JPH0739234Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0739234Y2 JPH0739234Y2 JP1986032787U JP3278786U JPH0739234Y2 JP H0739234 Y2 JPH0739234 Y2 JP H0739234Y2 JP 1986032787 U JP1986032787 U JP 1986032787U JP 3278786 U JP3278786 U JP 3278786U JP H0739234 Y2 JPH0739234 Y2 JP H0739234Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrically insulating
- hole
- recess
- insulating substrate
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W70/681—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986032787U JPH0739234Y2 (ja) | 1986-03-07 | 1986-03-07 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986032787U JPH0739234Y2 (ja) | 1986-03-07 | 1986-03-07 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62145337U JPS62145337U (show.php) | 1987-09-12 |
| JPH0739234Y2 true JPH0739234Y2 (ja) | 1995-09-06 |
Family
ID=30839797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986032787U Expired - Lifetime JPH0739234Y2 (ja) | 1986-03-07 | 1986-03-07 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739234Y2 (show.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0746709B2 (ja) * | 1986-08-11 | 1995-05-17 | イビデン株式会社 | 電子部品搭載用基板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5836500A (ja) * | 1981-08-28 | 1983-03-03 | マックス株式会社 | 製図ヘッドの符号化用ディスク取付装置 |
| JPS6218084A (ja) * | 1985-07-16 | 1987-01-27 | 新藤電子工業株式会社 | 半導体素子実装用プリント配線板の製造方法 |
| JPS6239032A (ja) * | 1985-08-14 | 1987-02-20 | Matsushita Electric Works Ltd | 電子素子用チツプキヤリア |
-
1986
- 1986-03-07 JP JP1986032787U patent/JPH0739234Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62145337U (show.php) | 1987-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5504372A (en) | Adhesively sealed metal electronic package incorporating a multi-chip module | |
| US6262477B1 (en) | Ball grid array electronic package | |
| US5596231A (en) | High power dissipation plastic encapsulated package for integrated circuit die | |
| US5173844A (en) | Integrated circuit device having a metal substrate | |
| US7948076B2 (en) | Semiconductor chip assembly with post/base heat spreader and vertical signal routing | |
| US5578869A (en) | Components for housing an integrated circuit device | |
| JP2660295B2 (ja) | 電子部品搭載用基板 | |
| JP2006303400A (ja) | 電子部品収納用パッケージおよび電子装置ならびに電子装置の実装構造 | |
| US7256486B2 (en) | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same | |
| JPH0739234Y2 (ja) | 半導体装置 | |
| WO1996030942A1 (en) | Components for housing an integrated circuit device | |
| GB2301937A (en) | IC package with a ball grid array on a single layer ceramic substrate | |
| JPH0997860A (ja) | 半導体装置 | |
| KR100203932B1 (ko) | 칩에 방열 기판이 부착된 볼 그리드 어레이 패키지 | |
| JP2612468B2 (ja) | 電子部品搭載用基板 | |
| JP2735920B2 (ja) | インバータ装置 | |
| JPH0897329A (ja) | 電子部品搭載装置 | |
| JP2003338579A (ja) | 放熱板付き配線基板 | |
| JP2614495B2 (ja) | 電子部品搭載用基板 | |
| JPS6095943A (ja) | プラグインパツケ−ジとその製造方法 | |
| JP2604621B2 (ja) | 半導体素子収納用パッケージの製造方法 | |
| JP2023091272A (ja) | 半導体モジュール及びその製造方法 | |
| JP2865166B1 (ja) | 樹脂封止形電子部品 | |
| JP2649251B2 (ja) | 電子部品搭載用基板 | |
| JP2509428B2 (ja) | 超小型電子パッケ―ジ |