JPS62169062A - Mounting and dismounting apparatus - Google Patents

Abstract

PURPOSE:To improve work efficiency and reduce man-hours by automatically performing the insertion and/or takeout of a work for a lidded or lidless socket. CONSTITUTION:An aging substrate 3 with a lid 17 closed and provided with a plurality of sockets 7 is set to the supplying portion 4 of a mount 1. The substrate 3 is transferred to a lid opening portion 8 wherein a lid opening piece 26 is operated to release the lid 17 from a body 15. When the substrate 3 reaches a work takeout portion 9 in this condition wherein the lid is opened, a semiconductor device 2 that has been subjected to an aging is taken out from the socket 7 and accommodated in a work container 14 by a transfer system 12. The vacant socket 7 is fed to a work inserting portion 10 wherein another semiconductor device 2 that has not been subjected to the aging and transferred by the transfer system 12 is accommodated in the socket 7. The socket that has accommodated the semiconductor device 2 are fed to a lid closing portion 11 wherein the lid 17 is closed by a lid closing block to become a condition capable of the aging.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and is particularly applicable to inserting and removing a semiconductor device from an aging substrate for aging processing in semiconductor aging processing. It's about technology.

[Conventional technology]

Sockets for attaching and detaching aging semiconductor devices, etc., are published by Kogyo Kenkyukai Co., Ltd., November 20, 1985,
[Electronic Materials J 1986 edition, P222-3 on P226
(I was posted).

By the way, the semiconductor device is placed on both sides of the package at -C (
D I L (Dual I) with the lead bent downward.
n Line) type packages and flat types with leads protruding outside the four sides of the package, such as P P P (Flat Plastic P
ackage) Furthermore, for example, Pl, CC (Plas
It is divided into semiconductor devices consisting of surface mount type packages such as tic leaded chip carriers and others.

2. Description of the Related Art As a means of inspecting the quality of products, there is an aging process in the semiconductor manufacturing process in which an operating voltage is applied to the product and the product is left at a high temperature for a long period of time.

The work in this aging process uses an aging 25+w having a jig (hereinafter referred to as a socket) for accommodating the semiconductor device, and conventionally, the semiconductor device was manually inserted into and taken out from the socket.

Furthermore, in recent years, we have seen the emergence of devices that automatically insert and remove DSL type semiconductor devices into and from aging board sockets.

On the other hand, with respect to flat type semiconductor devices, since the leads protrude from the four sides of the package, it is not possible to use a conventional socket and push the semiconductor device into the contact terminals in the socket body.

Therefore, when using a flat type semiconductor device,
When inserting a semiconductor device, move the socket lid lock claw in the socket lid opening direction, then move the socket lid in the socket opening direction and insert it into the socket body, then move the socket lid in the socket M closing direction, Next, the socket M lock claw was moved 1 J in the socket cover lock closing direction. Furthermore, when a semiconductor device is taken out from a socket, the operation is performed in reverse.

(Problems to be Solved by the Invention) However, the present inventors have found that the method described above not only increases the number of work steps but also causes many problems such as deformation of the external lead by the worker.

The inventors have also discovered that the opening and closing operations of the socket H become a bottleneck in automation, making it difficult to proceed easily.

An object of the present invention is to improve work efficiency and reduce man-hours by providing a device that automatically inserts a semiconductor device into a socket on an aging board without deforming external leads, and takes it out from a socket on an aging board. and to provide technical means to facilitate quality improvement.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the lid of a socket with a lid mounted on the aging board can be automatically opened or closed during the transportation of the acid-aged board, and a workpiece is automatically inserted into and/or taken out of the socket. .

Further, according to another invention, the socket mounted on the aging board does not have any trouble, and the workpiece can be automatically inserted into or taken out from the socket while the aging board is being transported. It does one or both.

[Effect]

According to the above-mentioned means, it is possible to automatically insert and/or take out a workpiece into a socket with a lid or without a lid, and no manual work is required, thereby improving work efficiency, reducing man-hours, and High quality is possible.

[Embodiment 1] Fig. 1 is a schematic plan view of an attachment/detachment device that is an embodiment of the present invention, Fig. 2 is a partial cross-sectional view showing the socket lid opening operation, and Fig. 3 shows the socket lid closing operation. FIG.

In the first embodiment, the present invention is applied to attaching and detaching a so-called flat package type semiconductor device to and from a socket.

In the first embodiment, on the base 1 of the attachment/detachment device, a flat package type semiconductor gW (F P P type IC) 2
Aging substrates 3 for inspecting (workpieces) by aging are sequentially conveyed from a supply section 4 in the direction of arrow A and further in the direction of arrow B to an aging substrate conveyance system 5 to a storage section 6. On this aging board 3, there is an FP
A large number of sockets 7 are provided for inserting and removing P-type ICs 2. One IC 2 to be aged is inserted into each socket 7 and taken out after a predetermined aging test is completed, and these insertions and removals are all performed automatically in this embodiment.

In order to insert and take out the FPP type IC 2 into and out of the socket 7 of the aging board 3' transported along the aging board transport system 5, the aging board is transported along the aging board transport system 5. From left to right in Figure 1,
- A lid opening part 8 for opening the lid of the throat 7, a workpiece take-out part 9 for taking out the FPP type IC2 from the throat 7, and a workpiece insertion part 10 for inserting the FPP type IC2 into the socket 7. and a lid closing part 11 for closing the lid of the socket l-7 are arranged in this order.

On the other hand, on one side of the base 1, a workpiece conveyance system 12 is provided in parallel with the aging substrate conveyance system 5 for supplying FPP type ICs 2 to be aged.

That is, this workpiece transfer system 12 is connected to the FPP type I in the opposite direction to the aging substrate transfer direction of the aging substrate transfer system 5.
C2 is conveyed from right to left in FIG. 1 as indicated by arrows C and D. Therefore, the work supply section 13, which is the supply section for the unaged FPP type IC2, is located at the right end of the workpiece conveyance system 12, and the FPP type IC2 after the aging is completed.
The work storage section 14 that stores the workpieces is located on the left end side.

Next, the socket 7 that accommodates the FPP type 1c2 will be explained. The socket 7 of the first embodiment includes a main body 15 and a 117 that is attached to the main body 15 so as to be able to swing around a shaft 16.
and an FPP type IC stored in the storage hole 18 of the socket 7.
A contact terminal 20 that contacts the lead terminal 19 of No. 2, and 117
A locking piece 22 is attached to the free end side so as to be swingable around a shaft 21, a locking protrusion 23 provided at one end of this locking piece 22, and a locking protrusion 23 is releasably engaged with the locking protrusion 23. Combine lid 1
7 to the main body 15. Further, the locking piece 22 of the socket 7 is provided in the lid opening part 8.
A lid opening piece 26 that engages with the release mold 25 to open M17.
is provided. The lid opening piece 26 moves along a trajectory indicated by E in FIG. 2 in order to open the lid 17.

On the other hand, the lid closing section 11 includes a mold closing block 28 having lid closing rollers 27, as shown in FIG. This mold closing block 28 closes l117 of the socket 7 by moving along the locus F in FIG.
The locking protrusion 23 of No. 2 is engaged with the locking portion 24 of the main body 15, so that the locking projection 117 is opened against the main body 15.

Next, the operation of this embodiment will be explained.

First, the aging board 3 with a plurality of sockets 7 with M17 closed is set in the supply section 4 of the base 1, and the unaged FPP IC 2 is placed in a jig in the workpiece supply section 13. set. Thereafter, when the attachment/detachment device is activated and the aging substrates 3 are conveyed along the aging 254 anti-conveying system 5 in the direction of arrow A, the aging substrates 3 sequentially reach the lid opening section 8.

In this lid opening part 8, the lid opening piece 26 engages with the release mold 25 and moves along the trajectory by a driving means (not shown), thereby moving the locking protrusion 23 of the locking piece 22 to the main body 1.
5 from the locking part 24, and swings the part 17 around the shaft 16 to release it from the main body 15.

When the aging board 3 comes to the workpiece take-out part 9 with the lid open, if there is an FPP type IC 2 that has completed aging in the socket 7, it is taken out from the socket 7 by a vacuum suction means (not shown) and moved in the direction of arrow G. The workpiece is transferred to the workpiece transport system 12 and stored in an empty jig. The jig containing the aged FPP IC 2 in this manner is stored in the storage section 14 as shown by the arrow.

Further, the empty socket 7 from which the FPP type 1c2 has been taken out as described above is conveyed to the workpiece insertion section 10. At this position, the unaged FPP type IC is removed from the jig of the workpiece transfer system 12 using a vacuum suction means (not shown) or the like.
2 is transferred in the direction of arrow 11 and housed in the socket 7 so that its lead terminal 19 is placed on the contact terminal 20 of the main body 15 of the socket and door.

The aging board 3 containing the unaged FPP type TC2 in the socket 7 is further sent to the lid closing section 11, where the socket 7 is moved by moving the mold closing block 28 along the trajectory F as shown in FIG. M17 is axis 1
13 around G, the locking protrusion 23 of the locking piece 22 is engaged with the locking part 24 of the main body 15, and the lid 17 is closed. As a result, the pressing protrusion 7a of the lid 7 presses the lead terminal 19 of the FPP type IC 2 against the contact terminal 20, and both terminals 19 and 20
Since they are brought into conductive contact with each other, aging inspection becomes possible.

Therefore, this socket 7 is stored in the storage section 6 together with the aging board 3.

As described above, according to the first embodiment, the following effects can be obtained.

(1) Since the FPP type IC 2 can be automatically inserted into and taken out from the socket 7 on the aging board 3, extremely efficient attachment/detachment work is possible.

(2) The above +11 can prevent bending and deformation of the external lead terminals that would otherwise occur due to manual attachment and detachment.

(3) According to (11) above, it is possible to reduce the number of work steps.

(4) According to the above (11), reliable and stable work can be performed without being affected by the skill level of the worker [Example 2] Fig. 4 shows another example of the present invention. A plan view of the attachment/detachment device;
FIG. 5 is a partial sectional view showing the workpiece holding state, and FIG. 6 is a partial sectional view showing the contact terminal open state.

Embodiment 2 is applied to workpiece attachment/detachment for aging inspection of a surface-mounted semiconductor device (surface-mounted IC) 2a such as a PLCC as a workpiece. That is, in the case of this type of 1c2a, since the external lead terminal does not have a protruding structure, conductive contact with the contact terminal cannot be made by pressing and holding the lead terminal from above and below. Therefore, in the second embodiment, the socket 30 disposed on the aging board 3 does not have a lid as in the first embodiment, but extends through the base 31 in the vertical direction. Contact terminals 32 each having a bifurcated branch 33 whose upper end can be elastically opened and closed, and an upper plate 3 fitted onto the branch 33 of the contact terminal 32.
4, and is formed on the outside of the opening 35 for inserting a workpiece in the upper plate 34, and when the plate 34 is pushed down, the inner part of the branching part 33 is pressed outward to form a surface mount type I.
Tapered surface 3 that separates the conductive part of C2a from the branch part 33
6. The pusher 37, which serves as a pushing body for pushing the upper plate 34 downward, is attached to a head (not shown) that carries the surface mount IC 2a by vacuum suction, for example, and moves in the vertical direction together with the pusher 37. can do.

As shown in FIG. 4, the attachment/detachment device of the second embodiment using such a socket 30 eliminates the need to open and close the lid of the socket 30, so that the lid opening part 8 and the lid closing part of the first embodiment are not required. 11 can be omitted, so the structure becomes an hour wheel, but other than that, the structure is substantially the same as in Embodiment 1, so corresponding parts are given the same reference numerals as in Embodiment 1, and detailed explanation thereof will be omitted. Omitted.

Next, to explain the operation of storing a workpiece into the socket 30 in the second embodiment, the surface mount type 1c2a, which is an example of the workpiece, is placed in the workpiece take-out section 9 as shown in FIG.
By pushing down the upper plate 34 with the button 37, the contact terminal 3 is pushed down by the tapered surface 36 of the upper plate 34.
The inner portion of the branch portion 33 of the contact terminal 32 is elastically bent outward to separate the branch portion 33 of the contact terminal 32 from the conductive portion of the surface-mounted IC 2a. Therefore, in this state, the vacuum suction means (
surface mount type 1c2 after aging is completed by
a can be removed from the socket 30 through the opening 35.

On the other hand, when the push-down force by the pusher 37 is released, the upper plate 34 returns inward due to the elastic restoring force of the branch portion 33 of the contact terminal 32 and the action of the tapered surface 36, as shown in FIG. This makes it possible to conduct an aging test by making conductive contact with the parts.

As described above, according to the second embodiment, the following effects can be obtained.

+11. By having a socket y 30 without an i and a contact terminal 32 having a branch part 33, the surface mount type IC 2
A can be easily automatically attached and detached for aging inspection.

+2+, By (1), the structure of the mounting Hw can be simplified (3), and in the present Example 1, the effects obtained by the above-mentioned Example 2 can also be obtained.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above Examples, and various modifications may be made without departing from the gist of the invention.
Needless to say, it is J-Noh.

For example, any means can be used as the workpiece attachment/detachment means, conveyance means, etc.

Further, the attachment/detachment device of the present invention may be configured as a device exclusively for either taking out or inserting a workpiece. That is, the present invention can be applied not only to the attachment/detachment device but also to dedicated devices for the insertion device and the extraction device.

Further, the shape of the contact terminal of the socket is not limited to this embodiment, and various shapes can be used as long as the socket can be opened and closed with one touch.

In the above description, the invention made by the present inventor was mainly applied to the field of application of the invention, which is the attachment and detachment of FPP type and PLCC type semiconductor devices, but is not limited thereto. It may also be applied to other types of semiconductor devices.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, the workpiece can be automatically attached and detached, and work efficiency can be improved. In addition, bending and deformation of the lead can be prevented, and work can be performed reliably and stably.

Note that the term "detachable device" used in this specification has a broad meaning that also includes "insertion device" or "extraction device."

[Brief explanation of drawings]

FIG. 1 is a schematic plan view of an attachment/detachment device according to an embodiment of the present invention, FIG. 2 is a partial sectional view showing the socket lid opening operation, FIG. 3 is a partial sectional view showing the socket lid closing operation, and FIG. FIG. 4 is a plan view of an attachment/detachment device according to another embodiment of the present invention, FIG. 5 is a partial sectional view showing the workpiece holding state, and FIG. 6 is a partial sectional view showing the contact terminal in the open state. DESCRIPTION OF SYMBOLS 1... Base, 2... Flat package type semiconductor device (FPP type IC) (work), 2a-- Surface mount type semiconductor device (surface mount type IC) (work), 3... Aging board, 4... Supply unit, 5... Aging board transfer system, 6... Storage unit, 7... Socket, 7a.
... Holding projection, 8... Lid opening part, 9... Workpiece take-out part, 10... Workpiece insertion part, 11... Lid closing part,
12... Workpiece conveyance system, 13... Workpiece supply section, 1
4... Work storage part, 15... Main body, 16... Shaft, 17... Cold, 18... Storage hole, 19... Lead terminal, 20... Contact terminal, 21... Axis, 22...
Locking piece, 23... Locking protrusion, 24... Locking portion, 25
...Release claw, 26...Lid opening piece, 27...Lid closing part roller, 28...Lid closing block, 30...Socket, 31...Base, 33... Branch part, 34...
Upper plate, 35... Opening, 36... Tapered surface, 3
7...butsusha (pushing body). 1st Figure 3-1-:゛゛~7~7 Ghi Autumn Harvest Goose Inner Rod 2 Figure! ! −′−１２６＋ 、、、、／ □F M Y Figure 4 Figure 5 Figure 6

Claims (1)

[Scope of Claims] 1. An aging board transport system that transports an aging board equipped with a socket with a lid; a work transport system that transports a workpiece to be attached to and removed from the socket; A workpiece attachment/detachment device comprising a workpiece attachment/detachment section that automatically opens or closes a socket lid and inserts or takes out a workpiece into or out of the socket. 2. The socket includes a socket body, a lid attached to the socket body so as to be able to swing open and close, and a contact terminal that is in conductive contact with the terminal of the workpiece, and which swings around an axis and is connected to the socket body. The attachment/detachment device according to claim 1, further comprising a locking piece having a locking protrusion that can be engaged with the locking portion. 3. The work attachment/detachment part engages with a part of the locking piece of the socket and swings the locking piece, thereby detaching the locking protrusion from the locking part of the socket body. The attachment/detachment device according to claim 2, further comprising a lid opening means that operates to open the lid. 4. The workpiece attachment/detachment section has a lid closing means that operates to swing and close the lid in a closing direction by abutting and pushing the locking piece of the socket. An attachment/detachment device according to claim 2. 5. The attachment/detachment device according to any one of claims 1 to 4, wherein the workpiece is a flat package type semiconductor device. 6. An aging board transport system that transports an aging board equipped with a socket with a lid, a work transport system that transports a work to be attached to and removed from the socket, and a lid for the socket provided in the middle of the aging board transport system. a lid opening section that opens the lid, a workpiece takeout section that takes out the workpiece from the socket with the lid open, a workpiece insertion section that inserts the workpiece that has been transported along the workpiece transport system into the socket; and a lid closing part for closing the lid of the socket into which the socket is inserted. 7. The socket includes a socket body, a lid attached to the socket body so as to be able to swing open and close, and a contact terminal that is in conductive contact with the terminal of the workpiece, and which swings around an axis and is connected to the socket body. 7. The attachment/detachment device according to claim 6, further comprising a locking piece having a locking protrusion that can be engaged with the locking portion. 8. The lid opening part engages with a part of the locking piece of the socket and vibrates the locking piece, thereby detaching the locking protrusion from the locking part of the socket body and 8. The attachment/detachment device according to claim 6, further comprising a lid opening means that operates to open the lid. 9. The lid closing part is characterized by having a lid closing means that operates to swing and close the lid in the closing direction by abutting and pushing the locking piece of the socket. An attachment/detachment device according to claim 7. 10. The attachment/detachment device according to any one of claims 6 to 9, wherein the workpiece is a flat package type semiconductor device. 11. An aging board transport system that transports an aging board with a socket mounted thereon, a work transport system that transports a workpiece to be attached to and removed from the socket, and inserting or removing a workpiece into or out of the socket during the aging board transport system. A workpiece attachment/detachment device comprising a workpiece attachment/detachment section. 12. The socket has a base, a contact terminal provided on the base and having a branch part that can be opened and closed on the workpiece insertion side, and an opening for receiving the workpiece, and when pushed toward the base, the socket contacts the terminal of the workpiece. 12. The attachment/detachment device according to claim 11, further comprising a pushing body which separates the workpiece from the contact terminal and brings the terminal of the workpiece into conductive contact with the contact terminal when not being pushed. 13. The attachment/detachment device according to claim 11 or 12, wherein the workpiece is a surface-mounted semiconductor device. 14. An aging board transport system that transports an aging board with a socket mounted thereon, a work transport system that transports a workpiece to be attached to and removed from the socket, and a workpiece insertion system that inserts a workpiece into the socket midway through the aging board transport system. a workpiece take-out part for taking out the workpiece from the socket in the middle of the aging board transport system;
An attachment/detachment device comprising a pushing means that pushes the pushing body of the socket toward the base in the workpiece take-out portion to separate the workpiece from a conductive contact state with the contact terminal of the socket. 15. The contact terminal of the socket has a branch part that can be opened and closed on the workpiece insertion side, and this branch part separates the terminal of the workpiece from the branch part when the pushing body is pushed toward the base. 15. The attachment/detachment device according to claim 14, wherein when the workpiece is not pushed, the terminal of the workpiece is opened and closed so as to bring the branch part into conductive contact. 16. The attachment/detachment device according to claim 14 or 15, wherein the workpiece is a surface-mounted semiconductor device.