JPH0715175A - Supplying tape for semiconductor element and feeding device for the tape - Google Patents

Abstract

PURPOSE:To provide such a semiconductor element supplying tape that bare semiconductor elements having no protective coating are accurately positioned on the tape and the tooth section of a geta (Japanese wooden footgear)-type collet can easily hold the semiconductor elements. CONSTITUTION:A cavity section B which houses a semiconductor element 1 is formed in such a way that the shape of the section B on its bottom side is decided in accordance with the shape of the element 1 and that on its opening side (6) is made larger than that of the element 1 so that the tooth section of a geta-type collet 8 can get between the element 1 and the opening side 6 internal side face of the cavity section B.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element supplying tape and a semiconductor element supplying tape supplying apparatus used for manufacturing a semiconductor electronic device, and more particularly to supplying a bare semiconductor element having no protective coating. The present invention relates to a semiconductor element supplying tape and a semiconductor element supplying tape supplying device used in the case of performing.

[0002]

2. Description of the Related Art A conventional semiconductor element supplying tape and a semiconductor element supplying tape supplying apparatus will be described with reference to FIGS.

As shown in FIG. 7, a semiconductor element supply tape A includes a cavity tape 2 that forms a side surface 50 of a cavity portion B that houses the semiconductor element 1, and a cavity portion B.
Bottom tape 4 attached to the bottom surface of the cavity tape 2 to form the bottom surface of the cavity tape 2, the top tape 3 attached to the top surface of the cavity tape 2 so that the semiconductor element 1 does not fall from the cavity B, and the semiconductor element supply And a carrying hole 7 provided for carrying the tape A.

A state in which the semiconductor element 1 is taken out from the semiconductor element supply tape A will be described with reference to FIGS. 8 and 9.

FIG. 8 is a view showing a state in which the semiconductor element 1 is taken out by the suction tweezers 80 having the vacuum suction hole 10. The semiconductor element supplying tape A is at the semiconductor element taking-out position 20 of the semiconductor element supplying tape feeding device C. Before reaching, the top tape 3 is peeled off, and at the semiconductor element take-out position 20, the semiconductor element supplying tape A is pressed by the pressing plate 30 of the semiconductor element supplying tape supplying device C, and the suction tweezers 80 are The semiconductor element 1 is adsorbed and taken out by the vacuum of the vacuum suction hole 10 and mounted on the substrate 40. The pressing plate 30 regulates the conveyance of the semiconductor element supplying tape A on a predetermined track on the tape conveying surface of the semiconductor element supplying tape supplying device C.

FIG. 9 is a view showing a state in which the semiconductor element 1 is taken out by the getter-type collet 8 having the vacuum suction hole 10 and the tooth portion 9 holding the semiconductor element 1, and the semiconductor element supplying tape A is used for semiconductor element supplying. Before reaching the semiconductor element taking-out position 20 of the tape feeding device C, the top tape 3 is peeled off, and at the semiconductor element taking-out position 20, the semiconductor element feeding tape A is pressed by the pressing plate 30 of the semiconductor element feeding tape feeding device C. In the pressed state, the tooth portion 9 of the getter-type collet 8 holds the semiconductor element 1 and the vacuum suction hole 1
The semiconductor element 1 is adsorbed and taken out by a vacuum of 0 and mounted on the substrate 40. In this case, the semiconductor element 1 is in contact with the getter-type collet 8 and its tooth portion 9 only at the edge portion of the upper surface of the semiconductor element 1, and between the upper surface of the semiconductor element 1 and the getter-type collet 8 is slight. With the gap left, the semiconductor element 1 is attracted to the getter-type collet 8 by the vacuum of the vacuum suction hole 10. Therefore, the semiconductor device 1
In the case where is a semiconductor element without protective coating, such as a bare IC, a getter-type collet 8 is used. The tooth portions 9 of the getter-type collet 8 may be provided on four sides of the getter-type collet 8 or may be provided only on two opposite sides.

[0007]

However, in the structure of the conventional example described above, when the semiconductor element 1 is taken out by the suction tweezers 80 as shown in FIG. 8, the semiconductor element is a semiconductor element having a protective coating. If there is no problem,
If the semiconductor element is a bare semiconductor element without a protective coating, for example, a bare IC, the circuit of the bare IC is damaged by the suction tweezers 80, and thus there is a problem that it cannot be used.

Further, as shown in FIG. 9, a getter-type collet 8 is provided.
When the semiconductor element 1 is taken out by the method, the semiconductor element 1 is accurately positioned at the semiconductor element taking-out position 20 of the tape feeding device C for supplying the semiconductor element, and the tooth portion 9 of the getter-type collet 8 easily holds the semiconductor element 1. In such a state, as shown in FIG. 10, the getter-type collet 8 can stably take out the semiconductor element 1, but the difference between the size of the cavity portion B and the size of the semiconductor element 1 is reduced. When the positioning of the semiconductor element 1 is performed accurately, the tooth portion 9 of the getter-type collet 8 is held when the semiconductor element 1 is held.
11 interferes with the upper surface of the side of the cavity B and cannot hold the semiconductor element 1. As shown in FIG. 11, the semiconductor element 1 tilts with respect to the getter collet 8 and the getter collet 8 is stable. Then, there is a problem that the semiconductor element 1 cannot be taken out.
As shown in FIG. 2, the size of the cavity B is made larger than that of the semiconductor element 1 so that the teeth 9 of the getter-type collet 8 are formed.
13 makes it easier to hold the semiconductor element 1, the semiconductor element 1 moves within the cavity B as shown in FIG. 13, and the positioning of the semiconductor element 1 becomes inaccurate. Also in this case, as shown in FIG. As described above, the getter-type collet 8 cannot properly adsorb the semiconductor element 1.

The present invention solves the above problems, accurately positions a bare semiconductor element without a protective coating, and supplies the semiconductor element in which the teeth of the getter-type collet easily hold the semiconductor element. An object of the present invention is to provide a tape and a tape supply device for supplying semiconductor elements.

[0010]

In order to solve the above-mentioned problems, a tape for supplying a semiconductor element according to the first invention of the present application has a cavity portion for accommodating a semiconductor element, and the shape of the cavity portion is formed on the bottom side of the cavity portion. It is formed according to the shape of the semiconductor element, and the shape of the cavity on the opening side of the cavity is larger than the shape of the semiconductor element so that the teeth of the getter-type collet are located inside the opening of the semiconductor element and the cavity. It is characterized in that it is formed so as to enter between the side surface.

In order to solve the above problems, the semiconductor element supply tape according to the second aspect of the present invention has a shape in which a getter type collet having a width smaller than the size of the semiconductor element is adsorbed to the semiconductor element. It is characterized in that it has a cavity portion which is also formed in a cross shape.

In order to solve the above-mentioned problems, the semiconductor element supplying tape feeding device of the third invention of the present application is a semiconductor element feeding tape pressing plate provided near the semiconductor element taking-out position, and a semiconductor element at the semiconductor element taking-out position. It is provided on the supply tape feeding surface, retracts so as not to interfere with the feeding of the semiconductor element feeding tape when the semiconductor element feeding tape is fed, and is pressed by the semiconductor element feeding tape holding plate when the semiconductor element is taken out. It is characterized in that it has a pushing-up convex portion that rises from the lower side of the cavity portion of the semiconductor element supply tape so as to push up the semiconductor element accommodated in the cavity portion.

In order to solve the above problems, the semiconductor element supply tape supply device of the third invention of the present application is such that the pushing-up convex portion vacuum-adsorbs the lower side of the cavity of the semiconductor element supply tape. It is preferable to have a ventilation hole of.

In order to solve the above-mentioned problems, the semiconductor element supplying tape supply device according to the third aspect of the present invention is preferably such that the semiconductor element supplying tape has a ventilation hole at the bottom of the cavity. is there.

In order to solve the above-mentioned problems, the semiconductor element supplying tape supply device according to the fourth aspect of the present invention forms a cavity tape forming a side surface of a cavity for accommodating a semiconductor element and a bottom surface of the cavity. A semiconductor element supply tape having a bottom tape attached to the bottom surface of the cavity tape and a top tape attached to the upper surface of the cavity tape so that the semiconductor element does not fall from the cavity portion are used. Has a peeling means for peeling the bottom tape before reaching the semiconductor element take-out position.

[0016]

In the tape for supplying a semiconductor element of the first invention of the present application, the cavity portion for housing the semiconductor element is formed on the bottom side of the cavity portion so that the shape of the cavity portion matches the shape of the semiconductor element, and the opening of the cavity portion is formed. On the part side, the shape of the cavity part is made larger than the shape of the semiconductor element so that the tooth part of the getter-type collet is formed so as to enter between the semiconductor element and the inner surface on the opening side of the cavity part.
Accurate positioning of the semiconductor element by making the bottom side of the cavity formed according to the shape of the semiconductor element slightly larger than the dimension of the semiconductor element, that is, by the difference within the positioning tolerance error range. In addition, since the tooth portion of the getter-type collet that attempts to adsorb the accurately positioned semiconductor element does not interfere with the upper surface of the side surface of the cavity portion, the getter-type collet is stable and accurate. The element can be adsorbed.

The semiconductor element supply tape according to the second aspect of the present invention is a cavity formed in a cross shape in accordance with a shape in which a getter-type collet having a width smaller than the size of the semiconductor element is adsorbed to the semiconductor element. Since it has a portion, it is necessary to insert the tooth portion of the getter-type collet between the side surface of the cavity portion and the semiconductor element to adsorb the semiconductor element regardless of the size of the portion of the cavity portion that accommodates the semiconductor element. Since it is possible to enlarge the cavity portion, it is possible to accurately position the semiconductor element by matching the dimension of the portion of the cavity portion that accommodates the semiconductor element with the dimension of the semiconductor element, and to enlarge the cavity portion. , The upper surface of the side surface of the cavity part can be prevented from interfering with the getter-type collet that is trying to adsorb the semiconductor element, so that the getter-type collet is stable and positive. It can adsorb the semiconductor element.

A semiconductor element supplying tape feeding device according to the third invention of the present application is provided on a semiconductor element feeding tape feeding surface at a semiconductor element taking-out position, and when the semiconductor element feeding tape is fed, the semiconductor element feeding tape is fed. So that the semiconductor element stored in the cavity is pushed up from below the cavity of the semiconductor element supply tape that is held by the semiconductor element supply tape holding plate when removing the semiconductor element. Since the semiconductor device has an upward pushing convex portion, in order to accurately position the semiconductor element, the size of the portion of the semiconductor element supply tape to be used for accommodating the semiconductor element in the cavity portion of the tape is equal to that of the semiconductor element. Even if there is no room for the getter-type collet to enter between the side surface of the part and the semiconductor element, inside the cavity Semiconductor element, pushed up to the push-up projection portion, since protrude from the upper surface of the semiconductor device supply tape, Geta type collet can easily adsorb the semiconductor element stably.

Further, in the tape feeding device for supplying semiconductor elements according to the third aspect of the present invention, when the pushing-up convex portion pushes up the semiconductor element housed in the cavity portion from below the cavity portion of the tape for feeding semiconductor element. In some cases, the bottom of the cavity is pushed up with a roundness, the semiconductor element is tilted, and it may be difficult for the getter-type collet to adsorb the semiconductor element. When the lower side of the cavity portion has a vent hole for vacuum suction, the bottom surface of the cavity portion pushed up with a roundness has a bottom surface of the cavity portion that is pushed up by the vacuum suction of the vent hole of the push-up protrusion portion. Since it is attracted to the upper surface of and is horizontal, the getter-type collet is stable and can easily attract the semiconductor element. When the bottom tape of the cavity portion is formed by attaching the bottom tape to the bottom surface of the cavity tape that forms the side surface of the cavity portion, wrinkles and warps occur, and the wrinkles and warps cause the semiconductor element to have a flatness level. Although it may be damaged, even against these wrinkles and sleds,
The vacuum suction of the vent hole allows the semiconductor element to be sucked onto the upper surface of the pushing-up convex portion to reduce the influence of wrinkles and warpage and improve the levelness of the semiconductor element. In addition, the third application
In the semiconductor element supply tape supply device of the invention, when the semiconductor element supply tape to be supplied has a ventilation hole at the bottom of the cavity, by vacuum suction through the ventilation hole,
Not only the bottom of the cavity, but the semiconductor element itself can be vacuum-adsorbed on the upper surface of the raised protrusion, so the bottom of the cavity pushed up with the roundness and the improvement of wrinkles and warpage of the bottom tape are further improved. It can be done effectively.

The semiconductor element supply tape supply device according to the fourth aspect of the present invention is attached to the bottom surface of the cavity tape so as to form the side surface of the cavity portion for housing the semiconductor element and the bottom surface of the cavity portion. Before using the semiconductor element supply tape having a bottom tape and a top tape attached to the upper surface of the cavity tape so that the semiconductor element does not fall from the cavity, the semiconductor element supply tape reaches the semiconductor element removal position. In addition, since it has a peeling means for peeling the bottom tape, the semiconductor element is directly held at the semiconductor element taking-out position portion of the semiconductor element feeding tape feeding device at the semiconductor element taking-out position of the semiconductor element feeding tape feeding device. Since it has a shape, the problem of horizontality of the semiconductor element is eliminated, and the getter type collet is inexpensive. It is possible to adsorb the semiconductor element is.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the semiconductor element supplying tape of the present invention will be described with reference to FIG.

1A and 1B are a plan view and a sectional view taken along line XX of the first embodiment, in which a semiconductor element supply tape A is a cavity portion B for accommodating the semiconductor element 1. Of the cavity tape 2 that forms the side surface of the cavity portion 2, the bottom tape 4 that is attached to the bottom surface of the cavity tape 2 to form the bottom surface of the cavity portion B, and the cavity tape 2 that prevents the semiconductor element 1 from falling from the cavity portion B. Has a top tape 3 attached to the upper surface thereof and a transport hole 7 provided for transporting the semiconductor element supply tape A. Then, a cavity portion B for accommodating the semiconductor element 1
On the bottom side of the cavity B, the shape of the cavity B is formed to match the shape of the semiconductor element 1, and on the opening side of the cavity B, the shape of the cavity B is made larger than that of the semiconductor element 1. The tooth portion 9 of the getter-type collet 8 is formed so as to be inserted between the semiconductor element 1 and the inner side surface of the cavity portion B on the opening side. The sloped portion 6 that widens the opening is provided on the opening side portion of the side surface, and the bottom side portion of the side surface of the cavity B is accommodated in the semiconductor element 1 to be housed.
With respect to the above dimension, the vertical portion 5 is formed in which the cavity portion B having a dimension capable of keeping the positioning error of the semiconductor element 1 within the allowable range is obtained.

The state in which the semiconductor element 1 is taken out from the semiconductor element supply tape A of the first embodiment is shown in FIGS. 1 (3) and 1 (4).
It will be described based on.

In FIG. 1, (3) and (4) are vacuum suction holes 10.
By the getter-type collet 8 having the tooth portion 9 holding the semiconductor element 1, the semiconductor element not protected by
That is, in this embodiment, it is a diagram showing a state in which the bare IC is taken out.

In (3) and (4) of FIG. 1, the semiconductor element supplying tape A is applied to a tape holding means (not shown) of the semiconductor element supplying tape supplying apparatus C, and the semiconductor element supplying tape supplying apparatus C is provided. Before being conveyed by the conveying means (not shown) and reaching the semiconductor element taking-out position 20, the top tape 3 is peeled off by the peeling means (not shown) of the semiconductor element supplying tape supplying device C, and the semiconductor element taking-out position 20 In the state where the semiconductor element supplying tape A is pressed by the pressing plate 30 of the semiconductor element supplying tape supplying apparatus C, the tooth portion 9 of the getter-type collet 8 holds the semiconductor element 1 and the semiconductor element 1 is vacuumed by the vacuum suction hole 10. The element 1 is adsorbed, taken out, and mounted on the substrate 40. In this case, the semiconductor element 1 is in contact with the getter-type collet 8 and its tooth portion 9 only at the edge portion of the upper surface of the semiconductor element 1, and between the upper surface of the semiconductor element 1 and the getter-type collet 8 is slight. With the gap left, the semiconductor element 1 is attracted to the getter-type collet 8 by the vacuum of the vacuum suction hole 10. Therefore, even if the semiconductor element 1 is a bare IC or the like without a protective coating, it can be mounted without damaging the bare IC circuit. The tooth portions 9 of the getter-type collet 8 may be provided on four sides of the getter-type collet 8 or may be provided only on two opposite sides. The pressing plate 30 has been conventionally used, and regulates the transportation of the semiconductor element supply tape A on a predetermined track on the tape transportation surface of the semiconductor element supply tape feeder C.

Then, in the first embodiment, as described above,
Since the bottom side portion of the side surface of the cavity portion B forms a vertical portion 5 having a dimension that allows the positioning error of the semiconductor element 1 to be within an allowable range with respect to the dimension of the semiconductor element 1 to be housed. The element 1 is accurately positioned at the semiconductor element extraction position 20. Further, as described above, the opening side portion of the side surface of the cavity B is formed into the sloped portion 6 having a wide opening, and the tooth portion 9 of the getter-type collet 8 enters the sloped portion 6. The tooth portion 9 securely holds the edge portion of the upper surface of the semiconductor element 1 which is accurately positioned, and the semiconductor element 1 is vacuumed by the vacuum suction hole 10.
Adsorb. The sucked semiconductor element 1 is mounted on the substrate 40.

In this embodiment, the side surface of the cavity B is divided into the sloped portion 6 and the vertical portion 5, but the ratio between the sloped portion 6 and the vertical portion 5 can be freely designed. Further, a stepped portion may be provided instead of the sloped portion 6 and the vertical portion 5.

A second embodiment of the semiconductor element supplying tape of the present invention will be described with reference to FIG.

2A and 2B are a plan view and a sectional view taken along the line Y-Y of the second embodiment. A semiconductor element supply tape A is a cavity portion B for accommodating the semiconductor element 1. Of the cavity tape 2 for forming the bottom surface of the cavity portion B, the bottom tape 4 attached to the bottom surface of the cavity tape 2 for forming the bottom surface of the cavity portion B, and the cavity tape 2 for preventing the semiconductor element 1 from falling from the cavity portion B. It has a top tape 3 attached to the upper surface and a transport hole 7 provided for transporting the semiconductor element supply tape A. The cavity portion B is formed of a semiconductor element portion 11 matching the shape of the semiconductor element 1 and a getter-type collet portion 12 into which the getter-type collet 8 is inserted, and the semiconductor element 1 is smaller than the semiconductor element 1 in size. It is characterized by having a cross shape in a state in which a getter-type collet 8 having a width as a dimension is adsorbed. And these side surfaces are vertical surfaces. In the present embodiment, the semiconductor element portion 11 is formed to have a size that allows the positioning error of the semiconductor element 1 to be within an allowable range with respect to the size of the semiconductor element 1 to be housed. It enables accurate positioning.

The state in which the semiconductor element 1 is taken out from the semiconductor element supply tape A of the second embodiment is shown in FIGS. 2 (3) and 2 (4).
It will be described based on.

(3) and (4) of FIG.
The semiconductor element 1 not protected by the getter-type collet 8 having the tooth portion 9 holding the semiconductor element 1
That is, in this embodiment, it is a diagram showing a state in which a bare IC is taken out.

2 (3) and (4), the semiconductor element supplying tape A is applied to the tape holding means (not shown) of the semiconductor element supplying tape supplying apparatus C, and the semiconductor element supplying tape supplying apparatus C is provided. Before being conveyed by the conveying means (not shown) and reaching the semiconductor element taking-out position 20, the top tape 3 is peeled off by the peeling means (not shown) of the semiconductor element supplying tape supplying device C, and the semiconductor element taking-out position 20 In the state where the semiconductor element supplying tape A is held by the holding plate 30 of the semiconductor element supplying tape feeding device C, the tooth portion 9 of the getter-type collet 8 holds the semiconductor element 1 and the semiconductor element 1 is held by the vacuum suction hole 10 to generate a semiconductor The element 1 is adsorbed, taken out, and mounted on the substrate 40.

Then, in the second embodiment, as described above,
The semiconductor element portion 11 on the side surface of the cavity B is formed to have a dimension that allows a positioning error of the semiconductor element 1 to be within an allowable range with respect to the dimension of the semiconductor element 1 to be housed. Since the semiconductor element 1 can be accurately positioned, the semiconductor element 1 is accurately positioned at the semiconductor element take-out position 20. Further, as described above, since the getter type collet portion 12 into which the getter type collet 8 is inserted is formed on the side surface of the cavity portion B, the tooth portion 9 of the getter type collet 8 enters the getter type collet portion 12, The tooth portion 9 securely holds the edge portion of the upper surface of the semiconductor element 1 which is accurately positioned, and sucks the semiconductor element 1 by the vacuum of the vacuum suction hole 10. The sucked semiconductor element 1 is mounted on the substrate 40.

In the present embodiment, the getter-type collet portion 12 into which the getter-type collet 8 is inserted is provided in two vertical and horizontal directions, but it may be provided in one direction. Also in this case, the cavity B
Is a cross shape.

A third embodiment of the semiconductor element supplying tape supplying apparatus of the present invention will be described with reference to (1) and (2) of FIG.

(1) and (2) of FIG. 3 are a sectional view showing the structure of the main part of the third embodiment and a sectional view showing the operation thereof.
The semiconductor element supply tape A is a cavity tape 2 that forms a side surface of a cavity portion B that houses the semiconductor element 1.
A bottom tape 4 attached to the bottom of the cavity tape 2 to form the bottom of the cavity B, and a top tape 3 attached to the top of the cavity tape 2 so that the semiconductor element 1 does not fall from the cavity B. Have and. The side surface of the cavity portion B is a vertical surface, and the cavity portion B is formed to have a dimension that allows a positioning error of the semiconductor element 1 to be within an allowable range with respect to the dimension of the semiconductor element 1 to accurately position the semiconductor element 1. I am able to do it. In this case, the semiconductor element 1 can be accurately positioned, but the tooth portion 9 of the getter-type collet 8 interferes with the side portion of the cavity portion B, so that the tooth portion 9 of the getter-type collet 8 remains as it is. I can't hold the element 1.

As a countermeasure against this, in the present embodiment, the semiconductor element take-out position 2 of the semiconductor element supplying tape supplying apparatus C is used.
When the semiconductor element supplying tape A is conveyed, the semiconductor element supplying tape A is withdrawn so as not to hinder the conveyance, and when the semiconductor element 1 is taken out, the semiconductor element supplying tape A is pressed by the pressing plate 30 of the semiconductor element supplying tape supplying apparatus C. From the lower side of the cavity portion B of the semiconductor element supply tape A, there is provided a pushing-up convex portion 13 that rises so as to push up the semiconductor element 1 housed in the cavity portion B.

A state in which the semiconductor element 1 is taken out from the semiconductor element supplying tape A by the semiconductor element supplying tape supplying apparatus C of the third embodiment will be described with reference to FIGS. 3 (1) and 3 (2).

(1) and (2) of FIG.
The semiconductor element 1 not protected by the getter-type collet 8 having the tooth portion 9 holding the semiconductor element 1
In this embodiment, it is a diagram showing a state in which a bare IC is taken out.

In FIGS. 3A and 3B, the semiconductor element supplying tape A is a semiconductor element supplying tape supplying device C.
Before reaching the semiconductor element taking-out position 20 of FIG. 2, the top tape 3 is peeled off, and the semiconductor element feeding tape A is held by the holding plate 30 of the semiconductor element feeding tape feeding device C at the semiconductor element taking-out position 20. Then, the push-up convex portion 13 rises, the semiconductor element 1 is pushed up together with the bottom tape 4 by the push-up convex portion 13, and the upper portion thereof projects upward from the cavity tape 2. The protruding portion of the semiconductor element 1 is held by the tooth portion 9 of the getter-type collet 8, and the semiconductor element 1 is adsorbed and taken out by the vacuum of the vacuum suction hole 10 and mounted on the substrate.

A fourth embodiment of the tape supplying apparatus for supplying a semiconductor element of the present invention will be described with reference to (1) and (2) of FIG.

In the third embodiment, the getter-type collet 8 allows the semiconductor element 1 to be stably adsorbed, but the push-up protrusion 13 is formed from the lower side of the cavity B of the semiconductor element supply tape A. When pushing up the semiconductor element 1 housed in the cavity portion B, the bottom surface of the cavity portion B is pushed up with a roundness, and the semiconductor element 1 tilts.
As shown in, it may be difficult for the getter-type collet 8 to adsorb the semiconductor element 1. The implementation of this measure is the fourth embodiment.

(1) and (2) of FIG. 4 are a sectional view showing the structure of the main part of the fourth embodiment and a sectional view showing the operation thereof.
The fourth embodiment is different from the third embodiment in that, as a measure against the above-mentioned improvement, a ventilation hole for vacuum-sucking the lower side of the cavity B of the semiconductor element supply tape A to the pushing-up convex portion 13 is provided. Only 14 is provided. With this vent hole 14, the bottom surface of the cavity portion B pushed up with a roundness is attracted to the upper surface of the push-up convex portion 13 by the vacuum suction of the vent hole 14 of the push-up convex portion 13 and becomes horizontal. Therefore, the getter-type collet 8 can stably and easily adsorb the semiconductor element 1. When the bottom tape 4 is attached to the bottom surface of the cavity tape 2 that forms the side surface of the cavity portion B to form the bottom surface, wrinkles and warps occur, and the horizontal direction of the semiconductor element 1 is generated. The degree may be impaired, but even against these wrinkles and sleds,
By vacuum suction through the air holes 14, the levelness of the semiconductor device 1 can be improved.

A fifth embodiment of the semiconductor element supplying tape supplying apparatus of the present invention will be described with reference to (1) and (2) of FIG.

The fifth embodiment implements a measure to further ensure the operation of the above-mentioned fourth embodiment.

(1) and (2) of FIG. 5 are a sectional view showing the structure of the main part of the fifth embodiment and a sectional view showing the operation thereof.
The fifth embodiment differs from the fourth embodiment only in that a ventilation hole 15 is provided at the bottom of the cavity B of the semiconductor element supply tape A used. This vent 15
Then, the bottom surface of the cavity B pushed up by the push-up convex portion 13 with a roundness is adsorbed on the upper surface of the push-up convex portion 13 by the vacuum suction of the ventilation hole 14 of the push-up convex portion 13 and is leveled. At the same time, since the above-mentioned vacuum suction action also acts on the semiconductor element 1 through the ventilation holes 14 and 15, the semiconductor element 1 is further pushed up at the position pushed up by the pushing-up convex portion 13. It is adsorbed on the upper surface of the convex portion 13 and its levelness is further improved. In this case, the vacuum suction force acting on the semiconductor element 1 is transmitted through the ventilation holes 14 and 15, and there is a gap between the ventilation holes 14 and 15, so that the getter-type collet 8 by the vacuum suction hole 10 is removed. It is smaller than the vacuum suction force and does not hinder the vacuum suction action of the semiconductor element 1 of the getter-type collet 8. Of course, when the getter-type collet 8 vacuum-sucks the semiconductor element 1, the vacuum suction by the vent holes 14 and 15 may be stopped.

A sixth embodiment of the semiconductor element supplying tape supplying apparatus of the present invention will be described with reference to FIG.

FIG. 6 is a sectional view showing the structure of the main part of the sixth embodiment.

In FIG. 6, the semiconductor element supply tape A used in the sixth embodiment is the semiconductor element supply tape A of the second embodiment. When using the semiconductor element supply tape A of the second embodiment, the bottom tape 4 attached to the lower surface of the cavity tape 2 may have wrinkles or warps. Even if 1 is accurately positioned, the wrinkles and warps may cause the semiconductor element 1 to rise and tilt, and the getter-type collet 8 cannot reliably adsorb the semiconductor element 1. In the sixth embodiment, as a countermeasure against this, the semiconductor element supplying tape supplying device C is provided with the bottom tape 4 before the semiconductor element supplying tape A reaches the semiconductor element taking-out position 20 of the semiconductor element supplying tape supplying device C. A peeling means D for peeling is provided. Of course, the top tape 3 of the tape A for supplying semiconductor elements
Also, the semiconductor element supplying tape A is peeled off before reaching the semiconductor element taking-out position 20 of the semiconductor element supplying tape supplying apparatus C. Further, a ventilation hole 16 for vacuum-sucking the semiconductor element 1 in the cavity B of the semiconductor element supplying tape A is provided at the semiconductor element take-out position 20 of the semiconductor element supplying tape supplying device C.

The operation of the sixth embodiment will be described with reference to FIG.

In FIG. 6, the semiconductor element supplying tape A of the second embodiment is applied to a tape holding means (not shown) of the semiconductor element supplying tape supplying apparatus C, and the semiconductor element supplying tape supplying apparatus C is shown. The tape is conveyed to the semiconductor element take-out position 20 of the semiconductor element supplying tape supplying device C by a conveying means which is not provided. The semiconductor element supply tape A is peeled off by the peeling means (not shown) and the bottom tape 4 is peeled off by the peeling means D before reaching the semiconductor element take-out position 20. Cavity tape 2 of semiconductor element supply tape A in which top tape 3 and bottom tape 4 are separated
Holds the semiconductor element 1 in the cavity B and accurately positions it at the semiconductor element take-out position 20. In this case, since the bottom tape 4 is peeled off, the problem of the semiconductor element 1 being lifted or tilted due to the wrinkles and warps of the bottom tape 4 is eliminated. However, in this case,
The cavity tape 2 of the semiconductor element supply tape A, from which the top tape 3 and the bottom tape 4 have been peeled, holds the semiconductor element 1 in the cavity B and conveys it to the semiconductor element take-out position 20. Due to a stepped portion such as D, the semiconductor element may be lifted and tilted in an extremely rare case. As a countermeasure in this case, the semiconductor element 1 is vacuum-sucked through the vent hole 16 for vacuum-sucking the semiconductor element 1 in the cavity B of the semiconductor element supply tape A, and the levelness thereof is surely maintained. To do. The vacuum suction by the ventilation holes 14 and 15 is stopped when the getter-type collet 8 vacuum-sucks the semiconductor element 1.

Although the tape A for supplying semiconductor elements of the second embodiment is used in the sixth embodiment, the tape of the first embodiment may be used. Further, the ventilation hole 15 may be moved before the semiconductor element taking-out position 20, and its posture may be corrected before the semiconductor element 1 reaches the semiconductor element taking-out position 20.

[0053]

According to the semiconductor element supply tape of the present invention, the shape of the cavity is adjusted to the shape of the semiconductor element so that the semiconductor element accommodated in the cavity can be accurately positioned, and the semiconductor element is adsorbed. The shape of the getter-type collet does not interfere with the target getter-type collet, so that the getter-type collet can stably and accurately adsorb semiconductor elements, and it can be mounted stably without damaging bare semiconductor elements without protective coating. It has the effect of being able to.

The tape feeding apparatus for supplying a semiconductor element of the present invention has, at the semiconductor element take-out position, a pushing-up convex portion that is raised so as to push up the semiconductor element housed in the cavity, and also a pushing-up convex portion. Since it has a vent hole for vacuum suction of the lower side of the cavity of the semiconductor element supply tape, the position and posture of the pushed semiconductor element is stable, and the getter-type collet is stable and easily sucks the semiconductor element. There is an effect that can be done. The above effect can be improved by providing a ventilation hole on the bottom surface of the cavity of the semiconductor element supply tape.

Further, since the semiconductor element supplying tape supply device of the present invention has the separating means for separating the bottom tape before the semiconductor element supplying tape reaches the semiconductor element taking-out position, the bottom tape is wrinkled or warped. Therefore, the problem of the deterioration of the levelness of the semiconductor element due to the above is eliminated, and the getter-type collet can stably and easily adsorb the semiconductor element.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of a semiconductor element supply tape according to the present invention, its XX sectional view, and its operation.

FIG. 2 is a plan view of a second embodiment of a semiconductor element supply tape according to the present invention, its YY sectional view, and its operation.

FIG. 3 is a cross-sectional view showing a configuration of a third embodiment of a semiconductor element supply tape supplying apparatus of the present invention and a view showing its operation.

FIG. 4 is a cross-sectional view showing the configuration of a fourth embodiment of a semiconductor element supply tape feeding apparatus of the present invention and a diagram showing its operation.

5A and 5B are a cross-sectional view showing the configuration of a fifth embodiment of a semiconductor element supply tape feeding apparatus of the present invention and a diagram showing its operation.

FIG. 6 is a cross-sectional view showing the configuration of a sixth embodiment of the semiconductor element supplying tape supplying apparatus of the present invention.

FIG. 7 is a perspective view of a semiconductor element supply tape.

FIG. 8 is a diagram showing a configuration and an operation of a conventional semiconductor element supply tape and a suction tweezers.

FIG. 9 is a diagram showing a configuration and an operation of a semiconductor element supply tape and a getter-type collet in a conventional example.

FIG. 10 is a diagram showing a normal operation of the getter-type collet.

FIG. 11 is a diagram showing an abnormal operation of the getter-type collet.

FIG. 12 is a view showing an operation of the getter-type collet.

FIG. 13 is a diagram showing a positional shift of the semiconductor element in the cavity portion of the semiconductor element supply tape.

[Explanation of symbols]

 A semiconductor element supply tape B cavity portion C semiconductor element supply tape supply device D peeling means 1 semiconductor element 2 cavity tape 3 top tape 4 bottom tape 5 vertical portion (bottom side) 6 gradient portion (opening side) 8 getter type Collet 9 Tooth portion 10 Vacuum drawing hole 11 Semiconductor element portion 12 Getter-type collet portion 13 Push-up convex portion 14 Vent hole 15 Vent hole 20 Semiconductor element take-out position 30 Holding plate

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shiro Ohji 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] 1. A cavity for accommodating a semiconductor element,
On the bottom side of the cavity part, the shape of the cavity part is formed to match the shape of the semiconductor element, and on the opening side of the cavity part, the shape of the cavity part is made larger than the shape of the semiconductor element so that the tooth part of the getter-type collet is a semiconductor. A tape for supplying a semiconductor element, which is formed so as to be inserted between the element and an inner surface of the cavity portion on the opening side. 2. A semiconductor element having a cavity portion formed in a cross shape in conformity with a shape of a state in which a getter-type collet having a width smaller than the dimension of the semiconductor element is adsorbed to the semiconductor element. Supply tape. 3. A semiconductor element supplying tape pressing plate provided near a semiconductor element taking-out position and a semiconductor element supplying tape feeding surface at a semiconductor element taking-out position, wherein the semiconductor element feeding tape is carried at the time of feeding the semiconductor element feeding tape. The tape is retracted so as not to interfere with the feeding of the supply tape, and is accommodated in the cavity from below the cavity of the semiconductor element supply tape which is held by the semiconductor element supply tape pressing plate when the semiconductor element is taken out. A tape feeding device for feeding a semiconductor element, comprising: a push-up convex portion that rises so as to push up the semiconductor element. 4. The semiconductor element supply tape supply device according to claim 3, wherein the push-up convex portion has a ventilation hole for vacuum-sucking the lower side of the cavity of the semiconductor element supply tape. 5. The semiconductor element supply tape supply device according to claim 4, wherein the supplied semiconductor element supply tape has a ventilation hole at the bottom of the cavity. 6. A cavity tape which forms a side surface of a cavity for accommodating a semiconductor element, a bottom tape which is attached to a bottom surface of the cavity tape so as to form a bottom of the cavity, and the semiconductor element does not fall from the cavity. Using a semiconductor element supply tape having a top tape attached to the upper surface of the cavity tape, and having a peeling means for peeling the bottom tape before the semiconductor element supply tape reaches the semiconductor element take-out position A tape supply device for supplying a semiconductor element.