JPH0749794Y2 - ワイヤレスボンデイング用金バンプ - Google Patents

ワイヤレスボンデイング用金バンプ

Info

Publication number
JPH0749794Y2
JPH0749794Y2 JP1989029563U JP2956389U JPH0749794Y2 JP H0749794 Y2 JPH0749794 Y2 JP H0749794Y2 JP 1989029563 U JP1989029563 U JP 1989029563U JP 2956389 U JP2956389 U JP 2956389U JP H0749794 Y2 JPH0749794 Y2 JP H0749794Y2
Authority
JP
Japan
Prior art keywords
bump
bumps
gold
ball
wireless bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989029563U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02120836U (enrdf_load_stackoverflow
Inventor
正樹 森川
保 森
利昇 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP1989029563U priority Critical patent/JPH0749794Y2/ja
Publication of JPH02120836U publication Critical patent/JPH02120836U/ja
Application granted granted Critical
Publication of JPH0749794Y2 publication Critical patent/JPH0749794Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP1989029563U 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ Expired - Lifetime JPH0749794Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989029563U JPH0749794Y2 (ja) 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989029563U JPH0749794Y2 (ja) 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ

Publications (2)

Publication Number Publication Date
JPH02120836U JPH02120836U (enrdf_load_stackoverflow) 1990-09-28
JPH0749794Y2 true JPH0749794Y2 (ja) 1995-11-13

Family

ID=31253886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989029563U Expired - Lifetime JPH0749794Y2 (ja) 1989-03-15 1989-03-15 ワイヤレスボンデイング用金バンプ

Country Status (1)

Country Link
JP (1) JPH0749794Y2 (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4952973A (enrdf_load_stackoverflow) * 1972-09-22 1974-05-23
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
JPS60134444A (ja) * 1983-12-23 1985-07-17 Hitachi Ltd バンプ電極形成方法
JPS62152143A (ja) * 1985-12-26 1987-07-07 Toshiba Corp バンプ形成方法
JPS63173345A (ja) * 1987-01-12 1988-07-16 Nec Kansai Ltd バンプ電極形成方法
JPH0750726B2 (ja) * 1987-05-07 1995-05-31 松下電器産業株式会社 半導体チップの実装体

Also Published As

Publication number Publication date
JPH02120836U (enrdf_load_stackoverflow) 1990-09-28

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term