JPH0740577B2 - Probe card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a probe card arranged in a probe apparatus and used for test measurement of a semiconductor chip formed on a semiconductor wafer.

(Prior Art) Generally, a probe card is arranged in a probe device,
It is used for test measurement of semiconductor chips formed on a semiconductor wafer.

FIG. 7 shows an essential part of such a conventional probe card, and a plate-shaped probe card body 1 made of a printed circuit board or the like is provided with a circular through hole 2, for example. Around the through hole 2, contact terminals, that is, a large number of probes 3 are planted obliquely downward, and the probes 3 are provided with a conductor layer 4 formed on the probe card body 1 therebetween. , Is electrically connected to an electrode (not shown) arranged at the end of the probe card body 1.

Then, the probe card is fixed to an insert ring or the like of the probe device and brought into contact with the electrode pad 6 of the semiconductor wafer 5. At this time, an insulating film made of an aluminum oxide film or the like is often formed on the surface of the electrode pad 6. Therefore, for example, the semiconductor wafer 5 is lifted to bring the probe 3 and the electrode pad 6 into contact with each other. After that, by further raising the semiconductor wafer 5, the tip end portion of the probe 3 is slid on the electrode pad 6 by, for example, the distance S, the insulating film is broken, and electrical conduction is obtained.

(Problems to be Solved by the Invention) However, in the conventional probe card described above,
There are the following problems.

That is, since the probe, which is a contact terminal, contacts the electrode pad of the semiconductor chip and then slides in the lateral direction, the surface of the electrode pad is scraped by the probe, and a large scratch is formed.
Wire bonding may be defective.

Further, since the probe as the contact terminal is obliquely arranged, it is difficult to arrange the probe at a high density, for example, the probe can simultaneously contact a plurality of semiconductor chips.

The present invention has been made in response to such a conventional situation, and it is possible to prevent the electrode pad surface from being scraped by the contact terminal and forming a large scratch on the electrode pad surface, and the contact terminal. An object of the present invention is to provide a probe card capable of arranging a large number of cells at high density.

[Structure of the Invention] (Means for Solving Problems) That is, the probe card of the present invention comprises a plate-shaped probe card main body, an insulating substrate, and a contact consisting of a plurality of conductor patterns formed on the surface of the insulating substrate. A plurality of contact terminal units having terminals and held substantially vertically to the probe card main body are provided. (Operation) In the probe card of the present invention, the plate-shaped probe card main body is provided with an insulating material. A probe made of a substrate and a conductor layer formed on at least a part of the surface of the insulating substrate is held substantially vertically.

Therefore, the lateral slide amount after the probe comes into contact with the electrode pad of the semiconductor chip can be significantly reduced compared to the conventional case, and the electrode pad surface is scraped by the probe and a large scratch is formed. Can be prevented. Further, a large number of probes can be arranged at a high density, and for example, the probes can be simultaneously contactable with a plurality of semiconductor chips.

(Embodiment) An embodiment of the probe card of the present invention will be described below with reference to FIGS. 1 to 6.

A plate-shaped probe card main body 11 made of a material such as resin or ceramics has a plurality of contact terminal units 12 penetrating through the probe card main body 11 and arranged substantially vertically.

The contact terminal unit 12 includes an insulating substrate 13 made of, for example, a crystal substrate formed by photolithography.
And a conductor pattern 14 formed at a desired portion of the surface of the insulating substrate 13 by photolithography, for example.

As shown in FIG. 3, the insulating substrate 13 has a substantially triangular outer shape, and a comb-teeth-shaped contact terminal portion 15 is formed at the lower end thereof. Then, the comb-shaped contact terminal portion 15
The conductor patterns 14 are respectively formed on the bases, and the conductor patterns 14 are formed in a strip shape so as to gradually widen toward the upper part. Further, as shown in FIG. 4, an insulating substrate 13 is provided at the tip of the contact terminal portion 15.
A conductor pattern 14 is formed so as to wrap around to the opposite side.

The comb-teeth-shaped contact terminal portion 15 is formed corresponding to the electrode pad of the semiconductor chip formed on the surface of the semiconductor wafer.

In addition, the contact terminal unit 12 is
A connecting member 16 provided with a conductor layer made of, for example, a conductive rubber or the like is arranged at the portion projecting on the upper surface. That is, as shown in FIG. 5, the connecting member 16 includes the conductor layer 16a.
And the insulating layer 16b is repeated. Then, through some conductor tanks 16a in contact with the conductor pattern 14, for example, via a conductor layer (not shown) formed in the card body 11, it is electrically connected to a connection terminal (not shown).

For example, as shown in FIG. 6, the surface of the connecting member 16 opposite to the surface in contact with the conductor pattern 14 is an insulating layer 16b, and the connecting member 16 is interposed between a large number of contact terminal units 12. It is also possible to configure them integrally.

Further, in the probe card of this embodiment, the vibrating means such as the ultrasonic transducer 17 including a piezoelectric element is arranged above the probe card body 11.

The probe card having the above configuration is fixed to the insert ring or the like of the probe device. Then, the contact terminal portion 15 is brought into contact with the electrode pad of the semiconductor chip formed on the semiconductor wafer, and the test measurement of the semiconductor chip is performed.

In addition, after the contact terminal portion 15 and the electrode pad of the semiconductor wafer are brought into contact with each other, the insulating film made of an aluminum oxide film or the like formed on the surface of the electrode pad is destroyed to obtain electrical continuity. The sound wave vibrator 17 vibrates the contact terminal portion 15 for a predetermined time. The vibration time, the vibration frequency, etc. are appropriately selected depending on the type of the semiconductor wafer to be measured.

That is, in the above-described probe card of this embodiment, the contact terminal unit 12 is arranged in the probe card main body 11 substantially vertically.

Therefore, the amount of sliding in the lateral direction after the contact terminal portion 15 comes into contact with the electrode pad of the semiconductor wafer can be significantly reduced as compared with the conventional case, and the electrode pad surface is scraped to form a large scratch, and the wire It is possible to prevent defective bonding.

Furthermore, the contact terminal units 12 and the contact terminal portions 15 can be arranged in high density in a large number, and the contact terminal portions 15 can be simultaneously brought into contact with a plurality of semiconductor chips.
The time required for the test measurement can be shortened as compared with the conventional case.

[Advantages of the Invention] As described above, in the probe card of the present invention, it is possible to prevent the electrode pad surface from being scraped by the contact terminal and form a large scratch on the electrode pad surface, and the contact terminal can be prevented. Can be arranged in high density.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a probe card according to an embodiment of the present invention, FIG. 2 is a vertical sectional view of FIG. 1, FIG. 3 is a front view showing a contact terminal unit, and FIG. FIG. 3 is a longitudinal sectional view showing an essential part of FIG. 3, FIG. 5 is a perspective view showing an essential part of FIG. 1, FIG. 6 is a longitudinal sectional view showing a modified example, and FIG. 7 is an essential part of a conventional probe card. FIG. 11 …… Probe card body, 12 …… Contact terminal unit,
13 ... Insulating substrate, 14 ... Conductor pattern, 15 ... Contact terminal part.

Claims (3)

[Claims] 1. A plurality of plate-shaped probe card main bodies, a plurality of contact terminals composed of an insulating substrate and a plurality of conductor patterns formed on the surface of the insulating substrate, and a plurality of contact terminals held substantially vertically on the probe card main body. A probe card comprising a contact terminal unit. 2. The probe card according to claim 1, wherein the insulating group is molded by photolithography. 3. The probe card according to claim 1, wherein the conductor layer is formed on a desired portion of the surface of the insulating substrate by photolithography.