TW348280B - Method and apparatus for producing a substrate - Google Patents

Method and apparatus for producing a substrate

Info

Publication number
TW348280B
TW348280B TW086114144A TW86114144A TW348280B TW 348280 B TW348280 B TW 348280B TW 086114144 A TW086114144 A TW 086114144A TW 86114144 A TW86114144 A TW 86114144A TW 348280 B TW348280 B TW 348280B
Authority
TW
Taiwan
Prior art keywords
elastic member
lug portions
plate elastic
circular lug
shaft body
Prior art date
Application number
TW086114144A
Other languages
Chinese (zh)
Inventor
Hiromasa Hashimoto
Koichi Saito
Hiroshi Morita
Original Assignee
Mutsubishi Gum Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mutsubishi Gum Kk filed Critical Mutsubishi Gum Kk
Application granted granted Critical
Publication of TW348280B publication Critical patent/TW348280B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method of producing a substrate for producing a substrate used for fastening a wafer in a wax-free process for polishing a semiconductor wafer, which is characterized in that the wafer holding face of a plate elastic member is formed with a plurality of grooves for installing groove-forming members during the production thereby forming a plurality of circular lug portions having a diameter substantially equal to the shaft body and installed into concentrical to the shaft body and spaced at an appropriate spacing in the axial direction of the shaft body; the circular lug portions on the groove-forming members being heated to a temperature above the softening point of the plate elastic member so that the groove-forming members rotate and move along the surface of the plate elastic member such that the circular lug portions press on the surface of the plate elastic member and rotate thereon thereby simultaneously forming a plurality of grooves corresponding to the shape and dimensions of the outer periphery of the circular lug portions.
TW086114144A 1996-03-28 1997-09-27 Method and apparatus for producing a substrate TW348280B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10437196A JPH09262763A (en) 1996-03-28 1996-03-28 Method and device for manufacturing backing pad

Publications (1)

Publication Number Publication Date
TW348280B true TW348280B (en) 1998-12-21

Family

ID=14378943

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114144A TW348280B (en) 1996-03-28 1997-09-27 Method and apparatus for producing a substrate

Country Status (3)

Country Link
EP (1) EP0798078A3 (en)
JP (1) JPH09262763A (en)
TW (1) TW348280B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261058A (en) * 2001-03-06 2002-09-13 Sumitomo Electric Ind Ltd Method for manufacturing compound semiconductor wafer
JP4520327B2 (en) * 2004-03-31 2010-08-04 不二越機械工業株式会社 Water absorption method and water absorption device
JP6696756B2 (en) * 2014-11-13 2020-05-20 富士紡ホールディングス株式会社 Holder and method for manufacturing the same
CN109605179B (en) * 2019-01-14 2020-03-24 桃江冰梦家居用品有限公司 Summer sleeping mat bamboo chip shaftless polishing equipment and use method thereof
JP2020188057A (en) * 2019-05-10 2020-11-19 株式会社ディスコ Fixing method and resin sheet
CN112454188A (en) * 2020-12-14 2021-03-09 重庆希尔亿朋轨道交通设备有限公司 Track grinding wheel machining equipment
CN114523410A (en) * 2022-03-11 2022-05-24 南京林业大学 Furniture polishing of intelligence is waxed and is integrated equipment
CN115056045B (en) * 2022-06-30 2023-10-20 成都泰美克晶体技术有限公司 Wafer single-sided polishing device and method
CN115609392B (en) * 2022-09-29 2023-07-25 亚新半导体科技(无锡)有限公司 Fab factory is with processing equipment that has intelligent automatic function of snatching

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2007388A1 (en) * 1970-02-18 1971-09-02 Spies W Patterning plastic foam panel
JPS6099561A (en) * 1984-10-01 1985-06-03 Yoshiaki Nagaura Precision working
FR2662971A1 (en) * 1990-06-08 1991-12-13 Loire Snc Literie Mousses Val Process for manufacturing articles made from foam covered with fabric and mould for the implementation of this process

Also Published As

Publication number Publication date
EP0798078A3 (en) 1998-04-08
JPH09262763A (en) 1997-10-07
EP0798078A2 (en) 1997-10-01

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