JP4334684B2 - Substrate inspection sensor and substrate inspection apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate inspection sensor for executing a predetermined electrical inspection on a package substrate, and a substrate inspection apparatus including the substrate inspection sensor.
[0002]
[Prior art]
In recent years, with the increase in the density of semiconductor components, a microcomputer in which a bare chip integrated circuit (hereinafter referred to as “IC”) is mounted on a package substrate is used. As shown in FIGS. 11 and 12, this type of package substrate 70 is formed in a flat plate shape as a whole, and a cavity 71 is formed at the center of the upper surface 70a. In the cavity 71, an IC mounting surface 72 for mounting the IC and a bonding terminal forming surface 73 formed at a position higher than the IC mounting surface 72 so as to surround the IC mounting surface 72 are stepped. Is formed. In this case, on the bonding terminal forming surface 73, bonding terminals 44, 44,... For wire bonding IC connection terminals are formed in a line at a very fine pitch. Further, around the cavity 71, a plurality of external connection terminals 45, 45,... Connected to the bonding terminals 44, 44,. Is formed.
[0003]
On the other hand, a substrate inspection apparatus 51 shown in FIG. 13 is conventionally known as a substrate inspection apparatus for inspecting this type of package substrate 70. The substrate inspection apparatus 51 is an inspection apparatus for inspecting the continuity between the bonding terminals 44, 44,... And the external connection terminals 45, 45,. A substrate mounting table 2 to be mounted, inspection signal output probes 5, 5,..., And a capacitance measuring sensor unit 56 are provided.
[0004]
The probes 5, 5,... Are fixed to a probe fixing portion 54 attached to a probe moving mechanism (not shown) so as to be able to contact the external connection terminals 45, 45,. As shown in FIG. 10, the sensor unit 56 includes a flat electrode 61, an insulating film 62 attached to the bottom surface of the electrode 61, and a cable 63 that electrically connects the electrode 61 and a control device (not shown). And is attached to an air cylinder (not shown) via a columnar attachment portion 61 a erected on the upper surface of the electrode 61. In this case, the electrode 61 is formed to have substantially the same size as the outer shape of the bonding terminal forming surface 73 of the package substrate 70.
[0005]
When the package substrate 70 is inspected using the substrate inspection apparatus 51, first, the package substrate 70 is mounted on the substrate mounting table 2 with the upper surface 70a facing upward. Next, the probe moving mechanism is controlled to move the probe fixing portion 54 downward so that the probes 5, 5,... Are brought into contact with the external connection terminals 45, 45,. The cylinder is driven to insert the sensor unit 56 into the cavity 71. At this time, the electrode 61 abuts on the bonding terminal forming surface 73 through the insulating film 62, and the bottom surface of the electrode 61 is disposed away from the bonding terminals 44, 44,... By the thickness of the insulating film 62. The
[0006]
Next, an AC voltage as an inspection signal is output to the external connection terminal 45 via an arbitrary probe 5 and the capacitance between the bonding terminal 44 and the electrode 61 is measured. Thereafter, the conduction state between the bonding terminal 44 and the external connection terminal 45 is inspected by comparing the measured capacitance with the inspection reference data absorbed from the non-defective substrate. At this time, if the measured electrostatic capacitance is outside the predetermined range with respect to the inspection reference data and has a low capacitance value, it is determined that the bonding terminal 44 and the external connection terminal 45 are disconnected. The quality of the package substrate 70 is determined by executing this inspection process for all the bonding terminals 44, 44... And the external connection terminals 45, 45.
[0007]
[Problems to be solved by the invention]
However, the conventional board inspection apparatus 51 has the following problems.
That is, in the conventional substrate inspection apparatus 51, for example, as shown in FIGS. 8 and 9, when inspecting the package substrate 40 having the cavities 41 in which the bonding terminal forming surfaces 43a to 43c are formed in steps different from each other. Since the bottom surface of the electrode 61 cannot be brought into contact with all of the bonding terminal forming surfaces 43a to 43c, the electrostatic force between the bonding terminals 44, 44,. The capacity cannot be measured. For this reason, the conventional substrate inspection apparatus 51 has a problem in that it cannot inspect a package substrate having a cavity in which a plurality of bonding terminal forming surfaces are formed stepwise.
[0008]
In this case, three types of sensor portions 56, 56, 56 each having electrodes 61 having the same size as the outer shape of the bonding terminal forming surfaces 43a to 43c may be prepared in advance, and these may be alternately attached to the air cylinder for inspection. it can. In this case, by sequentially measuring the capacitance between the bonding terminals 44, 44,... On the bonding terminal forming surfaces 43a to 43c and the electrodes 61, the conduction state is inspected based on the measured capacitance. To do. However, in such a case, there arises a problem that the inspection time becomes longer by the amount required for replacement of the sensor unit 56.
[0009]
On the other hand, for example, an inspection jig and probes 5, 5... In which a large number of contact type probes are implanted in a stepped manner so as to come into contact with the bonding terminals 44 on the bonding terminal forming surfaces 43a to 43c, respectively. By conducting the inspection signal between the bonding terminal 44 and the external connection terminal 45 using the above, it is possible to inspect the conduction state. However, in such a case, contact traces of the contact-type probe remain on the bonding terminals 44, so that there is a problem that a wire bonding defect due to the contact traces occurs when the IC is mounted. Furthermore, since it is very difficult to implant a large number of contact probes according to the formation pitch of the bonding terminals 44, 44,..., There is a problem that the manufacturing cost of the inspection jig increases.
[0010]
The present invention has been made in view of such problems, and a substrate inspection sensor and substrate capable of performing an electrical inspection on a package substrate without causing an increase in manufacturing cost and without damaging bonding terminals. The main purpose is to provide an inspection device.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the substrate inspection sensor according to claim 1 is a substrate inspection sensor for performing a predetermined electrical inspection on a package substrate having a cavity in which a bonding terminal forming surface is formed. , insulating layer of a predetermined thickness is formed on the bottom surface, and at the same time capable of abutting configured via respective insulating layer on at least two bonding terminal forming surface which is formed stepwise different heights from each other Rutotomoni, vertical A plurality of electrodes that can be finely moved independently of each other are provided , and an elastic material that is elastically deformed in accordance with the upward movement of the electrodes is disposed at the upper end of the electrodes, and a predetermined electrical inspection is performed. An inspection unit to be executed and a connection cable for connecting each electrode to the inspection unit are further provided. The connection cable is electrically connected to the electrode by being sandwiched between the elastic material and the electrode. It is characterized in that is.
[0012]
The substrate inspection sensor according to claim 2 is the substrate inspection sensor according to claim 1, wherein the plurality of electrodes are insulated from each other .
[0013]
According to a third aspect of the present invention, there is provided a substrate inspection apparatus comprising: the substrate inspection sensor according to the first or second aspect; and a probe that is arranged in contact with an external connection terminal of the package substrate and outputs or inputs an inspection signal. While applying an inspection signal between each electrode in the inspection sensor and the bonding terminal in contact with the probe, and measuring the capacitance between the bonding terminal formed on the bonding terminal forming surface and each electrode, A predetermined electrical inspection is performed on the package substrate based on the measured value.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of a substrate inspection sensor and a substrate inspection apparatus according to the present invention will be described below with reference to the accompanying drawings.
[0015]
Initially, the structure of the board | substrate inspection apparatus 1 is demonstrated with reference to each figure.
[0016]
As shown in FIG. 1, the substrate inspection apparatus 1 includes a substrate mounting table 2, a moving mechanism 3 a, an air cylinder 3 b, a probe fixing unit 4, a sensor unit 6, and a control device 7 constituting the inspection unit in the present invention. Yes. In this case, a base plate (not shown) is fixed to the moving mechanism 3a, and the probe fixing portion 4 and the air cylinder 3b are connected and fixed to the base plate. Therefore, the moving mechanism 3a moves the probe fixing unit 4 and the air cylinder 3b up and down simultaneously under the control of the control device 7, and the air cylinder 3b moves the sensor unit 6 up and down independently under the control of the control device 7. Move. 7, a plurality of probes 5, 5... Surround the sensor unit 6 so that the external connection terminals 45, 45. It is fixed at a position corresponding to the formation position.
[0017]
The sensor portion 6 corresponds to a substrate inspection sensor according to the present invention, and as shown in FIGS. 2 and 3, a case 11, a rubber plate 12, a base portion 13, electrodes 14a, 14a,..., 14b, 14b,. 14c..., Spacers 15, 15..., And cables 16, 16. As shown in FIG. 2, the case 11 is formed in a box shape with a bottom opening. Further, as shown in FIG. 3, a cylindrical attachment portion 11a for attaching to the air cylinder 3b is erected on the upper surface of the case 11, and for insertion of cables for inserting the cables 16, 16,. Holes 21a, 21a, ..., 21b, 21b, ..., 21c, 21c, ... are formed.
[0018]
The rubber plate 12 corresponds to an elastic material in the present invention, and a base portion insertion hole 12a through which the base portion 13 can be inserted is formed in the central portion, and a cable insertion hole through which the cables 16, 16,. 22a, 22a, ..., 22b, 22b, ..., 22c, 22c, ... are formed. The base portion 13 is resin-molded in a box shape, and shafts 13a and 13a for attaching the electrodes 14a to 14c and the spacers 15, 15,. In this case, a spring 18 is attached to each shaft 13a. Further, a bolt insertion hole 23 into which a fixing bolt for fixing the base portion 13 to the case 11 can be inserted is formed in the center portion of the base portion 13.
[0019]
The electrodes 14a to 14c are formed of a metal in a flat plate shape, and an insulating layer 17 having a predetermined thickness is formed on the bottom surface thereof. Further, shaft insertion holes 24, 24,... Through which the shafts 13a, 13a of the base portion 13 can be inserted are formed in the electrodes 14a to 14c so as to communicate with each other. In this case, as shown in FIG. 5, the shaft insertion hole 24 can finely move the electrodes 14 a to 14 c (the electrode 14 b is shown in the figure) in a state where the shafts 13 a and 13 a are inserted vertically. In order to do this, it is formed in an oblong shape that is long in the vertical direction. The electrodes 14a to 14c are formed such that each length from the lower edge portion of the shaft insertion hole 24 to the insulating layer 17 can be brought into contact with each opposing bonding terminal forming surface 43a to 43c. Each lateral width is formed so as to be substantially equal to the length of the bonding terminal forming surfaces 43a to 43c that are in contact with each other.
[0020]
The spacer 15 is resin-molded into a flat plate shape, and is formed such that shaft insertion holes 25, 25,... Through which the shafts 13a, 13a can be inserted communicate with each other as shown in FIG. Further, the cables 16, 16,... Are inserted through the cable insertion holes 21a (or 21b, 21c) of the case 11 and the cable insertion holes 22a (or 22b, 22c) of the rubber plate 12, and the central portions thereof are formed. The electrodes 14a (or 14b, 14c) are electrically connected to each other, and both ends (or only one end thereof) are connected to the control device 7 in a state of being insulated from each other. For example, the cable 16 inserted into the cable insertion holes 21a, 22a, 21a, 22a is sandwiched between the rubber plate 12 and the electrode 14a and electrically connected to the electrode 14a. Further, the control device 7 controls driving of the moving mechanism 3a and the air cylinder 3b, output control of the inspection signal via the probe 5, and each electrode 14a to 14c based on the inspection signal input via each cable 16. And the bonding terminals 44 are measured, and the package substrate 40 is judged to be good or bad based on the measured capacitance.
[0021]
On the other hand, as shown in FIGS. 8 and 9, the package substrate 40 to be inspected is formed in a flat plate shape as a whole, and a cavity 41 is formed at the center of the upper surface 40a. In this case, the cavity 41 includes an IC mounting surface 42 for mounting an IC, a bonding terminal forming surface 43a formed so as to surround the IC mounting surface 42 and slightly higher than the IC mounting surface 42, and a bonding terminal formation. A bonding terminal forming surface 43b formed at a higher position so as to surround the surface 43a, and a position higher than the bonding terminal forming surface 43b so as to surround the bonding terminal forming surface 43b and slightly higher than the upper surface 40a. A bonding terminal forming surface 43c formed at a low position is formed in a step shape. In this case, bonding terminals 44, 44,... For wire bonding IC connection terminals are formed in rows at very fine pitches on the bonding terminal forming surfaces 43a to 43c. Further, as shown in FIG. 9, external connection terminals 45, 45... Individually connected to bonding terminals 44, 44... Via conductor patterns 46, 46. It is formed in a lattice pattern with a pitch of about 1.27 mm.
[0022]
Next, the manufacturing method of the sensor part 6 is demonstrated with reference to each figure.
[0023]
First, the rubber plate 12 is fitted inside the case 11, and the cable insertion holes 21a, 21a,..., 21c, 21c, .. of the case 11 and the cable insertion holes 22a, 22a,. .. Insert cables 16, 16,. At this time, as shown in FIG. 5, for example, the cable 16 inserted from the upper surface side of the case 11 into the cable insertion hole 21b is pulled out to the back surface side of the rubber plate 12 through the cable insertion hole 22b. Then, the rubber plate 12 is inserted into the adjacent cable insertion hole 22b from the back surface side and pulled out to the upper surface side of the case 11 through the cable insertion hole 21b. Next, after attaching the spring 18 to each shaft 13a of the base portion 13, the electrodes 14a to 14c and the spacer 15 are attached. At this time, as shown in FIG. 4, the electrode 14a, the spacer 15, the electrode 14b, the spacer 15, the electrode 14c, and the spacer 15 are mounted in this order.
[0024]
Next, the base portion 13 in this state is fitted inside the case 11, and the fixing bolt inserted through the bolt insertion hole 23 is tightened and fixed to the case 11. At this time, as shown in FIG. 5, for example, the cable insertion holes 21b and 21b and the cable 16 inserted into the cable insertion holes 22b and 22b are sandwiched between the rubber plate 12 and the electrode 14b, 14b is electrically connected. Similarly, the cable 16 inserted through the cable insertion holes 21a and 21a and the cable insertion holes 22a and 22a is connected to the electrode 14a and is inserted into the cable insertion holes 21c and 21c and the cable insertion holes 22c and 22c. The made cable 16 is connected to the electrode 14c. Thereby, as shown in FIG. 6, the sensor part 6 is completed. In this case, since the sensor unit 6 is small, it is almost impossible to solder the cable 16 and the electrodes 14a to 14c. However, according to the connection method using this pinching, the both are electrically connected very easily. be able to.
[0025]
Next, a method for inspecting the package substrate 40 using the substrate inspection apparatus 1 will be described with reference to each drawing.
[0026]
First, after the package substrate 40 to be inspected is placed at a predetermined position on the substrate placing table 2, the control device 7 drives and controls the moving mechanism 3a to move down the probe fixing portion 4, and the external connection terminals 45, The probes 5, 5... Are brought into contact with 45. Next, the control device 7 drives the air cylinder 3b to move the sensor unit 6 downward and inserts it into the cavity 41 as shown in FIG. At this time, even if the formation positions of the bonding terminal formation surfaces 43a to 43c in the height direction vary for each of the package substrates 40, 40,... To be inspected, the electrodes 14a to 14c are independently independent in the vertical direction. As a result of the fine movement, the variation and the impact at the time of contact are absorbed. Further, when the electrodes 14a to 14c are slightly moved upward relative to the case 11, the rubber plate 12 is elastically deformed to urge the electrodes 14a to 14c to bond terminal forming surfaces 43a to 43a. Press against 43c respectively. As a result, the electrodes 14a to 14c are arranged to be separated from the bonding terminals 44 and 44 on the bonding terminal formation surfaces 43a to 43c by the thickness of the insulating layer 17.
[0027]
Next, an AC voltage as an inspection signal is output to the external connection terminal 45 through an arbitrary probe 5, and the bonding terminal 44 to be inspected and any one of the electrodes 14 a to 14 c arranged on the bonding terminal 44 Measure the capacitance between. At this time, since the electrodes 14a to 14c of the sensor unit 6 are insulated from each other by the spacers 15, 15,... In the substrate inspection apparatus 1, a maximum of four bonding terminals are provided for each of the bonding terminal forming surfaces 43a to 43c. 44, 44... (16 pieces as a whole of the substrate inspection apparatus 1) can be measured simultaneously and separately. For this reason, inspection time can be shortened. Thereafter, the conductive state between the bonding terminal 44 and the external connection terminal 45 is inspected by comparing the capacitance between each bonding terminal 44 and the electrodes 14a to 14c with the reference data absorbed from the non-defective substrate. . At this time, the control device 7 determines that the bonding terminal 44 and the external connection terminal 45 are disconnected when the measured capacitance is outside the predetermined range with respect to the reference data and has a low capacitance value. The quality of the package substrate 40 is determined by executing this inspection process for all the bonding terminals 44, 44... And the external connection terminals 45, 45.
[0028]
As described above, in the substrate inspection apparatus 1, by performing an electrical inspection on the package substrate 40 using the sensor unit 6 having the electrodes 14 a to 14 c that can simultaneously contact the plurality of bonding terminal forming surfaces 43 a to 43 c. The inspection time can be greatly shortened. Also, compared to an inspection jig in which a large number of contact-type probes are implanted corresponding to all the bonding terminals 44, 44,..., An electrical inspection can be performed while keeping manufacturing costs low and leaving no contact marks. Can be executed. Furthermore, when replacing the electrodes 14a to 14c that are most easily damaged and worn, only the worn electrodes 14a to 14c can be easily replaced without replacing the cable 16, and the entire sensor unit 6 needs to be replaced. Therefore, the replacement cost and running cost can be reduced.
[0029]
The present invention is not limited to the configuration shown in the above-described embodiment of the present invention. For example, in the embodiment of the present invention, the example of the sensor unit 6 capable of inspecting the package substrate 40 having the cavity 41 in which the three bonding terminal formation surfaces 43a to 43c are formed has been described. The number of bonding terminal forming surfaces is not limited to this, and a package substrate having two or four or more bonding terminal forming surfaces can be inspected. In this case, the number of electrodes 14 corresponding to the number of bonding terminal forming surfaces may be provided.
[0030]
In the embodiment of the present invention, four electrodes 14 are arranged on one bonding terminal forming surface, and the capacitance is measured simultaneously for all bonding terminals 44, 44 on the bonding terminal forming surface. Although the example which comprised it was demonstrated, for example, the electrode 14 was arrange | positioned with respect to one bonding terminal formation surface, the sensor part which has the electrode 14 was rotated every 90 degrees, and the bonding terminal formation surface It is also possible to configure so that the electrostatic capacity can be sequentially measured for all the bonding terminals 44, 44 above. Furthermore, for example, it can be configured by using rectangular tube-shaped electrodes that are in contact with the bonding terminal forming surfaces 43a to 43c, respectively, and the bottom surface is integrated in a stepped manner according to the formation positions of the bonding terminal forming surfaces 43a to 43c. It can also be configured using the formed electrodes.
[0031]
【The invention's effect】
As described above, according to the substrate inspection sensor according to claim 1, each of the plurality of electrodes configured to be able to simultaneously contact at least two bonding terminal formation surfaces via the insulating layer is provided. The inspection time can be shortened compared with the case where the inspection is performed in order for each bonding terminal forming surface, and compared with the case where the inspection is performed using an inspection jig having a large number of contact probes to be brought into contact with each bonding terminal. Thus, the manufacturing cost can be reduced, and the electrical inspection can be executed while preventing the bonding terminals from being damaged.
[0032]
Further, according to the substrate inspection sensor, when each electrode, by being slightly movable constructed by independently with respect to the vertical direction, there are variations in the forming position in the height direction of the bonding terminal forming surface However, each electrode moves independently up and down to absorb the variation, so the capacitance between each bonding terminal can be measured accurately, resulting in accurate inspection of the package substrate. can do.
[0033]
Further, according to this substrate inspection sensor, since the elastic material is disposed at the upper end of each electrode, each electrode is urged and pressed by the elastic material toward the bonding terminal forming surface side, so that the bottom surface of the electrode is bonded to the bonding surface. As a result of accurately separating the terminal by the thickness of the insulating layer, the capacitance between the terminal and the bonding terminal can be accurately measured.
[0034]
Further, according to this board inspection sensor, since the connection cable is sandwiched between the elastic material and the electrode and electrically connected to the electrode, it is extremely reliable and easy to electrically connect both to the connection method by soldering or the like. Can be connected.
[0035]
According to the substrate inspection sensor of claim 2 , since the electrodes are insulated from each other, the capacitance between the plurality of bonding terminals can be measured simultaneously by the number of electrodes. Can be further shortened.
[0036]
Furthermore, according to the substrate inspection apparatus of the third aspect, the manufacturing cost can be reduced by providing the substrate inspection sensor having a plurality of electrodes configured to be able to contact two or more bonding terminal forming surfaces. Moreover, a predetermined electrical inspection can be performed in a very short time while preventing the bonding terminals from being damaged.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1 according to an embodiment of the present invention.
FIG. 2 is a side sectional view of the sensor unit 6;
FIG. 3 is an exploded perspective view of a sensor unit 6;
4 is a perspective view of a state in which electrodes 14a to 14c and a spacer 15 are mounted on a base portion 13. FIG.
5 is a side cross-sectional view showing a connection state between an electrode 14b and a cable 16. FIG.
6 is an external perspective view of the sensor unit 6 in a completed state. FIG.
7 is a side cross-sectional view of the substrate inspection apparatus 1 in a state in which the probes 5, 5,...
FIG. 8 is an external perspective view of a package substrate 40 as an example of an inspection target.
9 is a side sectional view of the package substrate 40. FIG.
10 is an external perspective view of a sensor unit 56 in a conventional substrate inspection apparatus 51. FIG.
FIG. 11 is an external perspective view of a package substrate 70 as an example of an inspection target.
12 is a side cross-sectional view of the package substrate 70. FIG.
13 is a side cross-sectional view of the substrate inspection apparatus 51 in a state where the probes 5, 5,...
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 5 Probe 6 Sensor part 12 Rubber | gum board 14a-14c Electrode 15 Spacer 17 Insulating layer 40 Package board 41 Cavity 43a-43c Bonding terminal formation surface 44 Bonding terminal 45 External connection terminal

Claims (3)

A substrate inspection sensor for performing a predetermined electrical inspection on a package substrate having a cavity in which a bonding terminal forming surface is formed,
Insulating layer of a predetermined thickness is formed on the bottom surface, and at the same time capable of abutting configured respectively through the insulating layer in at least two of said bonding terminal forming surface which is formed stepwise different heights from each other Rutotomoni, vertical A plurality of electrodes each configured to be finely movable independently with respect to the direction ,
An elastic material that is elastically deformed in accordance with the upward movement of the electrode is disposed at the upper end of the electrode,
An inspection unit that performs the predetermined electrical inspection, and a connection cable that connects each of the electrodes to the inspection unit, and the connection cable is sandwiched between the elastic material and the electrode and electrically connected to the electrode. Board inspection sensor, characterized in that it is connected in a connected manner . Wherein the plurality of electrodes, the sensor board inspection according to claim 1, characterized in that it is insulated from each other. 3. The substrate inspection sensor according to claim 1 and a probe that is arranged so as to be in contact with an external connection terminal of the package substrate and outputs or inputs an inspection signal, and each of the electrodes in the substrate inspection sensor; The inspection signal is applied to the bonding terminal with which the probe is in contact to measure the capacitance between the bonding terminal formed on the bonding terminal forming surface and each electrode, and the measured value And performing the predetermined electrical inspection on the package substrate.

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