JPH0755384B2 - Clad metal plate manufacturing method and apparatus - Google Patents

Description

The present invention relates to a method for producing a clad metal plate and an apparatus therefor,
More specifically, a clad metal plate having a high adhesion is produced by cold-rolling and bonding a polymerized metal plate (including a strip-shaped metal plate. The same applies below) at a low rolling rate without heating. Manufacturing method and apparatus therefor.

[Conventional technology]

What is used as a method for producing a clad metal sheet is (1) a hot rolling method in which dissimilar metal sheets are stacked,
(2) Cold rolling method, or (3) Explosive pressure welding method, and (4) A combination of the above (1), (2), and (3) performed by interposing a metal other than two dissimilar metals to be joined. Method,
(5) Brazing method, (6) Welding method, and (7) So-called sandwich method using an organic material such as plastics as an intermediate layer.

Among these, the means for continuously joining two or more kinds of metal plates is the above-mentioned (1), (2), (4) (however, except for the explosion pressure welding method and the plastics sandwich method).

In the hot rolling method of the above (1), for example, when steel is used as a substrate, it is necessary to heat it to 800 ° C. or higher, and therefore, a metal having a lower melting point cannot be used as a counterpart material, and the rolling temperature Because of the high temperature, a thick alloy layer is often formed at the joint interface, which tends to impair the workability of the metal plate of the product clad. Also, because of the oxide film at the interface, poor joints are likely to occur, and the appearance is similar to that of the oxide film. There was a problem that it lacked beauty.

In the cold rolling method of (2), in order to give a strong joining force between dissimilar metals, a high rolling rate of 50% or more per rolling is required, and further the workability of the product clad metal plate is secured. Therefore, strain relief annealing is indispensable after rolling, but when strain relief annealing is performed, an alloy layer is often formed between both metals, which causes a trade-off that workability is impaired.

In order to solve these problems, a low rolling reduction cold rolling method is considered, and in order to strengthen the weak joining force which is a defect, the surface of the metal to be joined is cleaned before rolling.

For example, as disclosed in JP-A-59-92186, the oxygen mole of the atmosphere (weakly oxidizing or non-oxidizing atmosphere) at the time of performing blasting such as shot blasting and wire brushing on the surface of a metal plate and rolling. There is a method of limiting the product of the fraction and the time from blasting to rolling within a certain numerical value.

However, this method cannot prevent the phenomenon that gas molecules or atoms other than oxygen, such as hydrocarbons, are adsorbed on the cleaned and cleaned metal surface.

In addition, as disclosed in JP-A-61-286078, there is a method of activating the surface by ion milling before cold rolling bonding.

However, the beam diameter of the ion milling method is currently as narrow as 20 cm at maximum.

The etching rate is slow.

Since the oxide film on the metal surface is usually an insulating substance, it has a drawback that it is charged by ion irradiation and etching efficiency decreases.

The rolling rate required for pressure welding is as high as 50%, diffusion heat treatment is required, and light strain pressure welding at room temperature is difficult.

Ion beam guns are expensive.

For these reasons, it is not always suitable for the simple process of joining wide materials aimed at by the present invention at a relatively high speed.

Although not a method for manufacturing a clad metal plate, there is a room temperature low pressure welding method in which a surface cleaning treatment is performed by ion beam milling and then room temperature welding is performed in an ultrahigh vacuum (Japanese Patent Laid-Open No. 54-124853). Bulletin, The Japan Institute of Metals, Vol. 46, No. 9
No. 935-943, Welding Technology July 1987 88-91). But,
This method is not industrial since it is essential to press-contact in an ultrahigh vacuum (usually 1 × 10 ^-8 Torr. Or less) in order to avoid contamination of the clean surface.

[Problems to be Solved by the Invention]

It is an object of the present invention to provide a method and an apparatus for continuously producing a clad metal plate within a technically practically applicable range, that is, at a low bonding rolling rate at room temperature.

Further, the present invention does not generate an alloy layer at the bonding interface, does not have bonding defects due to gas entrapment in the bonding surface, or due to metal oxide, has a strong bonding strength, and has excellent workability. It is intended to provide a manufacturing method.

Further, according to the present invention, it is possible to join at a low rolling rate at room temperature, so that a combination of materials which has been difficult to join in the past, for example, a very hard material, cannot obtain the cold rolling rate necessary for joining in the conventional method. Or, the strain generated by cold rolling cannot be removed by heat treatment because the metal melting point of the mating material is low.
An object of the present invention is to provide a method and an apparatus for producing a clad metal plate in which the above metals are combined. The combination of these metals indicates, for example, Pb-Fe, amorphous Fe-polycrystalline Fe, or the like.

[Means for Solving the Problems]

According to the present invention, in a method for producing a clad metal plate, the joint surface of a dissimilar metal plate is preliminarily activated in a vacuum chamber, and then the dissimilar metal plate is polymerized to perform cold rolling bonding. In an extremely low-pressure inert gas atmosphere of 1 × 10 ^-1 to 1 × 10 ^-4 Torr., A metal plate having a joint surface is used as one electrode A grounded to the other electrode B that is insulated and supported. Between 1 to 50MHz
Is applied to cause glow discharge, and the area of the electrode A exposed in the plasma generated by the glow discharge is 1/3 or less of the area of the electrode B, and the sputter etching process is performed. And a hollow roll-shaped metal plate supporting electrode pivotally mounted inside at least two openings of a vacuum chamber equipped with a rolling mill, and electrically insulated through the openings. And a metal plate surface for trimming the exposed area in the etching chamber of the metal plate mounted on the hollow roll-shaped metal plate supporting electrode. There is provided a clad metal plate manufacturing apparatus characterized by comprising a skirt portion which is not in contact with and is electrically connected to the etching chamber.

〔Example〕

Hereinafter, the present invention will be described in detail based on examples and drawings.

FIG. 1 is a partially sectional front view showing an embodiment of a clad metal plate manufacturing apparatus according to the present invention.

In FIG. 1, the clad materials 20A and 20B unwound from the rewind reels 3A and 3B are partially etched.
The electrode rolls 6A and 6B protruding into the inside 2 are respectively wound and sputter-etched in the etching chamber 22 to be activated.

After that, it is cold-rolled by a rolling unit 2 provided in the vacuum tank 1, and the clad metal plate 19 is wound on a winding roll 5.

It is desirable that both the rewinding reels 3A and 3B and the take-up reel 5 are installed inside the vacuum chamber 1, but when handling a large-diameter coil, they can be installed outside the vacuum chamber 1 in terms of equipment cost. . In this case, it is necessary to make the seal between the metal plate and the vacuum chamber 1 tight.

The rolling unit 2 is provided with a rolling down device 18 for rolling down.

The vacuum chamber 1 is 10 ^-3 to 10 ^-6 Tor with a large exhaust pump 9.
r. The degree of vacuum is maintained.

In the present embodiment, in order to maintain the airtightness of the vacuum chamber, the hydraulic cylinder of the pressure reducing device 18 is housed in a flexible container constituted by an airtight bellows and pierced, and the hydraulic power source and control unit outside the vacuum chamber 1 are controlled. Although the example in which the rolling reduction is controlled through the hydraulic piping from 79 is shown, the rolling mechanism may be a screw rolling type that is usually used in rolling mills, and the screw rotating shaft may be vacuum-sealed. In this case, the degree of vacuum tends to be slightly lowered, and a countermeasure is required.

FIG. 2 is a partial cross-sectional plan view showing a clad metal plate manufacturing apparatus.

The rotating shafts 4A and 4B of the rewinding reels 3A and 3B penetrate the vacuum seals 12A and 12B on the driving side wall of the vacuum chamber 1 and are connected to the external back tension generating brakes 11A and 11B.

On the other hand, the take-up reel 5 has its rotary shaft 13 similarly to the vacuum chamber 1.
It is driven by an external winding reel driving motor 15A which penetrates the vacuum seal 12C on the driving side wall. Further, the roll drive shaft 14 of the rolling mill vacuum seals the drive side wall of the vacuum tank 1.
Variable speed motor with reduction gear 15B that penetrates through 12D
Driven by.

The support shaft extensions 16A, 16B of the metal plate support electrodes 6A, 6B have through holes for cold water inside, and penetrate the vacuum seals 12E, 12F on the driving side wall of the vacuum chamber 1 to pass through the rotary joints 17A, 17B for cooling.
It is connected to the.

Here, illustration of guide rolls and auxiliary devices necessary for stabilizing the tracking of the plate is omitted.

FIG. 3 is an enlarged partial sectional front view of the etching chamber 22 shown in FIG. In FIG. 3, the counter electrode 26 is conductively attached to the etching chamber 22, and the vacuum chamber 1
Are insulated from each other via an insulating airtight packing 23. Further, of the surface areas of the metal plate supporting electrodes 6A and 6B, the area of the etching region exposed in the etching chamber 22 (electrode A) is the same as the surface area of the counter electrode 26 and the etching chamber 22.
1/3 or less of the sum of the inner surface area of (electrode B).

The reason for this is that in the case of high frequency plasma etching, the bias voltage is generated depending on the area ratio of the discharge electrodes, and therefore the area of the material to be clad needs to be smaller than the area of the facing anode (counter electrode 26). This is because it is necessary to further reduce the amount to 1/3 or less of the anode in order to perform etching efficiently. The smaller the area ratio is, the better the efficiency is. However, if the area ratio is about 1/3, etching can be performed with sufficient efficiency.

It is preferably about 1/10 or less.

The metal plate supporting electrodes 6A and 6B are grounded. The reason for this is as follows.

That is, in the conventional ion etching apparatus, as shown in FIG.
The material to be etched is placed on the electrically insulated small-area cathode 60, and a voltage is applied.

When applying such a conventional apparatus to the etching of the strip-shaped metal plate, it is necessary to continuously handle the strip-shaped metal plate having a large area while applying a high voltage,
In this case, it is necessary to support all parts in the vacuum tank such as rolling mills, reels, guides, etc. that come into contact with the plate with an insulator having a withstand voltage of several thousand volts. However, this makes it difficult to apply it to an industrial production line.

Therefore, in the present invention, conversely, ion etching is performed with the metal plate side grounded.

Further, the insides of the metal plate supporting electrodes 6A and 6B are water-cooled, and the magnetron magnet 7 is attached inside thereof.

The metal plate supporting electrodes 6A and 6B are rotatable, but the magnet 7 is fixed in a fixed orientation shown in the drawing.
The orientation of 0,51 is unchanged.

The etching is performed over the entire plate width, mainly in the portions 52 and 53 surrounded by the magnetic field lines. Therefore, by moving the clad materials 20A, 20B at a constant speed, the etching is uniformly performed over the entire surface of the plate.

Further, the back surface of the etching chamber 22 is attached to a vacuum pump 25 which is grounded via an insulating hermetic packing 24.

A lead wire is formed on the counter electrode 26 in the etching chamber 22.
A high frequency is supplied from the matching box 28 via 27.

An Ar gas introduction hole 29 is opened in the etching chamber 22,
Ar gas is introduced from the insulating tube 30.

In the gap between the etching chamber 22 and the metal plate supporting electrodes 6A, 6B, a skirt portion 31 for specifying an etching region is attached at a distance of 1 to 4 mm from the surface of the metal plate supporting electrodes 6A, 6B.

FIG. 11 is a view taken along the line III-III ′ of FIG. In FIG. 11, reference numeral 8 denotes an opening (inner frame) of which an skirt portion 31 is exposed inside so as to have a frame shape, and a metal strip etching chamber mounted on a hollow brazing metal strip support electrode. The exposed side is trimmed. If the metal strip is a flat metal plate, trim it like a dry plate of a camera.

Further, the skirt portion 31 includes the vacuum chamber 1 and the etching chamber 22.
It also serves as a seal to maintain the pressure difference between and.
The skirt portion 31 is formed so as to be concentric with the metal plate supporting electrodes 6A and 6B, and reduces the conductance of the gas flow between the etching chamber 22 and the vacuum chamber 1 to reduce the conductance of the etching chamber 22. Of Ar gas molecules and stripped metal particles are prevented from flowing into the vacuum chamber 1.
The flow of gas molecules in the slit-shaped gap between the skirt portion 31 and the clad materials 20A, 20B is almost a molecular flow region, so a simple thin plate can sufficiently secure the pressure difference, but if the main exhaust If the pressure in the vacuum chamber 1 does not drop sufficiently due to insufficient pump capacity, a sliding material such as Teflon is attached to the inside of the skirt portion 31, and the clad material 20
This problem can be solved by bringing the surfaces of A and 20B into contact and sliding. Further, plasma due to glow discharge is also generated at the connection portion 33 on the side of the vacuum exhaust port 32 and the vacuum pump 25, but here, metal nets 34, 35 with large exhaust conductance are attached to the etching chamber 22 and the vacuum pump 25 side, respectively. By setting the clearance to 1 to 4 mm, it is possible to prevent the occurrence of glow discharge at the connection portion 33, and it is possible to minimize the deterioration of the exhaust performance of the vacuum pump.

A shield cover 36 is provided on the entire outer circumference of the etching chamber 22 to prevent radio wave interference and electric shock.

In the present invention, the reason why the magnetron sputtering method is adopted as the method for activating the clad materials 20A, 20B is as follows.

The oxide thickness on the metal surface is about 2000 Å at most for Ti and Al, which are generally considered to be relatively thick, and 100 Å or less for Cu, Ti, and amorphous metal. The basic method for dry removal of these oxides is the bipolar sputter etching method, which can etch a large area at a time with a high efficiency and a relatively simple structure. You can increase efficiency.

If the frequency at this time is less than 1 MHz, it is difficult to maintain stable glow discharge, and it is not suitable for continuous etching.
Further, if the frequency is higher than 50 MHz, oscillation is likely to occur and the power supply system becomes complicated, which is not preferable. Therefore, the frequency band used in the present invention is set to 1 to 50 MHz.

To start etching, the exhaust pump 25 temporarily holds the etching chamber 22 at a pressure of 1 × 10 ⁻⁴ Torr. Or less, and then Ar gas is introduced through the introduction hole 29 to supply Ar gas of 10 ⁻¹ to 10 ⁻⁴ Torr. If an atmosphere is provided and a high frequency is applied to the vacuum chamber 1, plasma is generated in the chamber and the clad material 20A, 20
The surface of B is etched. Ar gas pressure is 1 × 10 ^-4 T
If it is less than orr, it is difficult to stabilize the glow discharge, and at the same time, a high ion flow cannot be obtained,
It is difficult to perform etching at high speed.

When the Ar gas pressure exceeds 1 × 10 ^-1 Torr., The mean free path of sputtered atoms becomes small, and due to the high frequency of implantation into the target again, the oxygen released by etching strikes the target again. The efficiency of the surface activation treatment is reduced due to the inclusion. Therefore, the Ar pressure in the etching chamber 22 is set in the range of 10 ^-1 to 10 ^-4 Torr.

FIG. 4 shows the time required for removing the oxide film in the etching chamber 22. That is, when etching is performed at an etching rate of 1000Å / min for about 1 minute, about 80% of oxygen (O) does not remain on the aluminum plate, and when etching is performed at 2000Å / min for 1 minute, almost no residual oxygen is left.

In the magnetron sputtering method of the present invention, an etching rate of 1000 Å / min or more can be obtained, and the time required for completely removing a thick oxide film of aluminum, titanium or the like can be several minutes. copper,
For steel, stainless steel, and amorphous metal, a nearly clean surface can be obtained by etching for several seconds.

In the present invention, by changing the etching time, it is possible to manufacture a clad metal plate having a bonding strength according to the purpose of use.

FIG. 6 shows the relationship between the etching amount and the bonding strength. That is, the result shows that mild steel completely cleaned by etching with a thickness of 400 liters and an aluminum plate with a different etching amount were pressed at a rolling rate of 5% in a vacuum chamber of 1 × 10 ^-5 Torr. As the etching amount increases, the bonding strength increases, and in the etching state of 3000 Å where oxygen on the surface is completely removed, the peel strength leading to the fracture of the base material aluminum can be obtained.

Next, FIG. 7 shows the relationship between the degree of vacuum and the bonding strength.
In other words, 0.5mm aluminum plate is about 2000Å, 0.21mm iron plate is about 100
Å Shows the joining strength when the material is etched and left in 1 × 10 ^{−4 to} 5 × 10 ⁻³ Torr. For example,
In order to obtain a clad metal plate having a bonding strength of 40 kgf / 10 mm, it is necessary to maintain the degree of vacuum in the vacuum chamber 1 at 1 × 10 ^-4 Torr. And perform bonding within 25 minutes.

Similarly, in order to obtain a bonding strength of 30 kgf / 10 mm, it is necessary to carry out the bonding within 45 minutes. A decrease in the degree of vacuum in the vacuum chamber 1 naturally leads to a decrease in the bonding strength, but when industrial economical efficiency is taken into consideration, the lower limit is 1 × 10 ^-6 Torr. The upper limit is 1 × 10 ^-3 Tor
Up to r., sufficiently high bonding strength can be obtained. If the degree of vacuum is higher than this, contamination of the bonding surface proceeds and the bonding strength decreases.
When the residual gas is an inert gas such as argon, the bonding surface is less likely to be contaminated, and therefore the bonding strength is less likely to decrease. In addition,
The rolling rate was 1.5%.

In the present invention, by changing the etching amount shown in FIG. 6, the degree of vacuum and the standing time shown in FIG.

In the present invention, since it is not necessary to heat the plate at the time of bonding,
The plate temperature T at the time of rolling biting may be room temperature, and the upper limit may be an alloy layer that reduces the bonding strength and a range where carbide formation does not occur, but the deformation after cooling due to the difference in the thermal expansion coefficient of dissimilar metals is small. In order to achieve this, the temperature is preferably 300 ° C or lower. The rolling rate of the two plates must also be within the range of 0.1% to 30%.

That is, T ₁ ... plate thickness of clad material 1 before rolling T ₂ ... plate thickness of clad material 2 before rolling T _m ... total thickness of two clad sheets after clad R ... rolling rate (%) = (T ₁ + T ₂ -T _m) if × 100 / a (T ₁ + T ₂₎ becomes 0.1 ≦ R ≦ 30 rolled within the R.

Here, the minimum rolling ratio is determined by the following factors. That is, although the surface of the plate seems to be flat at first glance, the contact area is very small in a non-pressurized state because of microscopic unevenness, and the bonding is not performed even if the surface is sufficiently activated.

In the conventional cold rolling pressure welding method, since the oxide film on the surface is plastically fluidized by a high rolling rate to partially generate the activation surface and the bonding is performed by expanding the contact area,
The surface roughness of the plate was not necessarily flat. That is, a plate that has been slightly roughened in advance has been flattened and joined at a high rolling rate.

On the other hand, the method for cleaning a plate according to the present invention does not newly generate irregularities on the surface of the plate and can press-contact while maintaining the flatness of the finish rolling state, so that the contact area is large even with a small pressing force. Moreover, it is considered that the contact portion can be bonded with a small rolling rate because the metal bonding is surely performed.

On the other hand, the upper limit of the rolling ratio is set to 30% because rolling joining and finish rolling or temper rolling may be performed in one rolling process. On the other hand, if it exceeds 30%, work hardening becomes remarkable, which is not preferable.

The numerical value of the rolling rate was determined based on the following experiment.

The results are shown in FIG. That is, FIG. 8 shows the relationship between the rolling ratio and the peel strength.

Depth of about 2000Å Aluminum plate with etching thickness of 0.1 mm,
About 400Å The etched iron plate with a thickness of 0.23 mm was joined by changing the rolling rate and the T peel strength was measured.
A bonding strength of 0.1% is generated, and a bonding strength of about 3% leading to the breaking of the base material of the aluminum plate is obtained. The surface roughness of the material plate is 0.05 μmRa for aluminum and 0.15 μmRa for iron, respectively.
Further, when the surface roughness is small, the lower limit of rolling rate can be lowered.

Instead of using a roll for pressing the plate, a pressing mechanism such as a press using a flat plate on one side or both sides may be used instead.

Table 1 shows the results of rolling bonding performed on the basis of the examples of the present invention and comparative examples. Examples 1 to 15 are examples in which a clad metal plate is manufactured by satisfying all the manufacturing conditions of the present invention, and Comparative Examples 1 to 6 are examples in which a part of the manufacturing conditions is different from that of the present invention. In addition, the leaving time from etching to rolling and joining was unified to 1.5 minutes.

The T-peel peel test was adopted as the method for evaluating the bonding strength of the clad metal plate. As shown in FIG. 5, the T-peel peeling test is performed by cutting a clad metal plate into a width of 10 mm and pulling each plate material on which the clad metal plate is formed in the vertical direction at a constant speed. The load is the peel strength.

The peel strength of the clad metal plate according to the present invention is higher than that of the comparative example, and it is possible to provide a clad metal plate having excellent bonding strength.

The inequality sign “<” shown in the peel strength column of the first vote indicates that one of the plate materials was cut at the peel strength or higher.

Furthermore, as a qualitative evaluation, a 5 mm Erichsen overhanging test and a 180-degree bending test were performed.

In each of the clad metal plates of Examples 1 to 15, no separation between the clad metal plates was observed (marked with ⊚ in the evaluation column of the clad metal plate in Table 1).

However, the clad metal plates of Comparative Examples 1 to 6 have the entire surface between both metal plates (shown in the evaluation column of clad metal plate in Table 1).
Mark) or peeling was partially observed (marked with Δ in the evaluation column of the clad metal plate in Table 1), and good joining results were not obtained.

Next, FIGS. 9 and 10 show the results of observing the bonding state of the clad metal plate manufactured by the method of the present invention with a microscope.

(Fig. 9) Fe-etched about 100 Å in Ar gas of 5 × 10 ^-3 Torr.
Amorphous metal with a thickness of 0.06mm consisting of Ni-Cr-Si-B components and an aluminum plate with a thickness of 0.26mm that has been etched by about 2000Å are rolled and bonded at a rolling rate of 3% in a vacuum of 1 x 10 ^-5 Torr. After that (Example 9), FIG. 9 shows a micrograph of a cross section of a bent portion observed when the amorphous metal was bent outside.

The clad metal plate is bent so that the inner aluminum plate is compressed and strongly deformed so that the plate thickness increases, but no peeling phenomenon is observed at the bonding interface, indicating that the bonding strength is large.

(Fig. 10) Fe and Al are each 400 in Ar gas of 1 × 10 ^-2 Torr.
Å, 1000Å etched and bonded at a rolling rate of 5% in a vacuum of 3 × 10 ^-5 Torr. (Example 2) A cross-sectional observation photomicrograph of a bonding interface of a clad metal plate of aluminum and iron is shown in FIG. Show. The portion etched with the Nital solution shows the texture of iron.

The clad metal plate does not have an alloy layer formed at the bonding interface between aluminum and iron, and is manufactured at a low rolling rate, so the crystalline metallographic structure of iron does not change.

〔The invention's effect〕

By using the manufacturing method and apparatus according to the present invention, it is possible to manufacture a clad metal plate which has been impossible to manufacture in the past. That is, 1) a plate that is a combination of a low melting point metal and a high melting point metal 2) A plate that uses a material whose properties change significantly with increasing temperature (eg, amorphous metal) 3) Use a metal that has an active oxidative property Plate (Example: Mg, Li, T
i) 4) It becomes possible to manufacture plates (eg, Al and Fe, Ti and stainless steel) that do not generate alloy layers due to temperature rise at the joint interface.

Therefore, in addition to the conventional applications of clad metal plates, a wide range of applications as functional materials can be expected. In particular, the fact that the amorphous metal can be clad is a major feature not found in the conventional method, and since the workability and spot weldability are extremely poor, it is possible to expand the use of the amorphous metal that has been put off until now.

[Brief description of drawings]

FIG. 1 is a schematic front sectional view showing an embodiment of the present invention,
2 is a partial cross-sectional plan view of FIG. 1, FIG. 3 is an enlarged view of a main part of an etching portion, FIG. 11 is a view taken along the line III-III of FIG.
FIG. 3A is a schematic view of a conventional etching apparatus, FIG. 4 is a graph showing a required etching time, FIG. 5 is a perspective view of a peel strength test, and FIG. 6 is a graph showing an influence of an etching amount on a bonding strength. FIG. 7 is a graph showing the influence of the degree of vacuum and the standing time on the bonding strength, FIG. 8 is a relationship diagram of rolling ratio and peel strength, and FIGS. 9 and 10 are micrographs of a clad metal plate cross section. 1: vacuum tank, 2: rolling unit, 3A, 3B: rewind reel, 4A, 4B: rotating shaft, 5: take-up reel, 6A, 6B: metal plate supporting electrode, 7: magnet, 8: opening, 9 , 25: Vacuum pump, 11A, 11B: Brake, 12A, 12B, 12C, 12D, 12E, 12F: Vacuum seal, 14: Drive shaft, 15A, 15B: Motor, 16A, 16B: Support shaft, 17A, 17B: Rotary Joint, 18: Reduction device, 19: Clad metal plate, 20A, 20B: Clad material, 22: Etching chamber, 23, 24: Packing, 26: Counter electrode, 27: Lead wire, 28: Matching box, 29: Gas Introduction hole, 30: Insulation tube, 31: Skirt part, 32, 33: Exhaust port, 34, 35: Wire mesh, 36: Shield cover, 37A, 37B: Cover, 50, 51: Magnetic field line, 52, 53: Etching area ( Electrode A), 60: cathode, 61: anode, 62: etching chamber.

Claims (5)

[Claims] 1. A method for producing a clad metal plate, which comprises activating a bonding surface of a dissimilar metal plate in a vacuum chamber in advance and then polymerizing the dissimilar metal plate for cold rolling bonding. Electrode A with one of the metal plates having a joint surface grounded in an extremely low pressure inert gas atmosphere of 1 × 10 ^-1 to 1 × 10 ^-4 Torr.
Then, an alternating current of 1 to 50 MHz is applied between the electrode B and the other electrode B which is insulated and supported to cause the glow discharge, and the area of the electrode A exposed in the plasma generated by the glow discharge is A method for manufacturing a clad metal plate, which comprises performing a sputter etching process on 1/3 or less of the area. 2. Cold rolling joining is 1 × 10 ⁻⁴ to 1 × 10 ⁻⁶ Torr.
In a vacuum chamber of T, where T is the temperature (° C.) of the metal plate and R is the rolling rate (%), 0 <T ≦ 300, 0.1 ≦ R ≦ 30. A method for producing the clad metal plate described. 3. A hollow roll-shaped metal plate supporting electrode pivotally mounted inside at least two openings of a vacuum chamber having a rolling mill therein, and the vacuum chamber electrically insulated through the openings. At least two etching chambers, which are connected to each other, and which house counter electrodes, and the exposed area in the etching chamber of the metal plate mounted on the hollow roll-shaped metal plate supporting electrode are trimmed without contacting the metal plate surface. An apparatus for manufacturing a clad metal plate, comprising a skirt portion electrically connected to the etching chamber. 4. The clad metal plate manufacturing apparatus according to claim 3, further comprising a rewinding reel and / or a winding reel inside or outside the vacuum chamber. 5. The clad metal plate manufacturing apparatus according to claim 3, wherein the metal plate support electrode is a support electrode into which a magnet is inserted.