JPH0749793Y2 - 半導体装置のめっき用接続体 - Google Patents

半導体装置のめっき用接続体

Info

Publication number
JPH0749793Y2
JPH0749793Y2 JP464489U JP464489U JPH0749793Y2 JP H0749793 Y2 JPH0749793 Y2 JP H0749793Y2 JP 464489 U JP464489 U JP 464489U JP 464489 U JP464489 U JP 464489U JP H0749793 Y2 JPH0749793 Y2 JP H0749793Y2
Authority
JP
Japan
Prior art keywords
plating
wafer
recess
tip
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP464489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0296729U (enrdf_load_stackoverflow
Inventor
彰 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP464489U priority Critical patent/JPH0749793Y2/ja
Publication of JPH0296729U publication Critical patent/JPH0296729U/ja
Application granted granted Critical
Publication of JPH0749793Y2 publication Critical patent/JPH0749793Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP464489U 1989-01-19 1989-01-19 半導体装置のめっき用接続体 Expired - Lifetime JPH0749793Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP464489U JPH0749793Y2 (ja) 1989-01-19 1989-01-19 半導体装置のめっき用接続体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP464489U JPH0749793Y2 (ja) 1989-01-19 1989-01-19 半導体装置のめっき用接続体

Publications (2)

Publication Number Publication Date
JPH0296729U JPH0296729U (enrdf_load_stackoverflow) 1990-08-01
JPH0749793Y2 true JPH0749793Y2 (ja) 1995-11-13

Family

ID=31207338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP464489U Expired - Lifetime JPH0749793Y2 (ja) 1989-01-19 1989-01-19 半導体装置のめっき用接続体

Country Status (1)

Country Link
JP (1) JPH0749793Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11242610B2 (en) 2017-10-19 2022-02-08 Kyushu University, National University Corporation Plating method, bubble ejection member, plating apparatus, and device

Also Published As

Publication number Publication date
JPH0296729U (enrdf_load_stackoverflow) 1990-08-01

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