JPH0733860A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPH0733860A JPH0733860A JP17935593A JP17935593A JPH0733860A JP H0733860 A JPH0733860 A JP H0733860A JP 17935593 A JP17935593 A JP 17935593A JP 17935593 A JP17935593 A JP 17935593A JP H0733860 A JPH0733860 A JP H0733860A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- epoxy resin
- benzimidazole
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、銅との密着性に優れた
樹脂組成物に関するものである。FIELD OF THE INVENTION The present invention relates to a resin composition having excellent adhesion to copper.
【0002】[0002]
【従来の技術】従来、ダイオード、トランジスタ、集積
回路等の電子部品を熱硬化性樹脂で封止しているが、特
に集積回路では耐熱性、耐湿性に優れたO−クレゾール
ノボラックエポキシ樹脂をノボラック型フェノール樹脂
で硬化させたエポキシ樹脂組成物が用いられている。近
年、半導体パッケージは多ピン化、小型化・薄型化の傾
向にある。それに伴い、デザイン・ルールの狭ピッチ化
による集積度の向上、及び高速化になってきており、消
費電力の増大の傾向にある。この素子の高消費電力に対
して各半導体メーカーは、従来の42合金製リードフレ
ームから銅合金製リードフレームを適用している。ある
いは、銅製のヒートスプレッダを使用している。また、
パッケージの小型化・薄型化により、半導体の実装方法
は従来の挿入型から表面実装型(VPSリフロー型、I
Rリフロー型、半田浸漬法等)へ変わってきている。表
面実装型の実装方法により、半田浸漬の工程においてパ
ッケージが急激に200℃以上の高温にさらされること
により銅合金リードフレームと封止材または、ヒートス
プレッダと封止材の界面が剥離するといった現象が発生
し耐湿性が劣化してしまい信頼性が低くなるといった問
題が起こっている。そのため、銅との密着性に優れた樹
脂組成物の開発が急がれている。2. Description of the Related Art Conventionally, electronic parts such as diodes, transistors and integrated circuits have been sealed with a thermosetting resin. Especially in integrated circuits, O-cresol novolac epoxy resin which is excellent in heat resistance and moisture resistance is used as a novolac resin. An epoxy resin composition cured with a type phenolic resin is used. In recent years, semiconductor packages have tended to have a large number of pins and to be small and thin. Along with this, the degree of integration has been improved and the speed has been increased by narrowing the pitch of the design rule, and the power consumption tends to increase. With respect to the high power consumption of this element, each semiconductor manufacturer applies a copper alloy lead frame to a conventional 42 alloy lead frame. Alternatively, a copper heat spreader is used. Also,
Due to the miniaturization and thinning of packages, the semiconductor mounting method has changed from the conventional insertion type to the surface mounting type (VPS reflow type, I type).
R reflow type, solder dipping method, etc.). Due to the surface mounting type mounting method, a phenomenon in which the interface between the copper alloy lead frame and the sealing material or the interface between the heat spreader and the sealing material is separated when the package is rapidly exposed to a high temperature of 200 ° C. or higher in the solder dipping process However, there is a problem that moisture resistance is deteriorated and reliability is lowered. Therefore, there is an urgent need to develop a resin composition having excellent adhesion to copper.
【0003】[0003]
【発明が解決しようとする課題】本発明は、このような
問題に対して銅との密着性に優れた樹脂組成物を提供す
るものである。SUMMARY OF THE INVENTION The present invention provides a resin composition having excellent adhesion to copper against such problems.
【0004】[0004]
【課題を解決するための手段】本発明者らは、これらの
問題を解決するために鋭意研究を進め、次の組成を持つ
樹脂組成物を見いだした。即ち本発明は、 (A)エポキシ樹脂 (B)フェノール樹脂硬化剤 (C)式(1)で示されるベンゾイミダゾール系化合物[Means for Solving the Problems] The inventors of the present invention have conducted extensive studies to solve these problems and found a resin composition having the following composition. That is, the present invention provides: (A) epoxy resin (B) phenolic resin curing agent (C) benzimidazole compound represented by formula (1)
【0005】[0005]
【化2】 [Chemical 2]
【0006】(D)無機充填材 及び (E)硬化促進剤 を必須成分とし、該ベンゾイミダゾール系化合物を総樹
脂組成物中に0.05〜2.0重量%含むことを特徴と
する半導体封止用樹脂組成物である。(D) An inorganic filler and (E) a curing accelerator are essential components, and the benzimidazole compound is contained in an amount of 0.05 to 2.0% by weight in the total resin composition. It is a stopping resin composition.
【0007】以下に本発明を詳しく説明する。式(1)
で示されるベンズイミダゾール系化合物のイミダゾール
構造は、金属と錯体をつくり、一方ベンゼン環は樹脂成
分との親和性を有しているため、銅リードフレーム等の
素材と樹脂間の強固な結合材となる。本発明で用いられ
るベンゾイミダゾール系化合物の置換基のR1はCH、
NまたはCSHのいずれの化合物でも有効である。これ
らの化合物は混合して用いてもよい。ベンゾイミダゾー
ル系化合物の配合量は、総樹脂組成物中に0.05〜
2.0重量%であることが好ましい。0.05重量%未
満だと銅との密着性の効果が薄く、また2.0重量%を
越えると流動性が不十分となり適さない。The present invention will be described in detail below. Formula (1)
The imidazole structure of the benzimidazole-based compound shown in Fig. 3 forms a complex with a metal, while the benzene ring has an affinity with the resin component. Become. R 1 of the substituent of the benzimidazole compound used in the present invention is CH,
Either N or CSH compound is effective. You may mix and use these compounds. The amount of the benzimidazole-based compound added is from 0.05 to 0.05 in the total resin composition.
It is preferably 2.0% by weight. If it is less than 0.05% by weight, the effect of adhesion to copper is weak, and if it exceeds 2.0% by weight, the fluidity is insufficient, which is not suitable.
【0008】本発明で用いるエポキシ樹脂は、エポキシ
基を有するポリマー全般をいう。例えばビスフェノール
型エポキシ樹脂、クレゾールノボラック型エポキシ樹
脂、ビフェニル型エポキシ樹脂、フェノールノボラック
型エポキシ樹脂及びトリフェノールメタン型エポキシ樹
脂、アルキル変性トリフェノールメタン型エポキシ樹脂
等の3官能エポキシ樹脂、トリアジン核含有エポキシ樹
脂等が挙げられる。本発明で用いるフェノールノボラッ
ク樹脂硬化剤は、フェノール性水酸基を有するポリマー
全般をいう。例えば、フェノールノボラック樹脂、クレ
ゾールノボラック樹脂、ジシクロペンタジエン変性フェ
ノール樹脂、ジシクロペンタジエン変性フェノール樹脂
とフェノールノボラック及びクレゾールノボラック樹脂
との共縮合物、パラキシリレン変性フェノール樹脂等を
用いることができる。エポキシ樹脂のエポキシ基当量と
フェノール樹脂の水酸基当量の比は、0.8〜1.2が
好ましい。The epoxy resin used in the present invention is a general polymer having an epoxy group. For example, bisphenol type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin and triphenol methane type epoxy resin, trifunctional epoxy resin such as alkyl modified triphenol methane type epoxy resin, triazine nucleus-containing epoxy resin Etc. The phenol novolac resin curing agent used in the present invention refers to all polymers having a phenolic hydroxyl group. For example, phenol novolac resin, cresol novolac resin, dicyclopentadiene modified phenol resin, co-condensation product of dicyclopentadiene modified phenol resin and phenol novolac or cresol novolac resin, paraxylylene modified phenol resin and the like can be used. The ratio of the epoxy group equivalent of the epoxy resin and the hydroxyl group equivalent of the phenol resin is preferably 0.8 to 1.2.
【0009】本発明に用いる無機充填材としては、溶融
シリカ粉末、球状シリカ粉末、結晶シリカ粉末、2次凝
集シリカ粉末、多孔質シリカ粉末、2次凝集シリカ粉末
または多孔質シリカ粉末を粉砕したシリカ粉末、アルミ
ノ等が挙げられ、特に溶融シリカ粉末が好ましい。全組
成物中の無機充填材量は70〜90重量%が好ましい。
本発明で用いる硬化促進剤は、エポキシ樹脂とフェノー
ル性水酸基との反応を促進させるものであれば良く、一
般に封止用材料に使用されているものを広く使用するこ
とができ、例えばジアザビシクロウンデセン(DB
U)、トリフェニルホスフィン(TPP)、テトラフェ
ルルホスホニウムテトラフェノルボレート(TPP−
K)、ジメチルベンジルアミン(2MZ)等が単独もし
くは2種類以上混合して用いられる。As the inorganic filler used in the present invention, fused silica powder, spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, porous silica powder, secondary agglomerated silica powder or silica obtained by pulverizing porous silica powder is used. Examples thereof include powder and alumino, and fused silica powder is particularly preferable. The amount of the inorganic filler in the entire composition is preferably 70 to 90% by weight.
The curing accelerator used in the present invention may be any one as long as it accelerates the reaction between the epoxy resin and the phenolic hydroxyl group, and those generally used for the encapsulating material can be widely used, for example, diazabicyclo. Undecen (DB
U), triphenylphosphine (TPP), tetraferulphosphonium tetraphenorborate (TPP-
K), dimethylbenzylamine (2MZ) and the like are used alone or in combination of two or more.
【0010】本発明の封止用エポキシ樹脂組成物はエポ
キシ樹脂、フェノール樹脂硬化剤、ベンゾイミダゾール
系化合物、無機充填材及び硬化促進剤を必須成分とする
が、これ以外に必要に応じてシランカップリング剤、ブ
ロム化エポキシ樹脂、三酸化アンチモン、ヘキサブロム
ベンゼン等の難燃剤、カーボンブラック、ベンガラ等の
着色剤、天然ワックス、合成ワックス等の離型剤及びシ
リコーンオイル、ゴム等の低応力添加剤等の種々の添加
剤を適宜配合しても差し支えない。又、本発明の封止用
エポキシ樹脂組成物を成形材料として製造するには、エ
ポキシ樹脂、硬化剤、ベンゾイミダゾール系化合物、硬
化促進剤、充填材、その他の添加剤をミキサー等により
十分に均一混合した後さらに熱ロールまたはニーダー等
で溶融混合し、冷却後粉砕して成形材料とすることがで
きる。これらの成形材料は電子部品あるいは電気部品の
封止、被覆、絶縁等に適用することができる。The encapsulating epoxy resin composition of the present invention contains an epoxy resin, a phenol resin curing agent, a benzimidazole compound, an inorganic filler and a curing accelerator as essential components. Ring agents, brominated epoxy resins, flame retardants such as antimony trioxide and hexabromobenzene, colorants such as carbon black and red iron oxide, release agents such as natural wax and synthetic wax, and low stress additives such as silicone oil and rubber. Various additives such as the above may be appropriately blended. Further, in order to produce the encapsulating epoxy resin composition of the present invention as a molding material, the epoxy resin, the curing agent, the benzimidazole compound, the curing accelerator, the filler, and other additives are sufficiently homogenized with a mixer or the like. After mixing, the mixture can be further melt-mixed with a hot roll or a kneader, cooled and pulverized to obtain a molding material. These molding materials can be applied to sealing, coating, insulating, etc. of electronic parts or electric parts.
【0011】以下本発明を実施例で示す。配合割合は重
量部とする。 実施例1〜4、比較例1〜4 ・式(2)で示されるベンゾイミダゾール系化合物The present invention will be shown below with reference to examples. The mixing ratio is parts by weight. Examples 1 to 4, Comparative Examples 1 to 4 Benzimidazole compound represented by formula (2)
【0012】[0012]
【化3】 [Chemical 3]
【0013】・エポキシ樹脂(3,3′,5,5′−テ
トラメチル−4,4′−ジヒドロキシビフェニルグリシ
ジルエーテル) ・オルソクレゾールノボラックエポキシ樹脂(エポキシ
当量200、軟化点55℃) ・式(3)で示されるフェノール樹脂硬化剤(水酸基当
量170、軟化点70℃) (n=1が20重量%、n=2が60重量%、n=3が
20重量%の混合物)Epoxy resin (3,3 ', 5,5'-tetramethyl-4,4'-dihydroxybiphenylglycidyl ether) Orthocresol novolac epoxy resin (epoxy equivalent 200, softening point 55 ° C) Formula (3 ) Phenolic resin curing agent (hydroxyl equivalent 170, softening point 70 ° C.) (n = 1: 20% by weight, n = 2: 60% by weight, n = 3: 20% by weight)
【0014】[0014]
【化4】 [Chemical 4]
【0015】・フェノールノボラック樹脂(水酸基当量
104、軟化点95℃) ・ブロム化ビスフェノール型エポキシ樹脂(エポキシ当
量273、軟化点65℃) ・トリフェニルホスフィン ・溶融シリカ粉末 ・三酸化アンチモン ・エポキシシラン ・カーボンブラック ・カルナバワックス を表1に示したそれぞれの割合でミキサーで常温で混合
し、70〜100℃で2軸ロールにより混練し、冷却後
粉砕し成形材料とし、これをタブレット化して半導体封
止用エポキシ樹脂組成物を得た。この組成物を低圧トラ
ンスファー成形機(成形条件:175℃、70kg/c
m2、120秒)を用いて成形し、得られた成形品を1
75℃、8時間で後硬化し評価した。評価結果を表1に
示す。Phenol novolac resin (hydroxyl group equivalent 104, softening point 95 ° C.) Brominated bisphenol type epoxy resin (epoxy equivalent 273, softening point 65 ° C.) triphenylphosphine, fused silica powder, antimony trioxide, epoxy silane Carbon black and carnauba wax are mixed in the respective proportions shown in Table 1 at room temperature with a mixer, kneaded with a biaxial roll at 70 to 100 ° C., cooled and pulverized to obtain a molding material, which is tableted into a semiconductor encapsulation. An epoxy resin composition for use was obtained. A low-pressure transfer molding machine (molding conditions: 175 ° C., 70 kg / c)
m 2 for 120 seconds), and the resulting molded product is 1
It was post-cured at 75 ° C. for 8 hours and evaluated. The evaluation results are shown in Table 1.
【0016】評価方法 *1 スパイラルフロー EMMI−I−66に準じたスパイラルフロー測定用金
型を用い、試料を15g、成形温度を175℃、成形圧
力70kg/cm2、成形時間2分で成形したときの成
形品の長さ *2 半田クラック性試験 80pQFPパッケージ(チップサイズ81mm2、パ
ッケージ厚2.0mm、銅フレーム)20個について8
5℃/85%RHの水蒸気下で72Hr処理後、260
℃の半田槽に10秒間浸漬し、クラックの発生した成形
品の個数を示す。 *3 半田耐湿性試験 テスト用素子(16pSOP)を85℃で、85%RH
の環境下で72Hr処理し、その後260℃の半田槽に
10秒間浸漬後、プレッシャークッカー試験(125
℃、100%RH)を行ない、回路のオープン不良数を
測定した。 *4 QFP成形品のリードフレームと封止樹脂界面剥
離の有無 上記半田クラック性試験評価パッケージの成形後、超音
波探傷装置により、リードフレーム封止樹脂界面の剥離
の有無により、リードフレームと封止樹脂の密着性を調
べた。 *5 リード密着強度 図1に示す引張りせん断治具1を用いて、封止樹脂部2
とリードフレーム素材の平板3との密着力を引張りせん
断強度を測定することにより調べた。(接着部面積:
1.0cm2、形状:円)Evaluation method * 1 Spiral flow Using a mold for spiral flow measurement according to EMMI-I-66, a sample was molded at 15 g, a molding temperature of 175 ° C., a molding pressure of 70 kg / cm 2 , and a molding time of 2 minutes. Molded product length * 2 Solder cracking property test 80 pQFP package (chip size 81 mm 2 , package thickness 2.0 mm, copper frame) 20 pieces 8
After treatment for 72 hours under steam at 5 ° C / 85% RH, 260
The number of molded products in which a crack was generated after immersion in a solder bath at ℃ for 10 seconds is shown. * 3 Solder moisture resistance test Test element (16pSOP) at 85 ℃, 85% RH
72Hr treatment in the environment of, and then immersed in a solder bath at 260 ° C for 10 seconds, and then subjected to a pressure cooker test (125
C., 100% RH) and the number of open defects in the circuit was measured. * 4 Presence or absence of peeling between the lead frame and the sealing resin of the QFP molded product After the solder cracking test evaluation package is molded, the lead frame is sealed with the lead frame sealing resin by an ultrasonic flaw detector. The adhesion of the resin was examined. * 5 Lead adhesion strength Using the tensile shearing jig 1 shown in Fig. 1, the sealing resin part 2
The adhesion force between the and the flat plate 3 of the lead frame material was examined by measuring the tensile shear strength. (Adhesive area:
1.0cm 2 , shape: circle)
【0017】[0017]
【表1】 [Table 1]
【0018】[0018]
【発明の効果】本発明による樹脂組成物は、銅との密着
性に優れ、耐半田クラック性及び耐湿性に極めて優れて
いることにより表面実装封止用樹脂組成物として非常に
信頼性の高いものである。EFFECT OF THE INVENTION The resin composition according to the present invention is highly reliable as a surface mounting encapsulating resin composition because it has excellent adhesion to copper and extremely excellent solder crack resistance and moisture resistance. It is a thing.
【図1】引張りせん断治具に試験片を固定した状態の断
面図を示す。FIG. 1 is a sectional view showing a state in which a test piece is fixed to a tensile shearing jig.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C08K 5/3445 H01L 23/29 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical indication C08K 5/3445 H01L 23/29 23/31
Claims (1)
脂組成物中に0.05〜2.0重量%含むことを特徴と
する半導体封止用樹脂組成物。1. (A) Epoxy resin (B) Phenolic resin curing agent (C) Benzimidazole compound represented by formula (1) (D) Inorganic filler and (E) Curing accelerator as essential components, and the benzimidazole compound is contained in the total resin composition in an amount of 0.05 to 2.0% by weight. Composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17935593A JP3280474B2 (en) | 1993-07-20 | 1993-07-20 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17935593A JP3280474B2 (en) | 1993-07-20 | 1993-07-20 | Resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0733860A true JPH0733860A (en) | 1995-02-03 |
JP3280474B2 JP3280474B2 (en) | 2002-05-13 |
Family
ID=16064400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17935593A Expired - Fee Related JP3280474B2 (en) | 1993-07-20 | 1993-07-20 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3280474B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005263878A (en) * | 2004-03-16 | 2005-09-29 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2009111327A (en) * | 2007-10-12 | 2009-05-21 | Hitachi Chem Co Ltd | Circuit connecting material and connection structure for circuit member using the same |
JP2013166959A (en) * | 2005-12-22 | 2013-08-29 | Dow Global Technologies Llc | Curable epoxy resin composition having mixed catalyst system and laminate made therefrom |
-
1993
- 1993-07-20 JP JP17935593A patent/JP3280474B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005263878A (en) * | 2004-03-16 | 2005-09-29 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2013166959A (en) * | 2005-12-22 | 2013-08-29 | Dow Global Technologies Llc | Curable epoxy resin composition having mixed catalyst system and laminate made therefrom |
JP2009111327A (en) * | 2007-10-12 | 2009-05-21 | Hitachi Chem Co Ltd | Circuit connecting material and connection structure for circuit member using the same |
Also Published As
Publication number | Publication date |
---|---|
JP3280474B2 (en) | 2002-05-13 |
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