JPH0751801Y2 - ホトカプラ - Google Patents
ホトカプラInfo
- Publication number
- JPH0751801Y2 JPH0751801Y2 JP1987113049U JP11304987U JPH0751801Y2 JP H0751801 Y2 JPH0751801 Y2 JP H0751801Y2 JP 1987113049 U JP1987113049 U JP 1987113049U JP 11304987 U JP11304987 U JP 11304987U JP H0751801 Y2 JPH0751801 Y2 JP H0751801Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- light emitting
- emitting element
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 47
- 238000010168 coupling process Methods 0.000 claims description 28
- 238000005859 coupling reaction Methods 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 230000008878 coupling Effects 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 claims description 27
- 239000000463 material Substances 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113049U JPH0751801Y2 (ja) | 1987-07-23 | 1987-07-23 | ホトカプラ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113049U JPH0751801Y2 (ja) | 1987-07-23 | 1987-07-23 | ホトカプラ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6418765U JPS6418765U (enrdf_load_stackoverflow) | 1989-01-30 |
| JPH0751801Y2 true JPH0751801Y2 (ja) | 1995-11-22 |
Family
ID=31352542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987113049U Expired - Lifetime JPH0751801Y2 (ja) | 1987-07-23 | 1987-07-23 | ホトカプラ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751801Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5746225A (en) * | 1980-09-01 | 1982-03-16 | Amada Eng & Service | Method and device for cooling condensing lens in laser machining apparatus |
-
1987
- 1987-07-23 JP JP1987113049U patent/JPH0751801Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6418765U (enrdf_load_stackoverflow) | 1989-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0645811A2 (en) | Semiconductor device having semiconductor chip with backside electrode | |
| US20020167015A1 (en) | Semiconductor light emitting device | |
| CA1043008A (en) | Photo coupler | |
| JP3437709B2 (ja) | 立体配線型光結合装置及び反射型光結合装置 | |
| US5245620A (en) | Laser diode system for reflecting and maintaining laser light within the system | |
| JP4117868B2 (ja) | 光結合素子 | |
| JPH10294495A (ja) | 電子部品 | |
| JPH0751801Y2 (ja) | ホトカプラ | |
| JPH0623002Y2 (ja) | ホトカプラ | |
| US20240113093A1 (en) | Insulation module | |
| US7777234B2 (en) | Light-receiving element and photonic semiconductor device provided therewith | |
| JP2535786Y2 (ja) | 発光表示装置 | |
| JP2002185069A (ja) | 受光素子及びそれを備える光半導体装置 | |
| JP3824696B2 (ja) | フォトカプラ及びその製造方法 | |
| JP2525554Y2 (ja) | 発光表示装置 | |
| JPH0559863U (ja) | 半導体発光装置 | |
| US20250194285A1 (en) | Photocoupler | |
| JP2002359392A (ja) | 半導体リレー | |
| JPH0528059U (ja) | 光結合半導体装置 | |
| JPS6127192Y2 (enrdf_load_stackoverflow) | ||
| JPH0112306Y2 (enrdf_load_stackoverflow) | ||
| JPS5935001Y2 (ja) | 光双方向性サイリスタ | |
| JPH0645636A (ja) | 受発光素子およびこれを利用した受発光装置 | |
| JPH085571Y2 (ja) | 光結合半導体装置 | |
| JP2000208808A (ja) | 光結合素子及び製造方法 |