on the frame-shaped thin plate portion 9.

As illustrated in FIG. 5, a metal block 30 formed by adhering to the semiconductor component 1 by adhering the wedge-shaped lower surface to the package bottom surface 1A of the semiconductor component 1 and the window into which the semiconductor component 1 is inserted. The printed wiring board 5 which is sealed and housed in the metal case 10 provided with 6 and the flat lead 2-1 of the semiconductor component 1 are arrayed and formed on the mounting surface along the four side edges of the window 6 for soldering connection. And a pad 7.

Further, both ends of the slender plate-like bridging plate portion 92 are seated on the mounting surface of the printed wiring board 5 by substantially Z.
The elastic heat dissipation / grounding metal fitting 90 having the screwed seat 93 formed by bending into a shape and the bottom plate 51 are inserted into the holes provided in the central portion of the bridge plate 92 with the bottom plate 51 facing down, and the outer periphery of the peripheral wall 52 is the bridge. Trapping board
And a can 50 having a bottomed cylindrical shape or a bottomed rectangular tubular shape soldered to 92.

Further, the upper surface provided on the case bottom plate 11 of the metal case 10 so as to face the semiconductor component 1 is a metal block.
Semiconductor mounting base 18 tilted at an angle equal to 30
And, through the printed wiring board 5, heat dissipation and ground reinforcement metal fittings 20
And a pedestal 13 with a screw hole provided on the case bottom plate 11 of the metal case 10 so as to face the screwing seat 23.

Then, the printed wiring board 5 is housed and fixed in the metal case 10 in a state where the inclined lower surface of the metal block 30 is in close contact with the inclined upper surface of the semiconductor mounting pedestal 18, and the screw fixing seat 93 of the heat dissipation / earth reinforcing metal fitting 90 is fixed. The screw 25 is inserted into the screw hole of the can and the screw hole of the printed wiring board 5, and the screw portion is screwed into the screw hole of the pedestal 13 with the screw hole, thereby the bottom plate of the can 50.
The heat dissipation / earth reinforcement metal fitting 90 is fixed to the case bottom plate 11 of the metal case 10 in a state in which 51 is in contact with the upper flat surface 1B of the package of the semiconductor component 1.

As illustrated in FIG. 6, the opening side of the peripheral wall 52 of the can 50, which is soldered to the bridging plate portion 92 of the heat dissipation / earthing reinforcing metal fitting 90, has the opening of the lid 15 for closing the opening of the metal case 10. The can 50 is penetrated and the opening edge 53 of the can 50 is soldered to the lid 15.

Alternatively, a plurality of slits 98 are provided in the bridging plate portion of the heat dissipation / grounding metal fitting. As illustrated in FIG. 7, the printed wiring board 5 having the window 6 into which the semiconductor component 1 is inserted and sealed and housed in the metal case 10 is soldered to the flat lead 2-1 of the semiconductor component 1. Window 6
And pads 7 arranged in an array on the mounting surface at the four side edges thereof.

The flat surface 1B on the package of the semiconductor component 1
The both ends of the bridging plate portion 62 are attached so as to be attached to the fixing seat 61 provided in the central portion of the elongated plate-like bridging plate portion 62 so as to be closely attached to the through hole 8 connected to the ground pattern of the printed wiring board 5. Pin part formed by bending downward at a right angle
A heat dissipation / ground strengthening metal fitting 60 having 65 and is provided.

Further, a trapezoidal semiconductor mounting pedestal 12 provided on the case bottom plate 11 of the metal case 10 so as to face the semiconductor component 1 is provided. And heat dissipation, ground reinforcement metal fittings 60
The fixing seat 61 of is soldered to the flat surface 1B on the package, the pin portion 65 is soldered to the through hole 8 of the printed wiring board 5, and the heat dissipation / earth strengthening metal fitting 60 is mounted on the printed wiring board 5, and the semiconductor component 1 The printed wiring board 5 is housed and fixed in the metal case 10 with the bottom surface 1A of the package in close contact with the upper surface of the semiconductor mounting base 12.

As illustrated in FIG. 8, the heat dissipation / earth reinforcing metal fitting has three or four elongated bridging plate portions 72, and each bridging plate portion 72 has an end portion. It is assumed to have a pin portion 75 bent downward at a right angle and soldered and inserted into a through hole of a printed wiring board, and a plurality of slits 78 formed in a bridging plate portion 72.

Alternatively, the ribs 76 formed by bending are formed on both side edges of each bridging plate portion 72 of the heat dissipation / earth reinforcing metal fitting 70, and the edges 78a projecting downward to the entire periphery of each slit 78. It is assumed to have.

As illustrated in FIG. 9, a metal block 30 formed by adhering to the semiconductor component 1 by adhering the wedge-shaped lower surface to the package bottom surface 1A of the semiconductor component 1 with the upper surface and a window into which the semiconductor component 1 is inserted. A printed wiring board 5 which has a housing 6 and is sealed and housed in a metal case 10 and a flat lead 2-1 of the semiconductor component 1 are arrayed and formed on the mounting surface along the four side edges of the window 6 for soldering connection. And a pad 7.

A spring plate portion 82 formed by bending one side edge of the main plate 81 downward by 180 degrees and a printed wiring board 5 formed by bending the other side edge of the main plate 81 downward in a substantially Z shape. A heat-dissipation / earth-strengthening metal fitting 80 including a screw-fastening seat 83 seated on the surface of the main plate 81 and a tongue piece 85 formed by cutting and raising the central portion of the main plate 81 upward.

Further, a semiconductor mounting base, which is provided on the case bottom plate 11 of the metal case 10 so as to face the semiconductor component 1, and whose upper surface is inclined at an angle equal to the inclination angle of the metal block 30.
18 and the printed wiring board 5 through the heat dissipation and ground reinforcement metal fittings
And a pedestal 13 with a screw hole provided on the case bottom plate 11 of the metal case 10 so as to face the screwing seat 83 of 80.

Then, the printed wiring board 5 is housed and fixed in the metal case 10 with the inclined lower surface of the metal block 30 being in close contact with the inclined upper surface of the semiconductor mounting pedestal 18, and the screw fixing seat 83 of the heat dissipation / earth strengthening metal fitting 80 is attached. The screw 25 is inserted into the screw hole of the printed wiring board 5 and the screw hole of the printed wiring board 5, and the screw portion is screwed into the screw hole of the pedestal 13 with the screw hole. The heat dissipation / grounding metal fitting 80 is fixed to the case bottom plate 11 of the metal case 10 while being pressed against 1B, and the lid 15 is attached to the opening side of the metal case 10 to attach the tongue piece.
The upper portion of 85 is pressed against the inner surface of the lid 15.

[0044]

The inventions of claims 1, 2, 3, 4, 5, 6, 10 are as follows:
Slide the printed wiring board in the metal case and make sure that the inclined surface of the semiconductor mounting pedestal and the inclined surface of the metal block attached to the semiconductor component are aligned and the printed wiring board is fixed to the case bottom plate. Using a heat dissipation / earth reinforcement metal fitting soldered to the surface, the screwed seat is seated on the printed wiring board, and the heat dissipation / earth reinforcement metal fitting is fixed to the metal case.

Therefore, even if the dimensional accuracy of the metal block, the heat dissipation / earth reinforcing metal fitting, the semiconductor mounting pedestal, etc. is slightly inferior, the Z-shaped lead or the flat lead is almost always obtained when the heat dissipation / earth reinforcing metal fitting is fixed to the case bottom plate. No bending force is applied.

Therefore, since it is not necessary to absorb the applied bending force, the length of the Z type lead or the flat type lead can be shortened without any trouble. Therefore, by using short Z-shaped leads or short flat-shaped leads, it is possible to prevent deterioration of the characteristics of high-speed signals of semiconductor components.

Even if the lead length is short, there is no risk of damaging the soldered portion between the lead and the pad of the printed wiring board. It goes without saying that the grounding of the semiconductor component is strengthened and the heat dissipation is good.

According to the seventh, eighth and ninth aspects of the present invention, when the semiconductor component 1 is reflow soldered to the printed wiring board 5, the fixing seat of the heat radiation / earth reinforcing metal fitting is used as the semiconductor component, and the pin of the heat radiation / earth metal reinforcing metal fitting is used. The parts can be simultaneously reflow soldered to the through holes of the printed wiring board. Further, in this case, the trapezoidal semiconductor mounting base does not require a screw hole mounting base and a metal block attached to the semiconductor component.

Therefore, the work of attaching the heat radiation / grounding metal fitting is simplified. On the other hand, by providing a slit in the bridging plate portion of the heat dissipation / earth reinforcing metal fitting, there is an advantage that the soldering portion between the lead of the semiconductor component and the pad (or land) of the printed wiring board can be visually checked.

[0050]

The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention, and FIG.
3 (A), (B), and (C) are views showing the assembling order of the embodiment of the present invention, and FIG.
Is a sectional view of another embodiment of the present invention, (A) is a sectional view, (B) is a perspective view of a main portion, and FIG. 4 is a sectional view of an embodiment of the invention of claim 3.

FIG. 5 is a diagram of an embodiment of the invention of claim 4 (A).
Is a cross-sectional view, (B) is a plan view of the heat dissipation / grounding reinforcing metal fitting, FIG. 6 is a cross-sectional view of the embodiment of the invention of claim 5, and (A) and (B) of FIG. 7 are the embodiments of the invention of claim 7. FIG. 8 is a perspective view of an embodiment of the invention of claim 9 and FIG. 9 is a view of the embodiment of the invention of claim 10.
(A) is a cross-sectional view, and (B) is a perspective view of a heat dissipation / ground reinforcing metal fitting.

In FIGS. 1 and 2, 1 is a semiconductor component in which an LSI is metal-packaged, and 2 is a Z-shaped lead having a short leg portion formed in a Z-shape in a side view taken out from each side wall of the package of the semiconductor component. Reference numeral 5 denotes a printed wiring board on which the semiconductor component 1 and other electronic components are surface-mounted to form a desired functional circuit.

A rectangular window 6 larger than the semiconductor component 1 is provided at a desired portion of the printed wiring board 5, and pads 7 are formed on the mounting surface along the four side edges of the window 6. 30
Is a metal block made of, for example, wedge-shaped aluminum whose planar shape is substantially the same as that of the semiconductor component 1 and whose lower surface is inclined.

The metal block 30 is attached to the semiconductor component 1 by bringing the upper surface into close contact with the package bottom surface 1A of the semiconductor component 1 and soldering. Numeral 20 is a heat dissipation / earth strengthening metal fitting made of a metal plate of good conductivity and good heat conductivity such as aluminum and copper-based metal.

The heat dissipation / earth reinforcing metal fitting 20 is provided with a fixing seat 21 which is recessed into a channel shape in a side view and is closely adhered to the upper flat surface 1B of the package of the semiconductor component 1 in the central portion of the elongated plate-like bridging plate portion 22. At the same time, both ends of the bridging plate portion 22 are bent into substantially Z-shapes, and screwing seats 23 for seating on the surface of the printed wiring board 5 are provided.

The screwing seat 23 is provided with a screw hole into which the neck of the screw 25 is inserted. Reference numeral 10 denotes a metal case made of aluminum or the like for accommodating and fixing a shallow box-shaped printed wiring board 5 having an upper opening, which is composed of a case bottom plate 11 and four side walls. The opening of the metal case 10 is made of aluminum or the like. It is adapted to be sealed with a lid 15 made of a metal plate.

The bottom plate 11 of the case has four printed wiring boards 5.
Printed board support seats 14 are provided corresponding to the corners, and a screw hole is provided in the center of the boston board support seat 14. Therefore, the printed wiring board 5 is housed horizontally in the metal case 10, the lower surfaces of the four corners are seated on the Bosnto board support seats 14, and then machine screws are inserted into the screw holes of the printed wiring board 5. The printed wiring board 5 is fixed to the metal case 10 by screwing the screw portion into the screw hole.

Reference numeral 18 corresponds to the window 6 of the printed wiring board 5 and is provided integrally with the case bottom plate 11 (or the case bottom plate 11).
It is a semiconductor mounting base made of metal. The semiconductor mounting pedestal 18 has a plan view shape that is substantially the same as the shape of a semiconductor component, and an upper surface that is inclined at an angle equal to the inclination angle of the metal block 30.

The case bottom plate 11 has a semiconductor mounting base 18
A pair of pedestals 13 with predetermined screw holes, each having a screw hole 13A into which a screw 25 is screwed at its center, are provided at positions on both sides of the radiating / earthing reinforcing metal fitting 20 facing the screwing seat 23.

The height of the pedestal 13 with screw holes is equal to the height of the printed board support seat 14. Next, the order of assembling the electronic module of the present invention will be described with reference to FIG. Of FIG.
As shown in (A), the semiconductor component 1 is inserted into the window 6 of the printed wiring board 5, each Z-shaped lead 2 is placed on the corresponding pad 7, and reflow soldering is performed to print the semiconductor component 1 on the printed wiring board. It is mounted on the plate 5.

A flat surface on the package of the semiconductor component 1
Apply cream solder 29A to 1B. Next, FIG. 2 (B)
As shown in FIG. 3, the printed wiring board 5 is placed horizontally in the metal case 10 so that the semiconductor component 1 is located directly above the semiconductor mounting pedestal 18, and the lower surfaces of the four corners of the printed wiring board 5 are It is seated on the boston plate support seat 14.

Then, the printed wiring board 5 is displaced in the direction of arrow A in FIG. 2C to bring the inclined lower surface of the metal block 30 into close contact with the inclined upper surface of the semiconductor mounting pedestal 18. Then, small screws are inserted into the screw holes at the four corners of the printed wiring board 5, and the screw parts are screwed into the screw holes of the printed board support seat 14 to fix the printed wiring board 5 to the metal case 10.

Next, the heat radiating / grounding metal fittings 20 are arranged so that the fixing seats 21 come into close contact with the package upper flat surface 1B of the semiconductor component 1 and the respective screwing seats 23 are positioned directly above the corresponding pedestals 13 with screw holes. Is placed on the printed wiring board 5.

Then, as shown in FIG. 1, the screw 25 is inserted into the screw hole of the screw fixing seat 23 and the screw hole of the printed wiring board 5, and the screw portion is screwed into the screw hole 13A of the pedestal 13 with the screw hole. Then, the heat dissipation / earth strengthening fitting 20 is fixed to the case bottom plate 11 of the metal case 10.

Next, the fixing seat 21 is heated so that the creamy solder 29A is in a molten state, and the fixing seat 21 is reflow-soldered (solder 29) to the flat surface 1B on the package. At this time, if a hole is provided at the center of the fixing seat 21, the molten solder will permeate the upper surface of the fixing seat 21 through the hole, so that the reliability of soldering between the fixing seat 21 and the package upper flat surface 1B will be improved. improves.

Unlike the drawing, when the Z-shaped lead 2 and the pad 7 are reflow-soldered, the fixing seat 21 of the heat dissipation / earth strengthening metal 20 and the package flat surface 1B are simultaneously reflow-soldered. The heat dissipation / earth strengthening metal fitting 20 may be fixed to the semiconductor component 1.

As described above, since the heat dissipation / earth strengthening metal fitting 20 is incorporated, the ground of the semiconductor component 1 is grounded to the semiconductor mounting pedestal 18 through the package bottom surface 1A, the metal block 30, and the package flat surface 1B. Since it is grounded to the pedestal 13 with a screw hole through the heat dissipation / grounding strengthening metal 20 and the screw 25, the grounding is strengthened and the characteristics of the high speed signal of the semiconductor component 1 are improved.

On the other hand, the heat of the semiconductor component 1 is transferred to the semiconductor mounting pedestal 18 through the package bottom surface 1A and the metal block 30 and is radiated to the outside of the metal case. Then, it is transmitted to the pedestal 13 with a screw hole through the screw 25 and discharged to the outside of the metal case.

Therefore, the semiconductor component 1 has good heat dissipation. According to the present invention, even if the dimensional accuracy of the metal block, the heat dissipation / earth reinforcing metal fitting, the semiconductor mounting pedestal, etc. is somewhat inferior, bending stress is applied to the Z-shaped lead when the heat dissipation / earth reinforcing metal fitting is fixed to the case bottom plate. Not done.

Therefore, even if the length of the Z-shaped lead is shortened, cracks do not occur in the soldered portion between the Z-shaped lead 2 and the pad 7 of the printed wiring board 5. Further, since the leads can be shortened, the characteristics of the high speed signal of the semiconductor component are not deteriorated.

On the other hand, although not shown in the drawing, the head portion is inserted into a through hole connected to a desired pattern of the printed wiring board and soldered, and the middle portion penetrates through the hole of the case bottom plate 11 and is hermetically sealed in a pin-shaped electron. I / O terminals of the module are provided.

Then, the electronic modules are mounted on the motherboard by inserting the lower portions of the input / output terminals into the corresponding through holes of the motherboard and soldering them. In the semiconductor component 1 shown in FIG. 3, flat leads 2-1 having a relatively short projecting length are arranged on four side surfaces of the package.

On the other hand, on the inner wall of the window 6 for inserting the semiconductor component 1 provided on the printed wiring board 5, half-broken through holes 40 are formed in an array corresponding to the respective flat leads 2-1. On the front surface side of the printed wiring board 5 along the edge of the land, lands 41 connected to the respective half-cut through holes 40 are provided on the mounting surface.

The semiconductor component 1 is inserted into the window 6 of the printed wiring board 5, each flat lead 2-1 is reflow-soldered to the corresponding land 41, and the semiconductor component 1 is mounted on the printed wiring board 5. There is.

The printed wiring board 5 is housed and fixed in the metal case 10 with the inclined lower surface of the metal block 30 being in close contact with the inclined upper surface of the semiconductor mounting pedestal 18. Also, the fixing seat 21 of the heat dissipation / grounding metal fitting 20 is on the flat surface of the package.
1B is reflow-soldered (solder 29), and the screw 25 is inserted into the screw hole of the screw fixing seat 23 of the heat dissipation / earth strengthening bracket 20 and the screw hole of the printed wiring board 5 so that the screw portion has a screw hole pedestal 13 The heat radiation / earthing strengthening metal fitting 20 is fixed to the case bottom plate 11 of the metal case 10 by being screwed into the screw hole.

As shown in FIG. 3, by soldering the flat lead 2-1 having a short length to the semi-broken through hole 40, solder fillets are generated at two places, the land 41 and the semi-broken through hole 40. Therefore, even if the lead length is short, the reliability of connection with the flat lead 2-1 is further enhanced.

Further, since the flat lead 2-1 has a short lead length, the characteristics of the high speed signal of the semiconductor component are not deteriorated. Figure 4
The electronic module shown in FIG. 3 is different from that shown in FIG. 3 in that a flexible frame-shaped thin plate portion 9 is provided at the peripheral edge of the window 6 without providing a semi-cut through hole in the inner wall of the window 6. That is, the pads 7 are formed on the mounting surface side of the frame-shaped thin plate portion 9.
Since the frame-shaped thin plate portion 9 is bent by reducing the thickness of the printed wiring board on the periphery of the window 6 as described above, even if the electronic module may vibrate, the flat lead 2-1 is impossible. No stress is applied.

Therefore, even if there is vibration or the like, cracks are prevented from being generated in the solder that connects the flat lead 2-1 and the pad 7. In FIG. 5, reference numeral 90 denotes a heat dissipation / earth reinforcing metal member made of a thin elastic metal plate having good conductivity and good heat conductivity such as copper metal.

On the heat dissipation / earth strengthening fitting 90, both ends of the elongated plate-shaped bridging plate portion 92 are bent into substantially Z-shapes, and screwed seats 93 for seating on the mounting surface of the printed wiring board 5 are provided. is there.

Reference numeral 50 denotes a can formed by processing and molding a copper-based metal into a bottomed cylindrical shape or a bottomed rectangular tube shape. Can 50 is a bridge plate part
The bottom plate 51 is inserted into a hole provided in the central portion of 92 so that the bottom plate 51 faces downward, and the outer periphery of the peripheral wall 52 is soldered to the bridging plate portion 92.

A plurality of slits 98 are provided in the bridging plate portion 92 portion of the heat dissipation / earth strengthening fitting 90, and a screw hole 93A into which the neck portion of the screw 25 is inserted in the center portion of each screw fixing seat 93. Is provided.

The semiconductor component 1 is inserted into the window 6 of the printed wiring board 5, and each flat lead 2-1 is reflow-soldered to the corresponding pad to mount the semiconductor component 1 on the printed wiring board 5. .

The printed wiring board 5 is housed and fixed in the metal case 10 with the inclined lower surface of the metal block 30 being in close contact with the inclined upper surface of the semiconductor mounting pedestal 18. And
The elasticity of the bridge plate portion 92 urges the can 50,
With the bottom plate 51 of the semiconductor component 1 pressed against the flat surface 1B of the package of the semiconductor component 1, the screw 25 is inserted into the screw hole of the screw fixing seat 93 of the heat dissipation / earth strengthening bracket 90 and the screw hole of the printed wiring board 5. The screw portion is screwed into the screw hole of the pedestal 13 with the screw hole, and the heat dissipation / earth strengthening metal fitting 90 is fixed to the case bottom plate 11 of the metal case 10.

Incidentally, in FIG. 5, the semiconductor mounting base 18
And the pedestal 13 with screw holes are provided on the same metal plate, and this metal plate is welded and fixed to the case bottom plate 11. As described above, the slits are formed in the bridging plate portion 92 of the heat dissipation / earth strengthening bracket 90.
Since 98 is provided, the flat lead of the semiconductor component 1
Check the soldering status between 2-1 and the pad of the printed wiring board 5.
It can be checked visually.

The electronic module shown in FIG. 6 is different from that shown in FIG. 5 in that the opening side of the peripheral wall 52 of the can 50, which is soldered to the bridging plate portion 92 of the heat dissipation / earth reinforcing metal fitting 90, is made of metal. Penetrating through the hole of the lid 15 that closes the opening of the case 10, the opening edge 53 of the can 50 is folded back and brought into close contact with the surface of the lid 15,
This is the point of soldering.

By connecting the upper portion of the can 50 to the lid 15 as described above, the heat of the semiconductor component 1 is directly transferred to the lid 15 via the can 50, so that the heat dissipation of the semiconductor component 1 is further improved. .

Further, since the ground of the semiconductor component 1 is connected to the lid 15 via the can 50, the effect of strengthening the ground is great. In FIG. 7, reference numeral 60 designates a fixing seat 61 provided at the central portion of an elongated plate-shaped bridging plate portion 62 so as to be in close contact with the package flat surface 1B of the semiconductor component 1, and further, left and right end portions of the bridging plate portion 62. Are bent at right angles downward, and a plurality of pin portions 65 are provided at the ends of the bending, respectively, which is a heat dissipation and earth strengthening metal member made of a thin copper-based metal plate.

A plate-shaped metal member is provided below the bridging plate portion 62.
69 is stuck. On the other hand, the printed wiring board 5 has a window 6
Through holes 8 into which the pin portions 65 are inserted are arranged at positions symmetrical with respect to. The through hole 8 is connected to the metal case 10 through the ground pattern 8A of the printed wiring board 5.

On the case bottom plate 11 of the metal case 10, a trapezoidal semiconductor mounting pedestal 12 having a horizontal upper surface is provided so as to face the semiconductor component 1. The pedestal 13 with screw holes is not required.

Semiconductor component 1 and heat dissipation / grounding metal fitting 60
7 is mounted on the printed wiring board 5, the creamy solder 29A is applied to the pad 7 and the package flat surface 1B as shown in FIG. Apply the creamy solder P.

Next, as shown in FIG. 7B, the semiconductor component 1 is inserted into the window 6 of the printed wiring board 5 and each flat lead 2-1 is placed on the corresponding pad 7. To do. Further, the pin portion 65 of the heat dissipation / earth strengthening metal fitting 60 is inserted into the corresponding through hole 8 and the fixing seat 61 is attached to the semiconductor component 1.
Press on the flat surface 1B on the package.

In this state, the solder is heated to the reflow temperature, and the flat lead 2-1 is reflow-soldered to the pad 7, the pin portion 65 to the through hole 8 and the fixing seat 61 to the package flat surface 1B. .

At this time, since the metal member 69 is attached to the bridging plate portion 62, the heat radiation / grounding metal fitting 60 is prevented from rising. Therefore, the upper flat surface 1B of the package and the fixing seat 61 are reliably soldered and connected.

The printed wiring board 5 is arranged so that the package bottom surface 1A of the semiconductor component 1 is in close contact with the top surface of the semiconductor mounting base 12.
And place it in a metal case to make the printed wiring board 5
The lower surface of each of the four corners is seated on the Boston plate support seat.

Then, machine screws are inserted into the screw holes at the four corners of the printed wiring board 5, and the screw parts are screwed into the screw holes of the printed board supporting seat to fix the printed wiring board 5 to the metal case. It is a thing.

As described above, when the semiconductor component 1 is soldered to the printed wiring board 5, the fixing seat of the heat dissipation / earth reinforcing metal fitting can be reflow-soldered to the semiconductor component, and at the same time, the pin portion of the heat dissipation / earth reinforcing metal fitting is fixed. It can be reflow soldered to the through hole of the printed wiring board.

Therefore, the work of attaching the heat radiation / grounding metal fitting is simplified. In FIG. 8, reference numeral 70 denotes a fixing seat 71 to be soldered to the flat surface 1B on the package, and a long and narrow cuboid plate shape around the fixing seat 71, and a bridging plate portion 72 having a plurality of slits 78 in each. And a pin portion 75 that is soldered and inserted into a through hole of a printed wiring board in which the end portions of the respective bridging plate portions 72 are bent downward at a right angle, and a heat radiation and earth reinforcing metal fitting.

The slits 78 formed in the bridging plate 72 are extruded. Therefore, the edge 78a is provided on the entire periphery of the slit 78 so as to project downward. Further, ribs 76 are formed by bending on both side edges of each bridge plate portion 72.

A hole 71A is provided in the central portion of the fixing seat 71, and the molten solder is passed through the hole 71A when reflow soldering is performed.
The upper surface of 71 is bleeding to increase the strength of soldering.

The electronic module shown in FIG.
The other structure is the same as that shown in FIG. 7 except for the structure of the earth reinforcing metal fitting 70. As described above, it has four bridging plate portions 72, and each bridging plate portion 72 has an edge 78a.
Since the attached slit 78 and the rib 76 are provided, the electrical resistance is small and the thermal resistance is also small. Therefore, heat dissipation and grounding are further improved than those shown in FIG.

In FIG. 9, 80 is a strip-shaped main plate 81,
The spring plate portion 82 is formed by bending one side edge of the main plate 81 downward by 180 degrees, and the other side edge of the main plate 81 is seated on the surface of the printed wiring board 5 which is bent downward in a substantially Z shape. A heat dissipation / earthing strengthening metal fitting including a screwing seat 83 and a tongue piece 85 formed by cutting and raising the central portion of the main plate 81 upward.

The heat dissipation / ground strengthening metal fitting 80 is a thin elastic metal plate having good conductivity and good heat conductivity, such as copper metal.
For example, it is made of a phosphor bronze plate. Further, a metal block 30 having a wedge shape with an inclined lower surface and an upper surface adhered to the package bottom surface 1A of the semiconductor component 1 and attached to the semiconductor component 1
And the printed wiring board 5 which has the window 6 for inserting the semiconductor component 1 and is sealed and housed in the metal case 10 and the flat side lead 2-1 of the semiconductor component 1 by soldering to connect the four side edges of the window 6. Pad 7 arranged in an array on the front surface side.

Further, a semiconductor mounting pedestal, which is provided on the case bottom plate 11 of the metal case 10 so as to face the semiconductor component 1, and whose upper surface is inclined at an angle equal to the inclination angle of the metal block 30.
18 and the printed wiring board 5 through the heat dissipation and ground reinforcement metal fittings
One base 13 with a screw hole is provided on the case bottom plate 11 of the metal case 10 so as to face the screwing seat 83 of 80.

The printed wiring board 5 is a metal case 10.
The edges are placed on the cut-and-raised parts provided on the respective side walls of and are soldered to be fixed to the metal case 10. The printed wiring board 5 is housed and fixed in the metal case 10 with the inclined lower surface of the metal block 30 being in close contact with the inclined upper surface of the semiconductor mounting pedestal 18.

The screw 25 is inserted into the screw hole of the screw fixing seat 83 of the heat dissipation / earth strengthening fitting 80 and the screw hole of the printed wiring board 5, and the screw portion is screwed into the screw hole of the pedestal 13 with the screw hole. With the spring plate portion 82 in pressure contact with the upper flat surface 1B of the package of the semiconductor component 1, the heat dissipation / earth reinforcing metal fitting 80 is fixed to the case bottom plate 11 of the metal case 10.

Further, by attaching the lid 15 to the opening side of the metal case 10, the upper surface of the tongue piece 85 of the heat dissipation / earth strengthening fitting 80 is pressed against the inner surface of the lid 15. With such a structure of the heat dissipation / earth reinforcing metal fitting 80, the heat of the semiconductor component 1 is transferred to the lid 15 via the heat dissipation / earth reinforcing metal fitting 80, so that the heat dissipation property is good.

Further, the ground of the semiconductor component is also connected to the lid 15 through the heat dissipation / ground reinforcing metal fitting 80, and the ground is further strengthened. Further, since it is not necessary to solder and connect the semiconductor component and the heat dissipation / earth strengthening metal fitting, the heat dissipation / earth strengthening metal fitting can be easily attached.

[0109]

As described above, according to the present invention, the printed wiring board is displaced in the metal case so that the inclined surface of the semiconductor mounting pedestal and the inclined surface of the metal block attached to the semiconductor component are aligned with each other. Is fixed to the bottom plate of the case, and the fixing seat is soldered to the flat surface of the package to fix the heat dissipation / earth strengthening metal fitting to the metal case.The earth of the semiconductor component is strengthened and the heat dissipation is good. Needless to say, the lead shape may be a short Z-type lead or a short flat-type lead, which has the effect of preventing deterioration of the characteristics of high-speed signals of semiconductor components.

Further, there is an effect that the soldered portion between the lead and the pad of the printed wiring board is not damaged. On the other hand, the electronic module is such that the grounding of the semiconductor parts is strengthened and the heat dissipation is good, as well as the heat dissipation / grounding strengthening metal fittings are inserted into the through holes of the printed wiring board. This has the effect of preventing the deterioration of the characteristics of, and further facilitating the work of attaching the heat dissipation / ground strengthening metal fittings.

Further, in the heat dissipation / earth strengthening metal fitting having the bridging plate portion provided with slits, the soldering portion between the lead of the semiconductor component and the pad (or land) of the printed wiring board is
It has an effect that it can be visually checked.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

2 (A), (B), and (C) are views showing the assembling order of the embodiment of the present invention.

FIG. 3 is a view of another embodiment of the present invention, (A) is a sectional view, and (B) is a perspective view of a main part.

FIG. 4 is a sectional view of an embodiment of the invention of claim 3;

FIG. 5 is a diagram of an embodiment of the invention of claim 4, (A) is a cross-sectional view, and (B) is a plan view of a heat dissipation / earth reinforcing metal fitting.

FIG. 6 is a sectional view of an embodiment of the invention of claim 5;

7 (A) and (B) are diagrams of an embodiment of the invention of claim 7. FIG.

FIG. 8 is a perspective view of an embodiment of the invention of claim 9;

FIG. 9 is a diagram of an embodiment of the invention of claim 10; (A) is a cross-sectional view;

[FIG. 10] FIG. 10 is a cross-sectional view of a conventional example, and (B) is a plan view of a heat dissipation / ground reinforcing metal fitting.

FIG. 11 is a sectional view of a key part of a conventional example.

[Explanation of symbols]

 1 Semiconductor parts 1A Package bottom surface 1B Package flat surface 2 Z type lead 2-1 Flat type lead 5 Printed wiring board 6 Window 7 Pad 8 Through hole 9 Frame thin plate part 10 Metal case 11 Case bottom plate 12,18, Semiconductor mounting base 13 Pedestal with screw hole 15 Lid 20,60,70,80,90 Heat dissipation / ground strengthening bracket 21,61,71 Fixed seat 22,62,72,92 Bridge plate 23,83,93 Screw seat 25 Screw 30 Metal block 40 Half cut through hole 41 Land 50 Can 51 Bottom plate 52 Peripheral wall 65,75 Pin part 76 Rib 78a Edge 78,98 Slit 81 Main plate 82 Spring plate part 85 Tongue piece

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yasuhide Kuroda 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Makoto Totani, 1015, Kamikodanaka, Nakahara-ku, Kawasaki, Kanagawa Prefecture, Fujitsu Limited ( 72) Inventor, Koji Nakahara 1015, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Yoko Murata, 1015, Kamikodanaka, Nakahara-ku, Kawasaki, Kanagawa Prefecture, Fujitsu Limited

Claims (10)

[Claims] 1. An electronic module, in which a semiconductor component formed by metal packaging is mounted on a printed wiring board, and the printed wiring board is sealed and housed in a metal case, the bottom surface of which is the package bottom surface of the semiconductor component (1) ( The wedge-shaped metal block (30) attached to the bottom of the semiconductor component (1) and the semiconductor component (1) are inserted so that the upper surface is bonded to the package bottom surface (1A) so as to be inclined with respect to 1A). With metal window (6)
Mounted along the four side edges of the window (6) so that the printed wiring board (5) sealed in (10) and the Z-shaped lead (2) of the semiconductor component (1) can be connected by soldering. A pad (7) arranged on the surface, an elongated plate-shaped bridging plate part (22), and a flat surface on the package of the semiconductor component (1) provided in the central part of the bridging plate part (22) ( 1B), and a fixing seat (23) that is seated on the mounting surface of the printed wiring board (5) in which both ends of the bridging plate portion (22) are bent and formed into a substantially Z shape. ), Which is provided on the case bottom plate (11) of the metal case (10) so as to face the semiconductor component (1) and has the upper surface of the metal block (30). Semiconductor mounting base tilted at an angle equal to the tilt angle (18)
And the metal case (1) so as to face the screwing seat (23) of the heat dissipation / earth strengthening metal fitting (20) through the printed wiring board (5).
(0) is provided with a pedestal (13) with a screw hole provided on the case bottom plate (11), and the printed wiring board (5) is such that the inclined lower surface of the metal block (30) is the semiconductor mounting pedestal (18). The heat-dissipating / grounding metal fitting (20) has a fixing seat (21) on the flat surface (1B) of the package, in which the heat-dissipating / grounding metal fitting (20) is fixedly attached to the inclined upper surface of the metal case (10). The heat dissipation / grounding strengthening metal fitting (20) is to be soldered by inserting the screw (25) into the screw hole of the screw seat (23) and the screw hole of the printed wiring board (5). An electronic module characterized by being fixed to a case bottom plate (11) of the metal case (10) by being screwed into a screw hole of the pedestal (13) with a screw hole. 2. A printed wiring board (5) having half-broken through holes (40) arranged and formed on an inner wall of a window (6) provided in a printed wiring board (5) into which a semiconductor component (1) is inserted. The land (41) of the semi-broken through hole (40) formed on the mounting surface of the semiconductor component (1) is a flat lead (2-1) soldered to the land (41). The electronic module according to claim 1, wherein the electronic module comprises: 3. A frame-shaped thin plate portion having a flexible peripheral edge of a window (6) provided in a printed wiring board (5) into which a semiconductor component (1) is inserted.
(9), the semiconductor component (1) has a flat lead (2-1) soldered to a pad (7) arranged on the mounting surface along the frame-shaped thin plate portion (9). Characterized by having
The electronic module according to claim 1. 4. The upper surface of the package (1A) has a lower surface inclined with respect to the package bottom surface (1A) of the semiconductor component (1).
A metal case having a wedge-shaped metal block (30) adhered to the lower part of the semiconductor component (1) and a window (6) into which the semiconductor component (1) is inserted.
The printed wiring board (5) sealed and housed in (10) and the flat lead (2-1) of the semiconductor component (1) are soldered and connected along the four side edges of the window (6). (7) arrayed on the mounting surface, an elongated plate-shaped bridge plate (92) having a hole in the center, and both ends of the bridge plate (92) are bent in a substantially Z shape. Screwed seat (93) seated on the mounting surface of the printed wiring board (5)
And an elastic heat and earth strengthening metal fitting (90) consisting of and a bottom plate (51) with the bottom plate (51) facing down and inserted into the hole of the bridging plate part (92). 92) Can with a bottomed cylindrical shape or a bottomed rectangular tube shape that is soldered to 92)
And a semiconductor mounting pedestal provided on the case bottom plate (11) of the metal case (10) so as to face the semiconductor component (1) and whose upper surface is inclined at an angle equal to the inclination angle of the metal block (30). 18)
And the metal case (1) so as to face the screw fastening seat (93) of the heat dissipation / earth strengthening metal fitting (90) through the printed wiring board (5).
(0) is provided with a pedestal (13) with a screw hole provided on the case bottom plate (11), and the printed wiring board (5) is such that the inclined lower surface of the metal block (30) is the semiconductor mounting pedestal (18). The heat dissipating / grounding reinforcing metal fitting (90) is fixed to the metal case (10) in a state of being in close contact with the inclined upper surface of the screw (25), and the screw (25) is fixed to the screw seat (93). Fixed to the case bottom plate (11) of the metal case (10) by inserting it into the screw hole of the printed wiring board (5) and the screw hole of the pedestal (13) with the screw hole. The heat dissipation / can (50) is connected to the heat dissipation / earth strengthening metal fitting (90).
An electronic module, characterized in that the bottom plate (51) is in contact with the upper flat surface (1B) of the package of the semiconductor component (1) while being fixed to the case bottom plate (11). 5. The bridge plate part (9) of the heat dissipation / earth reinforcing metal member (90).
The opening side of the peripheral wall (52) of the can (50) soldered to 2) penetrates the hole of the lid (15) that closes the opening of the metal case (10),
The electronic module according to claim 4, wherein the opening edge (53) of the can (50) is soldered to the lid (15). 6. A plurality of slits (98) are provided in the bridge plate portion of the heat dissipation / earth strengthening metal fitting.
The electronic module of 2, 3, 4, or 5. 7. A printed wiring board having a window (6) for inserting a semiconductor component (1) and sealed and housed in a metal case (10).
Pads (7) arrayed and formed on the mounting surface along the four side edges of the window (6) for soldering and connecting the flat lead (2-1) of the semiconductor component (1) with the (5) And an elongated plate-shaped bridging plate part (62), and a fixing seat (61) which is provided in the central part of the bridging plate part (62) and adheres to the flat surface (1B) of the package of the semiconductor component (1). , And a pin formed at each end of the bridging plate portion (62) bent downward at a right angle so as to be inserted into the through hole (8) connected to the ground pattern of the printed wiring board (5). A heat dissipation / earthing strengthening metal fitting (60) consisting of a part (65) and a trapezoidal semiconductor mounting base (11) provided on the case bottom plate (11) of the metal case (10) so as to face the semiconductor component (1). 12), the heat dissipation / earth strengthening metal fitting (60) has a fixing seat (61) soldered to the flat surface (1B) of the package, and a pin portion (65) of the printed wiring board (5) through. Soldered into the hole (8) , The printed wiring board (5) is mounted, and the printed wiring board (5) has a package bottom surface (1A) of the semiconductor component (1) closely contacted with an upper surface of the semiconductor mounting base (12). An electronic module, which is housed and fixed in the metal case (10) in a state. 8. The heat dissipation / earth reinforcing metal fitting according to claim 7 has three or four elongated plate-shaped bridging plate parts (72), and each of the bridging plate parts (72). End portions are bent downward at a right angle to be soldered and inserted into through holes of the printed wiring board, and a plurality of slits (78) formed in the bridging plate portion (72). ) And
An electronic module having. 9. The heat dissipation / ground strengthening metal fitting (7) according to claim 8,
The ribs (76) formed by bending on both side edges of each bridging plate portion (72) of (0) and the edge (78) protruding downward on the entire periphery of each slit (78).
a) An electronic module comprising: 10. The package has a bottom surface (1A) whose bottom surface is inclined with respect to a package bottom surface (1A) of the semiconductor component (1).
A metal case having a wedge-shaped metal block (30) attached to the lower part of the semiconductor component (1) and a window (6) into which the semiconductor component (1) is inserted.
The printed wiring board (5) sealed and housed in (10) and the flat lead (2-1) of the semiconductor component (1) are soldered and connected along the four side edges of the window (6). Pads (7) arrayed on the mounting surface, a spring plate portion (82) formed by bending one side edge of the main plate (81) downward by 180 degrees, and the other side edge of the main plate (81). Is a substantially Z-shaped bent downward, the screwed seat (83) seated on the mounting surface of the printed wiring board (5), and the central portion of the main plate (81) are formed by cutting and raising upward. The heat dissipation / earth strengthening metal fitting (80) consisting of the tongue piece (85) and the case bottom plate (11) of the metal case (10) facing the semiconductor component (1), the upper surface of which is the metal. Semiconductor mounting base (18) tilted at an angle equal to the tilt angle of the block (30)
And through the printed wiring board 5, the heat dissipation / ground reinforcing metal fitting (8
The metal case (10) so that it faces the screw seat (83) of (0).
And a pedestal (13) with a screw hole provided on the case bottom plate (11) of the above, the printed wiring board (5) has a sloping lower surface of the metal block (30) and an inclined pedestal of the semiconductor mounting pedestal (18). The metal case (10) is closely fixed to the upper surface of the metal case (10), and the heat dissipation and grounding metal fitting (80) includes a screw (25) and a screw hole of the screw seat (83) and The spring plate portion (82) is inserted into the screw hole of the printed wiring board (5) and screwed into the screw hole of the pedestal (13) with the screw hole so that the spring plate portion (82) is a flat surface on the package of the semiconductor component 1. It is fixed to the case bottom plate (11) of the metal case (10) in a state of being pressed against (1B), and the tongue piece (85) covers the opening side of the metal case (10) with a lid (15). ) Is attached, the upper surface of the lid (15) is in pressure contact with the inner surface of the lid (15).