JPH0744021Y2 - 半導体素子収納用パッケ−ジ - Google Patents
半導体素子収納用パッケ−ジInfo
- Publication number
- JPH0744021Y2 JPH0744021Y2 JP1987087945U JP8794587U JPH0744021Y2 JP H0744021 Y2 JPH0744021 Y2 JP H0744021Y2 JP 1987087945 U JP1987087945 U JP 1987087945U JP 8794587 U JP8794587 U JP 8794587U JP H0744021 Y2 JPH0744021 Y2 JP H0744021Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- base
- semiconductor
- marker
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 40
- 239000003550 marker Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000000049 pigment Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 229910000428 cobalt oxide Inorganic materials 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087945U JPH0744021Y2 (ja) | 1987-06-05 | 1987-06-05 | 半導体素子収納用パッケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087945U JPH0744021Y2 (ja) | 1987-06-05 | 1987-06-05 | 半導体素子収納用パッケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63197342U JPS63197342U (enrdf_load_stackoverflow) | 1988-12-19 |
| JPH0744021Y2 true JPH0744021Y2 (ja) | 1995-10-09 |
Family
ID=30945620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987087945U Expired - Lifetime JPH0744021Y2 (ja) | 1987-06-05 | 1987-06-05 | 半導体素子収納用パッケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744021Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0793386B2 (ja) * | 1988-09-07 | 1995-10-09 | 新光電気工業株式会社 | 電子部品用セラミックパッケージの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51112815A (en) * | 1975-03-31 | 1976-10-05 | Fujitsu Ltd | Ceramics compositions |
| JPS53111310A (en) * | 1977-02-25 | 1978-09-28 | Fujitsu Ltd | Ceramic composites |
| JPS5937598B2 (ja) * | 1980-04-07 | 1984-09-11 | 日本電気株式会社 | 半導体装置 |
| JPS6268237U (enrdf_load_stackoverflow) * | 1985-10-18 | 1987-04-28 |
-
1987
- 1987-06-05 JP JP1987087945U patent/JPH0744021Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63197342U (enrdf_load_stackoverflow) | 1988-12-19 |
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