JPH0745962Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JPH0745962Y2
JPH0745962Y2 JP12545489U JP12545489U JPH0745962Y2 JP H0745962 Y2 JPH0745962 Y2 JP H0745962Y2 JP 12545489 U JP12545489 U JP 12545489U JP 12545489 U JP12545489 U JP 12545489U JP H0745962 Y2 JPH0745962 Y2 JP H0745962Y2
Authority
JP
Japan
Prior art keywords
insulating
semiconductor element
insulating substrate
insulating base
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12545489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363942U (de
Inventor
博司 土岐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP12545489U priority Critical patent/JPH0745962Y2/ja
Publication of JPH0363942U publication Critical patent/JPH0363942U/ja
Application granted granted Critical
Publication of JPH0745962Y2 publication Critical patent/JPH0745962Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP12545489U 1989-10-26 1989-10-26 半導体素子収納用パッケージ Expired - Lifetime JPH0745962Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12545489U JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12545489U JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0363942U JPH0363942U (de) 1991-06-21
JPH0745962Y2 true JPH0745962Y2 (ja) 1995-10-18

Family

ID=31673324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12545489U Expired - Lifetime JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0745962Y2 (de)

Also Published As

Publication number Publication date
JPH0363942U (de) 1991-06-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term