JPH0365659A - Probe card - Google Patents

Abstract

PURPOSE:To reduce the contact pressure of a wafer chip to a pad thereby preventing the pad from being damaged by providing, in place of a contact needle, a bump having a circuit printed on a transparent plate. CONSTITUTION:Bumps 4, 4 are pressed in contact with a pad of a wafer chip from above. At this time, the grounding state is monitored through a transparent plate 3 from a central hole 1 of a card substrate 2. If the pad and pumps 4, 4 are not in uniform contact with each other, they are adjusted by parallel adjusting screws 7, 7. After the pad and bumps 4, 4 are adjusted in uniform contact visually, a high frequency wave is applied to a vibrating plate 8, causing vibration of the plate. Then, electric characteristic test is conducted. The vibration of the plate 8 is transmitted to the transparent plate 3 itself, and the bumps 4, 4 are eventually vibrated. Since an oxide film formed on the pad is slightly delaminated by the vibration of the bumps 4, 4, conductive property is enhanced, enabling favorable electric characteristic test.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a probe card that performs electrical measurements by contacting with bumps instead of electrically measuring semiconductor chips that are made into multiple bins using stylus probes.

<Prior art> Electrical characteristics such as conduction state are measured when manufacturing semiconductor products. For example, it is used to check semiconductor products in wafer state, or to check resistor arrays, diode arrays, liquid crystal display boards, etc. Electrical checks and the like are performed on various ICs.

As such a measuring device, a card-shaped probe card is known, which is used by replacing it with each semiconductor product.For example, as shown in FIG. It is connected to tester C by connector b.

A plurality of stylus d are provided at the center of the card board a, and the tips of the stylus d protrude downward.

On the other hand, semiconductor wafer chips e are placed at predetermined positions on a movable table f, and by moving the movable table f, the wafer chips e are successively set at positions below the stylus d. Electrical measurements of the wafer chip e are performed using the stylus d.

As shown in FIG. 6, the stylus d attached to the card substrate a is attached to the card substrate a by an insulator g such as an epoxy resin material in accordance with the number of pads of the wafer chip e.

<Problems to be Solved by the Invention> However, in recent years, with the spread of VTRs with LCD TVs, word processors, etc., the demand for high-density integration ports &4 (multi-bin circuits) has increased. Therefore, the only way to deal with this is to increase the number of stylus, but the thickness of the stylus mentioned above is 20
It has a diameter of 0 μm to 250 μm, and there is a limit to arranging the stylus in a high density, and the higher the density, the more easily the stylus becomes misaligned, bends, or shorts with other stylus. Problems such as these become more likely to occur. Moreover, by bringing only the tip of the stylus into contact with the pad of the wafer chip, the current situation is that depending on the contact force, the tip of the stylus often pierces the pad and causes damage.

In order to solve the above-mentioned problems, the present invention provides a probe card in which the pads of a wafer chip are brought into contact with a group of bumps arranged on an insulating plate such as a glass plate without using a stylus. The purpose is to

<Means for Solving the Problems> The above objects of the present invention can be achieved by a probe card having the following configuration. In other words, the gist is that, in a card board equipped with a connector that can be attached or detached to a tester, a central hole is provided through the card board approximately in the center thereof, and a transparent plate made of an insulator covers the center hole from the bottom surface of the card board. When the transparent plate is placed over the center hole, an auxiliary plate and an M-impinging member made of modified rubber are interposed between the card substrate and the tip thereof is freely pressed against the auxiliary plate. The parallel adjustment screw provided on the same edge of the center hole as shown in FIG. This probe card is characterized in that it is provided with means for.

<Embodiments and Effects> The probe card according to the present invention will be described in detail below with reference to the drawings showing the embodiments thereof.

FIG. 1 is an explanatory side view of the probe card A of the present invention, and FIG. 2 is an explanatory plan view thereof.

That is, the probe card A consists of a card substrate (2) made of epoxy resin or the like with a center hole (1) inserted through the center thereof, and a quartz glass or the like provided so as to cover the center hole (1). A transparent plate (3) and the upper surface of the same transparent plate (3),
The printed wiring bump is composed of a group of ). Therefore, as shown in Fig. 3, the transparent plate (3) is fixed to the lower surface of the card substrate (2) via an auxiliary plate (buffer member (6) such as a rubber plate and modified rubber). be.

Then, attach the parallel adjustment screw (7) to the card board +21 on the queen auxiliary plate (5), the tip of which touches the auxiliary plate (5).
), (7), ... are provided, and the parallel adjustment screw (by rotating the sword left and right, its tip comes into contact with the above-mentioned auxiliary plate (5), and depending on its strength, the above-mentioned The transparent plate (3) is adjusted to be parallel to the buffer member (6).The tip of the transparent plate (3) is placed on the inner wall surface of the center hole (1). A diaphragm (a) is provided that comes into contact with the diaphragm (a).

Next, as shown in FIG. 4, the transparent plate (3) has a transmission line, an electric transmission line (9) for the power supply circuit, +91, etc. on the lower surface of the transparent plate (3) using a thin film hybrid IC process.・
form. Bumps G4) (4), . . . are provided protrudingly on the tip of this electrical transmission path (9) (91) at the same position as the pad position of the wafer chip. This bump 4) is made of a material with excellent electrical conductivity and wear resistance.

Furthermore, the base end 00) of the electric transmission path (9) formed on the transparent plate (3) is connected integrally to a pattern (not shown) wired on the bottom surface of the card substrate ('2J). be.

In addition to quartz glass, the material of the transparent plate (3) may be any transparent material that is hard and has excellent insulating properties, such as white sapphire glass, and preferably a material that can be formed into a thin plate shape as much as possible. It is.

In addition to the mechanism that applies vibration to the diaphragm (8) and vibrates the bumps (4) via the transparent plate (3), a mechanism that directly applies high frequency to the bumps (4) to cause them to vibrate can be considered. Therefore, it is desirable to adopt the most suitable vibration mechanism depending on the situation.

In the present invention having the above configuration, the bumps 4), (4), . . .
The transparent plate (3
) to observe the grounding condition. If the pads and bumps (4), (4), . After the pads and the bumps (4), (4), etc. are brought into contact with each other visually in this manner, an electrical characteristic test is performed by applying high-frequency vibration Σ to the diaphragm (8). The vibration of the diaphragm (8) transmits the vibration to the transparent plate L31 itself, causing the bumps 4), (4), . . . to vibrate. Therefore, by delicately peeling off the oxide film formed on the pad surface, current conductivity is improved and it becomes possible to conduct a good electrical property test. Also, by making a slight scratch, it is possible to visually confirm the contact status after the test.

<Effects of the Invention> As described above, according to the present invention, by providing printed wiring bumps on the transparent plate instead of the stylus, the contact pressure of the wafer chip against the pad can be controlled by the stylus mechanism. In the case of 12 to 20g/-, in the present invention, 4g/-
It becomes extremely small (mm2), and there is almost no damage to the pad. In addition, the contact status can be observed using the transparent plate, and contact adjustment can be easily performed using the parallel adjustment screw.Furthermore, since the transparent plate can be used with CAD for LCI-designed pad layouts, the grounding circuit and dump This makes it possible to miniaturize the structure, and it is possible to sufficiently cope with the increase in the number of bins.

In addition, by causing the bumps to vibrate with the diaphragm, the current conduction characteristics can be improved, making it possible to conduct better electrical characteristic tests, and various other effects can be achieved.

[Brief explanation of drawings]

FIG. 1 is an overall side view of the 10-p card A of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is an enlarged sectional view of the main part of the invention, and FIG. 4 is an enlarged plan view of the main part of the invention. 5 and 6 are explanatory diagrams showing conventional examples. In the figure (1); center hole (21; card board (3); transparent plate (4); bump (sash; auxiliary plate + 6); M support member (71; parallel adjustment screw (8); diaphragm No. 1 figure

Claims (1)

[Claims] 1. In a card board equipped with a connector that can be freely attached to and detached from the tester, a center hole penetrated through approximately the center of the card board;
A transparent plate made of an insulator that covers the center hole from the lower surface of the card base, and an auxiliary plate, a modified rubber, etc. that is interposed between the transparent plate and the card base when covering the center hole. a buffer member, a parallel adjustment screw provided at the same edge of the center hole such that its tip is freely pressed against the auxiliary plate, and a wiring provided on the lower surface of the transparent plate to correspond to the pads of the wafer chip. What is claimed is: 1. A probe card comprising: a bump that is applied to the bump; and further comprising means for imparting vibration to the bump.