JP2000208600A - Processing method for wafer and wafer carrier case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the forward end part of a take-out jig from coming into contact with an adjacent wafer by disposing a base inclined to abut against the circumference of a wafer on the bottom of a wafer carrier case thereby providing a level difference at the upper end between adjacent wafers when they are contained. SOLUTION: A carrier guide 3 is provided on the inside of a wafer carrier case 1 and a base 4 having a specified inclination is disposed on the bottom in the direction orthogonal to a wafer being contained. Under a state where a plurality of wafers are contained, circumference of the wafer abuts on the base 4 and the wafers are arranged stepwise with a level difference appearing at the upper end between adjacent wafers arranged along the inclination of the base 4. Since a level difference is provided at the upper end between adjacent wafers by disposing an inclining base 4, the wafer can be taken out using the level difference and an adjacent wafer can be protected against adhesion of foreign matters or damages.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of processing a wafer in a semiconductor device manufacturing process and a wafer carrier case used for the method.

[0002]

2. Description of the Related Art A wafer carrier case is used for storing and moving a carrier containing a wafer therein. When processing a wafer, the carrier is taken out of the carrier case, and the wafer is taken out of the carrier with a jig and used.

[0003]

However, the wafers housed in the carrier are arranged in parallel at a narrow interval at the same height, and when the tip of the jig is inserted between the wafers to take out the wafers. In some cases, the jig comes into contact with an adjacent wafer.

As a result, foreign matter adheres to the wafer, or the wafer is damaged.

In the current situation where LSIs (Large Scale Integrated Circuits) are miniaturized, the attachment and scratches of minute foreign matter cause defective products.

[0006]

In order to solve the above-mentioned problems, the present invention provides a carrier accommodating a wafer by providing a pedestal at the bottom of a wafer carrier case with which the peripheral edge of the wafer abuts. When a wafer is placed in a wafer carrier case, a difference in height is generated at the upper end of an adjacent wafer.

[0007]

FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG. 2 is a perspective view showing a carrier to be placed in the wafer carrier case of FIG.

In FIG. 1, a wafer carrier case 1 is integrally injection-molded with, for example, a synthetic resin, and a frame 2 used for moving or the like is provided at an upper portion, and a guide 3 for inserting a carrier is provided at an inner portion. A pedestal 4 having a predetermined inclination is provided on the bottom in a direction orthogonal to the wafer to be stored.

The pedestal 4 may be integrally molded when the wafer carrier case 1 is molded, or may be separately formed and fixed with an adhesive or the like.

The carrier 5 shown in FIG. 2 is the same as the conventional one and is injection-molded with a synthetic resin.
7 inch wafer provided in the side surface 6 of the carrier 5
Fit and store.

When 25 wafers are stored in the carrier 5 and the wafer 5 is placed in the wafer carrier case 1, the peripheral portion of the wafer comes into contact with the pedestal 4. Since the pedestal 4 has an inclination, the wafers are arranged in a stepped manner.

FIG. 3 is a side view showing a state in which the wafers are arranged in a stepwise manner. A height difference h occurs at the upper end of adjacent wafers 8 arranged along the inclination of the pedestal 4.

Since the height difference h is used when the wafer 8 is taken out by a jig, the larger the difference, the better. However, it is appropriate to be about 5 to 6 mm in view of the structure of the current wafer carrier case.

For this purpose, it is desired that the inclination of the pedestal 4 be 50 ° or more for a 6-inch wafer and 45 ° or more for an 8-inch wafer.

Now, the wafers 8 are taken out one by one by a jig. When the jig is manually installed or when the jig is installed in an automatic machine, vacuum suction, an electrostatic chuck, or the like is performed. Then, the wafer 8 is brought into close contact with the tip of the jig and taken out.

The size of the tip of the jig depends on the product, but is, for example, 20 mm long, 15 mm wide and 3 mm thick. On the other hand, the interval between the wafers 8 is 5 to 6 mm, and the height difference h at the upper end is about 5 to 6 mm.

Ideally, the tip end of the jig to be sucked is exactly applied to the height difference h, but it is impossible to make the height difference h too large due to the structure of the wafer carrier case 1.

However, the height difference h of about 5 to 6 mm
However, according to the experiment, the jig did not come into contact with the adjacent wafer 8, and it was found that the adhesion and the damage of the foreign matter could be sufficiently prevented.

The height t of the lower end of the pedestal 4 is
The thickness is set to about 10 mm or more so that foreign matter dropped from the wafer 8 does not adhere to the wafer 8 again.

When a wafer having an orientation flat is used, if the orientation flat is set downward, the pedestal 4
And the stored wafer 8 is stabilized.

As described above, according to the first embodiment,
By providing the pedestal 4 having an inclination, a height difference h is generated at the upper end portion of the adjacent wafers 8 and the wafers 8 are taken out by using the height difference h. Therefore, adhesion of foreign substances to the adjacent wafers 8 and scratches are prevented. be able to.

FIG. 4 is a perspective view showing a second embodiment of the present invention, in which only a pedestal is shown, and other components are omitted.

The difference from the first embodiment is that the pedestal 9 is
It is not a book but a plurality. In the figure, three identical pedestals 9 are installed parallel to each other in a direction in which the longitudinal direction thereof is directly opposed to the wafer to be stored.

The three pedestals 9 are arranged with a narrow interval so that the wafer orientation flat comes into contact with the three pedestals 9.

With this configuration, once the wafer is once taken out of the carrier, the wafer is processed, and when the processed wafer is directly stored again in the wafer carrier case containing the carrier by the jig, Impact between the wafer and the pedestal 9 due to the falling of the wafer can be reduced.

As described above, according to the second embodiment,
In addition to the effects of the first embodiment, since a plurality of pedestals 9 are provided, it is possible to reduce the generation of minute foreign matter from the wafer due to impact.

FIG. 5 is a perspective view showing a third embodiment of the present invention, in which only a pedestal is shown, and other components are omitted.

The second embodiment is different from the second embodiment in that at least three pedestals are provided, and the height of the central pedestal is lowered with respect to the pedestals on both sides so that the pedestals coincide with the curve of the peripheral portion of the wafer. Is different.

The pedestals 10 on both sides and the pedestal 11 at the center have the same inclination and differ only in height. Also, the interval between the pedestal 10 and the pedestal 11 is wider than in the case of FIG. 4 so that the curve of the peripheral edge of the wafer abuts.

FIG. 6 is a diagram showing the relationship between the wafer and the pedestal in the third embodiment.

The wafer 8 fits into a groove provided in the side surface portion 6 of the carrier 5, and a curve 12 at the peripheral edge thereof fits the pedestal 1 on both sides.
0 and the carrier 5 so as to be in contact with the pedestal 11 at the center.
It is stored in.

The orientation flat 13 of the wafer 8 does not come into contact with any of the pedestals, does not come into contact with the right pedestal 10 at the position shown by the solid line, and comes into contact with the central pedestal 11 even if it is located below. There is no.

As described above, since the wafer 8 comes into contact with at least two pedestals with the curved line 12 at the peripheral edge, the wafer 8 is stored in the wafer carrier case irrespective of the orientation and position of the orientation flat 13 even if it is stored in the carrier 5. Sometimes, the wafers 8 are arranged in a stepped manner.

Therefore, in the case of the wafer 8 having the orientation flat 13, it is not necessary to set the orientation flat 13 downward.

As described above, according to the third embodiment,
In addition to the effects of the second embodiment, the orientation of the orientation flat 13
Regardless of the position, the orientation flat 13 can always be stably held at a fixed position so that the orientation flat 13 can be arranged in a stepped manner.

FIG. 7 is a view for explaining a method of taking out a wafer according to the present invention.

The wafers 8 housed in the carrier are arranged in a step-like manner by the action of the inclined pedestal when the carrier is put in the wafer carrier case 1 and the upper ends of the adjacent wafers 8 are placed as described above. A height difference h occurs.

Utilizing the height difference h, the wafers 8 are sucked by the tip 15 of the jig 14 and are taken out one by one. The taken out wafer 8 is transported to a predetermined processing step, where wafer processing is performed.

[0039]

As described above, according to the present invention, the inclined pedestal is provided at the bottom of the wafer carrier case, so that the wafers can be arranged in a step-like manner and a height difference can be formed at the upper end of the adjacent wafer. Using this height difference, it is possible to prevent foreign matter from being attached or damaged when the wafer is taken out by the jig.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing a carrier.

FIG. 3 is a side view showing an aligned state of wafers.

FIG. 4 is a perspective view showing a second embodiment of the present invention.

FIG. 5 is a perspective view showing a third embodiment of the present invention.

FIG. 6 is a diagram showing a relationship between a wafer and a pedestal;

FIG. 7 is a view for explaining a method of taking out a wafer according to the present invention.

[Explanation of symbols]

 Reference Signs List 1 wafer carrier case 4, 9, 10, 11 base 5 carrier 8 wafer 12 curve 13 orientation flat 14 jig

Claims (6)

[Claims] 1. A wafer containing a wafer is placed in a carrier case having a tilted pedestal at the bottom, so that the wafers are arranged in a step-like manner, and a height difference generated at an upper end of an adjacent wafer is used. A wafer is taken out by a jig, and the taken out wafer is transported to a predetermined processing step for processing. 2. A wafer carrier case for accommodating a carrier accommodating a wafer, wherein a pedestal is provided at the bottom of the wafer carrier case, the pedestal having a peripheral edge of the wafer abutting thereon. 3. The wafer carrier case according to claim 2, wherein said inclination is 45 ° or more. 4. The wafer carrier case according to claim 2, wherein the orientation flat of the wafer is in contact with the pedestal. 5. The wafer carrier case according to claim 2, wherein a plurality of said pedestals are provided. 6. The apparatus according to claim 1, wherein at least three pedestals are provided, and a height of a central pedestal is lowered with respect to the pedestals on both sides so that the pedestals coincide with a curve of a peripheral portion of the wafer. The wafer carrier case according to claim 2 or claim 3.