JPH0749793Y2 - 半導体装置のめっき用接続体 - Google Patents
半導体装置のめっき用接続体Info
- Publication number
- JPH0749793Y2 JPH0749793Y2 JP464489U JP464489U JPH0749793Y2 JP H0749793 Y2 JPH0749793 Y2 JP H0749793Y2 JP 464489 U JP464489 U JP 464489U JP 464489 U JP464489 U JP 464489U JP H0749793 Y2 JPH0749793 Y2 JP H0749793Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- recess
- tip
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP464489U JPH0749793Y2 (ja) | 1989-01-19 | 1989-01-19 | 半導体装置のめっき用接続体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP464489U JPH0749793Y2 (ja) | 1989-01-19 | 1989-01-19 | 半導体装置のめっき用接続体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0296729U JPH0296729U (cs) | 1990-08-01 |
| JPH0749793Y2 true JPH0749793Y2 (ja) | 1995-11-13 |
Family
ID=31207338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP464489U Expired - Lifetime JPH0749793Y2 (ja) | 1989-01-19 | 1989-01-19 | 半導体装置のめっき用接続体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749793Y2 (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212934A (zh) * | 2017-10-19 | 2020-05-29 | 国立大学法人九州大学 | 电镀方法、气泡喷出部件、电镀装置以及设备 |
-
1989
- 1989-01-19 JP JP464489U patent/JPH0749793Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0296729U (cs) | 1990-08-01 |
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