JPH0732454Y2 - 電子部品連 - Google Patents
電子部品連Info
- Publication number
- JPH0732454Y2 JPH0732454Y2 JP15109289U JP15109289U JPH0732454Y2 JP H0732454 Y2 JPH0732454 Y2 JP H0732454Y2 JP 15109289 U JP15109289 U JP 15109289U JP 15109289 U JP15109289 U JP 15109289U JP H0732454 Y2 JPH0732454 Y2 JP H0732454Y2
- Authority
- JP
- Japan
- Prior art keywords
- mount
- electronic component
- resin
- series
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15109289U JPH0732454Y2 (ja) | 1989-12-30 | 1989-12-30 | 電子部品連 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15109289U JPH0732454Y2 (ja) | 1989-12-30 | 1989-12-30 | 電子部品連 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0390871U JPH0390871U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-17 |
| JPH0732454Y2 true JPH0732454Y2 (ja) | 1995-07-26 |
Family
ID=31697409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15109289U Expired - Lifetime JPH0732454Y2 (ja) | 1989-12-30 | 1989-12-30 | 電子部品連 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732454Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1989
- 1989-12-30 JP JP15109289U patent/JPH0732454Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0390871U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-17 |