JP3097410B2 - Thermocompression bonding equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component thermocompression bonding apparatus for thermocompression bonding an electronic component lead manufactured by punching a film carrier to an electrode on a substrate.

[0002]

2. Description of the Related Art TAB (Tape A)
A device manufactured by an automated bonding method is known. The TAB method is a method in which leads or chips are attached to the upper surface of a film carrier made of a synthetic resin film, and the leads are punched out with a die to manufacture an electronic component.

As a method for mounting an electronic component manufactured by the TAB method on a substrate, there is known a method in which a lead is pressed against an electrode of the substrate by a thermocompressor to perform thermocompression.

FIG. 11 is a perspective view of a main part of a conventional thermocompression bonding apparatus for electronic parts. This thermocompression bonding device includes a thermocompression bonding element 1 and a receiver 2. The thermocompression bonding element 1 has four member pieces 11,
A quadrangular frame 10 composed of 12, 13, and 14 is mainly used. Two opposing member pieces 1 of this frame 10
Columns 16 and 17 are connected to the central portions of the columns 2 and 14, and horizontal arms 18 and 19 are provided on the upper portions of the columns 16 and 17.
Are formed. The arms 18 and 19 are attached to a main body of a thermocompression bonding head (not shown).
8 and 19 and four member pieces 11 through the pillars 16 and 17
To 14 (see broken line arrows). When a current is applied, these member pieces 11 to 14 generate heat due to internal resistance. On the lower surfaces of the member pieces 11 to 14, a carbide piece 15 having a small friction coefficient such as diamond is mounted.
The cemented carbide pieces 15 prevent wear of the member pieces 11 to 14 and improve heat conductivity.

[0005] The receiver 2 is constituted by projecting four rib pieces 21, 22, 23 and 24 on the upper surface of the base 20. The rib pieces 2 are pressed so that the member pieces 11 to 14 are pressed.
1 to 24 are formed in a square frame shape.

Reference numeral 3 denotes an electronic component manufactured by the TAB method, which is formed by attaching a lead 32 and a chip 33 on a film carrier 31. Reference numeral 4 denotes a substrate, and leads 32 are bonded to the electrodes 41 by thermocompression bonding.

FIG. 12 is a front view during pressing, and FIG. 13 is a side view of the same. The substrate 4 and the electronic component 3 are mounted on the respective rib pieces 21 to 24 of the receiver 2, and the thermocompressor 1 is lowered by means (not shown) so that the respective member pieces 11 to 14 are connected to the leads 3.
The lead 32 is bonded to the electrode 41 by applying a current and causing heat to flow.

[0008]

However, the above-described conventional means has the following problems. That is, since the pressing force is transmitted to each of the member pieces 11 to 14 via the pillars 16 and 17, as shown by the chain line A in FIG.
The lower surfaces of the members 2 and 14 are easily deformed in a downward convex shape, so that the pressing force F1 is large at the center of the member pieces 12 and 14 to which the columns 16 and 17 are connected, and the pressing force F2 is at both ends.
Is small, so that the pressing force becomes non-uniform.

For the same reason, in the case of the member pieces 11 and 13 shown in the side view of FIG. 13, since the pressing force is applied from the pillars 16 and 17 on both sides, the lower surface of the member pieces 11 and 13 is indicated by a chain line B. As shown in FIG.
The pressing force F3 on both sides immediately below 6, 17 increases,
In addition, since the pressing force F4 is small at the center, the pressing force becomes non-uniform. In FIGS. 12 and 13, the curves indicated by chain lines A and B are exaggerated for easy understanding, but the amount of curvature is usually several microns.

If the pressing force becomes non-uniform as described above, it is not possible to press all the leads 32 of the electronic component 3 against the electrodes 41 of the substrate 4 with a uniform pressing force, and the state of thermocompression varies. There was a point. Moreover, in recent years, the size of the electronic component 3 has become larger and the number of leads 32 tends to increase, so that this problem has become more and more prominent.

Accordingly, the present invention provides a thermocompression bonding apparatus for an electronic component capable of eliminating the above-described variation in the pressing force and thermocompression bonding all the leads of the electronic component to the electrodes of the substrate with a uniform force. The purpose is to do.

[0012]

For this purpose, the thermocompression bonding apparatus for an electronic component according to the present invention is characterized in that the lower surface of the member of the thermocompressor or the upper surface of the rib of the receiver is bent in a downwardly concave or upwardly convex shape. It was made.

[0013]

According to the above construction, in a state where each member of the thermocompression bonding member is pressed against the lead of the electronic component placed on the rib of the receiver, the pressing force applied to all the leads becomes equal, All the leads can be bonded by thermocompression with uniform pressing force to the electrodes on the substrate.

[0014]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a front view of a thermocompression bonding apparatus for electronic components. Reference numeral 50 denotes a thermocompression bonding head provided with the thermocompression bonding element 1. Reference numeral 51 denotes a lead wire, which generates heat by supplying power to the thermocompression bonding device 1 in a pulsed manner. The receiving body 2 is provided below the thermocompression bonding head 50.

FIG. 2 shows a thermocompression contact 1, a receiver 2, an electronic component 3,
FIG. 3 is a perspective view of a substrate 4. The thermocompression bonding element 1 and the receiver 2 are the same as the conventional example shown in FIG.

The rib piece 2 of the receiver 2 against which the two member pieces 12, 13 connected to the pillars 16, 17 of the thermocompression bonding element 1 are pressed.
Each of the upper surfaces 22a and 24a of the 2 and 24 is bent in a concave shape. The rib piece 2 of the receiver 2 against which the other two member pieces 11 and 13 to which the pillars 16 and 17 are not connected is pressed.
The upper surfaces 21a and 23a of each of the first and second 23 are curved in an upward convex shape.

FIG. 3 is a front view before pressing, and FIG. 4 is a front view during pressing. As shown in FIG. 3, the rib pieces 21 to 21 of the receiver 2
The substrate 4 and the electronic component 3 are placed on the substrate 24, the thermocompression bonding element 1 is lowered, and the member pieces 11 to 14 are pressed against the leads 32.
The member pieces 12 and 14 are upper surfaces 22 a and 2 of the rib pieces 22 and 24.
The lead 32 is pressed while deforming along the line 4a.
At this time, on both sides of the member pieces 12, 14, the member pieces 12,
Since the force for restoring the original shape of 14 acts on the leads 32 on both sides, the pressing force F2 on both sides becomes equal to the pressing force F1 on the center, and all the leads 32 are evenly pressed. It is pressed against the electrode 41 of the substrate 4.

FIG. 5 is a side view before pressing, and FIG. 6 is a side view during pressing. The member pieces 11 and 13 are rib pieces 21 and
The lead 3 is deformed along the upper surfaces 21a and 23a of the lead 3.
Press 2. At this time, in the central portion of the member pieces 11 and 13, the force for restoring the member pieces 11 and 13 to the original shape acts on the lead 32 in the central portion.
Becomes equal to the pressing force F3 on both sides (the pressing force F3 and the pressing force F2 have the same magnitude). Therefore, all the leads 32 are pressed against and bonded to the electrodes 41 of the substrate 4 with an equal force. FIG. 7 is a perspective view of the substrate 4 to which the electronic component 3 has been bonded as described above.

Next, another embodiment of the present invention will be described with reference to FIGS. 8, 9 and 10. FIG. 8, among the member pieces 11 to 14 of the thermocompression bonding element 1, the lower surfaces 12a and 14 of the member pieces 12 and 14 coupled to the pillars 16 and 17, respectively.
a is curved in an upward concave shape, and the other two member pieces 1
The lower surfaces 11a and 13a of 1, 1 and 13 are curved in a downward convex shape. The upper surfaces of the rib pieces 21 to 24 of the receiver 2 are all flat.

Therefore, as shown in FIGS. 9 and 10, when the thermocompression bonding element 1 is lowered and pressed against the leads 32 of the electronic component 3, the respective member pieces 11 to 14 are pressed due to the pressing force.
Lower surfaces 11a to 14a are upper surfaces 21a of rib pieces 21 to 24.
4a to 4a (see dashed lines in FIG. 4), a uniform pressing force is applied to all the leads 32 in the same manner as shown in FIGS. Can be uniformly bonded to the electrode 41.

According to the present invention, as in the first embodiment, the rib pieces 2
A method of bending the upper surfaces 21a to 24a of the first to 24ths into a concave shape or an upwardly convex shape, and the member pieces 11 to 1 as in the second embodiment.
There is a method of bending the lower surfaces 11a to 14a of the member 4 into an upwardly concave shape or a downwardly convex shape. It is. Therefore, it is practically advantageous to bend the upper surfaces 21a to 24a of the rib pieces 21 to 24 as in the first embodiment.

[0023]

As described above, according to the thermocompression bonding apparatus for an electronic component of the present invention, each member of the thermocompression bonding element is pressed against the lead of the electronic component placed on the rib of the receiver. The pressing force applied to all the leads becomes equal, and all the leads can be bonded to the electrodes of the substrate by thermocompression bonding with a uniform pressing force.

[Brief description of the drawings]

FIG. 1 is a front view of an electronic component thermocompression bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a thermocompression contactor and a receiver according to one embodiment of the present invention.

FIG. 3 is a front view of the thermocompression bonding element and the receiver in one embodiment of the present invention.

FIG. 4 is a front view of the thermocompression bonding element and the receiver during thermocompression bonding in one embodiment of the present invention.

FIG. 5 is a side view of the thermocompression bonding element and the receiver during thermocompression bonding in one embodiment of the present invention.

FIG. 6 is a side view of the thermocompression bonding element and the receiver during thermocompression bonding according to an embodiment of the present invention.

FIG. 7 is a perspective view of a substrate according to an embodiment of the present invention.

FIG. 8 is a perspective view of a thermocompression contactor and a receiver according to another embodiment of the present invention.

FIG. 9 is a front view of the thermocompression bonding element and the receiver during thermocompression bonding in another embodiment of the present invention.

FIG. 10 is a side view of a thermocompression bonding element and a receiver during thermocompression bonding according to another embodiment of the present invention.

FIG. 11 is a perspective view of a conventional thermocompression contactor and a receiver.

FIG. 12 is a front view of a conventional thermocompression bonding element and a receiver during thermocompression bonding.

FIG. 13 is a side view of a conventional thermocompression bonding element and a receiver during thermocompression bonding.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 thermocompression bonding element 2 receiver 3 electronic component 4 substrate 11 member piece 12 member piece 13 member piece 14 member piece 11a lower surface of member piece 12a lower surface of member piece 13a lower surface of member piece 14a lower surface of member piece 21 rib piece 22 rib piece 23 rib piece 24 rib piece 21a upper face of rib piece 22a upper face of rib piece 23a upper face of rib piece 24a upper face of rib piece

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/603 H01L 21/60 311

Claims (2)

(57) [Claims] 1. A quadrangular frame consisting of four member pieces and a column member which is connected to a center portion of two opposing member pieces of the frame body and transmits a pressing force to the frame body. Comprising a thermocompressor, and a receiving member provided below the thermocompressor and having four rib pieces to be pressed by the respective member pieces protruding in a frame shape, and being coupled to the column body. The upper surfaces of the two rib pieces on which the two member pieces are pressed are bent in a downward concave shape, and the upper surfaces of the two rib pieces on which the two member pieces that are not coupled to the column are pressed are turned up. A thermocompression bonding device for electronic parts, characterized by being bent in a convex shape. 2. A quadrangular frame comprising four member pieces and a column member which is connected to a central portion of two opposing member pieces of the frame and transmits a pressing force to the frame. Comprising a thermocompressor, and a receiving member provided below the thermocompressor and having four rib pieces to be pressed by the respective member pieces protruding in a frame shape, and being coupled to the column body. A thermocompression bonding apparatus for an electronic component, wherein the lower surfaces of two member pieces are curved in an upwardly concave shape, and the lower surfaces of the two member pieces that are not coupled to the column are curved in a downward convex shape. .