JPH0766248A - Thermocompression bonding device for electronic part - Google Patents

Abstract

PURPOSE:To provide a means with which the lead of an electronic part, formed by a TAB method, can be thermocompression-bonded to the electrode of a substrate with uniform pressing force. CONSTITUTION:A thermocompressiom bonding element 1 is formed into frame shape by four member pieces 11 to 14, and two member pieces 12 and 14 are coupled to pole members 16 and 17. Also, rib pieces 21 to 24, with which the member pieces 11 to 14 are pressed, are provided in frame shape on the upper surface of a supporting member 2. Pressing force becomes larger on the part directly under the pole members 16 and 17. The upper surfaces 21a to 24a of the rib pieces 21 to 24 are curved in downward recessed shape and upward protruding shape so that the pressing force, added to the pole members 16 and 17, becomes uniform and all the leads 32 are pressed by uniform force to the electrode 41 of a substrate 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding apparatus for electronic components, which is used to bond the leads of an electronic component manufactured by punching a film carrier to the electrodes of a substrate by thermocompression bonding.

[0002]

2. Description of the Related Art As electronic parts, TAB (Tape A
Those manufactured by the automated bonding method are known. The TAB method is a method in which a lead or a chip is attached to the upper surface of a film carrier made of a synthetic resin film, and the lead portion is punched with a mold to manufacture an electronic component.

As a method for mounting an electronic component manufactured by the TAB method on a substrate, a method is known in which a lead is pressed against an electrode on the substrate by a thermocompression bonding element to perform thermocompression bonding.

FIG. 11 is a perspective view of a main part of a conventional thermocompression bonding apparatus for electronic parts. This thermocompression bonding apparatus comprises a thermocompression bonding element 1 and a receiving body 2. The thermocompressor 1 has four member pieces 11,
The main body is a quadrangular frame body 10 composed of 12, 13, and 14. Two member pieces 1 of this frame body 10 facing each other
Columns 16 and 17 are connected to the central portions of the rods 2 and 14, and horizontal arms 18 and 19 are provided above the columns 16 and 17, respectively.
Are formed. The arms 18 and 19 are attached to the body of a thermocompression bonding head (not shown), and the arm 1
4 pieces 11 through 8 and 19 and columns 16 and 17
A current is passed through -14 (see dashed arrow). When a current is applied, these member pieces 11-14 generate heat due to internal resistance. Further, a cemented carbide piece 15 having a small friction coefficient, such as diamond, is attached to the lower surface of each of the member pieces 11 to 14.
The superhard pieces 15 prevent wear of the member pieces 11 to 14 and improve heat transfer properties.

The receiving body 2 is constructed by projecting four rib pieces 21, 22, 23, 24 on the upper surface of the base 20. The rib pieces 2 are pressed so that the member pieces 11 to 14 are pressed.
1 to 24 are formed in a rectangular frame shape.

Reference numeral 3 denotes an electronic component manufactured by the TAB method, which is made by attaching a lead 32 and a chip 33 on a film carrier 31. Reference numeral 4 denotes a substrate, and the lead 32 is bonded to the electrode 41 by thermocompression bonding.

FIG. 12 is a front view during pressing, and FIG. 13 is a side view of the same. The board 4 and the electronic component 3 are mounted on the rib pieces 21 to 24 of the receiving body 2, and the thermocompressor 1 is lowered by a means (not shown), so that the member pieces 11 to 14 are connected to the leads 3.
While being pressed against 2, the lead 32 is bonded to the electrode 41 by applying an electric current to generate heat.

[0008]

However, the above-mentioned conventional means have the following problems. That is, since the pressing force is transmitted to each of the member pieces 11 to 14 via the pillars 16 and 17, as shown by the chain line A in FIG.
The lower surfaces of 2 and 14 are likely to be deformed in a downward convex shape, and therefore the pressing force F1 is large at the center of the member pieces 12 and 14 to which the pillars 16 and 17 are joined, and the pressing force F2 is at both ends.
Becomes smaller, which results in uneven pressing force.

For the same reason, in the case of the member pieces 11 and 13 shown in the side view of FIG. 13, since the pressing force is applied from the pillars 16 and 17 on both sides, the lower surface of the member pieces 11 and 13 is indicated by the chain line B. As shown in the figure, it is easy to deform into a convex shape, so
The pressing force F3 on both sides directly under 6 and 17 increases,
Further, since the pressing force F4 becomes small in the central portion, the pressing force becomes non-uniform. 12 and 13, the curved lines indicated by the chain lines A and B are exaggerated for easy understanding, but the curved amount is usually several microns.

When the pressing force becomes non-uniform in this way, it is impossible to press all the leads 32 of the electronic component 3 against the electrodes 41 of the substrate 4 with a uniform pressing force, and the thermocompression bonding state varies. There was a point. Moreover, in recent years, the size of the electronic component 3 has become larger and the number of the leads 32 has tended to increase, so this problem has become more prominent.

Therefore, the present invention provides a thermocompression bonding apparatus for an electronic component, which eliminates the above-mentioned variation in pressing force and can bond all the leads of the electronic component to the electrodes of the substrate by thermocompression bonding with a uniform force. The purpose is to do.

[0012]

To this end, in the thermocompression bonding apparatus for electronic parts of the present invention, the lower surface of the member piece of the thermocompressor and the upper surface of the rib piece of the receiver are bent in a downward concave shape or an upward convex shape. It was made.

[0013]

According to the above construction, in the state where each member piece of the thermocompression-bonding member is pressed against the leads of the electronic component placed on the rib piece of the receiving body, the pressing force applied to all the leads becomes equal, All leads can be bonded to the electrodes on the substrate by thermocompression bonding with a uniform pressing force.

[0014]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a front view of a thermocompression bonding apparatus for electronic parts. The thermocompression bonding head 50 includes the thermocompression bonding element 1. Reference numeral 51 denotes a lead wire, which heats the thermocompressor 1 by supplying electric power to the thermocompressor 1 in a pulsed manner. The receiver 2 is provided below the thermocompression bonding head 50.

FIG. 2 shows a thermocompressor 1, a receiver 2, an electronic component 3,
3 is a perspective view of the substrate 4. FIG. The thermocompression-bonding element 1 and the receiving body 2 are the same as the conventional example shown in FIG. 11 except for the top shapes of the ribs 21 to 22, and therefore, the explanation is omitted by giving the same reference numerals.

The rib piece 2 of the receiving body 2 against which the two member pieces 12 and 13 coupled to the pillar bodies 16 and 17 of the thermocompression-bonding element 1 are pressed.
The upper surfaces 22a and 24a of the Nos. 2 and 24 are bent downward. Also, the rib piece 2 of the receiving body 2 against which the other two member pieces 11 and 13 to which the pillars 16 and 17 are not joined are pressed.
The upper surfaces 21a and 23a of the Nos. 1 and 23 are bent in an upward convex shape.

FIG. 3 is a front view before pressing, and FIG. 4 is a front view during pressing. As shown in FIG. 3, the rib pieces 21 to 21 of the receiving body 2
The substrate 4 and the electronic component 3 are placed on 24, the thermocompression bonding element 1 is lowered, and the member pieces 11 to 14 are pressed against the leads 32.
The member pieces 12 and 14 are the upper surfaces 22a and 2 of the rib pieces 22 and 24, respectively.
The lead 32 is pressed while deforming along 4a.
At this time, on both sides of the member pieces 12, 14, the member pieces 12,
Since the force of 14 to restore to the original shape acts on the leads 32 on both sides, the pressing force F2 on both sides becomes even with the pressing force F1 on the central part, and all the leads 32 have uniform force. It is pressed against the electrode 41 of the substrate 4.

FIG. 5 is a side view before pressing, and FIG. 6 is a side view during pressing. The member pieces 11 and 13 are rib pieces 21 and 2.
The lead 3 is deformed along the upper surfaces 21a and 23a of the lead 3
Press 2. At this time, in the central portion of the member pieces 11 and 13, the force of the member pieces 11 and 13 to restore to the original shape acts on the lead 32 in the central portion, so that the pressing force F4 in the central portion is increased.
Becomes even with the pressing force F3 on both sides (the pressing force F3 and the pressing force F2 have the same magnitude). Therefore, all the leads 32 are pressed and bonded to the electrodes 41 of the substrate 4 with a uniform force. FIG. 7 is a perspective view of the substrate 4 to which the electronic component 3 is bonded in this way.

Next, another embodiment of the present invention will be described with reference to FIGS. 8, 9 and 10. In FIG. 8, among the member pieces 11 to 14 of the thermocompression-bonding element 1, the lower surfaces 12 a and 14 of the member pieces 12 and 14 coupled to the pillars 16 and 17, respectively.
a is curved in an upward concave shape, and the other two member pieces 1
The lower surfaces 11a and 13a of the reference numerals 1 and 13 are bent downwardly. The upper surfaces of the rib pieces 21 to 24 of the receiver 2 are all flat.

Therefore, as shown in FIGS. 9 and 10, when the thermocompressor 1 is lowered and pressed against the leads 32 of the electronic component 3, each of the member pieces 11 to 14 is pressed due to the pressing force.
Lower surfaces 11a to 14a of the ribs are upper surfaces 21a of the rib pieces 21 to 24.
All of the leads 32 are deformed to be flat along the lines 24a to 24a (see the chain line in the figure), and uniform pressing force is applied to all the leads 32 as in the case shown in FIGS. The electrode 41 can be bonded uniformly.

According to the present invention, as in the first embodiment, the rib piece 2 is used.
Method for bending upper surfaces 21a-24a of Nos. 1-24 into a downward concave shape or an upward convex shape, and member pieces 11-1 as in the second embodiment.
There is a method of bending the lower surfaces 11a to 14a of No. 4 into an upward concave shape or a downward convex shape. However, since the superhard pieces 15 such as diamond are provided on the lower surfaces of the member pieces 11 to 14, the bending processing is difficult. Is. Therefore, it is practically advantageous to bend the upper surfaces 21a to 24a of the rib pieces 21 to 24 as in the first embodiment.

[0023]

As described above, according to the thermocompression bonding apparatus for an electronic component of the present invention, each component piece of the thermocompression bonding element is pressed against the lead of the electronic component mounted on the rib piece of the receiving body. The pressing force applied to all the leads becomes equal, and all the leads can be thermocompression bonded with a uniform pressing force to bond to the electrodes on the substrate.

[Brief description of drawings]

FIG. 1 is a front view of a thermocompression bonding apparatus for electronic components according to an embodiment of the present invention.

FIG. 2 is a perspective view of a thermocompressor and a receiver according to an embodiment of the present invention.

FIG. 3 is a front view of a thermocompression-bonding element and a receiver according to an embodiment of the present invention.

FIG. 4 is a front view of the thermocompression bonding element and the receiver during thermocompression bonding according to an embodiment of the present invention.

FIG. 5 is a side view during thermocompression bonding of the thermocompressor and the receiver according to the embodiment of the present invention.

FIG. 6 is a side view during thermocompression bonding of the thermocompressor and the receiver in one embodiment of the present invention.

FIG. 7 is a perspective view of a substrate according to an embodiment of the present invention.

FIG. 8 is a perspective view of a thermocompressor and a receiver according to another embodiment of the present invention.

FIG. 9 is a front view of another embodiment of the present invention during thermocompression bonding of a thermocompressor and a receiver.

FIG. 10 is a side view of another embodiment of the present invention during thermocompression bonding of a thermocompressor and a receiver.

FIG. 11 is a perspective view of a conventional thermocompressor and a receiver.

FIG. 12 is a front view of a conventional thermocompression bonding element and a receiving member during thermocompression bonding.

FIG. 13 is a side view of a conventional thermocompression bonder and a receiver during thermocompression bonding.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermocompressor 2 Receiver 3 Electronic component 4 Board 11 Member piece 12 Member piece 13 Member piece 14 Member piece 11a Lower surface of member piece 12a Lower surface of member piece 13a Lower surface of member piece 14a Lower surface of member piece 21 Rib piece 22 Rib piece 23 rib piece 24 rib piece 21a rib piece upper surface 22a rib piece upper surface 23a rib piece upper surface 24a rib piece upper surface

Claims (2)

[Claims] 1. A quadrangular frame body composed of four member pieces and a column body coupled to the central portions of two member pieces of the frame body facing each other to transmit a pressing force to the frame body. A thermocompression-bonding member and a receiving body provided below the thermocompression-bonding member and having four rib pieces projecting in a frame shape and pressing each of the member pieces. The upper surfaces of the two rib pieces that are pressed by the two member pieces are bent downwardly, and the upper surfaces of the two rib pieces that are pressed by the two member pieces that are not joined to the pillar are turned up. A thermocompression bonding device for electronic parts, characterized by being bent in a convex shape. 2. A quadrangular frame body composed of four member pieces and a column body coupled to the central portions of two member pieces of the frame body facing each other and transmitting a pressing force to the frame body. A thermocompression-bonding member and a receiving body provided below the thermocompression-bonding member and having four rib pieces projecting in a frame shape and pressing each of the member pieces. A thermocompression bonding apparatus for electronic parts, characterized in that the lower surfaces of the two member pieces are bent in an upward concave shape, and the lower surfaces of the two member pieces that are not joined to the pillars are bent in a downward convex shape. .