JPH0743412B2 - Detachable device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and is particularly effective when applied to inserting and taking out a semiconductor device from an aging substrate for aging processing in semiconductor aging processing. It is about technology.

[Conventional technology]

Sockets for attaching / detaching semiconductor devices to be aged are described in "Electronic Materials", 1986 edition, P222-P226, published by Kogyo Kenkyukai Co., Ltd., November 20, 1985.

By the way, generally, a semiconductor device is a DIL (Dual In Line) type package in which external leads are bent downward on both sides of the package, and a flat type such as an FPP (Flat Pl) that has leads protruding outside the four sides of the package.
astic Package) Furthermore, for example PLCC (Plastic Leade)
d Chip Carrier) and other semiconductor devices that consist of surface mount packages.

As one means of product quality inspection, in the semiconductor manufacturing process, there is an aging process in which an operating voltage is applied to the product and the product is left at a high temperature for a long time.

The work in this aging process uses a aging substrate having a jig (hereinafter referred to as a socket) for housing the semiconductor device, and conventionally, the semiconductor device is manually inserted into or taken out from the socket.

Further, in recent years, regarding the DIL type semiconductor device, a device for automatically inserting and removing the aging substrate socket has been seen.

On the other hand, regarding the flat type semiconductor device, since the leads are projected from the four sides of the package, the conventional socket cannot be used to push the semiconductor device into the contact terminal in the socket body.

Therefore, when using a flat type semiconductor device,
When inserting the semiconductor device, move the socket lid lock claw in the socket lid lock opening direction, then move the socket lid in the socket lid opening direction to insert into the socket body, then move the socket lid in the socket lid closing direction, and then The socket lid lock claw was being moved in the socket lid lock closing direction. Also,
When the semiconductor device is taken out from the socket, the work is performed by reversing the above operation.

[Problems to be solved by the invention]

However, it has been found by the present inventors that the above-mentioned method not only increases the number of work steps, but also causes many problems such as the deformation of the external lead by the operator.

Further, it has been found by the inventor of the present invention that the opening / closing operation of the socket lid becomes a bottleneck and does not proceed easily even in automation.

An object of the present invention is to provide a device for automatically inserting a semiconductor device into a socket on an aging board without deformation of external leads and taking it out from the socket on the aging board, thereby improving work efficiency and reducing man-hours. And to provide technical means for facilitating high quality.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

The outline of a typical invention among the inventions disclosed in the present application will be briefly described as follows.

That is, the lid of a socket with a lid mounted on an aging board can be automatically opened or closed during the transportation of the aging board, and one or both of insertion and removal of a work from the socket is automatically performed. .

According to another aspect of the invention, the socket mounted on the aging board does not have a lid, and the socket is automatically inserted or removed during the transportation of the aging board. One or both.

[Action]

According to the above-mentioned means, one or both of insertion and removal of a work into and from a socket with or without a lid can be automatically performed, and manual work is not required, so that work efficiency is improved, man-hours are reduced, and further, Higher quality is possible.

[Embodiment 1] FIG. 1 is a schematic plan view of an attaching / detaching device according to an embodiment of the present invention, FIG. 2 is a partial sectional view showing a socket lid opening operation, and FIG. 3 shows a socket lid closing operation. FIG.

The first embodiment applies the present invention to the attachment / detachment of a so-called flat package type semiconductor device to / from a socket.

In the first embodiment, a flat package type semiconductor device (FPP type IC) 2 (workpiece) is mounted on the base 1 of the attachment / detachment device.
The aging substrate 3 for inspecting by aging is sequentially transported from the supply unit 4 to the storage unit 6 along the arrow A direction and further the B direction along the aging substrate transport system 5. On this aging board 3, insert FPP type IC2,
A large number of sockets 7 for receiving the takeout are installed. One IC 2 to be aged is inserted into each socket 7 and is taken out after completion of a predetermined aging inspection. In the present embodiment, these insertions and removals are all automatically performed.

In order to insert or remove the FPP type IC 2 into or from the socket 7 on the aging board 3 conveyed along the aging board conveyance system 5, the FPP IC 2 is moved along the aging board conveyance system 5 from left to right in FIG. To the opening 7, a lid opening portion 8 for opening the lid of the socket 7, a work take-out portion 9 for taking out the FPP type IC 2 from the socket 7, and a FPP type I for the socket 7.
A work insertion portion 10 for inserting C2 and a lid closing portion 11 for closing the lid of the socket 7 are sequentially arranged.

On the other hand, on the base 1, a work transfer system 12 for supplying the aged FPP type IC 2 is provided in parallel with the aging substrate transfer system 5. That is, this work transfer system
Numeral 12 is for carrying the FPP type IC 2 from the right to the left in FIG. 1 in the direction opposite to the aging board carrying direction of the aging board carrying system 5, as indicated by arrows C and D. Therefore, the work supply unit 13 which is a supply unit of the unaged FPP IC2 is located at the right end of the work transfer system 12, and the work storage unit 14 for housing the FPP IC2 after completion of aging is located on the left end side. The work transfer system 12 is provided in substantially the same horizontal plane as the aging substrate transfer system 5 provided on the base 1, and
The work is conveyed in parallel to.

Next, the socket 7 for accommodating the FPP type IC 2 will be described. The socket 7 of the first embodiment includes a main body 15 and the main body 15.
A lid 17 that is swingably mounted around a shaft 16 and a socket 7
The contact terminal 20 that comes into contact with the lead terminal 19 of the FPP type IC 2 housed in the housing hole 18 of the, the locking piece 22 attached to the free end side of the lid 17 so as to be swingable around the shaft 21, It has a locking projection 23 provided at one end of the stop piece 22, and a locking portion 24 that releasably engages with the locking projection 23 and locks the lid 17 to the main body 15. Further, the lid opening portion 8 is provided with a lid opening piece 26 which is joined to the release claw 25 of the locking piece 22 of the socket 7 to open the lid 17. This lid opening piece 26 is for opening the lid 17,
It operates along the locus indicated by E in FIG.

On the other hand, the lid closing portion 11 is provided with a lid closing block 28 having a lid closing roller 27 as shown in FIG. The lid closing block 28 closes the lid 17 of the socket 7 by operating along the locus F of FIG.
Is engaged with the locking portion 24 of the main body 15 to lock the lid 17 with respect to the main body 15.

Next, the operation of this embodiment will be described.

First, the supply unit 4 of the base 1 has a socket 7 with a lid 17 closed.
A plurality of aging substrates 3 are set, and the work supply unit 13 is set with the unaged FPP type IC 2 in a jig. After that, when the attachment / detachment device is activated and the aging board 3 is conveyed in the direction of arrow A along the aging board conveyance system 5, the aging board 3 sequentially reaches the lid opening part 8.

In the lid opening portion 8, the lid opening piece 26 engages with the release claw 25 and operates along the locus E by a driving means (not shown), so that the locking projection 23 of the locking piece 22 is engaged with the main body 15. Stop
It is released from 24 and the lid 17 is swung around the shaft 16 to release it from the main body 15.

When the aging board 3 comes to the work take-out part 9 with the lid open, the FPP type IC2 that has completed aging in the socket 7
If there is, it is taken out from the socket 7 by a vacuum suction means (not shown), and the work transfer system 12 is moved in the direction of arrow G.
And store it in an empty jig. The jig in which the aged FPP type IC2 is stored is stored in the storage portion 14 as shown by an arrow D.

Further, the socket 7 emptied by taking out the FPP type IC 2 as described above is conveyed to the work insertion portion 10. At this position, the work transfer system is connected by a vacuum suction means (not shown).
The unaged FPP type IC2 is transferred from the jig 12 in the direction of arrow H, and is housed in the socket 7 so that its lead terminal 19 is placed on the contact terminal 20 of the body 15 of the socket 7.

The aging board 3 in which the unaged FPP type IC2 is housed in the socket 7 is further sent to the lid closing part 11, and here the third
By operating the lid closing block 28 along the locus F as shown in the drawing, the lid 17 of the socket 7 swings around the shaft 16, and the locking projection 23 of the locking piece 22 is locked by the locking portion of the main body 15. The lid 17 is closed by engaging with 24. Thereby, the pressing protrusion 7a of the lid 7
Presses the lead terminal 19 of the FPP type IC 2 against the contact terminal 20 to bring both terminals 19 and 20 into conductive contact with each other, so that an aging inspection is possible.

Therefore, the socket 7 is housed in the housing part 6 together with the aging board 3.

As described above, according to the first embodiment, the following effects can be obtained.

(1). FPP type IC2 to socket 7 on aging board 3
Since the insertion and removal can be automatically performed, extremely efficient attachment / detachment work is possible.

(2). According to the above (1), it is possible to prevent the bending and the like of the external lead terminal which is caused by the manual attachment and detachment.

(3). By the above (1), it is possible to reduce the number of work steps.

(4). According to the above (1), reliable work can be stably performed without being influenced by the skill level of the worker.

[Embodiment 2] FIG. 4 is a plan view of an attaching / detaching device according to another embodiment of the present invention.
FIG. 5 is a partial sectional view showing the workpiece holding state, and FIG. 6 is a partial sectional view showing the contact terminal opened state.

The second embodiment is applied to work attachment / detachment for aging inspection of a surface mount semiconductor device (surface mount IC) 2a such as PLCC as a work. That is, this type of IC2a
In this case, since the external lead terminal does not project, the conductive contact with the contact terminal cannot be made by pressing and pinching the lead terminal from above and below. Therefore, in the second embodiment, the socket 30 arranged on the aging board 3 is used.
The base 31 does not have a lid as in the first embodiment.
And a contact terminal 32 that is attached so as to penetrate through the base 31 in the vertical direction, and has an upper end portion that has a bifurcated branch portion 33 that can be elastically opened and closed, and a branch portion 33 of the contact terminal 32. Formed on the outer side of the work insertion opening 35 of the upper plate (contact releasing member) 34 fitted in the upper plate 34, and when the plate 34 is pushed down, the inner portion of the branch portion 33 is directed outward. It has a taper surface 36 that presses the conductive portion of the surface-mounted IC 2a to separate the branch portion 33. A pusher as a pusher for pushing the upper plate 34 downward.
For example, 37 can be mounted on a head (not shown) that vacuum-sucks and conveys the surface-mounted IC 2a, and operates in the vertical direction together with the pusher 37.

As shown in FIG. 4, the attaching / detaching device of the second embodiment using such a socket 30 does not require opening / closing of the lid of the socket 30, so that the lid opening part 8 and the lid closing part of the first embodiment are not necessary.
The structure is simple because 11 can be omitted, but the other parts are substantially the same as those in the first embodiment, and therefore, corresponding parts are denoted by the same reference numerals as in the first embodiment, and detailed description thereof is omitted. .

Next, the operation of storing a work in the socket 30 according to the second embodiment will be described. A surface mount type IC that is an example of the work
In the work take-out portion 9, as shown in FIG. 6, 2a pushes down the upper plate 34 with a pusher 37 so that the inner surface of the branch portion 33 of the contact terminal 32 is elastically moved outward by the tapered surface 36 of the upper plate 34. Of the contact terminal 32,
Is separated from the conductive portion of the surface mount type IC 2a. Therefore,
In this state, the surface mount type IC 2a after completion of aging can be taken out from the socket 30 through the opening 35 by the vacuum suction means (not shown).

On the other hand, if the pushing down force of the pusher 37 is released,
As shown in the figure, the upper plate 34 returns to the inside due to the elastic restoring force of the branch portion 33 of the contact terminal 32 and the action of the tapered surface 36, and makes conductive contact with the conductive portion of the surface mount type IC 2a, so that the aging inspection can be performed. Becomes

As described above, according to the second embodiment, the following effects can be obtained.

(1). By having the socket 30 without the lid and the contact terminal 32 having the branch portion 33, the surface mounting type IC 2a can be easily automatically attached / detached for the aging inspection.

(2). According to the above (1), the structure of the device becomes extremely simple.

(3). In addition, in the first embodiment, the effects obtained by the second embodiment can be obtained together.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Nor.

For example, arbitrary means can be used as the work attaching / detaching means, the conveying means, and the like.

Further, the attachment / detachment device of the present invention may be configured as a device dedicated to only one of taking out and inserting a work. That is, the present invention can be applied not only to the attachment / detachment device but also to dedicated devices for the insertion device and the extraction device.

Further, the contact terminal shape of the socket is not limited to this embodiment, and various shapes can be used as long as they can be opened and closed with one touch.

In the above description, the case where the invention made by the present inventor is mainly applied to the attachment / detachment of the FPP type and PLCC type semiconductor devices, which are the fields of use of the invention, is not limited thereto, and, for example, other packages. It may be applied to a semiconductor device of the type.

〔The invention's effect〕

The following is a brief description of an effect obtained by the representative one of the inventions disclosed in the present application.

That is, the work can be attached and detached automatically, and the work efficiency can be improved. Further, it is possible to prevent the lead from being bent and deformed, so that reliable work can be stably performed.

The term "attaching / detaching device" used in this specification has a broad meaning including "insertion device" or "drawing device".

[Brief description of drawings]

FIG. 1 is a schematic plan view of an attaching / detaching device according to an embodiment of the present invention, FIG. 2 is a partial sectional view showing a socket lid opening operation, and FIG. 3 is a partial sectional view showing a socket lid closing operation. FIG. 4 is a plan view of an attaching / detaching device according to another embodiment of the present invention, FIG. 5 is a partial sectional view showing a work holding state thereof, and FIG. 6 is a partial sectional view showing a contact terminal opened state. 1 ... Base, 2 ... Flat package type semiconductor device (FPP type IC) (work), 2a ... Surface mount type semiconductor device (surface mount IC) (work), 3 ... Aging board, 4
…… Supply part, 5 …… Aging board transfer system, 6 …… Storage part, 7 …… Socket, 7 a …… Pressing protrusion, 8 …… Lid opening part, 9 …… Work take-out part, 10 …… Work insertion part , 11 ……
Lid closing part, 12 …… Work transfer system, 13 …… Work supply part,
14 …… Work storage, 15 …… Main body, 16 …… Axis, 17 ……
Lid, 18 ... Storage hole, 19 ... Lead terminal, 20 ... Contact terminal, 21 ... Shaft, 22 ... Locking piece, 23 ... Locking protrusion, 24 ...
Locking part, 25 ... Release claw, 26 ... Lid opening piece, 27 ... Lid closing roller, 28 ... Lid closing block, 30 ... Socket, 31 ...
… Base, 33 …… Branch, 34 …… Upper plate (contact release member), 35 …… Opening, 36 …… Tapered surface, 37 …… Pusher (pushing body)

Claims (16)

[Claims] 1. An aging board carrying system for carrying an aging board equipped with a socket with a lid, a work carrying system for carrying a work to be attached to and detached from the socket, and a lid for the socket in the middle of the aging board carrying system. And a work attaching / detaching unit for automatically inserting or removing the work and inserting or removing the work into or from the socket. 2. A socket body, a lid mounted on the socket body so as to be capable of swinging open / close, a contact terminal for conductively contacting a terminal of a work, and a swinging shaft, The attachment / detachment device according to claim 1, further comprising: a locking piece having a locking projection capable of being engaged with the locking portion of the socket body. 3. The work attachment / detachment portion engages with a part of the locking piece of the socket to swing the locking piece, whereby the locking projection is fixed to the locking portion of the socket body. The attachment / detachment device according to claim 2, further comprising a lid opening means that is operated so as to be detached from the lid and open the lid. 4. The work attaching / detaching portion has a lid closing means that operates to swing and close the lid in a closing direction by abutting and pushing the engaging piece of the socket. The attachment / detachment device according to claim 2, which is characterized. 5. The attachment / detachment device according to claim 1, wherein the work is a flat package type semiconductor device. 6. An aging board carrying system for carrying an aging board equipped with a socket with a lid, a work carrying system for carrying a work to be attached to and detached from the socket, and an aging board carrying system provided in the middle of the aging board carrying system. A lid opening portion that opens the lid of the socket, a workpiece ejection portion that takes out a workpiece from the socket with the lid opened, and a workpiece insertion portion that inserts the workpiece conveyed along the workpiece conveyance system into the socket. And a lid closing part for closing the lid of the socket into which the work is inserted. 7. The socket includes a socket body, a lid attached to the socket body so as to be capable of swinging open / close, contact terminals for conductively contacting a terminal of a work, and a swinging shaft, 7. The attachment / detachment device according to claim 6, further comprising: a locking piece having a locking projection capable of being engaged with the locking portion of the socket body. 8. The lid opening portion engages with a part of the locking piece of the socket to swing the locking piece,
8. The attachment / detachment according to claim 6 or 7, further comprising a lid opening means that operates to detach the locking protrusion from the locking portion of the socket body and open the lid. apparatus. 9. The lid closing portion has a lid closing means that operates to swing and close the lid in a closing direction by abutting and pushing the locking piece of the socket. The attachment / detachment device according to claim 7, which is characterized. 10. The attachment / detachment device according to claim 6, wherein the work is a flat package type semiconductor device. 11. An aging substrate transport system for transporting an aging substrate having a socket having a base provided with elastically deformable contact terminals for contacting a work and a contact releasing member for releasing contact of the contact terminal with the work. And a work transfer system which is provided in substantially the same horizontal plane with respect to the aging board transfer system and which transfers a work to be attached to and detached from the socket in parallel to a direction opposite to the aging board, and an aging board transfer system. A mounting / demounting device comprising a mounting / demounting unit that pushes the contact release member toward the base by a pushing unit to insert or remove a work into or from the socket. 12. The socket has a base, a contact terminal provided on the base and having a branch portion capable of opening and closing the work insertion side, and an opening for receiving the work, and when pushed toward the base. 12. The attachment / detachment device according to claim 11, further comprising: a contact releasing member that separates the work terminal from the contact terminal and electrically contacts the work terminal with the contact terminal when the work terminal is not pushed. 13. The attachment / detachment device according to claim 11 or 12, wherein the work is a surface-mounted semiconductor device. 14. An aging substrate carrying system for carrying an aging substrate equipped with a socket having a base provided with elastically deformable contact terminals for contacting a work and a contact releasing member for releasing contact of the contact terminal with the work. And a work transfer system which is provided in substantially the same horizontal plane with respect to the aging board transfer system and which transfers a work to be attached to and detached from the socket in parallel to a direction opposite to the aging board, and an aging board transfer system. A work insertion part for inserting a work into the socket on the way, a work take-out part for taking out a work from the socket in the middle of the aging board transfer system, and a contact release member of the socket facing the base at the work take-out part Pushing means for pushing and separating the work from the contact terminal of the socket from the conductive contact state; Ranaru removable devices. 15. The contact terminal of the socket has a branch portion that can be opened and closed on the workpiece insertion side, and the branch portion connects the work terminal when the pushing means is pushed toward the contact releasing member. 15. The attachment / detachment device according to claim 14, wherein the attachment / detachment device is separated from the branch portion and the terminal of the work is opened / closed so as to electrically contact the branch portion when not pushed. 16. The attachment / detachment device according to claim 14 or 15, wherein the work is a surface-mounted semiconductor device.