JPH0733364Y2 - ウエハー保持機構 - Google Patents

ウエハー保持機構

Info

Publication number
JPH0733364Y2
JPH0733364Y2 JP1989030764U JP3076489U JPH0733364Y2 JP H0733364 Y2 JPH0733364 Y2 JP H0733364Y2 JP 1989030764 U JP1989030764 U JP 1989030764U JP 3076489 U JP3076489 U JP 3076489U JP H0733364 Y2 JPH0733364 Y2 JP H0733364Y2
Authority
JP
Japan
Prior art keywords
wafer
holding mechanism
split ring
spring
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989030764U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02120746U (enExample
Inventor
智司 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1989030764U priority Critical patent/JPH0733364Y2/ja
Publication of JPH02120746U publication Critical patent/JPH02120746U/ja
Application granted granted Critical
Publication of JPH0733364Y2 publication Critical patent/JPH0733364Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1989030764U 1989-03-17 1989-03-17 ウエハー保持機構 Expired - Lifetime JPH0733364Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989030764U JPH0733364Y2 (ja) 1989-03-17 1989-03-17 ウエハー保持機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030764U JPH0733364Y2 (ja) 1989-03-17 1989-03-17 ウエハー保持機構

Publications (2)

Publication Number Publication Date
JPH02120746U JPH02120746U (enExample) 1990-09-28
JPH0733364Y2 true JPH0733364Y2 (ja) 1995-07-31

Family

ID=31256117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030764U Expired - Lifetime JPH0733364Y2 (ja) 1989-03-17 1989-03-17 ウエハー保持機構

Country Status (1)

Country Link
JP (1) JPH0733364Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58118747U (ja) * 1982-02-08 1983-08-13 日本電気株式会社 基板支持具
JPS63191634U (enExample) * 1987-05-29 1988-12-09

Also Published As

Publication number Publication date
JPH02120746U (enExample) 1990-09-28

Similar Documents

Publication Publication Date Title
US10867832B2 (en) Apparatus for holding semiconductor wafers
EP0926719A3 (en) Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
EP0865073A3 (en) Substrate processing apparatus and method
MY119887A (en) Throughput enhancement for single wafer reactor
JPH0733364Y2 (ja) ウエハー保持機構
TW365014B (en) Round heating plate used in the heating chamber for semiconductor device manufacture
TW348280B (en) Method and apparatus for producing a substrate
JPS5984438A (ja) シ−ト拡張装置
JPS63160355A (ja) 静電チヤツク
JPH04217456A (ja) ラップ定盤装置
JPS5831414Y2 (ja) テ−プ伸長装置
JPS60236223A (ja) 基板の冷却装置
JP2501798Y2 (ja) 低温処理装置
JPS62252937A (ja) 半導体装置の製造方法
JPH089162Y2 (ja) 基板保持装置
JPH07249672A (ja) 基板搬送方法
JPS6459809A (en) Formation of low-stress thin film and its manufacture
JPH037399Y2 (enExample)
KR200148639Y1 (ko) 반도체 패키지의 리드 글래스 부착장치
JPH07278820A (ja) 基板加熱ホルダー支持機構
JP2000003841A (ja) 基板の接着方法
JPH1041374A (ja) 半導体製造装置のウエハチャック装置
JPH062684U (ja) イオン注入装置用ウエファサイズ変換アダプタ
JPS57207351A (en) Manufacture of semiconductor element
JPH03110833A (ja) 化合物半導体の熱処理方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term