JPH0761032A - Manufacture of electrostatic recording head - Google Patents

Abstract

PURPOSE:To highly precisely and efficiently cut a control base plate forming a slit-like ion stream leading portion, without producing chippings and the like, by opposingly arranging the control base plate apart at a fixed interval from reference electrodes, thereby providing a method capable of productively manufacturing high-quality electrostatic recording heads. CONSTITUTION:In obtaining a control base plate 2 by cutting and separating an original plate 1 for the control base plate, having a plurality of plates of control electrodes 3 formed on one face of the original plate 1, a cutting step is carried out, wherein the original plate 1 is grooved from the opposite face of the control electrode-forming face thereof up to a predetermined depth by a coarse-grained rotary grindstone 4 along a cutting reference line X. Accordingly, the cutting machining is divided into two stages of the aforementioned cutting step and a step of grooving the original plate from the control electrode- forming face thereof up to the predetermined depth by a fine-grained grindstone 6 along the cutting reference line X while applying an electric field dressing 8 to the outer peripheral face of the grindstone 6. These two cutting steps are carried out at a predetermined processing ratio though not simultaneously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electrostatic recording head, and more particularly to a high quality by cutting a control substrate forming an ion flow lead-out portion in the electrostatic recording head with high accuracy and efficiency. The present invention relates to a method for manufacturing an electrostatic recording head with high productivity.

[0002]

2. Description of the Related Art In an electrostatic recording head disclosed in Japanese Patent Laid-Open No. 62-138250, a discharge wire b connected to a high voltage power source is generally stretched in the longitudinal direction on the opening side of a head body a. In addition, a control board d provided with a control electrode c connected to a control power source driven corresponding to image information.
By arranging the reference electrode e and the reference electrode e at regular intervals,
A structure including a slit-shaped ion derivation portion f formed by the control substrate d and the reference electrode e is adopted. In the figure, g indicates an insulating member. Then, the electrostatic recording head irradiates the electrostatic latent image receptor h arranged in close proximity with the ions having passed through the ion derivation part f according to the image information and charges the receptor. It is designed to form an electrostatic latent image. The electrostatic latent image on the electrostatic latent image receptor h is
In the subsequent step, it is visualized by development.

In such an electrostatic recording head, usually, fine control electrodes of a number corresponding to the resolution are provided on a control substrate material, for example, alkali-free glass whose both surfaces are polished (Corning 7059, etc.). A control board is prepared in advance by forming a plurality of control board master plates, and then the control boards are manufactured by cutting the master boards into individual control board units. Assembly is done by the procedure of attaching to.

Conventionally, in cutting and separating the original plate for a control board, a cutting line is preliminarily attached to the cut portion of the original plate surface by a cutter or the like, and then a load is applied from both sides of the cutting line to cut the cutting line. A cutting method for cutting (Japanese Patent Laid-Open No. 63-297237, Japanese Patent Laid-Open No. 2-80337, etc.) and a cutting method for grinding and cutting a disc-shaped grinding wheel at high speed are mainly adopted.

[0005]

However, in the case of the above-mentioned cutting method by cutting, the linearity (straightness) of the cut portion is poor, and the cut surface is slanted, resulting in poor dimensional accuracy. In the case of the cutting method by grinding cutting, the linearity of the cut edge portion was poor because a shell-shaped defect called chipping is likely to occur at the edge portion of the cut portion (dotted line i indicates chipping in the figure). Therefore, when an electrostatic recording head is manufactured using such a control substrate having a poor linearity of the cut portion, the slit width s of the ion derivation portion f formed by the opposing arrangement of the control substrate d and the reference electrode e.
Is not uniform, which causes the ions emitted from the ion derivation part f to be non-uniform in the slit direction, resulting in variations in the potential of the electrostatic latent image, which in turn causes uneven density in the developed image. is there. Such a problem causes a deterioration in quality and is fatal to a high-quality head or a high-resolution head which requires uniform ion ejection. Therefore, improvement thereof is strongly desired.

As a means for solving the above-mentioned problems, the present applicant first coated the film on both sides of the glass plate after the score line was formed, and then projected from both sides of the film along the cut line. When a film is pressed against the glass, the film is crushed by the pressing of the projection and the phenomenon that the film is about to be expanded to both sides around the tip of the projection is applied to the glass surface as a tensile force, and the glass is cut using this tensile force. We propose a cutting method of doing. However, although this cutting method is improved to some extent, it cannot cut a straightness of 100 μm or less, and it is difficult to apply it as a means for manufacturing a high image quality or high resolution head.

Further, in the case of utilizing a cutting method by grinding cutting, if a grindstone made of extremely fine abrasive grains is used, the amount of the abrasive grains cut into the surface of the material to be ground is reduced, and hard and brittle glass such as glass is used. It is known that even materials can be cut with very little chipping. However, when such a grindstone of fine abrasive grains is used, clogging is apt to occur, and grinding has to be interrupted, resulting in poor efficiency.

Therefore, a method has been proposed in which electrolytic grinding (grinding) is applied to the grindstone surface to perform grinding cutting while preventing clogging (Japanese Patent Laid-Open No. 3-196968). The following problems occur when performing grinding cutting using a grindstone of fine abrasive grains. That is, although clogging is prevented and continuous grinding is possible, a great amount of processing time is required because grinding is performed with an extremely small amount of cut, and the processing cost is also increased. Further, in order to supply the electrolytic solution for electrolytic dressing, when cutting and separating the control substrate original plate on which the control electrode formed with the thin film transistor circuit made of amorphous silicon or polycrystalline silicon or the like is formed on the control substrate, When the original plate is exposed to the electrolytic processing liquid containing alkali ions, it slightly penetrates into the circuit from the protective film of the circuit such as polyimide resin, which causes great damage to the circuit, which causes the yield to deteriorate.

In this case, although a countermeasure to increase the cutting efficiency by reducing the thickness of the glass plate or the like of the control substrate can be considered, it cannot be adopted for the following reasons. That is, since the thin film transistor circuit and the control electrode are formed by a photolithography process, the substrate is required to have extremely high smoothness, and a certain level or more is required to secure rigidity that can be endured during polishing processing for obtaining the high smoothness. This is because the thickness is required. In addition, if the substrate is too thin, it is difficult to handle when it is fixed on a photograph and is difficult to handle, and the yield is deteriorated.

The present invention has been made to solve the above-mentioned problems, and a control substrate forming a slit-shaped ion flow lead-out portion is cut with high precision and efficiency without chipping or the like. An object is to provide a method capable of manufacturing a high-quality electrostatic recording head with high productivity.

[0011]

According to the method of manufacturing an electrostatic recording head of the present invention, the control electrode is disposed on one side of the ion flow derivation portion for deducing the ion flow generated by the ion generation means. In a method of manufacturing an electrostatic recording head in which a control substrate and a reference electrode are opposed to each other at a constant interval to form a slit shape, a plurality of control electrodes are formed on one side of the control substrate. When cutting and separating from the control substrate original plate, a cutting step of grooving to a predetermined depth by a rotating grindstone of coarse abrasive grains along a cutting reference line from the surface opposite to the control electrode forming surface of the original plate, and The cutting step of grooving to a predetermined depth while performing electric field dressing on the outer peripheral surface of the grindstone from the control electrode forming surface of the original plate along the cutting reference line with a rotating grindstone of fine abrasive grains It is characterized in that performed the cross-sectional process is back and forth in a predetermined distribution ratio.

In the above technical means, in the two cutting steps, one step may be performed first to a certain depth and the other step may be performed later by the remaining depth. The procedure is as follows. It can be appropriately selected.

At this time, the grinding amount (distribution ratio) in each process can be set as appropriate, but, for example, the groove processing by the rotary grindstone of the fine abrasive grains is made to be at least about 10% of the thickness of the workpiece. Efficient cutting becomes possible if the ratio is set.

Further, the groove processing by the rotating grindstone of fine abrasive grains is set so as to obtain a cut portion having a straightness of 10 μm or less. A known method can be applied as the electrolytic dressing for the rotating grindstone of fine abrasive grains.

[0015]

The above technical means operates as follows. First, a high-speed grooving process is performed by a grooving process from the control electrode forming surface of the control substrate original plate using a rotating grindstone of coarse abrasive grains. At this time, on the surface opposite to the control electrode forming surface of the control substrate original plate, large chipping occurs at the edge portion of the ground groove, but the edge portion of the groove does not contribute to the formation of the slit of the ion derivation portion. Therefore, it does not affect the uniformity of ion ejection.

On the other hand, a grooving process from the surface opposite to the control electrode forming surface of the control substrate original plate by the rotating grindstone of fine abrasive grains allows highly accurate grooving processing with almost no chipping. Further, this groove processing can be continuously performed without clogging because it is performed while performing electrolytic dressing. This grooving only needs to be performed for a relatively short time, so that even when grinding the control substrate original plate on which the control electrode having the thin film transistor circuit is formed, the circuit is not exposed to the electrolytic processing liquid for a short time. Therefore, the circuit damage due to the electrolytic processing liquid can be minimized.

Then, the control board is cut and separated from the control board original plate by carrying out these two groove processings back and forth at a predetermined ratio. As a result, it is possible to efficiently obtain a control substrate that is excellent in straightness with almost no chipping on the control electrode formation surface. By using this control substrate to create an electrostatic recording head, a high-quality static substrate with a uniform slit width can be obtained. The electrographic head can be manufactured with good productivity.

When grooving with a rotating grindstone of fine abrasive grains after grooving with a rotating grindstone of coarse abrasive grains,
Groove processing by a rotating grindstone of fine abrasive grains from the opposite direction, that is, the surface opposite to the control electrode formation surface of the control substrate original plate (that is,
When it is performed from the inner side of the groove formed by the previous processing), chipping of about 10 times the size is generated at the edge portion on the control electrode formation surface side compared with the case where the groove processing is performed from the normal direction, which is preferable. Absent.

[0019]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows each step of cutting and separating a control board original plate according to an embodiment of the present invention. 1 in the figure
Represents a control electrode substrate original plate, and the original plate 1 is composed of a control substrate (material) 2 and a control electrode 3. Reference numeral 4 denotes a rotary grindstone of coarse abrasive grains attached to the rotary shaft 5, and 4a
Is a rotary support of the grindstone 4. Reference numeral 6 denotes a rotary grindstone of fine abrasive grains attached to the rotary shaft 7, and 6a denotes a rotary support of the grindstone 6. Reference numeral 8 denotes an electrolytic dressing device installed on the rotary grindstone 6, and the main part of this device 8 is constituted by a dressing electrode 9 and an electrolytic power source 10 which are arranged close to the outer peripheral surface of the grindstone 6.

In this embodiment, the rough abrasive grains are first rotated with respect to the control electrode substrate original plate 1 in which a plurality of control electrodes 3 are formed on a borosilicate glass substrate 2 having a thickness of 1.1 mm. A case where the control substrate is separated by performing a cutting operation in the order of the steps of performing the groove processing by the grindstone 4 and then the groove processing by the rotary grindstone 6 of the fine abrasive grains will be described.

First, as the rotary grindstone 4, mesh size #
Using a disk-shaped blade grindstone having a thickness of 0.8 mm and made of 270 diamond abrasive grains, as shown in FIG. 1A, this grindstone was rotated by a rotating shaft 5 at a rotation speed of 12000 rpm, and a cutting depth (r ₁ ) 0.7 mm, feed rate 10
The control electrode 3 of the original plate 1 under the grinding condition of 0 mm / min.
Grooving was performed along the cutting reference line X from the surface opposite to the surface on which was formed.

As a result, a grinding groove 11 having a depth of 0.7 mm is formed on the original plate 1 leaving a plate thickness of 0.4 mm. At this time, the edge of the grinding groove 11 has 200 to 300
Chipping with a size of about μm occurred.

Next, the mesh size of the rotary grindstone 6 is #
A disc-shaped blade grindstone having a thickness of 0.5 mm and made of 4000 diamond abrasive grains and bronze bond was used. As shown in FIG.
Grooving was performed along the cutting reference line X from the surface of the original plate 1 on which the control electrodes 3 were formed under the condition of rotating at 0 rpm and a feed rate of 30 mm / min. Further, with respect to the rotating grindstone 6 being processed, dressing of the outer peripheral surface of the grindstone 6 was performed while the electrolytic processing liquid 12 was supplied by the electrolytic dressing device 8. The cutting depth at this time may be at least larger than the remaining plate thickness (r ₂ ) 0.4 mm,
Here, it is 0.8 mm.

As a result, the remaining plate thickness portion of the original plate 1 is ground and cut by the grinding groove 13, and as a result, as shown in FIG.
Control board 2 cut and separated from each other as shown in FIG.
a and 2b were obtained. Further, since the groove processing by the rotary grindstone 6 only needs to process a thin portion corresponding to the remaining plate thickness (r ₂ ), the entire thickness of the glass substrate 3 is 1.1 mm.
It was possible to carry out at a feed rate about 3 times faster than that in the case of cutting under the same conditions. Moreover, the edge portion 13a of the grinding groove 13 had almost no chipping, and the straightness of the edge portion 13a was excellent, ie, about 3 μm.

In this embodiment, the thickness (width) of the rotary grindstone 4 is not limited to 0.8 mm and can be set arbitrarily, but is preferably 0.1 to 1.0 mm.
The thickness (width) of one of the whetstones 6 can also be set arbitrarily, but it is necessary that at least the thickness of the whetstone 4 be the same or thinner, and preferably it is thinner than the thickness of the whetstone 4. When the thickness of the rotary grindstone 6 is thicker than the thickness of the grindstone 4, the processed portion of the grindstone 4 in the cut and separated control substrate is projected from the processed portion of the grindstone 6,
At the stage of use as an electrostatic recording head, the processing tip of the grindstone 4 may contact the surface of the electrostatic latent image receptor, which is not preferable.

Using the control board (for example, 2a) obtained as described above, as shown in FIG.
The slit-shaped ion derivation portion 24 is formed by installing the control substrate 2a and the reference electrode 23 so as to face each other with respect to the head main body 22 stretched inside the opening.
This produced the electrostatic recording head 20. In the figure, 25 indicates an insulating member. The above discharge wire 21 is used for a high voltage power source,
The control electrodes 3 are each connected to a control power source driven by a recording information signal. Further, compressed air is fed into the opening of the head main body 22 from an inlet (not shown).

The electrostatic recording head 20 is installed on the electrostatic latent image receptor 30 with a predetermined space. The compressed air into which the ions generated in the discharge wire 21 are introduced forms an ion flow, and the passage of the ions is controlled by the electric field formed between the control electrode 3 and the reference electrode 23 in the ion derivation unit 24 according to the image information. By irradiating the electrostatic latent image receptor 30 with the ions that have passed therethrough, an electrostatic latent image is formed on the receptor 30.

At this time, since the tip portion of the control substrate 2a forming the ion derivation portion 24 is ground by the rotary grindstone 6 of fine abrasive grains and has almost no chipping, the edge portion 13a excellent in straightness is positioned. Thus, the ion derivation portion 24 having a uniform slit width is formed. As a result, according to the electrostatic recording head 20, the ion ejection is also extremely uniform, so that the electrostatic latent image potential is constant and a high-quality image having no variation in image density can be obtained.

In the above embodiment, an example of the case where the groove processing of the coarse abrasive grains by the rotary grindstone 4 was carried out was shown previously, but in the present invention, as shown in FIG. 2, electrolytic dressing is first performed. However, grooving with the rotary grindstone 6 for fine abrasive grains is performed at the cutting depth (r ₃ ) (a in the figure), and then grooving with the rotary grindstone 4 for coarse abrasive grains is performed for the remaining plate thickness (b) in the same figure. It is also possible to cut and separate the control board in this order of steps (FIG. 7C).

In the case where the grooving of the coarse abrasive grains by the rotary grindstone 4 is performed in the subsequent stage, the coarse abrasive grain rotary grindstone 4 having a wedge-shaped cross-sectional shape as shown in FIG. 2 is used. In addition, it is desirable to use a grindstone whose tip has a bilaterally symmetrical cross-sectional shape.

[0031]

As described above, according to the present invention,
Since the control substrate forming the slit-shaped ion flow derivation portion is obtained by cutting and separating from the control substrate original plate on which a plurality of control electrodes are formed by the two-step cutting process,
It is possible to obtain the control substrate by cutting and separating it with high precision and efficiency without chipping or the like at least at the edge portion involved in the slit formation. Especially, the production efficiency as a whole is dramatically improved. As a result, a high-quality electrostatic recording head in which the slit width of the ion flow outlet is uniform can be manufactured with high productivity.

Further, even when a control substrate having a control electrode including a thin film transistor circuit is obtained, the circuit portion and the like are exposed to a grinding liquid containing alkali ions for a short time, which causes damage to the thin film transistor circuit. It is possible to prevent a decrease in yield.

Further, according to the present invention, since the cutting portion can be formed in two positions on the left and right of the control substrate original plate by grinding cutting with fine abrasive grains, the control electrode and the like are sandwiched between the cutting reference lines. By forming symmetrically on the left and right sides, two control boards can be obtained by one cutting operation, and the productivity is further improved. The control electrodes may be formed so as to be bilaterally symmetrical so as to stride over the cutting reference line, or may be formed bilaterally symmetrically from a position separated from each other by a predetermined distance from the cutting reference line.

[Brief description of drawings]

FIG. 1 is a process chart showing a manufacturing method according to an embodiment of the present invention.

FIG. 2 is a process drawing showing a manufacturing method according to another embodiment of the present invention.

FIG. 3 is a schematic sectional view showing an electrostatic recording head obtained by the present invention.

FIG. 4 is a schematic cross-sectional view showing a conventional electrostatic recording head.

[Explanation of symbols]

1 ... Control board original plate, 2 ... Control board, 3 ... Control electrode, 4
… Rotating stones with coarse grains, 6… Rotating fine grains, 8…
Electrolytic dressing device, 20 ... Electrostatic recording head, 24 ...
Ion derivation part, X ... Cutting reference line.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B24B 53/00 D 9422-3C B41J 2/395 G03G 15/05 G03G 15/00 115

Claims (1)

[Claims] 1. An ion flow derivation unit for deriving an ion flow generated by an ion generating means is arranged such that a control substrate having a control electrode on one side and a reference electrode are opposed to each other with a constant gap. In the method of manufacturing an electrostatic recording head formed in a slit shape by the above, in obtaining the control board by cutting and separating from the control board original plate in which a plurality of control electrodes are formed on one surface thereof,
A cutting process of grooving from the surface opposite to the control electrode formation surface of the original plate along the cutting reference line to a predetermined depth with a rotating grindstone of coarse abrasive grains, and along the cutting reference line from the control electrode forming surface of the original plate It is divided into two steps, a cutting step of making a groove to a predetermined depth while performing electric field dressing on the outer peripheral surface of the grinding wheel with a fine grinding grain rotating wheel, and these two cutting steps are performed in a predetermined distribution ratio before and after. A method of manufacturing an electrostatic recording head, comprising: