JPH0742660Y2 - 半導体ウエハの洗浄機構を備えた保持装置 - Google Patents
半導体ウエハの洗浄機構を備えた保持装置Info
- Publication number
- JPH0742660Y2 JPH0742660Y2 JP1990402536U JP40253690U JPH0742660Y2 JP H0742660 Y2 JPH0742660 Y2 JP H0742660Y2 JP 1990402536 U JP1990402536 U JP 1990402536U JP 40253690 U JP40253690 U JP 40253690U JP H0742660 Y2 JPH0742660 Y2 JP H0742660Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- holding
- diffusion layer
- holding plate
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 53
- 238000004140 cleaning Methods 0.000 title claims description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 52
- 238000005520 cutting process Methods 0.000 claims description 39
- 239000012535 impurity Substances 0.000 claims description 37
- 238000009792 diffusion process Methods 0.000 claims description 27
- 239000007921 spray Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- 239000002826 coolant Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990402536U JPH0742660Y2 (ja) | 1990-12-28 | 1990-12-28 | 半導体ウエハの洗浄機構を備えた保持装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990402536U JPH0742660Y2 (ja) | 1990-12-28 | 1990-12-28 | 半導体ウエハの洗浄機構を備えた保持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0494408U JPH0494408U (enrdf_load_stackoverflow) | 1992-08-17 |
| JPH0742660Y2 true JPH0742660Y2 (ja) | 1995-10-04 |
Family
ID=31880437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990402536U Expired - Lifetime JPH0742660Y2 (ja) | 1990-12-28 | 1990-12-28 | 半導体ウエハの洗浄機構を備えた保持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0742660Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01110105A (ja) * | 1987-10-23 | 1989-04-26 | Sumitomo Metal Ind Ltd | 硬脆材料の切断方法 |
-
1990
- 1990-12-28 JP JP1990402536U patent/JPH0742660Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0494408U (enrdf_load_stackoverflow) | 1992-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |